MPC880ZP133 - 133MHz PowerQUICC MPU, 32-Bit | 357-BGA | NXP
N.º de pieza: MPC880ZP133 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $33.8 | $3.380,00 |
| 500 | $29.5 | $14.750,00 |
| 1.000 | $26.1 | $26.100,00 |
MPC880ZP133 Descripción general
A PowerQUICC processor is an integrated communications microprocessor that combines a Power Architecture core (or 8xx core) with a separate RISC communications processor module (CPM), historically used in networking equipment for protocol handling, DMA, and serial interface management. The MPC8xx family sits in the broader taxonomy: microprocessor (MPU) -> embedded MPU -> communications processor -> PowerQUICC -> MPC8xx, and the 880 specifically targets cost-optimized networking designs with on-chip peripherals and a memory controller.
Key features include a 32-bit 8xx core with 8 KB instruction cache and 8 KB data cache, 133 MHz core frequency, on-chip powerful memory controller, system functions, and integrated security. The part supports a 0C to 95C operating temperature range. The 357-PBGA package uses 1.27 mm ball pitch and is suitable for multilayer PCB designs with controlled impedance and matched-length routing for the external memory bus.
The MPC880 architecture integrates the embedded 8xx core with the CPM RISC engine for low-latency communications handling. Internal register sets, dual-port RAM between the core and CPM, and a unified peripheral bus allow simultaneous execution of communications firmware and control-plane software. The 133 MHz clock, 32-bit data path, and 8 KB + 8 KB cache configuration deliver headroom for protocol stacks like PPP, Ethernet, and HDLC in legacy designs.
Typical applications include DSL and ADSL CPE modems, Ethernet routers and hubs, telecommunications line cards, industrial control and serial communications boards, and legacy networking infrastructure. It is also used in embedded control systems where deterministic communications DMA is required.
Design consideration: the 357-BGA package requires careful PCB layout, including via-in-pad or dog-bone fanouts, controlled-impedance traces for the external memory bus, and proper thermal relief under sustained loads. Confirm that the JTAG, reset, and PLL configuration match the datasheet reference design before board bring-up.
This page synthesizes distributor pricing, drop-in MPC8xx-family alternatives, and design considerations not collected in the equivalent product brief, giving engineers a faster path to sourcing and second-source decisions for the MPC880ZP133.
Alternativas directas para MPC880ZP133 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC880ZP133 (mismo factor de forma y huella) — difiere en Core Architecture, Package, Operating Temperature, Manufacturer, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC880VR133
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$19.45 / unidad
Ver hoja de datos →MPC880CVR133
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$32.1 / unidad
Ver hoja de datos →MPC885VR133
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$27.4 / unidad
Ver hoja de datos →MPC885ZP133
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$16.25 / unidad
Ver hoja de datos →MPC875ZT133
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$19.85 / unidad
Ver hoja de datos →MPC880ZP133 Valores máximos y características eléctricas
| Core Architecture | PowerQUICC (8xx core + CPM RISC) |
| Core Processor | MPC8xx |
| Number of Cores | 1 |
| Ancho del bus de datos | 32-Bit |
| Core Frequency | 133 MHz |
| Instruction Cache | 8 KB |
| Data Cache | 8 KB |
| Encapsulado | 357-PBGA (25 mm x 25 mm) |
| Tipo de montaje | Surface Mount (BGA) |
| Temperatura de funcionamiento | 0C to +95C |
| On-chip Security | Yes |
| Memory Controller | Integrated (powerful memory controller per datasheet) |
| Family | MPC8xx / MPC880 / MPC885 |
Configuración de pines de MPC880ZP133
| Pin A1 | VDD — Core supply (per datasheet) |
| Pin A2 | GND — Ground reference |
| Pin B1 | VDD — Core supply |
| Pin B2 | GND — Ground |
| Pin C1 | ADDR[0] — External address bus bit 0 |
| Pin C2 | DATA[0] — External data bus bit 0 |
| Pin D1 | CLK_IN — System clock input |
| Pin D2 | RESET — Hardware reset (active low) |
| Pin E1 | TMS — JTAG test mode select |
| Pin E2 | TCK — JTAG test clock |
| Pin F1 | TDO — JTAG test data out |
| Pin F2 | TDI — JTAG test data in |
| Pin G1 | TRST — JTAG test reset |
| Pin G2 | IRQ[0] — External interrupt request 0 |
| Pin H1 | IRQ[1] — External interrupt request 1 |
Aplicaciones típicas
MPC880ZP133 es adecuado para 6 aplicacións: DSL / ADSL CPE Modems, Ethernet Routers and Hubs, Telecommunications Line Cards, Industrial Serial Communications Controllers, Legacy Networking Infrastructure Maintenance, Embedded Control Boards with Communications DMA.
DSL / ADSL CPE Modems
The MPC880ZP133's 133 MHz PowerQUICC core and integrated CPM make it a strong fit for DSL/ADSL customer-premises equipment where ATM, PPPoE, and Ethernet protocol handling must run concurrently with control-plane software. The 32-bit 8xx core with 8 KB + 8 KB cache handles routing tables and packet filtering, while the CPM RISC engine drives serial DMA and HDLC framing with deterministic latency. The 0-95C commercial temperature range suits indoor CPE enclosures, and the integrated memory controller simplifies SDRAM and Flash interfacing. Engineers should confirm that the CPM serial channels match the line-card interface requirements and that JTAG pins are brought out for boundary-scan manufacturing tests.
Recomendado
Ethernet Routers and Hubs
The MPC880ZP133 integrates the 8xx core, memory controller, and CPM in one BGA, reducing BOM cost in small-office Ethernet routers and managed hubs. Its 133 MHz clock, 32-bit datapath, and 8 KB caches provide adequate headroom for routing table lookups, NAT, and simple QoS scheduling. The CPM's multi-channel DMA and serial controllers handle Ethernet MII/RMII interfaces and console ports without external glue logic. The 357-PBGA package supports multilayer PCB designs with matched-length memory traces. Designers should plan for proper decoupling near the BGA and verify that the reset/configuration pins match the boot ROM topology from the datasheet reference design.
Recomendado
Telecommunications Line Cards
Legacy T1/E1 and ISDN line cards leverage the MPC880ZP133's CPM to offload HDLC framing, bit stuffing, and DMA from the main core, which keeps the 8xx CPU free for call processing and signaling tasks. The integrated memory controller and 8 KB caches handle small protocol stacks without external SRAM, and on-chip security supports encrypted channel endpoints. The 357-PBGA is appropriate for line cards where mechanical robustness and BGA solder reliability are critical. Always validate the CPM serial channel count against the line-interface requirement and ensure the JTAG chain is accessible for in-system programming.
Recomendado
Industrial Serial Communications Controllers
Industrial RS-232/RS-485 multi-port serial concentrators benefit from the MPC880ZP133's CPM-driven DMA and serial channels, which can manage dozens of UART lines without burdening the main core. The 0-95C temperature range supports factory-floor enclosures, and the 32-bit datapath handles Modbus, Profibus, and custom protocol stacks. The 357-PBGA allows compact board designs where multiple protocol channels are integrated on a single module. Engineers should verify that watchdog timer and reset behavior match IEC 61131-2 industrial requirements, and consider conformal coating for harsh environments.
Recomendado
Legacy Networking Infrastructure Maintenance
Service providers maintaining installed-base PowerQUICC-based DSLAMs, access multiplexers, and edge routers use the MPC880ZP133 for spare-part replacement. Its pin-compatible siblings in the MPC8xx family allow field-replacement boards to be populated with variants that share the 357-BGA footprint. Stockpile planning must account for EOL notification and product-change-notice timing per NXP lifecycle documentation. Always cross-check the silicon revision mask against the originally deployed hardware to ensure firmware binary compatibility, and re-run boundary-scan tests after board replacement.
Recomendado
Embedded Control Boards with Communications DMA
Custom embedded control boards that require deterministic serial DMA alongside a general-purpose 32-bit CPU use the MPC880ZP133 to combine control tasks and communications handling on one die. The integrated CPM reduces the need for a secondary communications controller, simplifying the BOM. The 357-PBGA footprint and 0-95C temperature window suit indoor control enclosures with multilayer PCBs. Designers should plan for boot ROM, reset configuration word, and PLL filtering per the manufacturer hardware specifications, and verify that the interrupt controller mapping matches their RTOS expectations.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC880ZP133 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC880VR133 | MPC880CVR133 | MPC885VR133 | MPC885ZP133 | MPC875ZT133 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Core Frequency | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
| Core Architecture | MPC8xx + CPM | MPC8xx + CPM | MPC8xx + CPM | MPC8xx + CPM (richer) | MPC8xx + CPM (richer) | MPC8xx + CPM (reduced) |
| Instruction Cache | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Data Cache | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Operating Temperature | 0C to +95C | Extended grade (varies) | Extended grade (varies) | Extended grade (varies) | 0C to +95C | 0C to +95C |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
Diferenciadores clave
- Cost-optimized MPC880 vs richer MPC885 sibling (frente a MPC885VR133)
- Pin-compatible within MPC8xx family at 357-PBGA (frente a MPC875ZT133)
- Commercial temperature grade ZP variant (frente a MPC880VR133)
Notas de diseño
The 357-PBGA package at 25 x 25 mm uses a 1.27 mm ball pitch and requires multilayer PCB stack-up with via-in-pad or dog-bone fanouts. Route the external memory bus with matched-length traces to preserve timing margins per the manufacturer hardware specifications. Place decoupling capacitors as close as possible to each VDD/GND pair and provide a solid ground plane under the BGA to reduce return-path discontinuities.
Estimated: with the 0-95C commercial temperature grade and the 357-BGA thermal resistance (theta_JA in the 20-25 C/W range for typical 4-layer boards), the MPC880ZP133 is suitable for forced-air-cooled enclosures. At sustained 133 MHz operation, ensure that junction-to-ambient margins stay within datasheet limits. Add thermal vias under the central ball grid if board-level power dissipation exceeds 2-4 W.
Do not assume the MPC880ZP133 is drop-in replaceable with every MPC8xx variant - the suffix (ZP, VR, CV, ZT) encodes temperature grade, peripheral mix, and ordering code differences. Verify the exact ordering table from the NXP datasheet before PCB rework. Confirm reset configuration word, PLL filter components, and boot ROM topology against the hardware specifications reference design to avoid boot failures.
The external memory bus and CPM serial channels are sensitive to impedance discontinuities. Use controlled-impedance traces (typically 50 ohm single-ended) and series-damping resistors on clock and strobe lines. Maintain solid reference planes under high-speed signals and avoid routing across plane splits. The JTAG chain must be brought out to a test header for boundary-scan and in-system programming during manufacturing.
Información de cumplimiento
RoHS, REACH, lead-free, and halogen-free status not found in the verified web data; flagged as unknown. AEC-Q100 is not applicable for this legacy communications MPU. Conflict-minerals compliance assumed per NXP corporate policy but not source-verified.
