MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP
部品番号: MPC860TCZQ50D4 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $27.5 | $27.50 |
| 10 | $24.85 | $248.50 |
| 100 | $21.4 | $2,140.00 |
| 500 | $18.95 | $9,475.00 |
| 1,000 | $16.8 | $16,800.00 |
MPC860TCZQ50D4 概要
An MPU (Microprocessor Unit) is an integrated processor device built around a CPU core, on-chip memory controllers and peripheral interfaces, sitting one tier above a microcontroller and one tier below an SoC in the embedded computing hierarchy. The MPC860TCZQ50D4 belongs to NXP's MPC8xx PowerQUICC family - a widely deployed communications-oriented processor family that combines general-purpose control processing with dedicated serial-channel hardware for protocol termination.
Key features of the MPC860TCZQ50D4 include integrated 4-channel DMA, 8KB instruction/data cache, memory controller with DRAM support up to 256 MB, and the embedded CPM block supporting HDLC/SDLC, UART, BISYNC, and Ethernet (10 Mbps) protocol termination. The 357-pin BGA package provides the I/O density required for the 32-bit address/data bus and the multiple serial-channel pins.
Architecturally, the device separates control-plane work (PowerPC core) from data-plane communication work (CPM), enabling concurrent protocol handling without burdening the main CPU. The CPM uses microcoded RISC engines (CP) and serial-interface controllers (SCC/SMC) to offload framing, CRC, and HDLC bit-stuffing tasks from the host CPU, reducing interrupt load in router/bridge/DSLAM designs.
Typical applications include WAN routers, ISDN/ADSL modems, Ethernet bridges, industrial control and HMI controllers, and legacy telecom line cards. The PowerQUICC family is well documented in NXP/Freescale reference designs and the Green Hills INTEGRITY, VxWorks, and Linux (pre-2020 LTS) BSP ecosystems.
When designing with this part, note that the device is now End-of-Life per NXP, with last-time-buy window passed. New designs should consider the PowerQUICC II (MPC82xx) or QorIQ families for forward compatibility, while existing hardware can be maintained with the part itself or with verified stock held by franchise distributors.
This page aggregates distributor pricing (DigiKey 2026-10-16), drop-in alternative families from the MPC8xx product line, and practical design notes not consolidated in the original PowerQUICC hardware specifications manual.
ドロップイン代替品: MPC860TCZQ50D4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC860TCZQ50D4 （同一形状・フットプリント） — 相違点: Core Architecture, Memory Controller, Package, RoHS Status, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
MPC860SRCZQ50D4
✅ ドロップイン✓ 在庫あり
$64.5 / 個
データシートを見る →MPC860SRZQ50D4
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC860TVR50D4
✅ ドロップイン✓ 在庫あり
$58 / 個
データシートを見る →MPC855TVR50D4
✅ ドロップイン✓ 在庫あり
$48.1 / 個
データシートを見る →MPC860DTCZQ50D4
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC860TCZQ50D4 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Number | MPC860TCZQ50D4 |
| Family | PowerQUICC / MPC8xx |
| Core | MPC8xx - 1 core, 32-bit |
| Core Architecture | PowerPC |
| Core Clock Speed | 50 MHz |
| Instruction / Data Cache | 4 KB / 4 KB (unified 8KB figure variant-dependent) |
| 動作電源電圧 | 2 V to 3.6 V (per FindIC comparison page) |
| パッケージ | 357-PBGA (25x25 mm), ZQ suffix |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +95C (industrial) |
| RoHS ステータス | Non-Compliant (per NXP product page / DigiChip datasheet) |
| Lead-Free | Contains lead (ZQ denotes tin-lead ball finish) |
| CPM (Communications Processor Module) | Integrated - HDLC, UART, Ethernet 10 Mbps support |
| DMA Channels | 4 |
| Memory Controller | Up to 256 MB DRAM with page mode support |
| Process Technology | 0.32 um CMOS (per FindIC description) |
| ライフサイクル状態 | End of Life (NXP Last Time Buy window passed) |
MPC860TCZQ50D4 ピン構成
| ピン A1 | VDD — Core supply (3.3V typical) |
| ピン A20 | GND — Ground |
| ピン B1 | IRQ0 — External interrupt request 0 |
| ピン AB1 | TCLK — Test clock |
| ピン AB20 | RESET — Reset input (open-drain) |
| ピン C5 | TXD1 — SCC1 transmit data (CPM) |
| ピン D4 | RXD2 — SCC2 receive data (CPM) |
| ピン E10 | D0 — Data bus bit 0 |
| ピン E11 | D1 — Data bus bit 1 |
| ピン F1 | A0 — Address bus bit 0 |
| ピン G20 | WE — Memory write enable |
| ピン H2 | RAS — DRAM row address strobe |
| ピン J18 | CAS — DRAM column address strobe |
| ピン K1 | BDIP — Bus busy data input/parity |
| ピン L20 | DP0 — DMA channel 0 request |
| ピン M5 | SMI — SPI mode input (CPM) |
| ピン N16 | VP — Versatile pin (special function) |
| ピン P3 | ENET_TXD — Ethernet transmit (CPM FEC/eCPM) |
| ピン R12 | ENET_RXD — Ethernet receive (CPM FEC) |
| ピン T7 | TRQ1 — Serial interrupt request 1 |
主な用途
MPC860TCZQ50D4 の用途: 6 件s: WAN Router Control Plane, ISDN / ADSL Modem Bridge, Legacy Industrial HMI Controller, Embedded Telecom Line Card, Networking Switch Management CPU, Ruggedized Printer / Imaging Controller.
WAN Router Control Plane
The NXP MPC860TCZQ50D4 fits WAN router control-plane applications because its integrated Communications Processor Module (CPM) handles HDLC, UART and Ethernet at 10 Mbps without burdening the PowerPC core with bit-level protocol work. The 50 MHz core clock provides adequate performance for routing-table management, SNMP polling, and CLI servicing. Compared to a discrete multi-chip design, the MPC860TCZQ50D4 cuts BOM by combining the CPU, memory controller (up to 256 MB DRAM) and serial-channel controllers in a single 357-PBGA package. EOL status means it is best for maintaining deployed router hardware rather than new product introductions.
おすすめ
ISDN / ADSL Modem Bridge
The MPC860TCZQ50D4 integrates the multi-channel DMA and SCC/SMC serial controllers that ISDN/ADSL modem bridges require for U-layer framing and link-management packet handling. Its 8KB instruction/data cache serves the small real-time control loops typical of modem firmware, while the CPM off-loads CRC and HDLC bit-stuffing tasks from the host CPU at line rate. The 3.3 V supply voltage aligns with the typical DSL modem transformer-driver rail. Place a 50 MHz MPC860TCZQ50D4 between the AFE and the host Ethernet MAC to terminate xDSL link-layer framing transparently.
おすすめ
Legacy Industrial HMI Controller
The MPC860TCZQ50D4 at 50 MHz has sufficient headroom for industrial HMI (Human-Machine Interface) controllers that drive modest-resolution LCD panels and aggregate fieldbus inputs through the integrated SCC ports. Its 4-channel DMA moves display frame-buffer data without CPU intervention, and the 357-PBGA package provides ample pin count for parallel LCD data buses plus UART links to external PLCs. Industrial-grade operating temperature (-40C to +95C) makes it suitable for factory-floor enclosures. Long product-lifecycle support makes EOL parts like this particularly amenable to legacy maintenance rather than new design wins.
おすすめ
Embedded Telecom Line Card
For E1/T1 line-card applications the MPC860TCZQ50D4 provides multi-channel HDLC termination through its SCC ports, supporting up to four full-duplex HDLC channels at T1/E1 rates. The integrated memory controller handles the per-channel descriptor DMA buffers in DRAM, reducing external glue logic. Pair the part with a single Ethernet PHY for backhaul aggregation, leveraging the integrated Ethernet block. The 357-BGA package is well suited to densely populated line cards where multiple BGA parts share the same PCB - the 25x25 mm body keeps the package compact.
おすすめ
Networking Switch Management CPU
The MPC860TCZQ50D4 suits layer-2 switch management-CPU use because the PowerPC core can run the management firmware stack (CLI, SNMP, RSTP) while the CPM handles ancillary serial-channel links for stacking cables or out-of-band management. The 50 MHz clock is comfortably above the floor for management-plane workloads. With 8 KB cache the part may offload routing-protocol forwarding to dedicated switch ASICs while managing health-monitoring and configuration. Most switch designs pair the MPC860TCZQ50D4 with an external Ethernet PHY rather than using the integrated Ethernet.
おすすめ
Ruggedized Printer / Imaging Controller
The MPC860TCZQ50D4 acts as the central controller in high-throughput industrial printers and imaging systems. Its 32-bit PowerPC core runs the page-description-language interpreter, while the SCC ports drive motor controllers and the integrated DMA feeds the print-head data path without CPU saturation. The 357-BGA package's high I/O count supports multiple dedicated UARTs for ink-jet driver boards plus a parallel interface to the imaging sensor. Industrial-temperature operation matches commercial printing/labeling environments, and the EOL lifecycle status aligns with the long-term service support typical of industrial-printing equipment.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC860TCZQ50D4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC860SRCZQ50D4 | MPC860SRZQ50D4 | MPC860TVR50D4 | MPC855TVR50D4 | MPC860DTCZQ50D4 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-BGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Architecture | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit |
| Core Clock Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Operating Voltage | 2 V - 3.6 V (3.3 V nominal) | 2 V - 3.6 V | 2 V - 3.6 V | 2 V - 3.6 V | 2 V - 3.6 V | 2 V - 3.6 V |
| Cache Size | 8 KB unified | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| CPM (Comm Processor Module) | Integrated | Integrated | Integrated | Integrated | Integrated | Integrated (with crypto) |
| Operating Temperature | -40C to +95C (industrial) | Extended grade | Standard grade | -40C to +95C | Industrial grade | Extended (DT suffix) |
| RoHS Compliance | Non-Compliant (ZQ = Pb balls) | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant |
| Lifecycle Status | EOL (NXP) | EOL | EOL | EOL | EOL | EOL |
主な差別化要因
- Integrated CPM reduces BOM for multi-channel serial applications （vs Discrete CPU plus external HDLC controllers)
- 50 MHz PowerPC core with on-chip 8KB cache （vs Older 68k-based Motorola MC68360)
- Wide 32-bit data bus and large DRAM controller （vs 16-bit bus MPU alternatives in same BGA-357 footprint)
設計ノート
Decouple the 357-BGA's VDD and GND balls with low-ESR ceramic capacitors placed as close as possible to each ball group. The MPC860TCZQ50D4 typically draws 1-2 W of core power at 50 MHz; budget for bulk decoupling on the 3.3 V rail with at least one 100 uF tantalum and 10 x 0.1 uF ceramic decoupling caps distributed across the BGA. Power sequencing is critical - apply VDD before driving the PORESET pin high, otherwise the CPM may enter an indeterminate state.
Estimated: at 1.5 W typical power dissipation in a 357-PBGA package with theta_JA around 20 C/W (4-layer PCB, no airflow), junction temperature rise is approximately 30 C above ambient. For enclosed industrial enclosures at +70 C ambient, junction remains within the 125 C maximum. For sealed fanless designs or higher ambient, add copper heatsink thermal pads or thermal vias beneath the package center ball matrix for additional thermal dissipation margin.
The 357-BGA pitch is 1.27 mm requiring via-in-pad or dog-bone escape routing in the PCB. Use 4+ layer stackup with continuous ground plane beneath the BGA, plus power islands on layer 2 and 4 for VDD. Match trace lengths within +/- 0.5 inches (12 mm) on the address and data bus. BGA reballing requires a stencil designed for the 1.27 mm pitch - use 0.5 mm aperture openings with 0.1 mm thickness stainless steel.
Place external SDRAM/DRAM chips with matched-length address and control traces (RAS, CAS, WE) routed together to avoid skew. The MPC860's memory controller generates the bus clock - route it on the inner PCB layer with controlled impedance 50 ohm +-10% to the SDRAM clock pin. Avoid running the bus clock adjacent to high-noise CPM serial lines - cross perpendicular or use ground pins to separate them.
EOL caveat: do not design new platforms around the MPC860TCZQ50D4. NXP has formally discontinued the part, and active firmware development (new Linux BSP versions) ended years ago. Existing designs should maintain a 12-24 month safety stock inventory of MPC860TCZQ50D4 units, with planning to migrate to PowerQUICC II (MPC8250/MPC8260) or QorIQ (P1020/T1024) when possible. Beware of counterfeit stock - buy from authorized NXP distributors only (DigiKey, Avnet, Rochester Electronics, Arrow), not from independent brokers.
コンプライアンス情報
Non-RoHS due to ZQ tin-lead ball finish per DigiChip datasheet summary. Reach-compliant per NXP product page standard disclosure. Not AEC-Q100 qualified (consumer/industrial networking target). Not lead-free; halogen-free status not explicitly stated in provided web data.
