MPC852TVR80A - 80MHz PowerQUICC MPU, 256-PBGA | NXP
N.º de pieza: MPC852TVR80A ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.75 | $2.175,00 |
| 500 | $19.4 | $9.700,00 |
| 1.000 | $17.85 | $17.850,00 |
MPC852TVR80A Descripción general
An MPU (Microprocessor Unit) is an integrated circuit containing a complete central processing unit optimized for embedded control and computing tasks. PowerQUICC processors belong to the MPU family and target the wider category of communications processors within integrated circuits. The MPC852T sits inside NXP's MPC8xx PowerQUICC I family, bridging general-purpose processing with hardware-accelerated protocol handling — a hierarchy of: MPU -> Power Architecture -> PowerQUICC -> communications processor -> embedded integrated circuit.
Key features of the MPC852TVR80A include a single 32-bit core running up to 80MHz, hardware support for up to three fast Ethernet interfaces or HDLC/PPP channels, an integrated PCI bridge, and 8 Kbytes of unified instruction/data cache. Operating voltage is 3.3 V with a 5 V-tolerant I/O option, and the device is specified over the 0 to +95 °C commercial temperature range. The package is the 256-PBGA (23x23 mm) surface-mount format with 1.27 mm pitch.
Architecturally, the MPC852T pairs a PowerPC-style embedded core with the CPM (Communications Processor Module), an embedded RISC engine that off-loads serial-protocol work from the host CPU. This two-engine architecture is the principal reason the MPC852T outperforms single-core MPUs at protocol-heavy tasks such as multi-channel TDM and Ethernet switching.
Typical applications include Ethernet line cards, channelized T1/E1 access multiplexers, low-end routers, ISDN terminal adapters, and protocol-conversion bridges for industrial control. It is widely deployed in legacy telecom equipment where deterministic CPM performance outweighs raw CPU MHz.
Designers should note that the MPC852TVR80A is a legacy PowerQUICC I device: NXP has announced end-of-life on most MPC8xx derivatives, so the part is recommended only for sustaining engineering and existing platforms rather than new greenfield designs.
Alternativas directas para MPC852TVR80A — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC852TVR80A (mismo factor de forma y huella) — difiere en Manufacturer, RoHS Status, Operating Temperature, Package, Series.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC852TZT80A
✅ Sustitución directa✓ En stock
$29.95 / unidad
Ver hoja de datos →MPC852TCZT100A
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC852TCVR66A
✅ Sustitución directa✓ En stock
$22.1 / unidad
Ver hoja de datos →MPC852TVR80A Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series / Family | MPC8xx / PowerQUICC I |
| Core | Power Architecture, 32-bit, 1 core |
| Core Frequency | 80 MHz |
| Encapsulado | 256-PBGA (23x23 mm, 1.27 mm pitch) |
| Temperatura de funcionamiento | 0 °C to +95 °C |
| Tensión de alimentación | 3.3 V core with 5 V-tolerant I/O option |
| Instruction/Data Cache | 8 KB unified |
| Communications Module | CPM (Communications Processor Module) with HDLC/Ethernet |
| Ethernet Support | Up to 3x Fast Ethernet (10/100) |
| PCI Bridge | Integrated PCI bridge |
| Tipo de montaje | Surface Mount |
| Nivel MSL | 3 (168 hours) |
| HTSUS Code | 8542.31.0001 |
| Estado RoHS | Details not published - verify per lot |
Guía de configuración de pines de MPC852TVR80A 256-pbga (23x23 mm, 1.27 mm pitch)
Configuración de pines para MPC852TVR80A (encapsulado 256-pbga (23x23 mm, 1.27 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC852TVR80A.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC852TVR80A es adecuado para 6 aplicacións: Ethernet Line Card for Telecom, Channelized T1/E1 Access Multiplexer, Low-End Branch Router, ISDN Terminal Adapter / BRI Concentrator, Industrial Protocol Bridge (Serial-to-Ethernet), Legacy Telecom Backplane Controller.
Ethernet Line Card for Telecom
The MPC852TVR80A fits Ethernet line cards because its integrated CPM supports up to three 10/100 Ethernet MACs with HDLC and PPP offload, and the 80 MHz Power Architecture core runs management and routing code concurrently. With 8 KB unified cache and an integrated PCI bridge, the part can connect directly to a framer or PHY without external glue logic. Designers typically place the 256-PBGA on a 4-layer FR-4 board with a 3.3 V core rail and 5 V-tolerant I/O. Compared with a discrete CPU plus external Ethernet MAC, the MPC852T reduces BoM by 2-3 devices and PCB area by roughly 30 %.
Recomendado
Channelized T1/E1 Access Multiplexer
Channelized T1/E1 access multiplexers benefit from the MPC852TVR80A's CPM, which handles multiple TDM time-slots and HDLC channels in hardware. The 80 MHz Power Architecture core supervises the multiplexer, runs signaling stacks, and manages the uplink Ethernet. Operating temperature 0 °C to +95 °C matches central-office environments with controlled airflow. The integrated PCI bridge allows a host CPU or DSP to be added for voice processing. Total system cost is lower than using a separate CPU and multi-channel serial controller.
Recomendado
Low-End Branch Router
Low-end branch routers pair the MPC852TVR80A's 80 MHz Power Architecture core with its on-chip Ethernet MACs to provide WAN-edge routing at small-office scale. The CPM off-loads PPP, HDLC, and frame-relay encapsulation, freeing the host CPU for routing-table lookups, NAT, and firewall tasks. The 256-PBGA footprint suits compact router PCBs that need to fit 2-4 Ethernet ports plus one WAN serial port. Power consumption is moderate because the CPM is the dominant workhorse; the host core stays in light sleep between packets.
Recomendado
ISDN Terminal Adapter / BRI Concentrator
ISDN terminal adapters and BRI concentrators use the MPC852TVR80A because the CPM's HDLC controllers and TDM interface map directly onto ISDN D-channel and B-channel framing. The 80 MHz host core runs the LAPD stack and call-routing logic, while PCI is reserved for optional expansion (e.g., extra DSPs). The 256-PBGA package fits within the small form factor typical of desktop ISDN adapters. Compared with a microcontroller plus external framer, the MPC852T integrates frame formatting and call control in one device.
Recomendado
Industrial Protocol Bridge (Serial-to-Ethernet)
Industrial protocol bridges translating Modbus, Profibus, or proprietary serial protocols to Ethernet are well-served by the MPC852TVR80A, whose CPM handles multiple serial channels while the host core runs the protocol-conversion firmware. The 0 °C to +95 °C commercial grade suits cabinet-mounted industrial equipment with temperature-controlled enclosures. The 3.3 V supply and 5 V-tolerant I/O simplify integration with legacy 5 V transceivers. Single-BGA 256-pin package keeps the converter board compact for DIN-rail mounting.
Recomendado
Legacy Telecom Backplane Controller
Legacy telecom backplane controllers deploy the MPC852TVR80A as a shelf-management or alarm-aggregation processor. The PCI bridge talks to backplane glue, the CPM serializes alarm telemetry, and the host core runs local diagnostics. The part's long tenure in carrier equipment makes it a known-quantity for sustaining engineering. Its 256-PBGA footprint allows dense PCB layouts typical of 6U cPCI or ATCA backplanes. Use the -Q suffix or industrial-temp sibling when harsh cabinet environments are specified.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC852TVR80A — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC852TZT80A | MPC852TCZT100A | MPC852TCVR66A |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23 mm) | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same |
| Core Frequency | 80 MHz | 80 MHz | 100 MHz | 66 MHz |
| Operating Temperature | 0 °C to +95 °C | Industrial range suffix | 0 °C to +95 °C | 0 °C to +95 °C |
| Core | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit |
| CPM / Ethernet MACs | Up to 3x 10/100 + HDLC | Up to 3x 10/100 + HDLC | Up to 3x 10/100 + HDLC | Up to 3x 10/100 + HDLC |
| PCI Bridge | Integrated | Integrated | Integrated | Integrated |
| Lifecycle Status (2026) | Last-Time-Buy (EOL) | EOL | EOL | EOL |
Diferenciadores clave
- Identical 256-PBGA footprint as the industrial-temp sibling (frente a MPC852TZT80A)
- Higher 100 MHz speed grade available in the same package (frente a MPC852TCZT100A)
- Lower-power 66 MHz option for thermal-sensitive builds (frente a MPC852TCVR66A)
Notas de diseño
The MPC852TVR80A requires a stable 3.3 V core rail and an optional 5 V-tolerant I/O supply. Decouple each VDD/VSS pair with 100 nF ceramic and bulk 10 µF tantalum or polymer capacitors placed within 5 mm of the BGA balls. Power sequencing requires the core rail to come up before I/O; failure to sequence can cause latch-up on legacy PowerQUICC I silicon.
Although the 256-PBGA (23x23 mm) body spreads heat across a large footprint, sustained CPM activity at 80 MHz plus PCI traffic can drive junction temperature into the 90 °C range at room ambient. Provide at least 4 thermal vias in the centre pad array and connect them to an internal ground plane. For enclosed chassis, verify with a thermocouple at the package top-side.
Route all high-speed Ethernet and HDLC traces as 50 Ω controlled-impedance microstrips on the top layer, keeping the BGA break-out via fan-out short and matched. The 1.27 mm pitch of the 256-PBGA needs 0.2 mm laser-drilled microvias on 4-layer FR-4; confirm with your fab house that stack-up supports this. Keep PCI clock and reset traces away from CPM serial lines to avoid crosstalk.
Estimated: at 80 MHz core, typical power dissipation is approximately 1.2 W (input values: 3.3 V x 360 mA typical from the MPC852T datasheet). Do not assume the MPC852T and MPC860 family parts share identical boot-ROM timing - the MPC852T has a slightly different reset configuration word that must match the chosen bus width. Verify against the latest NXP MPC852T datasheet revision before programming.
Información de cumplimiento
RoHS status details not published on the NXP product page for this EOL part - verify per lot. REACH unaffected per GlobalSpec listing. AEC-Q100 not applicable for legacy telecom MPU.
