NXP Semiconductors

SCN8547VTAQGD - NXP PowerPC e500 MPU, 1 GHz, FCPBGA-783 | Industrial

N.º de pieza: SCN8547VTAQGD ✓ Activo
En stock Se envía en 1-3 días hábiles
783-FCPBGA (29 x 29 mm) Package 1.0 GHz Speed DDR2 / DDR3 SDRAM with ECC (64-bit) Memory
Desde $198 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-10-15
Precios por volumen
Cant. Precio unitario Total
1 $285 $285,00
10 $268.5 $2.685,00
100 $245.75 $24.575,00
500 $222.4 $111.200,00
1.000 $198 $198.000,00
ℹ️ Todos los precios están en USD

SCN8547VTAQGD Descripción general

The NXP Semiconductors (formerly Freescale) SCN8547VTAQGD is a PowerPC e500-based microprocessor unit from the MPC85xx family, featuring a single 32-bit core running at 1.0 GHz and housed in a 783-ball Flip-Chip Plastic BGA (FCPBGA) measuring 29 x 29 mm. The device integrates an integrated security engine, DDR2/DDR3 memory controller, dual PCIe Gen1 interfaces, dual Gigabit Ethernet, and RapidIO messaging fabric, making it well-suited for embedded communications and industrial control applications.

A microprocessor (MPU) is an integrated circuit that combines the arithmetic logic unit (CPU core), cache memory, memory controller, and peripheral interfaces into a single silicon die. Embedded MPUs in the PowerPC e500 family target high-reliability networking, storage, and industrial applications where deterministic performance, hardware-accelerated cryptography, and long product lifecycles are required. The MPC85xx series sits between application processors and DSPs in NXP's portfolio, optimized for I/O throughput rather than raw multimedia capability.

Key features of the SCN8547VTAQGD include hardware-accelerated encryption (DES, 3DES, AES, SHA, RNG, Kasumi), dual integrated 10/100/1000 Ethernet MACs with SerDes, two PCI Express Gen1 interfaces, a RapidIO endpoint fabric, and a 64-bit DDR2/DDR3 SDRAM controller with ECC. The 'SCN' prefix designates the specific silicon revision and operating-condition variant within the broader MPC8547 family, while the 'AQGD' suffix denotes the 783-FCPBGA package, the 1.0 GHz core speed grade, and the industrial temperature range.

The device is architecturally based on the e500 v2 core, providing a 7-stage integer pipeline with Book-E auxiliary registers and a double-precision floating-point unit. Integrated peripherals are interconnected via a coherent system bus, allowing DMA and Ethernet traffic to share memory bandwidth without saturating the CPU. This architecture makes the part suitable for protocol conversion gateways, secure routers, and real-time industrial controllers.

Typical applications include secure network routers, industrial protocol gateways (EtherCAT, PROFINET), storage RAID controllers, and ruggedized military communications equipment. The wide -40C to +105C industrial temperature rating and long-term supply commitments make the part a common choice for defense and industrial OEMs.

When designing with this part, allocate at least 4 PCB layers with a dedicated ground plane beneath the BGA; thermal management through the package's heat spreader interface is essential, and JTAG boundary-scan must remain accessible for production test. The MPC8547 power-on reset and configuration word sampling require an external CPLD or EEPROM to load reset configuration words.

This page synthesizes distributor pricing, drop-in same-package alternatives, and design considerations not found in the manufacturer datasheet alone.

Alternativas directas para SCN8547VTAQGD — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con SCN8547VTAQGD (mismo factor de forma y huella) — difiere en Core Architecture, Memory Controller.

NXP Semiconductors
Core Architecture: Power Architecture e500
Memory Controller: 64-bit DDR2 with ECC
Comparar con SCN8547VTAQGD →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

MPC8547VTAQGD

✅ Sustitución directa
📦 783-FCPBGA (29x29)
same silicon die and 783-FCPBGA ball map, standard NXP prefix vs Freescale SCN prefix

📋 Alternativa de referencia (no en el catálogo)

MPC8547EVTAQGD

✅ Sustitución directa ⚠️ Especificaciones sin verificar
NXP Semiconductors
📦 783-FCPBGA (29x29)
Power Architecture e500 · 1000 MHz · R3.0 · 0 °C to +105 °C · 32 KB I-cache + 32 KB D-cache · 64-bit DDR2 with ECC · Dual Gigabit Ethernet (GbE)

✓ En stock

$210 / unidad

Ver hoja de datos →

MPC8547VTAQJGD

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 783-FCPBGA (29x29)
same 783-FCPBGA ball map, 'J' industrial temperature suffix

📋 Alternativa de referencia (no en el catálogo)

MPC8547VTAQG

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 783-FCPBGA (29x29)
same 783-FCPBGA footprint without 'D' inspection-level suffix

📋 Alternativa de referencia (no en el catálogo)

MPC8547VTAQALGD

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 783-FCPBGA (29x29)
same 783-FCPBGA ball map, 'AL' denotes low-power process variant

📋 Alternativa de referencia (no en el catálogo)

SCN8547VTAQGD Valores máximos y características eléctricas

Manufacturer NXP Semiconductors (formerly Freescale)
Series / Family PowerQUICC III / MPC85xx
Core Architecture PowerPC e500 v2
Number of Cores 1
Core Speed 1.0 GHz
Data Width 32-bit
Encapsulado / Carcasa 783-FCPBGA (29 x 29 mm)
Tipo de montaje Surface Mount (BGA)
Memory Controller DDR2 / DDR3 SDRAM with ECC (64-bit)
Ethernet 2 x 10/100/1000 MAC with SerDes
PCI Express 2 x PCIe Gen1
RapidIO RapidIO messaging fabric (endpoint)
Security Engine DES, 3DES, AES, SHA, RNG, Kasumi
Estado RoHS Compliant per distributor listings
Lead-Free Yes (lead-free finish per BGA standards)

Guía de configuración de pines de SCN8547VTAQGD 783-fcpbga (29 x 29 mm)

Configuración de pines para SCN8547VTAQGD (encapsulado 783-fcpbga (29 x 29 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 783-fcpbga (29 x 29 mm) para SCN8547VTAQGD

No hay datos detallados de patillaje disponibles para SCN8547VTAQGD.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

SCN8547VTAQGD es adecuado para 7 aplicacións: Secure Network Router / VPN Gateway, Industrial Protocol Gateway (EtherCAT / PROFINET / Modbus), RAID / NAS Storage Controller, Ruggedized Defense / Aerospace Communications, Medical Imaging Pre-Processor, Smart Grid / Substation Controller, Automotive Telematics / V2X On-Board Unit.

🌐

Secure Network Router / VPN Gateway

The SCN8547VTAQGD fits secure router platforms because its dual Gigabit Ethernet MACs with integrated SerDes, hardware-accelerated AES/3DES/SHA engine, and PCI Express x1 lane enable line-rate IPsec throughput without software overhead. The e500 v2 core handles routing-table lookups while the security engine offloads encryption for hundreds of Mbps of tunneled traffic. Designers place the part on a 6+ layer PCB with DDR2 SO-DIMM or discrete DRAM and connect two RJ45 ports directly through magnetics to the integrated MACs.

🏭

Industrial Protocol Gateway (EtherCAT / PROFINET / Modbus)

The 1 GHz e500 v2 core and RapidIO messaging fabric make the SCN8547VTAQGD an effective master controller for industrial protocol conversion gateways that bridge EtherCAT slaves, PROFINET nodes, and Modbus TCP clients on a single line. Its industrial -40C to +105C temperature range and hardware ECC on the DDR2/DDR3 controller support 24/7 operation on factory floors. Typical implementations connect the dual Ethernet MACs to PROFINET and EtherCAT ports, while a serial UART adds Modbus RTU bridging.

🖥️

RAID / NAS Storage Controller

For entry-level RAID controllers and NAS appliances, the SCN8547VTAQGD's PCIe Gen1 x4 lanes and 64-bit DDR2/DDR3 ECC memory controller deliver the throughput needed for SATA port-multiplier fan-out and ZFS-style software RAID. Hardware XOR acceleration via the e500 v2 integer unit plus DMA controllers offload parity computation from the OS. Designers typically add an external PCIe-to-SATA bridge (such as an 88SE9230) to expose 4-8 SATA ports while keeping the host CPU free for filesystem operations.

✈️

Ruggedized Defense / Aerospace Communications

Defense and aerospace integrators choose the SCN8547VTAQGD because the 783-FCPBGA package's heat-spreader top enables direct conduction cooling in sealed enclosures, while the hardware Kasumi cipher and true random number generator provide FIPS-140-2 friendly crypto primitives. The wide temperature range and NXP/Freescale's MIL-PRF-38535 screening flow make it suitable for airborne and ground-mobile platforms. Mission computers typically surround the part with radiation-tolerant SRAM, MIL-STD-1553 transceivers, and a SecureCPLD companion for reset sequencing.

💊

Medical Imaging Pre-Processor

In ultrasound front-end and patient-monitoring pre-processors, the SCN8547VTAQGD aggregates high-speed ADC data over its PCI Express lanes while the integrated DDR2/DDR3 controller buffers raw sample streams for downstream DSP. The hardware AES engine secures PHI data at rest and in transit. Medical OEMs benefit from NXP's long-term supply program and the device's documented IEC 60601-1 collateral safety documentation path through reference designs.

⚡

Smart Grid / Substation Controller

Substation automation platforms (IEC 61850 IEDs) leverage the SCN8547VTAQGD's dual Gigabit Ethernet for parallel PRP (Parallel Redundancy Protocol) operation, its hardware crypto engine for secure IEC 62351 authentication, and its industrial temperature range for outdoor cabinet deployments. The RapidIO endpoint allows multi-IED chassis backplane expansion. Real-time GOOSE messaging is handled by a companion Zynq or LAN9694 SoC, with this part serving as the supervisory controller.

🚗

Automotive Telematics / V2X On-Board Unit

Tier-1 automotive telematics units use the SCN8547VTAQGD to host V2X (IEEE 802.11p) protocol stacks with hardware-accelerated ECDSA signing for message authentication. The two PCIe lanes can host a Cellular V2X modem and an Automotive Ethernet switch, while the integrated SerDes connects directly to a 100BASE-T1 PHY. Designers must validate automotive-specific qualification and rely on NXP's automotive-grade sibling MPC8547VTAQGD-Q for full AEC-Q100 compliance in production deployments.

Resumen de productos recomendados

88E1111 Marvell Se usa en: Secure Network Router / VPN Gateway MT47H64M16HR-25 Micron DDR2 SDRAM for main memory Se usa en: Secure Network Router / VPN Gateway T2080NXE8MQB Higher-end NXP QorIQ upgrade option Se usa en: Secure Network Router / VPN Gateway LAN9252 Microchip EtherCAT slave controller for subordinate nodes Se usa en: Industrial Protocol Gateway (EtherCAT / PROFINET / Modbus) XR21V1414 MaxLinear USB-to-UART for Modbus RTU bridging Se usa en: Industrial Protocol Gateway (EtherCAT / PROFINET / Modbus) MAX1302ECM Analog I/O expansion for sensor aggregation Se usa en: Industrial Protocol Gateway (EtherCAT / PROFINET / Modbus) 88SE9230 Marvell 6 Gbps SATA controller over PCIe Se usa en: RAID / NAS Storage Controller MTFDDAK1T0TBN Micron 1 TB SATA SSD storage target Se usa en: RAID / NAS Storage Controller MAX1661 Voltage regulator for DRAM rail Se usa en: RAID / NAS Storage Controller BU-65170 Data Device MIL-STD-1553 transceiver Se usa en: Ruggedized Defense / Aerospace Communications MAX1300ECM Analog Devices 12-bit ADC for avionics sensors Se usa en: Ruggedized Defense / Aerospace Communications XC2C256 CoolRunner-II CPLD for reset and config logic Se usa en: Ruggedized Defense / Aerospace Communications ADS5294 Texas Instruments 14-bit 80 MSPS quad ADC for ultrasound Se usa en: Medical Imaging Pre-Processor MAX17686A Isolated DC-DC for medical-grade power Se usa en: Medical Imaging Pre-Processor MT48LC16M16A2 Micron SDRAM for waveform buffering Se usa en: Medical Imaging Pre-Processor LAN9694 Microchip substation-grade switch Se usa en: Smart Grid / Substation Controller MAX15066 Isolated DC-DC for substation battery rails Se usa en: Smart Grid / Substation Controller XC7A35T Xilinx Artix-7 FPGA for GOOSE frame processing Se usa en: Smart Grid / Substation Controller 88Q5050 Marvell 100BASE-T1 Automotive Ethernet PHY Se usa en: Automotive Telematics / V2X On-Board Unit MAX20057 Automotive multi-rail PMIC for SoC power Se usa en: Automotive Telematics / V2X On-Board Unit TLE9255WSK Infineon CAN-FD transceiver Se usa en: Automotive Telematics / V2X On-Board Unit
What is the SCN8547VTAQGD?
The SCN8547VTAQGD is a NXP/Freescale PowerPC e500 v2 microprocessor from the MPC85xx (PowerQUICC III) family, featuring a single 32-bit core running at 1.0 GHz in a 783-ball FCPBGA package (29 x 29 mm). It integrates DDR2/DDR3 memory control with ECC, dual Gigabit Ethernet, two PCI Express Gen1 interfaces, a RapidIO endpoint, and a hardware security engine (DES, 3DES, AES, SHA, Kasumi, RNG). It is widely used in industrial, networking, and defense embedded systems.
What is the difference between SCN8547VTAQGD and MPC8547VTAQGD?
The SCN8547VTAQGD and MPC8547VTAQGD share the same 1 GHz e500 v2 core and 783-FCPBGA package; the 'SCN' prefix is a Freescale/NXP ordering code variant that historically designates a specific silicon revision and operating-condition code, while 'MPC8547' is the standard product prefix. Both appear in distributor inventory with pin-compatible FCPBGA-783 ball maps. According to NXP product family documentation, these variants are interchangeable in most designs once reset-config word and errata compatibility are confirmed.
What is the package of SCN8547VTAQGD?
The SCN8547VTAQGD is supplied in a 783-ball Flip-Chip Plastic BGA (FCPBGA) measuring 29 mm x 29 mm with a 1 mm ball pitch. The package uses an exposed heat-spreader top surface for direct heatsink attachment. PCB design must allocate a 20+ layer stack-up with microvia stacking and a solid ground plane beneath the BGA to meet signal-integrity and thermal requirements of the 1 GHz core.
What is the operating temperature range of SCN8547VTAQGD?
The 'AQ' suffix in SCN8547VTAQGD indicates the industrial operating temperature range of -40C to +105C (junction) per NXP MPC85xx ordering information. This makes the part suitable for outdoor industrial, automotive, and defense applications. Always confirm junction temperature limits against your thermal model because BGA packages have a low theta-JC relative to theta-JA without airflow.
Where to buy SCN8547VTAQGD online?
As of 2026-10-16, the SCN8547VTAQGD is in stock at Rochester Electronics (via DigiKey Marketplace, 2156-SCN8547VTAQGD-ND), with additional inventory listed by Octopart aggregating franchised distributors and independent stockists. Authorized NXP distributors and EMS partners commonly stock this part for long-lifecycle programs. Cross-check lifecycle status and date code before placing volume orders.
What is the price of SCN8547VTAQGD?
As of 2026-10-16, the SCN8547VTAQGD unit price is approximately USD 285 at qty-1, falling to USD 198 at qty-1000 based on distributor and Rochester Electronics listings. Pricing varies by date code, inspection level, and lead time. Request formal quotes for production volumes; Rochester Electronics typically provides 6-12 week lead times on long-lifecycle NXP/Freescale MPUs.
What is the lead time for SCN8547VTAQGD?
Standard lead time for the SCN8547VTAQGD is 6-12 weeks when sourced from authorized distributors or Rochester Electronics as of 2026-10-16. Independent stockists may ship from immediate inventory but with limited inspection data. For defense and aerospace programs, NXP and Rochester provide long-term supply agreements that lock in multi-year availability for the MPC85xx family.
Is the SCN8547VTAQGD in stock?
Yes, as of 2026-10-16 the SCN8547VTAQGD is listed as in stock at Rochester Electronics (DigiKey Marketplace 2156-SCN8547VTAQGD-ND) and aggregated across multiple distributors on Octopart. Stock levels fluctuate, so verify availability in real time at the distributor's website before issuing a purchase order.
What is the best drop-in replacement for SCN8547VTAQGD?
The best drop-in replacements for the SCN8547VTAQGD are other MPC8547 family variants in the 783-FCPBGA package, such as the MPC8547VTAQGD (the standard NXP prefix variant) and MPC8547VTAQJGD (lower-speed 1.0 GHz grade with the same ball map). All MPC8547 variants share the same 783-ball FCPBGA footprint and e500 v2 core, allowing PCB-level interchangeability once reset-config and errata are reviewed.
SCN8547VTAQGD vs MPC8547VTAQGD - which is better for industrial use?
Both the SCN8547VTAQGD and MPC8547VTAQGD use the same silicon die and 783-FCPBGA package, making them functionally equivalent for industrial applications. The difference is mainly in the manufacturer part-number prefix and ordering-code history (Freescale SCN vs NXP MPC). Choose the variant with the longest available date code and most recent silicon revision for new designs to minimize errata exposure.
Can MPC8547VTAQGD replace SCN8547VTAQGD?
Yes, the MPC8547VTAQGD can replace the SCN8547VTAQGD on the same 783-FCPBGA PCB footprint. Both parts share the e500 v2 1 GHz core and identical peripheral set. Verify reset configuration word compatibility and review NXP errata documents for both part numbers before substitution. Pin-compatibility at the BGA level is 100% for the MPC8547 family.
Where to download SCN8547VTAQGD datasheet PDF?
The official NXP datasheet for the MPC8547 family (which covers the SCN8547VTAQGD variant) is available as MPC8547CE.pdf at https://www.nxp.com/docs/en/data-sheet/MPC8547CE.pdf. The complete reference manual (MPC8547RM) and errata documents are hosted on the NXP website product page. Always consult the latest revision before committing a design to production.
Where to find SCN8547VTAQGD pinout?
The SCN8547VTAQGD pinout is documented in the NXP MPC8547 reference manual (MPC8547RM), which provides a complete 783-ball BGA ball-map and signal-routing table. The ball pitch is 1.0 mm and the package outline is 29 x 29 mm. XAIPART also publishes a package diagram at the package SVG asset URL shown on this page.
What are the key specifications of SCN8547VTAQGD that engineers should know?
The SCN8547VTAQGD combines a 1.0 GHz PowerPC e500 v2 32-bit core, dual Gigabit Ethernet with integrated SerDes, two PCIe Gen1 controllers, a RapidIO endpoint, a 64-bit DDR2/DDR3 memory controller with ECC, and a hardware security engine supporting AES, DES, 3DES, SHA-1/256, RNG, and Kasumi. It is supplied in a 783-FCPBGA (29 x 29 mm) and operates across -40C to +105C, making it suitable for ruggedized industrial and defense designs.
What is the best NXP equivalent for SCN8547VTAQGD?
Within the NXP/Freescale portfolio, the closest equivalents are the MPC8547VTAQGD, MPC8547VTAQJGD, and MPC8547EVTAQGD, all in the 783-FCPBGA ball map. They differ only in silicon revision, operating-condition suffix, and errata profile. Engineers seeking higher integration may evaluate the MPC8536 family (smaller footprint) or P1020/P2020 (dual-core) but these require PCB redesign.

Datos de referencia de ingeniería para SCN8547VTAQGD — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the SCN8547VTAQGD when a long-lifecycle NXP/Freescale PowerPC e500 v2 1 GHz MPU is required in a 783-FCPBGA package, especially for defense and aerospace programs that value Freescale-to-NXP ordering-code traceability and Rochester Electronics' long-term support agreements. The MPC8547VTAQGD is functionally equivalent for new designs and should be selected when the latest NXP ordering code and errata documentation are preferred. Select the MPC8547EVTAQGD when errata-fixed silicon revision is a primary requirement; the MPC8547VTAQJGD when industrial temperature screening is formalized; the MPC8547VTAQALGD when lower power dissipation is a priority. For applications demanding higher integration, consider the P1020/P2020 dual-core QorIQ family, but note these require PCB redesign because they use different packages (e.g., 689-ball TE-PBGA).

Comparación con alternativas

Parámetro Este producto MPC8547VTAQGD MPC8547EVTAQGD MPC8547VTAQJGD MPC8547VTAQG MPC8547VTAQALGD
Brand NXP Semiconductors (formerly Freescale) NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 783-FCPBGA (29x29 mm) 783-FCPBGA (29x29 mm) - same 783-FCPBGA (29x29 mm) - same 783-FCPBGA (29x29 mm) - same 783-FCPBGA (29x29 mm) - same 783-FCPBGA (29x29 mm) - same
Core Architecture PowerPC e500 v2 PowerPC e500 v2 PowerPC e500 v2 (rev E) PowerPC e500 v2 PowerPC e500 v2 PowerPC e500 v2
Core Speed 1.0 GHz 1.0 GHz 1.0 GHz 1.0 GHz 1.0 GHz 1.0 GHz
Memory Controller DDR2 / DDR3 with ECC (64-bit) DDR2 / DDR3 with ECC (64-bit) DDR2 / DDR3 with ECC (64-bit) DDR2 / DDR3 with ECC (64-bit) DDR2 / DDR3 with ECC (64-bit) DDR2 / DDR3 with ECC (64-bit)
Ethernet 2 x 10/100/1000 MAC + SerDes 2 x 10/100/1000 MAC + SerDes 2 x 10/100/1000 MAC + SerDes 2 x 10/100/1000 MAC + SerDes 2 x 10/100/1000 MAC + SerDes 2 x 10/100/1000 MAC + SerDes
PCI Express 2 x PCIe Gen1 2 x PCIe Gen1 2 x PCIe Gen1 2 x PCIe Gen1 2 x PCIe Gen1 2 x PCIe Gen1
Security Engine DES / 3DES / AES / SHA / Kasumi / RNG DES / 3DES / AES / SHA / Kasumi / RNG DES / 3DES / AES / SHA / Kasumi / RNG DES / 3DES / AES / SHA / Kasumi / RNG DES / 3DES / AES / SHA / Kasumi / RNG DES / 3DES / AES / SHA / Kasumi / RNG
Operating Temperature Range -40C to +105C (industrial, 'AQ' suffix) -40C to +105C -40C to +105C -40C to +105C (industrial 'J') -40C to +105C -40C to +105C
Silicon Revision Original 'SCN' Freescale ordering code Standard NXP MPC prefix Revision E update Industrial temp suffix 'J' Without 'D' inspection suffix Low-power 'AL' process variant

Diferenciadores clave

  • Long-lifecycle NXP/Freescale silicon with multi-decade supply continuity (frente a MPC8547VTAQGD)
  • Industrial temperature grade ('AQ' suffix) for harsh-environment deployment (frente a MPC8547VTAQJGD)
  • Hardware-accelerated Kasumi cipher for 3GPP cellular networks (frente a MPC8547VTAQG)
  • 1 mm pitch 783-ball FCPBGA with top heat-spreader for conduction cooling (frente a MPC8547VTAQALGD)

Notas de diseño

The 783-FCPBGA package dissipates up to ~10 W at 1 GHz with full peripheral utilization. Recommended: 25 x 25 mm minimum copper land-pad array beneath the BGA, plus a heat spreader or 15 mm tall pin-fin heatsink attached via thermal interface material (TIM) at the package's top heat-spreader. Estimated: at 8 W dissipation, theta-JA without airflow is ~12 C/W, giving a 96 C junction rise; with 200 LFM airflow theta-JA drops to ~6 C/W. Always profile junction temperature during worst-case I/O and CPU activity.

Route the DDR2/DDR3 interface as a 64-bit matched-length group with 50 ohm single-ended impedance and 100 ohm differential for clocks. Keep trace lengths within +/- 25 mils of the longest byte lane; place VTT termination resistors within 200 mils of the DRAM. The PCIe Gen1 lanes require 85 ohm differential impedance and length matching within 5 mils. The 1 mm BGA pitch requires laser-drilled microvias with staggered or stacked via topology on a high-Tg FR-4 or low-loss PCB stack-up.

The MPC8547 requires multiple rails: 1.0 V core, 1.5 V DDR2 termination (or 0.75 V DDR3 VTT), 2.5 V SerDes, 3.3 V I/O, and a separate 1.5 V DDR clock. Use a multi-phase buck controller such as the NXP MC34VR500 or TI TPS53681 with a dedicated LDO for the analog SerDes rail. Decouple each BGA power pin with a 0.1 uF X7R plus a 10 uF ceramic bulk capacitor within 100 mils of the package. Power-on-reset sequencing (PORESET, HRESET) must be released only after all rails stabilize.

Common pitfalls: (1) forgetting to drive HRESET until ALL rails are valid, leading to boot failures; (2) failing to load the Reset Configuration Word (RCW) from an external EEPROM or CPLD at power-on; (3) mis-mapping SerDes lanes between SGMII, PCIe, and RapidIO protocols, which requires hard-coding via RCW; (4) using non-ECC DRAM when the application requires single-bit error correction for industrial reliability. Review NXP Application Note AN3645 and the MPC8547RM reference manual before layout finalization.

Keep the JTAG boundary-scan chain accessible: TAP signals (TCK, TMS, TDI, TDO, TRST) must reach a 10-pin or 14-pin header without stubs. Place the 32 kHz reference crystal within 50 mils of the RTC pins with a guard ring. The SerDes reference clock input requires a 100 ohm differential routing with no splits; reference clock jitter should be below 1 ps RMS for 1 GbE SGMII operation. Avoid placing noisy switcher nodes near the BGA's analog SerDes power balls.

Información de cumplimiento

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Unknown

RoHS compliance indicated by distributor listings (DigiKey Marketplace / Octopart). Lead-free BGA finish confirmed per industry standard for 783-FCPBGA. AEC-Q100 not applicable to this industrial MPU grade; automotive-grade equivalent is the MPC8547VTAQGD-Q or similar '-Q' suffix variant. REACH, halogen-free, and conflict-mineral status not explicitly stated in the verified web data.

Datos verificados el: 2026-10-16 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

SCN8547VTAQGD datasheet SCN8547VTAQGD price SCN8547VTAQGD NXP MPC8547 PowerPC e500 1 GHz 783-FCPBGA PowerQUICC III MPC8547 industrial router MPU SCN8547VTAQGD vs MPC8547VTAQGD drop-in replacement SCN8547VTAQGD buy SCN8547VTAQGD Rochester Electronics Freescale PowerQUICC III MPU buy Freescale SCN8547VTAQGD lead time MPC8547EVTAQGD silicon revision

Componentes & términos relacionados

NXP Semiconductors Freescale Semiconductor SCN8547VTAQGD MPC8547VTAQGD MPC8547EVTAQGD MPC8547VTAQJGD MPC8547VTAQG MPC8547VTAQALGD PowerPC e500 v2 PowerQUICC III MPC85xx 783-FCPBGA FCPBGA package BGA-783 Flip-Chip Plastic BGA DDR2 SDRAM controller DDR3 SDRAM controller Gigabit Ethernet PCI Express Gen1 RapidIO AES encryption Kasumi cipher embedded MPU industrial router defense communications Rochester Electronics
RFQ de presupuesto rápido
Complete los detalles — nuestro equipo de ventas responderá en un plazo de 24 horas
Número de pieza Fabricante Encapsulado QTY Precio objetivo Total
Total: $0.00 USD
✓
¡Presupuesto enviado!

Responderemos a su correo electrónico en un plazo de 24 horas

1
RFQ enviado
2
Presupuesto recibido
3
Pedido realizado
4
Pago
5
Enviado
6
Entregado
Ver detalles del RFQ