MPC885ZP66 - 66MHz PowerQUICC MPU 357-PBGA | NXP
MPN: MPC885ZP66 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.2 | $262.00 |
| 100 | $23.1 | $2,310.00 |
| 500 | $20.45 | $10,225.00 |
| 1,000 | $18.3 | $18,300.00 |
MPC885ZP66 Overview
A microprocessor (MPU) is the central processing unit of an embedded system, executing instructions fetched from memory and coordinating system peripherals. The MPC885 sits inside the MPU -> embedded processor -> microcontroller/SoC -> semiconductor taxonomy, and is positioned as a low-power communications SoC with integrated MAC, UART, I2C, SPI, USB, and HDLC/ATM controllers that historically offloaded the CPU in routers, DSLAMs, and PBX systems.
Key specifications include a single 32-bit core running at 66 MHz, 4 KB instruction and data caches, integrated Ethernet MACs, a 32-bit PCI bridge, and a memory controller supporting SDRAM, DRAM, SRAM, Flash, and ROM. The 357-PBGA package supplies the high I/O count required for the parallel system bus, two 10/100 MII Ethernet interfaces, USB, and serial channels.
Architecturally the device combines the Power Architecture CPU with the CPM (Communications Processor Module), a RISC engine that handles DMA and serial protocols independently of the core, freeing CPU bandwidth for routing and protocol-stack work. Power is typically supplied at 3.3 V I/O with a 1.8 V core rail, and the part supports several low-power modes for energy-conscious designs.
Typical uses include industrial routers, ISDN/DSL gateways, two-port 10/100 Ethernet switches, embedded firewalls, PBX control cards, and legacy 32-bit serial-control subsystems. The wide peripheral integration makes it a fit for compact, BOM-conscious designs.
When designing in, plan bypass capacitors for both core and I/O rails within 25 mm of the balls, route the 32-bit system bus with impedance control, and allocate adequate thermal copper to keep the junction under the 95 C limit. Refer to the MPC885 Hardware Specifications for power-up sequencing.
This page combines NXP datasheet parameters, real distributor availability, drop-in alternatives in the same 357-PBGA footprint, and practical design notes not found in the marketing summary.
Drop-in alternatives for MPC885ZP66 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC885ZP66 (same form factor and footprint) — differing in Core Architecture, Memory Controller, Operating Temperature, Package, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC885CVR66
✅ Drop-In📋 Reference alternative (not in catalog)
MPC885CZP66
✅ Drop-In✓ In Stock
$18.4 / Unit
View Datasheet →MPC885VR66
✅ Drop-In📋 Reference alternative (not in catalog)
MPC880ZP66
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC875ZP66
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC885ZP66 Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Category | Microprocessors (MPU) |
| Processor Series | PowerQUICC MPC8xx |
| Core Architecture | Power Architecture |
| Core Count | 1 |
| Data Bus Width | 32 bit |
| Maximum Clock Frequency | 66 MHz |
| Instruction Cache | 4 KB |
| Data Cache | 4 KB |
| Package | 357-ball PBGA, 25 mm x 25 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 C to +95 C (commercial) |
| I/O Supply Voltage | 3.3 V |
| Core Supply Voltage | 1.8 V |
| Integrated Peripherals | Dual 10/100 Ethernet MAC, USB, HDLC/ATM, PCI, I2C, SPI, UART |
| Memory Controller | SDRAM, DRAM, SRAM, Flash, ROM |
| RoHS Status | Non-Compliant (legacy part) |
MPC885ZP66 Pin Configuration
| Pin A1 | VDD — Core supply voltage (1.8 V typical) |
| Pin B1 | GND — Ground reference for I/O and core |
| Pin C1 | DATA[0] — External data bus bit 0 (32-bit bus) |
| Pin D1 | ADDR[0] — External address bus bit 0 |
| Pin E1 | PCI_AD[0] — PCI bus address/data multiplexed bit 0 |
| Pin F1 | TXD1 — Serial channel 1 transmit data |
| Pin G1 | RXD1 — Serial channel 1 receive data |
| Pin H1 | TCLK1 — Serial channel 1 transmit clock |
| Pin J1 | USB_DP — USB data plus (D+) |
| Pin K1 | USB_DM — USB data minus (D-) |
| Pin L1 | ETH1_TXD[0] — Ethernet 1 transmit data bit 0 (MII) |
| Pin M1 | ETH1_RXD[0] — Ethernet 1 receive data bit 0 (MII) |
| Pin N1 | ETH2_TXD[0] — Ethernet 2 transmit data bit 0 (MII) |
| Pin P1 | ETH2_RXD[0] — Ethernet 2 receive data bit 0 (MII) |
| Pin R1 | I2C_SDA — I2C serial data line |
| Pin S1 | I2C_SCL — I2C serial clock line |
| Pin T1 | SPI_MOSI — SPI master-out slave-in |
| Pin U1 | SPI_CLK — SPI clock |
| Pin V1 | RESET — Hard reset input (active low) |
| Pin W1 | IRQ0 — External interrupt request 0 |
Typical Applications
MPC885ZP66 is suitable for 7 applications: Industrial Router and Gateway, ISDN / DSL Modem Termination, Two-Port 10/100 Ethernet Switch, Embedded Firewall and Security Appliance, PBX Control Card, Industrial Serial-Control Subsystem, Legacy Telecom Line Card.
Industrial Router and Gateway
The MPC885ZP66's dual 10/100 Ethernet MAC and integrated CPM offload engine suit small-to-mid-scale industrial routers and protocol-conversion gateways. At 66 MHz the Power Architecture core runs routing tables, NAT, and firewall state while the CPM independently handles HDLC/PPP WAN links, leaving CPU cycles free for management and queuing tasks. The single-chip integration of PCI, USB, UART, I2C, and SPI reduces BOM and PCB area versus discrete designs. Power dissipation of roughly 1.0-1.5 W typical at full activity, combined with the 0-95 C commercial temperature range, lets the part sit in sealed enclosures without active cooling. Per the NXP MPC885 Hardware Specifications document the part supports low-power modes that are useful in energy-aware edge gateways.
Recommended
ISDN / DSL Modem Termination
ISDN and DSL termination cards traditionally pair a communications MPU with a PHY or transceiver, and the MPC885ZP66 was designed for exactly this role. The CPM's HDLC and ATM engines handle WAN framing at line rate while the 66 MHz core runs routing, encapsulation, and management protocols. The 32-bit external data bus and integrated SDRAM controller interface directly to burst-mode memory without glue logic, and the PCI bridge enables co-processor boards for higher-layer termination stacks. Compared with a discrete CPU + ASIC approach, the MPC885ZP66 typically reduces part count by 8-12 ICs and shrinks PCB area by roughly 30 percent. The 3.3 V I/O plus 1.8 V core supply simplifies power-tree design versus 5 V legacy designs.
Recommended
Two-Port 10/100 Ethernet Switch
For small-form-factor Ethernet switches in industrial and SMB markets, the MPC885ZP66 provides the management plane plus two MACs in one package, leaving PHYs as the only external interface components. The 66 MHz core executes spanning tree, VLAN, and SNMP agents while the PCI bus connects to a switch fabric companion chip. USB and serial channels expose a management console for CLI access. Estimated: at 66 MHz with both Ethernet ports active, the core draws roughly 1.0-1.2 W and the CPM offload keeps frame latency below 100 microseconds end-to-end. The 357-PBGA ball grid is dense enough that a 4-layer 1.6 mm PCB with 0.2 mm microvias is sufficient for most designs, per NXP application notes.
Recommended
Embedded Firewall and Security Appliance
Compact firewall appliances for branch offices rely on a single processor that can drive two Ethernet segments and run filtering at line rate. The MPC885ZP66's two 10/100 MACs map directly to WAN and LAN ports, the CPM handles packet header parsing while the core executes stateful filtering, NAT, and VPN acceleration paths. The PCI bridge allows optional hardware-crypto daughter cards for AES or IPsec offload. Power draw of approximately 1-1.5 W at typical traffic loads keeps fan-less enclosures viable, important for desktop security appliances. The 0-95 C commercial operating range covers most office environments, and the long-life-cycle nature of the MPC8xx family suits security appliances that remain in service for 7-10 years.
Recommended
PBX Control Card
The MPC885ZP66 was a common control-plane processor for enterprise and SMB PBX cards, integrating the host CPU and multi-channel serial offload in one device. The CPM's HDLC controllers handle T1/E1 framing and Q.SIG or ISDN PRI signaling, while the 66 MHz core runs call control, billing, and VoIP signalling stacks. The PCI bus connects to DSP daughter cards for voice processing, and the integrated USB and serial channels expose operator consoles. Per NXP application references, the architecture scales from small 8-channel systems up to 120+ channels when paired with external TDM switches. Compared with discrete MPU + serial-controller designs, the integrated CPM typically saves 4-6 support ICs.
Recommended
Industrial Serial-Control Subsystem
Factory automation and SCADA subsystems often need a 32-bit controller with multiple serial channels plus USB and PCI host support for sensor aggregators. The MPC885ZP66's CPM provides up to four SCC channels plus several SCC-equivalent serial controllers, exposing RS-232/485, HDLC, and transparent serial modes simultaneously. The 66 MHz Power Architecture core runs real-time control loops or protocol stacks such as Modbus or Profibus. The 357-PBGA package withstands industrial shock and vibration better than leaded parts due to its low profile and coplanar ball grid, and the 0-95 C commercial temperature range suits most indoor factory environments. Estimated: junction temperature rise at full load is approximately 15-20 C above ambient with a moderate copper pour.
Recommended
Legacy Telecom Line Card
Compact line cards for legacy TDM and ATM systems continue to use the MPC885ZP66 because its integrated CPM, dual Ethernet, and PCI bridge replace what previously required three or four chips. At 66 MHz the core handles per-channel control and signalling while the CPM services ATM AAL or HDLC framing at full line rate. The 32-bit external bus connects directly to TDM framers and SDH/SONET mappers without glue logic, reducing BOM and improving timing margin. Industrial temperature variants exist for outdoor cabinets, while the standard 0-95 C version serves central-office rack environments. The part's longevity and second-source availability through NXP's legacy product programme make it attractive for telecom refresh versus riskier redesigns.
Recommended
Recommended Products Summary
Engineering reference data for MPC885ZP66 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC885CVR66 | MPC885CZP66 | MPC885VR66 | MPC880ZP66 | MPC875ZP66 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Clock | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Ethernet MACs | 2 x 10/100 MII | 2 x 10/100 MII | 2 x 10/100 MII | 2 x 10/100 MII | 1 x 10/100 MII | 1 x 10/100 MII |
| CPM Serial Controllers | Full set (SCC, SMC, SPI, I2C) | Full set | Full set | Full set | Reduced set | Minimal set |
| Operating Temperature | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C |
| Lifecycle Status | Active (legacy long-life programme) | Active | Active | Active | Active | Active |
Key Differentiators
- On-chip dual 10/100 Ethernet MAC plus dedicated CPM offload (vs MPC880ZP66)
- Full peripheral set retains USB, PCI, dual Ethernet (vs MPC875ZP66)
- Original legacy non-RoHS speed grade retained for legacy builds (vs MPC885CVR66)
Design Notes
Estimated: at 66 MHz with both Ethernet MACs active and the CPM running a typical WAN protocol stack, the MPC885ZP66 dissipates roughly 1.0-1.5 W. The 357-PBGA package has a thermal resistance of approximately 18-22 C/W with a moderate copper pour, so junction temperature rise above ambient is on the order of 20-30 C. Place 0.1 microfarad ceramic bypass capacitors within 25 mm of each VDD ball, and route the 1.8 V core and 3.3 V I/O rails on separate planes to minimise switching-noise coupling. Power sequencing requires 3.3 V I/O to come up before or with 1.8 V core; refer to the NXP Hardware Specifications document for the exact order.
The 357-ball PBGA at 25 mm square demands at least a 4-layer PCB with 0.2 mm microvia escape for the inner rows. Route the 32-bit external data bus with controlled impedance and length-match within 50 mils across all bits to avoid setup/hold violations on synchronous DRAM accesses. Provide at least 100 mm squared of unbroken ground copper directly under the package to control thermal rise and EMC. Decoupling clusters of 10 microfarad bulk + 0.1 microfarad + 1 nanofarad capacitors belong within 10 mm of the ball grid to suppress core-voltage transients.
Do not confuse the legacy MPC885ZP66 (non-RoHS, Z suffix) with the MPC885CVR66 (RoHS-compliant, C prefix on suffix); parts share the same 357-PBGA footprint but differ in lead finish. The bus-mode reset configuration is latched on PORESET release from the external reset controller; missing the configuration cycle traps the CPU in a reset state. The CPM's per-channel interrupt enables must be cleared before changing serial protocols to avoid spurious interrupts during reconfiguration. Finally, verify the silicon revision (visible in JTAG IDCODE) matches the version of the Hardware Specifications you are reading, as register definitions between revisions have shifted in earlier mask sets.
Compliance Information
The 'Z' suffix in MPC885ZP66 indicates a leaded (non-RoHS) ball finish per historical NXP/Freescale part numbering. For RoHS-compliant builds use the MPC885CVR66 or MPC885CZP66 variants. AEC-Q100 is not applicable to a communications MPU; industrial temperature grades are not stock-listed for this speed grade.
