MPC880CVR133 - PowerQUICC 32-Bit MPU, 133MHz, 357-PBGA
N.º de pieza: MPC880CVR133 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $47.98 | $47,98 |
| 10 | $44.5 | $445,00 |
| 100 | $39.2 | $3.920,00 |
| 500 | $35.4 | $17.700,00 |
| 1.000 | $32.1 | $32.100,00 |
MPC880CVR133 Descripción general
A PowerQUICC MPU is a category of integrated communications processor that combines a Power Architecture CPU core with system-on-chip peripherals such as serial interfaces, timers, and memory controllers. As an MPC8xx family device, the MPC880 sits within the broader taxonomy of microprocessor -> embedded MPU -> communications processor -> Power Architecture device -> semiconductor. The part addresses designers who need deterministic real-time performance together with integrated networking I/O.
Key differentiating characteristics of the MPC880CVR133 include the 133MHz 32-bit Power Architecture core, integrated communications peripheral module (CPM), 357-PBGA 25x25mm footprint, RoHS-compliant lead-free assembly, and an extended operating temperature range of -40C to +100C. Compared with the lower-frequency MPC860/MPC850 family members, the 133MHz clock rate and updated integration provide higher throughput for protocol handling without external glue logic.
Architecturally, the device combines a CPU32 core with separate CPM, dual-port system RAM, memory controller for SDRAM/ROM/Flash, Fast Ethernet and serial communications controllers, and PCMCIA interface logic. This SoC integration targets headless networking equipment where BOM reduction and deterministic interrupt response matter more than raw MHz. The PBGA package provides high-density interconnect for the 357 signals required by the integrated peripheral set.
Typical applications include industrial Ethernet routers, telecom control-plane boards, protocol bridges, ISDN modem controllers, WAN access multiplexers, and legacy PowerQUICC-based networking modules. Selection of the part is appropriate when engineers require a proven Power Architecture communications engine with broad software ecosystem support and long-life supply.
When designing with this device, allocate adequate PCB area for the 25x25mm BGA and use a minimum 4-layer stack-up with dedicated power and ground planes. BGA rework requires X-ray inspection or boundary-scan access; designers should plan JTAG debug headers and socket footprint options for prototype bring-up.
This page synthesizes current distributor pricing, drop-in alternative MPNs, and design notes curated beyond the manufacturer's datasheet summary, providing engineering context that pure parametric listings do not.
Alternativas directas para MPC880CVR133 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC880CVR133 (mismo factor de forma y huella) — difiere en Core Architecture, Package, Memory Controller, Operating Temperature, Family.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC880CZP133
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC885CVR133
✅ Sustitución directa✓ En stock
$37.95 / unidad
Ver hoja de datos →MPC880VR133
✅ Sustitución directa✓ En stock
$19.45 / unidad
Ver hoja de datos →MPC860TVR133
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC875ZT133
✅ Sustitución directa✓ En stock
$19.85 / unidad
Ver hoja de datos →MPC880CVR133-NXP
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC880CVR133 Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors |
| Part Number | MPC880CVR133 |
| Processor Type | MPC8xx PowerQUICC 32-Bit |
| Core Architecture | Power Architecture (CPU32) |
| Number of Cores | 1 |
| Ancho del bus de datos | 32-Bit |
| Maximum Clock Speed | 133 MHz |
| Tensión de alimentación de funcionamiento | 3.3 V |
| Encapsulado / Carcasa | 357-BBGA (PBGA-357, 25x25 mm) |
| Tipo de montaje | Surface Mount |
| Packaging | Tray |
| Temperatura de funcionamiento | -40C to +100C |
| Lead Free Status | Lead Free |
| Estado RoHS | RoHS Compliant |
| Product Family | MPC8xx PowerQUICC |
Guía de configuración de pines de MPC880CVR133 357-bbga (pbga-357, 25x25 mm)
Configuración de pines para MPC880CVR133 (encapsulado 357-bbga (pbga-357, 25x25 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC880CVR133.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC880CVR133 es adecuado para 6 aplicacións: Industrial Ethernet Router, Telecom Control-Plane Board, Legacy Network Print Server, ISDN Modem / WAN Access Equipment, Industrial Protocol Bridge, Embedded Networking Development Platform.
Industrial Ethernet Router
The MPC880CVR133's integrated PowerQUICC CPM with Fast Ethernet controllers and 133 MHz CPU32 core make it well-suited to industrial Ethernet routers and protocol bridges. The 357-PBGA 25x25mm package exposes enough parallel I/O to drive SDRAM, Flash, and dual MII Ethernet PHYs simultaneously. The part's -40C to +100C operating range supports deployment in factory cabinets and outdoor enclosures where consumer-grade parts fail. Deterministic CPM-based DMA handling of Ethernet frames leaves the CPU free for routing and management-plane tasks.
Recomendado
Telecom Control-Plane Board
Telecom equipment manufacturers used the MPC880CVR133 for control-plane processing in DSLAM line cards, T1/E1 multiplexers, and access multiplexers. The CPM handles HDLC/PPP framing for E1/T1 links while the CPU32 core runs the management stack. The 3.3V single-rail supply simplifies board power architecture for legacy telco slots. The 357-ball PBGA exposes the full address/data bus to external SDRAM, supporting the deterministic low-latency response required for control-plane protocols.
Recomendado
Legacy Network Print Server
Print server modules in enterprise networking products leveraged the MPC880CVR133 to offload TCP/IP and LPR protocol handling via the CPM and provide a high-speed parallel port to the printer engine. At 133 MHz the CPU32 can manage multiple concurrent print queues and protocol stacks. The PBGA-357 footprint is supported by mature BSD/BSP libraries that reduce time-to-market for legacy product refresh programs. The -40C to +100C range supports industrial printing environments.
Recomendado
ISDN Modem / WAN Access Equipment
ISDN terminal adapters and early broadband CPE relied on the MPC880CVR133's integrated serial controllers, glueless memory interface, and PowerQUICC CPM for high-speed DMA over ISDN BRI and PRI interfaces. The 133 MHz CPU32 core can terminate PPP and HDLC frames without external protocol engines. RoHS and lead-free compliance align the MPC880CVR133 with EU manufacturing regulations. Hot-swap and boundary-scan support via JTAG ease field repair of deployed telco equipment.
Recomendado
Industrial Protocol Bridge
Gateways bridging Modbus, PROFIBUS, and other industrial protocols to Ethernet TCP/IP benefit from the MPC880CVR133's mix of UART, SPI, and Fast Ethernet controllers in a single die. The 133 MHz core handles deterministic polling loops while the CPM offloads timer-driven serial DMA. The wide operating temperature range supports deployment alongside variable-frequency drives and motor controls without derating. The 357-PBGA package supports dense board layouts where the SoC replaces a CPU + external MAC + external PHY partitioning.
Recomendado
Embedded Networking Development Platform
Engineering teams maintaining legacy PowerQUICC firmware or extending mature BSPs use the MPC880CVR133 as a reference engine on CPU evaluation boards. The 32-bit Power Architecture instruction set, mature GCC and Green Hills toolchain support, and broad community reference designs shorten learning curve. The 357-PBGA footprint on standard 25x25 mm land patterns simplifies PCB layout. Long-term availability through Rochester Electronics extends the development window for safety-critical and industrial programs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC880CVR133 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC880CZP133 | MPC885CVR133 | MPC880VR133 | MPC860TVR133 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) |
| Clock Speed | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
| Core Architecture | Power Architecture CPU32 | Power Architecture CPU32 | Power Architecture CPU32 | Power Architecture CPU32 | Power Architecture CPU32 |
| Operating Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Family | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC860 PowerQUICC |
| RoHS / Lead Free | Yes | Yes | Yes | Yes | Yes |
| Lifecycle | EOL | EOL | EOL | EOL | EOL |
Diferenciadores clave
- Pin-compatible production tray variant with same die (frente a MPC880VR133)
- Higher peripheral integration in same PBGA footprint (frente a MPC860TVR133)
- Drop-in compatibility with documented thermally equivalent footprint (frente a MPC875ZT133)
Notas de diseño
The 25x25mm PBGA-357 package dissipates up to several watts under full CPU + CPM load. Design the PCB with an unbroken GND plane directly beneath the BGA and thermal vias in the center ball array. A 4-layer FR4 stack-up with 1 oz copper typically provides adequate spreading; estimate junction-to-ambient theta_JA around 15-20 C/W with a full thermal-via field underneath the package.
Use 0.8mm ball pitch layout with either microvia-in-pad or dog-bone fan-out. Match the NXP-recommended land pattern from the datasheet exactly to avoid solder joint defects. Place SDRAM, Flash, and PHY devices adjacent to the BGA edge routing channels; keep high-speed Ethernet traces on inner layers with controlled 50-ohm impedance.
Do not assume the MPC880CVR133 and MPC885CVR133 are interchangeable - the MPC885 has additional USB and additional Ethernet controllers that change the CPM register map. Verify software/firmware compatibility before mass substitution. Also beware suffix code variations (CVR vs VR vs CZP) - they encode temperature grade and shipping packaging and can impact sourcing.
Route the SDRAM clock, source-synchronous strobes, and Ethernet MII traces with matched length and 50-ohm impedance control. The CPU32 core is sensitive to jitter on the system clock - provide a clean oscillator or crystal reference and decouple its supply with a ferrite bead plus ceramic capacitors. JTAG chain access via a 14-pin header aids boundary-scan diagnosis and BGA rework verification.
Información de cumplimiento
RoHS Compliant and Lead Free per DigChip datasheet listing. REACH, halogen-free, and conflict-minerals status are not explicitly documented in the verified web data and should be confirmed with NXP before use in regulated industries.
