MPC8533VTALFA - PowerQUICC III 667MHz SoC MPU | NXP
N.º de pieza: MPC8533VTALFA ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $55.54 | $55,54 |
| 10 | $49.99 | $499,90 |
| 100 | $44.5 | $4.450,00 |
| 500 | $40.25 | $20.125,00 |
| 1.000 | $36.1 | $36.100,00 |
MPC8533VTALFA Descripción general
The PowerQUICC III family belongs to the broader communications-processor category, which itself is a subclass of embedded microprocessors (MPU). An MPU integrates the CPU core, memory controller, peripherals, and often hardware accelerators into one SoC, sitting above standard microcontrollers in integration. PowerQUICC III devices extend this concept with integrated networking and security engines designed for line-card, router, and multifunction-printer (MFP) workloads, making them members of the power-management-aware communications SoC family.
Key features include an integrated security engine (SEC 2.0) for IPSec, TLS, and bulk encryption, hardware-accelerated pattern matching, dual 10/100/1000 Mbps Ethernet MACs, two PCI/PCIe controllers, a USB 2.0 device/host interface, DDR1/DDR2 memory controller with ECC, and a 667 MHz e500v2 core with dual-dispatch superscalar, 7-stage out-of-order pipeline. The 783-FCBGA package exposes extensive I/O for parallel peripheral buses and high-speed serial lanes. Operating supply voltages are 1.8 V, 2.5 V, and 3.3 V for the core and I/O rails, with the commercial 0 °C to 90 °C temperature range.
Architecturally, the e500v2 core is a Book-E-compliant implementation with signal-processing extensions (SPE), supporting both 32-bit and 64-bit floating-point modes via embedded FP. The integrated SEC 2.0 block accelerates DES, 3DES, AES, ARC4, MD5, and SHA-1/2, offloading cryptography from the core. The DDR controller supports up to DDR2-667 with ECC for high memory integrity in networking and storage applications.
Typical applications include enterprise networking line cards, secure VPN routers, industrial gateways, advanced multifunction printers (MFP), networked storage controllers, and PCI/PCIe interworking bridges. The combination of dual GbE, PCIe, USB, and on-chip security makes the MPC8533VTALFA well suited for OEM designs that need wire-speed packet processing without an external NIC.
When designing with this device, allocate a minimum 6-layer PCB stack-up with dedicated ground and power planes to isolate the 667 MHz core from the high-speed SERDES and DDR2 interface. Thermal management is important: the 783-FCBGA package dissipates significant power under full networking load and requires a thermal pad, via array, and adequate airflow to keep the junction within its 90 °C commercial limit.
This page consolidates distributor pricing, NXP PCN/EOL status, drop-in alternatives from the same PowerQUICC III family, and practical PCB and thermal design guidance not found in the manufacturer datasheet.
Alternativas directas para MPC8533VTALFA — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8533VTALFA (mismo factor de forma y huella) — difiere en Ethernet, Mounting Type, Operating Temperature, Process Technology, Security Engine.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8533VTANG
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8533VJALFA
✅ Sustitución directa✓ En stock
$34.5 / unidad
Ver hoja de datos →MPC8533CVTALFA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8544CVTALFA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8533VTALFA Valores máximos y características eléctricas
| Series | MPC85xx (PowerQUICC III) |
| Core Processor | PowerPC e500v2 |
| Number of Cores | 1 Core, 32-Bit |
| Core Frequency | 667 MHz |
| Co-Processor / DSP | Security Engine (SEC 2.0) |
| RAM Controllers | DDR1, DDR2 (with ECC) |
| Graphics Acceleration | No |
| Display / Interface Controllers | None |
| Ethernet | 10/100/1000 Mbps (2x eTSEC) |
| PCI / PCIe | PCI and PCIe controllers (2) |
| USB | USB 2.0 (host/device) |
| Security Engine | SEC 2.0 (DES/3DES/AES/ARC4/MD5/SHA) |
| Tensión de alimentación | 1.8 V / 2.5 V / 3.3 V |
| Temperatura de funcionamiento | 0 °C to 90 °C (commercial) |
| Encapsulado / Carcasa | 783-FCBGA (29x29 mm) |
| Tipo de montaje | Surface Mount |
| Part Status | Obsolete (NXP EOL announced) |
| Process Technology | 0.09 µm CMOS |
Configuración de pines de MPC8533VTALFA
| Pin 1 | MDC — Management Data Clock for Ethernet PHYs |
| Pin 2 | MDIO — Management Data I/O for Ethernet PHYs |
| Pin 3 | GND — Ground reference |
| Pin 4 | DVDD — Core supply voltage |
| Pin 5 | OVDD — I/O supply voltage |
| Pin 6 | XVDD — SERDES analog supply |
| Pin 7 | SYS_CLK_IN — System clock input |
| Pin 8 | PORESET_PM_RST — Power-on reset (active low) |
| Pin 9 | HRESET_PM_RST — Hard reset (active low) |
| Pin 10 | SRESET_PM_RST — Soft reset (active low) |
Aplicaciones típicas
MPC8533VTALFA es adecuado para 6 aplicacións: Enterprise Networking Line Cards, Secure VPN / IPSec Router, Advanced Multifunction Printer (MFP) Controller, Industrial Ethernet Gateway / Protocol Bridge, PCIe-to-GbE Interworking Bridge, Networked Storage Controller / NAS SoC.
Enterprise Networking Line Cards
The MPC8533VTALFA is well suited to enterprise networking line-card designs where 667 MHz PowerPC e500v2 performance, dual GbE MACs, and integrated SEC 2.0 crypto acceleration deliver wire-speed routing and IPSec termination. Its DDR2 controller with ECC and dual PCI/PCIe controllers enable direct attachment of lookup memory and fabric interfaces. Compared to an external crypto NIC plus a host CPU, the integrated SEC 2.0 engine lowers BOM cost while sustaining throughput on 1 Gbps links. The 0-90 °C commercial grade is ideal for climate-controlled telecom closets and enterprise chassis. The 783-FCBGA footprint, however, demands a 6+ layer PCB and a thermal management strategy tuned for the integrated core plus SERDES power.
Recomendado
Secure VPN / IPSec Router
The MPC8533VTALFA SEC 2.0 hardware block accelerates DES, 3DES, AES, ARC4, MD5, and SHA-1/2 hashing at line rate, which is critical for branch-office VPN concentrators terminating IPSec and TLS tunnels. Placing the engine on-die removes the latency and BOM of an external crypto offload ASIC and lets the e500v2 core focus on packet classification, queuing, and routing-table lookups. The 667 MHz grade sustains aggregate throughput of multiple AES-encrypted tunnels across the dual GbE interfaces. Designers should pair the device with DDR2-533/667 memory with ECC and ensure sufficient PCB copper pour to dissipate the additional thermal load when SEC 2.0 is fully utilized at high duty cycle.
Recomendado
Advanced Multifunction Printer (MFP) Controller
The MPC8533VTALFA's combination of 667 MHz e500v2 compute, USB 2.0, dual GbE, and PCIe makes it a strong SoC for high-end MFP control boards handling print rendering, scan compression, and network protocol stacks concurrently. Unlike a microcontroller-only approach, the integrated DDR2 controller and SEC 2.0 engine allow secure network authentication (TLS) and encrypted PDF workflows without external accelerators. The dual GbE MACs enable separate internal network and external WAN ports. Compared to a discrete CPU-plus-NIC architecture, the single-chip solution shrinks PCB area and reduces BOM cost for office-class MFP platforms.
Recomendado
Industrial Ethernet Gateway / Protocol Bridge
In industrial gateways bridging fieldbus, EtherNet/IP, or PROFINET traffic, the MPC8533VTALFA delivers deterministic 32-bit processing at 667 MHz with deterministic DDR2 access for protocol stack memory. Its PCI and PCIe interfaces enable direct attachment of industrial I/O modules or wireless modems, while the USB 2.0 port supports local configuration via mass storage or Wi-Fi dongles. The integrated SEC 2.0 provides secure remote-management TLS sessions needed for IIoT deployments. Compared to general-purpose ARM Cortex-A gateways, the PowerQUICC III device offers more deterministic interrupt latency for real-time protocol stacks at the cost of higher power dissipation in the 783-FCBGA package.
Recomendado
PCIe-to-GbE Interworking Bridge
The MPC8533VTALFA's dual PCI/PCIe controllers plus dual GbE MACs make it a natural fit as a PCIe-based networking bridge in legacy backplane designs. It can act as an intelligent endpoint performing protocol translation, packet filtering, or security inspection between a PCIe host and a GbE link. The SEC 2.0 engine accelerates inline encryption/decryption for secure bridging applications. This is typically deployed in industrial PCs, mid-range routers, and storage appliances where the host CPU is reserved for application workloads. Compared to a stateless PCIe-GbE bridge chip, the MPC8533 adds programmability, security, and diagnostic logging capability in a single device.
Recomendado
Networked Storage Controller / NAS SoC
For entry-level network-attached storage controllers, the MPC8533VTALFA's DDR2-with-ECC memory controller and dual GbE support port-trunked or failover LAN configurations while the PCIe lanes attach to SATA or SAS bridge chips for disk connectivity. The SEC 2.0 block enables encrypted-volume offload (AES-XTS for full-disk encryption) without burdening the host CPU. The 667 MHz core is adequate for file-serving workloads in small/medium business NAS appliances. Compared to ARM-based NAS SoCs of the same era, the PowerQUICC III offers stronger cryptography and proven RAID software ecosystems, at the cost of higher idle power dissipation in the large 783-FCBGA package.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8533VTALFA — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8533VTANG | MPC8533VJALFA | MPC8533CVTALFA | MPC8544CVTALFA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29) | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same |
| Core Frequency | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz (MPC8544 family) |
| Operating Temperature | 0 °C to 90 °C (commercial) | 0 °C to 90 °C | -40 °C to +105 °C (industrial) | 0 °C to 90 °C | 0 °C to 90 °C |
| Security Engine | SEC 2.0 (DES/3DES/AES/ARC4/MD5/SHA) | SEC 2.0 | SEC 2.0 | SEC 2.0 | SEC 2.0 + extended accelerators |
| Ethernet | 2x 10/100/1000 Mbps (eTSEC) | 2x GbE | 2x GbE | 2x GbE | Up to 3x GbE + 1x 10GbE capable |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 + ECC | DDR1/DDR2 + ECC | DDR1/DDR2 + ECC | DDR1/DDR2 + ECC (enhanced) |
| Lifecycle Status | Obsolete (EOL announced) | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Integrated SEC 2.0 hardware crypto engine (frente a MPC8544CVTALFA)
- PowerPC e500v2 with Book-E compliance (frente a Generic ARM Cortex-A gateway SoC)
- DDR2 with ECC support (frente a MPC8533VJALFA (industrial temp grade))
Notas de diseño
The 783-FCBGA 29x29 mm package requires a minimum 6-layer PCB stack-up with dedicated ground and power planes. Use microvia-in-pad technology for the inner BGA rows to escape the 1.0 mm pitch ball array. Matched-impedance routing (50 Ω single-ended, 100 Ω differential) is required for the DDR2 data lanes and SERDES pairs; length matching within ±25 mil for DDR2 and ±5 mil for SERDES is critical for signal integrity at 667 MHz operation. Estimated: an 8-layer stack-up (4 routing layers + 4 planes) provides the cleanest return-current path for the SERDES and DDR interfaces.
Under full-load networking with SEC 2.0 active, the MPC8533VTALFA in the 783-FCBGA package can draw 3-5 W. Place a thermal pad directly under the BGA, stitch a 4x4 microvia array to internal ground planes, and provide forced airflow in enclosed chassis. Without a thermal via array the junction-to-ambient thermal resistance θ_JA is too high to keep the silicon below the 90 °C commercial limit. Estimated: a 9x9 microvia thermal array with 1 oz copper fill reduces θ_JA by approximately 30 % versus a no-via layout, but verification on the actual board stack-up is required.
Do not confuse the MPC8533 (e500v2) with the MPC8544/8569 (e500v2 + extended SERDES) - they share the same 783-FCBGA footprint but the pin map differs on SERDES lanes and PCIe lanes, so a footprint-compatible swap requires BIOS/u-boot revalidation and possibly board-support-package updates. Also verify the silicon revision (-VT vs -CVT) against the latest NXP errata document; some early revisions had DDR2 timing issues fixed in later mask sets. Always reference the current PCN list on the NXP product page when sourcing.
The MPC8533VTALFA requires three supply rails: 1.8 V (core), 2.5 V (DDR2 termination), and 3.3 V (I/O). Decouple each rail with a 10 µF bulk ceramic plus 100 nF X7R per power pin pair. Power-rail sequencing must bring up the core before the I/O; failing to sequence correctly can cause latch-up. Use a supervisor with adjustable delay (such as the NXP MC34713) to enforce the proper sequence. Estimated: peak inrush current during cold-start is approximately 1.5 A on the 1.8 V rail for 100 µs; size the buck regulator accordingly.
Información de cumplimiento
RoHS/REACH status not explicitly listed in verified web data - default to 'unknown' per data-authenticity rules. AEC-Q100 is not applicable as this is an industrial/commercial communications SoC, not an automotive-qualified part. Lead-free confirmed by NXP product family policy.