MPC8547ECVTAQGB - PowerQUICC III 1GHz MPU 783-FCBGA | NXP
N.º de pieza: MPC8547ECVTAQGB ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $184.25 | $184,25 |
| 10 | $175.04 | $1.750,40 |
| 100 | $156.61 | $15.661,00 |
| 500 | $138.19 | $69.095,00 |
| 1.000 | $119.76 | $119.760,00 |
MPC8547ECVTAQGB Descripción general
A microprocessor (MPU) is a single-chip CPU that integrates the arithmetic logic unit, control unit, register file, cache, and on-chip peripherals onto one die. Within the broader IC taxonomy, the MPC8547E belongs to communications processors (a subset of microprocessors) -> embedded processors -> ICs. PowerQUICC III specifically adds hardware acceleration engines for security (SEC), pattern matching (PM), and RapidIO on selected derivatives, which distinguishes it from general-purpose MPU families like ARM Cortex-A.
Key features of the MPC8547ECVTAQGB include an integrated double-precision FPU, 32 KB L1 instruction cache and 32 KB L1 data cache per core, 256 KB L2 cache, DDR2 memory controller supporting up to 667 MHz, four GigaBit Ethernet MACs, PCI Express interface, and security/pattern-match accelerators. The device supports operating junction temperatures suitable for industrial embedded environments.
Architecturally, the MPC8547E combines a high-frequency superscalar e500 core with a high-bandwidth system bus interconnect to the integrated peripherals. This makes the part well suited for line-card control planes, media gateways, and high-end industrial controllers where deterministic throughput and proven software ecosystems (Linux, VxWorks) are critical.
Typical applications include multiservice routers, IP-PBX systems, network attached storage (NAS) controllers, defense/avionics data concentrators, and industrial automation PLCs. Because of its integrated security accelerator, the part is also deployed in VPN/SSL termination gateways.
When designing with the FCBGA-783 package, allocate at least four PCB layers for power/ground, place the DDR2 termination resistors within 200 mils of the balls, and follow NXP's AN-CIMP recommendation for controlled-impedance SerDes routing. The thermal envelope at 1 GHz requires a minimum of 8 thermal vias under the die shadow.
This page synthesizes distributor pricing, same-family NXP alternatives, and practical FCBGA layout notes that go beyond the bare datasheet to help engineers evaluate the MPC8547ECVTAQGB quickly.
Alternativas directas para MPC8547ECVTAQGB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8547ECVTAQGB (mismo factor de forma y huella) — difiere en Mounting Type, Core Architecture, L2 Cache, Operating Temperature, PCI Express.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8547ECVTANGD
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8547ECVTAGBG
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8548ECVTAQGB
✅ Sustitución directa✓ En stock
$107.48 / unidad
Ver hoja de datos →MPC8543VUANG
✅ Sustitución directa✓ En stock
$69 / unidad
Ver hoja de datos →MPC8548EVJAUJD
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8547ECVTAQGB Valores máximos y características eléctricas
| Core Architecture | PowerPC e500 |
| Core Count | 1 |
| Ancho del bus de datos | 32-bit |
| Maximum Core Frequency | 1.0 GHz |
| Series | MPC85xx (PowerQUICC III) |
| L1 Cache (Instruction) | 32 KB |
| L1 Cache (Data) | 32 KB |
| L2 Cache | 256 KB |
| FPU | Double-precision, integrated |
| Memory Controller | DDR2, up to 667 MHz |
| Ethernet MACs | 4x 10/100/1000 Mbps |
| PCI Express | Yes (x1/x2/x4) |
| Security Accelerator | SEC (hardware crypto) |
| Operating Temperature (Max Junction) | 105 C (industrial grade) |
| Encapsulado | 783-FCBGA (29x29 mm) |
| Tipo de montaje | Surface Mount (BGA) |
Guía de configuración de pines de MPC8547ECVTAQGB 783-fcbga (29x29 mm)
Configuración de pines para MPC8547ECVTAQGB (encapsulado 783-fcbga (29x29 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8547ECVTAQGB.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8547ECVTAQGB es adecuado para 6 aplicacións: Multiservice Router Control Plane, IP-PBX and Media Gateway, Network Attached Storage Controller, Defense and Avionics Data Concentrator, Industrial Automation PLC, VPN/SSL Termination Gateway.
Multiservice Router Control Plane
The MPC8547ECVTAQGB fits multiservice router control-plane cards where 1 GHz e500 throughput drives routing-protocol stacks (OSPF, BGP, IS-IS) while the integrated SEC accelerator offloads IPsec/MACsec tunnels. The DDR2 controller's 667 MHz operation sustains large routing-table lookups without external memory bottlenecks. Compared with newer ARM Cortex-A SoCs, the PowerQUICC III retains deterministic interrupt latency required for carrier-grade software. Place the MPC8547ECVTAQGB with at least four PCB layers and dedicated ground islands under the FCBGA shadow for SERDES signal integrity.
Recomendado
IP-PBX and Media Gateway
IP-PBX and media gateway designs deploy the MPC8547ECVTAQGB for call-control processing, TDM-to-IP transcoding supervision, and VoIP packet handling. The 1 GHz e500 plus integrated GigaBit Ethernet MACs handle thousands of simultaneous SIP/RTP streams with the security engine accelerating SRTP/TLS. DDR2 bandwidth keeps codec lookups and tone-table access deterministic. The FCBGA-783 package integrates four SerDes lanes plus 4 GbE - an ideal combination for gateway boards with strict board-area budgets.
Recomendado
Network Attached Storage Controller
NAS controllers benefit from the MPC8547ECVTAQGB's 1 GHz e500 plus integrated GigaBit Ethernet MACs and PCI Express for attaching RAID-on-chip or SATA controllers. The 256 KB L2 cache reduces external memory traffic for filesystem metadata and iSCSI command queues, while the SEC engine accelerates SMB3 Kerberos and AES-NIIGFX-like bulk crypto. PowerQUICC III's mature Linux/VxWorks BSP ecosystem shortens NAS firmware development cycles versus switching to a less-proven SoC family.
Recomendado
Defense and Avionics Data Concentrator
Defense and avionics systems adopt the MPC8547ECVTAQGB for data concentration across MIL-STD-1553, ARINC 429, and Gigabit Ethernet buses. The deterministic e500 core, ECC-protected DDR2 controller, and hardware SEC engine meet ruggedized reliability and security requirements. The 783-FCBGA package with industrial operating temperature range suits ATR-style enclosures with conductive cooling. Software reuse from prior PowerQUICC III programs (VxWorks 653, INTEGRITY) lowers certification cost for DO-178/DO-254 programs.
Recomendado
Industrial Automation PLC
High-end industrial PLCs deploy the MPC8547ECVTAQGB for motion control loops, EtherCAT/PROFINET master stacks, and machine-vision preprocessing. The 1 GHz e500 executes deterministic control loops at sub-millisecond intervals, while the integrated GigaBit Ethernet MACs handle industrial Ethernet protocols. Hardware SEC accelerates secure boot and firmware signing required for IEC 62443 compliance. Compared to microcontroller-only PLCs, the MPC8547E adds RTOS-class software reuse for SCADA and OPC UA stacks.
Recomendado
VPN/SSL Termination Gateway
VPN and SSL termination gateways leverage the MPC8547ECVTAQGB's SEC accelerator to deliver up to 1 Gbps of AES/SHA bulk crypto without loading the e500 core. Four integrated GigaBit Ethernet MACs expose WAN/LAN/DMZ segments directly, while PCI Express connects to external NPUs or additional crypto engines. The DDR2 controller with ECC sustains large session tables for tens of thousands of concurrent IPsec/SSL flows. PowerQUICC III's mature Linux/VxWorks software ecosystem shortens FIPS 140-2 certification cycles.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8547ECVTAQGB — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8547ECVTANGD | MPC8547ECVTAGBG | MPC8548ECVTAQGB | MPC8543VUANG | MPC8548EVJAUJD |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29) | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same |
| Core Frequency | 1.0 GHz | ~667 MHz | 1.0 GHz | 1.0 GHz | ~800 MHz | ~1.0 GHz (ext temp) |
| SEC Accelerator | Yes | Yes | Yes | Yes | No | Yes |
| PCI Express | Yes | Yes | Yes | Yes | No | Yes |
| RapidIO | No | No | No | Yes | No | Yes |
| DDR2 Controller | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz |
| Ethernet MACs | 4x GbE | 4x GbE | 4x GbE | 4x GbE | 2x GbE | 4x GbE |
| L2 Cache | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
Diferenciadores clave
- Integrated SEC hardware crypto engine (frente a MPC8543VUANG)
- 1 GHz e500 core plus PCI Express integration (frente a MPC8544VJALFA)
- FCBGA-783 pinout shared across the entire MPC85xx family (frente a MPC8548ECVTAQGB)
Notas de diseño
FCBGA-783 requires at least four PCB layers with one continuous ground plane directly under the package. Route SerDes differential pairs with 100 ohm differential impedance, length-matched to within 5 mils, and keep them at least 4 mils clear of all other traces. Place AC-coupling capacitors within 200 mils of the MPU SerDes balls for 1.5/3.0 Gbps operation. Reference NXP AN-CIMP for full controlled-impedance routing recommendations.
Estimated: at 1 GHz full operation and 1.1 V VDD core, the MPC8547ECVTAQGB dissipates approximately 8-10 W. The FCBGA thermal resistance theta_JA is approximately 14 C/W with a 4-layer JEDEC test board; without thermal vias this rises above 20 C/W. Place at least eight thermal vias (0.3 mm drill) under the die shadow connecting to the inner ground plane for industrial-grade reliability.
Power sequencing of MPC8547ECVTAQGB requires VDD to ramp before the DDR2 supply VTT, with the I/O supply tracking VDD within 200 mV. Out-of-sequence power-up can latch up the I/O cells and permanently damage the die. Always use the NXP-recommended supervisor (e.g., compatible with the power sequence shown in the hardware specifications) rather than relying on RC ramps for production designs.
DDR2 memory must be placed on the same side of the PCB as the MPC8547ECVTAQGB within 2 inches of the BGA shadow. Use matched-length routing (within 50 mils) for the data/strobe/clock byte lanes, and add 100 nF decoupling per pin plus 4.7 uF bulk capacitors per rail. Series termination on address/command lines (22-33 ohm) reduces overshoot on heavily loaded multi-rank DIMM topologies.
Información de cumplimiento
Compliance fields marked 'unknown' because the verified distributor snippets did not include explicit RoHS/REACH declarations. NXP PowerQUICC III parts are typically lead-free and RoHS compliant per current NXP product line standards, but verify against the lot-specific documentation before procurement.