MPC8313VRAFFB - PowerQUICC II Pro MPU 333MHz | NXP | Networking
N.º de pieza: MPC8313VRAFFB ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.65 | $346,50 |
| 100 | $30.8 | $3.080,00 |
| 500 | $27.55 | $13.775,00 |
| 1.000 | $24.5 | $24.500,00 |
MPC8313VRAFFB Descripción general
A microprocessor (MPU) is the central computational unit of an embedded computing system - an integrated circuit that fetches, decodes and executes instructions while coordinating memory, I/O and on-chip peripherals. The MPC8313 sits in the broader taxonomy MPU -> embedded processor -> communications processor -> PowerQUICC II Pro -> NXP/Freescale Power architecture. Unlike a microcontroller (MCU), which integrates flash and modest analog peripherals, the MPC8313 relies on external DDR memory and external boot ROM, giving designers headroom for high-throughput networking, industrial control and storage applications.
Key features of the MPC8313VRAFFB include a hardware encryption engine option on the MPC8313E variant (this VRAFFB is the non-EAES version without encryption), two 10/100/1000 Ethernet MACs with integrated PHYs supported through SGMII/RGMII, a USB 2.0 full-/low-speed controller, PCI Express endpoint support on some derivatives, and an enhanced local bus controller for glue-less connection to NAND/NOR flash, FPGAs and ASICs. The integrated DDR1/DDR2 memory controller sustains high-throughput packet flows typical of small office/home office routers, DSLAM line cards and industrial gateways.
Architecturally the device pairs the e300c3 PowerPC core with a coherent system bus that fans out to dual Gigabit Ethernet, security acceleration (on E variants), USB and a flexible peripheral set, fabricated in a 0.09 um process. Hardware power management with multiple low-power states, JTAG/COP debugging, and a TEPBGA package that allows efficient multilayer PCB escape make it well suited to long-life industrial designs.
Typical uses include industrial networking routers, secure VPN gateways, factory automation controllers, line cards in access equipment, and embedded Linux/u-boot development platforms. The wide I/O supply range (1.8 V / 2.5 V / 3.3 V) eases interfacing to legacy 3.3 V peripherals common in telecom cards.
When designing with this part, allocate a contiguous 27x27 mm PCB land pattern and respect the TEPBGA escape rules - microvia or via-in-pad is recommended for inner-row balls. Validate DDR2 IBIS models against the chosen DIMM and keep impedance-controlled differential pairs (SERDES) within the manufacturer's routing guidelines.
This page synthesizes distributor pricing, same-package drop-in alternatives (including MPC8313VRAFFB variants and the closely related MPC8313E/MPC8321E family), and practical design notes not collected on any single distributor page.
Alternativas directas para MPC8313VRAFFB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8313EVRAFFC
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8313CVRAFFC
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8313VRAFFC
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8313ECVRAFFC
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8313VRAFFB
✅ Sustitución directa✓ En stock
$24.5 / unidad
Ver hoja de datos →MPC8313VRAFFB Valores máximos y características eléctricas
| Core Architecture | PowerPC e300c3 |
| Family | PowerQUICC II Pro (MPC83xx) |
| Number of Cores | 1 |
| Ancho del bus de datos | 32-bit |
| Maximum Core Frequency | 333 MHz |
| Process Technology | 0.09 um CMOS |
| Encapsulado | 516-TEPBGA (27x27 mm) |
| Core Supply Voltage | 1.0 V |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V |
| DDR Memory Controller | DDR1/DDR2 |
| Ethernet MAC | 2x 10/100/1000 (RGMII/SGMII) |
| USB | USB 2.0 full/low-speed |
| Encryption Engine | Not present (non-E variant) |
| Temperatura de funcionamiento | -40C to +125C (extended, per AFFB suffix) |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant (per DigiKey listing) |
Guía de configuración de pines de MPC8313VRAFFB 516-tepbga (27x27 mm)
Configuración de pines para MPC8313VRAFFB (encapsulado 516-tepbga (27x27 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8313VRAFFB.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8313VRAFFB es adecuado para 6 aplicacións: Industrial Networking Router, Secure VPN Gateway, Factory Automation Controller, DSLAM / Access Network Line Card, Embedded Linux/u-boot Development Platform, Network-Attached Storage Controller.
Industrial Networking Router
The MPC8313VRAFFB is a strong fit for industrial routers and gateways thanks to its dual Gigabit Ethernet MACs (RGMII/SGMII), integrated DDR1/DDR2 controller with ECC, and -40C to +125C operating range. The 333 MHz e300c3 core runs embedded Linux (LTIB or Yocto BSP) comfortably while leaving CPU headroom for iptables, NAT and IPSec software stacks on top of L2 switching. Hardware design uses the 516-TEPBGA 27x27 mm footprint with the local-bus boot ROM wired to a small parallel NOR flash, and the two GMACs serve as WAN/LAN bridges for routing traffic at line rate on Fast Ethernet ports.
Recomendado
Secure VPN Gateway
When hardware-accelerated cryptography is required, the MPC8313VRAFFB can be replaced pin-to-pin with the MPC8313E variant on the same PCB; both share the 516-TEPBGA footprint. The e300c3 core plus integrated SEC (on E variants) sustains IPsec tunnels in the 200-400 Mbps range, suitable for site-to-site VPN aggregation at branch offices. The DDR2 controller feeds packet buffers at line rate, and the local-bus controller interfaces to NAND flash for filesystem storage. Designers must sequence the 1.0 V, 1.8 V and 3.3 V rails correctly using a power-supply sequencer like the NXP PF3000 family.
Recomendado
Factory Automation Controller
The MPC8313VRAFFB's extended-temperature operation and dual Gigabit Ethernet make it a good fit for PLC-like controllers on the factory floor that must bridge legacy fieldbuses to Ethernet. The local bus, USB 2.0 full/low-speed and two UARTs interface to RS-485 transceivers for Modbus RTU and similar protocols. Running at 333 MHz, the e300c3 executes real-time control loops at sub-millisecond cadence while streaming process data to supervisory SCADA hosts over TCP/IP. The 516-TEPBGA footprint enables compact DIN-rail or panel-mount designs with all peripherals on a single board.
Recomendado
DSLAM / Access Network Line Card
Multi-service access platforms and DSLAM line cards historically used PowerQUICC processors for their combination of networking MACs, DDR controller and general-purpose compute. The MPC8313VRAFFB at 333 MHz can run the control-plane stack for line cards while feeding data to an external PHY or framer over the local bus. The dual GMACs connect to the control backplane and to subscriber-side uplinks respectively. The 0.09 um process and integrated peripherals keep bill-of-materials cost low compared to discrete CPU + external MAC designs of similar capability.
Recomendado
Embedded Linux/u-boot Development Platform
The MPC8313VRAFFB is a popular reference platform for embedded Linux developers because NXP ships a mature Linux BSP (LTIB and Yocto meta-freescale) with full U-Boot support for the 516-TEPBGA board. Engineers bring up JTAG (COP) debug, then iterate on U-Boot device trees, then port a Linux kernel with DDR2 timing tuned for the specific DIMM. The e300c3 333 MHz core is fast enough to run gdb-server, NFS-rooted filesystems and TCP/IP stacks in real time. The 27x27 mm footprint and BGA escape makes the resulting reference hardware reusable for product derivatives.
Recomendado
Network-Attached Storage Controller
Low-end NAS appliances and storage controllers have used PowerQUICC II Pro processors like the MPC8313VRAFFB to manage SATA disks attached through an external SATA controller bridged on the local bus. The dual Gigabit Ethernet provides link aggregation or multi-subnet access, while the DDR2 controller (with optional 32-bit ECC) holds the on-disk cache. At 333 MHz, the e300c3 runs the embedded NAS firmware (Linux + Samba/NFS) with headroom for SMB signing and software RAID5. Industrial temperature screening supports installation in non-climate-controlled wiring closets.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8313VRAFFB — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8313EVRAFFC | MPC8313CVRAFFC | MPC8313VRAFFC | MPC8313ECVRAFFC |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same |
| Core Architecture | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 |
| Maximum Core Frequency | 333 MHz | 333 MHz | 333 MHz | 333 MHz | 333 MHz |
| Encryption Engine (SEC) | Not present | Present (IPsec/AES/3DES/Kasumi) | Not present | Not present | Present (IPsec/AES/3DES/Kasumi) |
| Operating Temperature | -40C to +125C (extended) | -40C to +125C (extended) | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C (industrial) |
| DDR Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Gigabit Ethernet MACs | 2x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 |
Diferenciadores clave
- Same 333 MHz e300c3 core across the VRAFFx variants with a single 516-TEPBGA footprint enables a single PCB layout to ship in multiple SKUs (encrypted vs non-encrypted, extended vs industrial temperature) (frente a MPC8313EVRAFFC)
- Extended -40C to +125C operating temperature (AFFB suffix) supports outdoor and industrial wiring-closet installations without derating (frente a MPC8313CVRAFFC)
- Higher 333 MHz core speed compared to the older MPC8321E (266 MHz e300c2 with QUICC Engine) (frente a MPC8321EZQAFDC)
Notas de diseño
The MPC8313VRAFFB requires four independent supply rails (1.0 V core, 1.8 V DDR2 I/O, 2.5 V or 3.3 V GPIO) that must power up and power down in a manufacturer-specified sequence to prevent latch-up. Use a dedicated power-supply sequencer such as the NXP PF3000 or a discrete RC/MOSFET network. Each rail should have bulk capacitance close to the BGA and at least one 100 nF decoupling cap per supply pin pair. Validate sequencing with a four-channel oscilloscope before first power-up.
The 516-TEPBGA at 27x27 mm uses a 1.0 mm ball pitch and requires a multi-row escape strategy. Use microvia or via-in-pad technology with 0.4 mm drill / 0.2 mm pad for inner-row balls to escape the dense pitch. The thermal pad (exposed die side) must be soldered to a continuous copper pour with thermal vias (0.3 mm drill on 1.0 mm pitch) to dissipate ~3-5 W typical. Maintain 50 ohm single-ended and 100 ohm differential impedance for GMAC RGMII/SGMII traces.
Common mistakes on first designs include omitting the JTAG/COP header for debug, forgetting the local-bus boot ROM wiring (the device boots from the lowest-addressed local-bus device on reset), and not validating DDR2 write leveling / read gate training against the chosen DIMM. DDR2 IBIS models must be requested from NXP for board-level signal-integrity simulation. The 'VR' speed grade must match the system clock PLL configuration in U-Boot or the Linux kernel board file.
Información de cumplimiento
RoHS and REACH compliance per DigiKey product listing. AEC-Q100 not applicable - this is a communications MPU, not an automotive-qualified part. Lead-free yes per NXP manufacturing. Halogen-free status not stated in available data.