MPC852TVR80A vs MPC852TZT80A Comparación
Comparación detallada lado a lado de MPC852TVR80A por NXP Semiconductors y MPC852TZT80A por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC852TVR80A | MPC852TZT80A |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,85 | $29,95 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series / Family | MPC8xx / PowerQUICC I | — |
| Core | Power Architecture, 32-bit, 1 core | MPC8xx (32-bit Power Architecture) |
| Core Frequency | 80 MHz | 80 MHz |
| Encapsulado | 256-PBGA (23x23 mm, 1.27 mm pitch) | — |
| Temperatura de funcionamiento | 0 °C to +95 °C | 0 °C to +95 °C |
| Tensión de alimentación | 3.3 V core with 5 V-tolerant I/O option | 3.3 V |
| Instruction/Data Cache | 8 KB unified | — |
| Communications Module | CPM (Communications Processor Module) with HDLC/Ethernet | — |
| Ethernet Support | Up to 3x Fast Ethernet (10/100) | — |
| PCI Bridge | Integrated PCI bridge | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Nivel MSL | 3 (168 hours) | — |
| HTSUS Code | 8542.31.0001 | — |
| Estado RoHS | Details not published - verify per lot | Non-Compliant (legacy part) |
| Series | — | PowerQUICC, MPC8xx |
| Core Count | — | 1 |
| Process Technology | — | 0.18 µm CMOS |
| Package Type | — | 256-PBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 23 x 23 mm |
| Tray Packaging | — | Tray (per distributor listing) |
| Product Category | — | Microprocessors (MPU) |
| Lead Finish | — | Contains lead (SnPb or lead-bearing solder profile) |