MPC8541VTAPF - PowerPC e500 MPU 833MHz 783-FCPBGA | NXP
N.º de pieza: MPC8541VTAPF ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $247.96 | $247,96 |
| 10 | $223.16 | $2.231,60 |
| 100 | $198.37 | $19.837,00 |
| 500 | $173.57 | $86.785,00 |
| 1.000 | $148.78 | $148.780,00 |
MPC8541VTAPF Descripción general
A microprocessor (MPU) is a single-chip CPU that integrates the central processing unit, cache, memory controller, and peripheral interfaces on a single die. The MPC85xx family is a line of PowerQUICC III integrated communications processors that sit in the broader hierarchy of microprocessors -> processors -> integrated circuits -> semiconductors. These devices are purpose-built for routing, switching, and industrial control workloads where deterministic performance and high I/O bandwidth are required.
Key features of the MPC8541VTAPF include a PowerPC e500 core with 32KB L1 instruction cache and 32KB L1 data cache, a 256KB L2 cache, a double-precision floating-point unit, dual integrated triple-speed Ethernet controllers supporting 10/100/1000 Mbps, a 64-bit DDR memory controller, dual PCI/PCI-X controllers, and a flexible local bus interface. The device operates from a 1.3V core supply and 2.5V/3.3V I/O supplies, with a junction temperature range suitable for industrial and networking environments.
Architecturally, the MPC8541 combines a high-frequency e500 core with the PowerQUICC III communications engine, allowing wire-speed processing of networking packets while reserving CPU cycles for control-plane tasks. The integrated security engine and DMA controllers offload typical networking bottlenecks, while the high-bandwidth DDR controller supports up to DDR-333 with ECC for memory-intensive routing tables.
Typical applications include enterprise routers and switches, WAN access equipment, industrial automation controllers, network-attached storage (NAS) controllers, and embedded telecommunications platforms. The 833 MHz core frequency and rich peripheral set make it suitable for control-plane processing in mid-range networking gear.
When designing with the MPC8541VTAPF, careful attention to multi-rail decoupling, signal integrity on the DDR bus, and PCB layer stack-up for the high-pin-count BGA is essential. Because the part is now in NXP's end-of-life lifecycle, long-term availability planning and second-source qualification should be considered up front.
This page synthesizes distributor pricing, drop-in alternatives drawn from the MPC85xx family, and practical design notes not found in the manufacturer datasheet, giving engineers a single, citable reference for sourcing and replacement decisions.
Alternativas directas para MPC8541VTAPF — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8541VTAPF (mismo factor de forma y huella) — difiere en Memory Controller, Package, Mounting Type, Number of Cores, Data Bus Width.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8541PXAPF
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8541EPXAPF
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8555VTAPF
✅ Sustitución directa✓ En stock
$152 / unidad
Ver hoja de datos →MPC8541VTAPF-FR
✅ Sustitución directa✓ En stock
$71 / unidad
Ver hoja de datos →MPC8541VTAPF Valores máximos y características eléctricas
| Core Architecture | PowerPC e500 |
| Number of Cores | 1 |
| Ancho del bus de datos | 32-Bit |
| Maximum Core Frequency | 833 MHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 256 KB |
| Floating-Point Unit | Double-precision |
| Memory Controller | 64-bit DDR (up to DDR-333, ECC) |
| Ethernet Controllers | 2x integrated 10/100/1000 Mbps TSEC |
| PCI / PCI-X Controllers | 2 |
| Local Bus Interface | Yes (16-bit, up to 66 MHz) |
| Core Supply Voltage | 1.3 V |
| I/O Supply Voltage | 2.5 V / 3.3 V |
| Encapsulado | 783-FCPBGA (29 x 29 mm) |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
Guía de configuración de pines de MPC8541VTAPF 783-fcpbga (29 x 29 mm)
Configuración de pines para MPC8541VTAPF (encapsulado 783-fcpbga (29 x 29 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8541VTAPF.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8541VTAPF es adecuado para 6 aplicacións: Enterprise Routers and Switches, WAN Access Equipment, Industrial Automation Controllers, Network-Attached Storage (NAS) Controllers, Embedded Telecommunications Platforms, Legacy Defense and Aerospace Networking Equipment.
Enterprise Routers and Switches
The MPC8541VTAPF's 833 MHz PowerPC e500 core and dual integrated triple-speed Ethernet controllers (TSEC) make it well suited to mid-range enterprise routers and Layer 2/3 switches. The hardware accelerates packet classification, routing table lookup, and forwarding at wire speed while reserving CPU cycles for control-plane protocols such as OSPF, BGP, and MPLS. Per the NXP MPC8541E datasheet, the DDR-333 controller with ECC supports large routing tables. The 783-FCPBGA package integrates cleanly into multilayer router PCBs with dedicated power planes.
Recomendado
WAN Access Equipment
DSLAMs, multi-service access nodes, and WAN aggregation equipment leverage the MPC8541VTAPF for protocol termination and traffic shaping. The dual TSEC interfaces combined with the PCI/PCI-X controllers allow direct attachment of DSL PHY chips and TDM framers without external glue logic. According to NXP's PowerQUICC III reference designs, the integrated DMA engine offloads packet copy operations, freeing the e500 core for QoS scheduling. The 1.3 V core supply at typical 5-8 W dissipation suits fanless access-node chassis.
Recomendado
Industrial Automation Controllers
Deterministic real-time control applications such as PLCs, motion controllers, and industrial gateways benefit from the MPC8541VTAPF's integrated peripheral set and high core frequency. The local bus interface connects directly to FPGA-based I/O modules or ASIC glue, while the dual Ethernet ports enable redundant PROFINET/EtherNet/IP topologies. Per the NXP product family documentation, the PowerQUICC III architecture is widely deployed in industrial controllers. The wide supply tolerance and BGA package suit ruggedized industrial chassis.
Recomendado
Network-Attached Storage (NAS) Controllers
Mid-range NAS controllers use the MPC8541VTAPF as the main SoC managing RAID, file-system services, and dual GbE network interfaces. The 64-bit DDR controller with ECC handles disk-cache operations while the PCI-X bus attaches SATA or SAS controllers via bridge chips. According to the NXP MPC8541E datasheet, the L2 cache of 256 KB accelerates metadata operations. Designers should pair the MPC8541VTAPF with a platform-software stack such as Linux with NFS/CIFS support.
Recomendado
Embedded Telecommunications Platforms
The MPC8541VTAPF is widely deployed in embedded telecom platforms such as media gateways, IP-PBX controllers, and base-station transmission units. The integrated TDM support via the local bus and the high-bandwidth Ethernet ports handle voice and signaling traffic. Per NXP PowerQUICC III product collateral, the device's hardware queue manager accelerates packet scheduling. The 783-FCPBGA package fits into ATCA/AMC-style mezzanine layouts common in telecom chassis.
Recomendado
Legacy Defense and Aerospace Networking Equipment
Long-lifecycle defense and aerospace networking programs continue to use the MPC8541VTAPF because of its deterministic PowerPC architecture and proven reliability in deployed field systems. Per DigiKey distributor records and Rochester Electronics listings, the part remains procurable through authorized long-term suppliers. Engineers sustaining these programs benefit from a stable PowerQUICC III software ecosystem and BSP support. Designers must verify the operating temperature grade and any MIL-spec screening against the specific lot.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8541VTAPF — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8541PXAPF | MPC8541EPXAPF | MPC8555VTAPF | MPC8541VTAPF-FR |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Architecture | PowerPC e500, 1 core | PowerPC e500, 1 core | PowerPC e500, 1 core + SEC | PowerPC e500, 1 core | PowerPC e500, 1 core (refreshed) |
| Core Frequency | 833 MHz | Alternative speed grade | 833 MHz (typical) | Higher CPM performance | 833 MHz |
| Security Engine | No | No | Yes (SEC) | Optional (variant dependent) | No |
| L2 Cache | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Memory Controller | 64-bit DDR up to DDR-333, ECC | Same | Same | Same | Same |
| Ethernet Controllers | 2x 10/100/1000 TSEC | 2x 10/100/1000 TSEC | 2x 10/100/1000 TSEC | 2x 10/100/1000 TSEC + CPM | 2x 10/100/1000 TSEC |
Diferenciadores clave
- PowerQUICC III integrated communications architecture (frente a MPC8541PXAPF)
- 833 MHz core frequency in 783-ball FCPBGA (frente a MPC8541EPXAPF)
- DDR-333 with 64-bit bus and ECC (frente a MPC8555VTAPF)
Notas de diseño
The 783-FCPBGA package requires a multilayer PCB (typically 8-12 layers) with microvia or via-in-pad technology for the inner-row balls. Per NXP MPC8541E reference designs, allocate a continuous ground plane on layer 2 directly beneath the BGA, with dedicated power islands for the 1.3 V core rail and 2.5 V/3.3 V I/O rails. Use 1-oz copper on outer planes plus 0.5-oz on inner layers for high-current core delivery.
Decouple each VDD/VSS ball pair with a 0.1 uF X7R ceramic capacitor placed within 2 mm of the ball. Add bulk decoupling of 22-47 uF tantalum or polymer capacitors on each rail. The 1.3 V core rail may require 4-6 A under typical 833 MHz operation. Use a sequenced power architecture with the core rail coming up before the I/O rails to avoid I/O bus contention during startup.
Because the MPC8541VTAPF is in NXP's End of Life lifecycle, do not start new production designs without securing a long-term supply agreement. Rochester Electronics and authorized aftermarket distributors carry factory-reclaimed inventory. Validate any secondary-source part against the original NXP datasheet revision; the '-FR' suffix denotes factory-reclaimed stock, which has identical die but may carry different date codes.
Información de cumplimiento
RoHS compliance per DigiKey distributor listing. Reach and conflict-mineral statements are not present in the Verified Web Data and should be confirmed via NXP product-change-notice documentation. AEC-Q100 is not applicable for this MPU class.
