MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP
부품 번호: MSC8157TAG1000A ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $220 | $22,000.00 |
| 500 | $195 | $97,500.00 |
| 1,000 | $178 | $178,000.00 |
MSC8157TAG1000A 개요
A digital signal processor (DSP) is a specialized microprocessor optimized for numeric-heavy, real-time signal-processing workloads such as baseband demodulation, audio/voice codecs, radar pulse processing, and video transforms. Within the broader semiconductor hierarchy, the MSC8157 belongs to the high-performance DSP family, sitting between general-purpose microcontrollers and full application processors. StarCore-based devices were widely adopted in 3G/4G wireless base stations, media gateways, and defense signal-processing platforms where deterministic per-core throughput matters more than OS-rich user-experience features.
Key features include six SC3850 cores running at 1 GHz, MAPLE-B2 acceleration for forward-error-correction, dual DDR2/DDR3 memory controllers with ECC, dual SRIO (Serial RapidIO) lanes, dual PCIe interfaces, dual GbE MACs, two CIPRI links for inter-DSP interconnect, an MMU, extended programmable interrupt controller (EPIC), and four general-purpose 32-bit timers. The FC-PBGA package offers a compact 29x29 mm footprint while exposing a 1.0 mm ball pitch suitable for high-density multi-layer PCB designs.
The architecture combines SIMD-friendly ALU pipelines with hardware multi-issue and dynamic power management (Wait/Stop/Debug), enabling the MSC8157 to deliver high aggregate MMACS while remaining suitable for thermally constrained chassis. MAPLE-B2 offloads turbo decoding so the SC3850 cores remain available for upper-layer signal processing.
Typical applications include 3G/4G LTE baseband processing, wireless base-station channel cards, media gateways, defense signal-intelligence platforms, and high-density voice/media transcoding appliances where deterministic six-core throughput is required. The dual GbE plus dual SRIO fabric also suits it to packet-processing line cards. NXP product pages flag the part with end-of-life documentation.
When designing with this device, allocate generous PCB layers for the FC-PBGA breakout (1.0 mm pitch requires microvia stack-ups), provision thermal copper under the die, and follow NXP hardware-design guides for DDR2/DDR3 trace-length matching. Expect to validate boot ROM, MAPLE firmware, and SC3850 tool-chain (CodeWarrior / StarCore toolchain) compatibility for any new deployment.
드롭인 대체품: MSC8157TAG1000A — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MSC8157TAG1000A (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Operating Temperature, DSP Cores, Ethernet.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MSC8156ESAG1000B
✅ 드롭인✓ 재고 있음
$112 / 개
데이터시트 보기 →MSC8156HAG1000B
✅ 드롭인✓ 재고 있음
$198.75 / 개
데이터시트 보기 →MSC8251SVT1000B
✅ 드롭인✓ 재고 있음
$65 / 개
데이터시트 보기 →MSC8157TAG1000A 사양
| Device Type | Six-core Digital Signal Processor (DSP) |
| DSP Architecture | StarCore SC3850 (6x cores) |
| Core Frequency | 1 GHz per core |
| L1 Instruction Cache | 32 KB per core |
| L1 Data Cache | 32 KB per core |
| Unified L2 Cache | 512 KB (configurable as M2 in 64 KB increments) |
| Accelerator | MAPLE-B2 baseband accelerator |
| Memory Controller | Dual-channel DDR2/DDR3 with ECC |
| High-Speed Serial I/O | 2x SRIO, 2x PCIe, 2x GbE, 2x CIPRI |
| 패키지 | 783-FCPBGA (29x29 mm) |
| Ball Pitch | 1.0 mm |
| 동작 온도 | -40C to +105C |
| MMU | Yes |
| Interrupt Controller | EPIC (Extended Programmable Interrupt Controller) |
| Timers | 2x 32-bit general-purpose per core |
MSC8157TAG1000A 783-fcpbga (29x29 mm) 핀 구성 가이드
MSC8157TAG1000A(783-fcpbga (29x29 mm) 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: MSC8157TAG1000A.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MSC8157TAG1000A 적합 용도: 6 애플리케이션s: 3G/4G LTE Baseband Channel Card, Wireless Base Station Line Card, Media Gateway / Transcoding Appliance, Defense Signal-Intelligence Platform, Industrial Multi-Channel DSP Aggregator, Packet-Processing Line Card.
3G/4G LTE Baseband Channel Card
The MSC8157TAG1000A's six SC3850 cores at 1 GHz plus the MAPLE-B2 turbo/Viterbi accelerator make it a strong fit for LTE physical-layer channel cards where per-subframe FEC timing budgets demand hardware offload. Dual DDR2/DDR3 controllers with ECC keep large soft-bit buffers resident without saturating the bus, while the dual SRIO/CIPRI links allow multi-DSP scaling across the baseband card. The 783-ball FC-PBGA package breaks out the full peripheral set without internal muxing, simplifying PCB layout under heavy signal-integrity constraints. Estimated: aggregate throughput of ~24 GMACS at 1 GHz across six cores plus MAPLE-B2 FEC offload typically handles a 20 MHz LTE sector with margin.
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Wireless Base Station Line Card
Base-station line cards combine multiple MSC8157DSPs with a host CPU and fronthaul/backhaul fabrics, and the MSC8157TAG1000A integrates 2x SRIO, 2x PCIe, and 2x GbE so it can serve as both compute element and packet engine on the same board. Operating from -40C to +105C, the device tolerates outdoor cabinet thermal swings, while the 1.0 mm FC-PBGA supports high-density stack-up designs that share antenna data with co-located radios. The dual CIPRI links enable direct DSP-to-DSP messaging without consuming host CPU cycles, critical for tight scheduling loops. Estimated: at typical 5-8 W per device the FC-PBGA thermal envelope is comfortable in a fan-cooled chassis.
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Media Gateway / Transcoding Appliance
Media gateways performing high-density voice (VoIP) and video transcoding benefit from the MSC8157TAG1000A's six SC3850 cores, each capable of independent real-time DSP pipelines. The MAPLE-B2 baseband accelerator is repurposed for FEC-protected media transport in some designs, and the dual GbE MACs allow direct connection to packet fabric without an external switch. DDR2/DDR3 with ECC keeps transcoded frame buffers consistent across long sessions. The 783-ball FC-PBGA footprint is reusable across product variants, simplifying platform engineering. Estimated: six SC3850 cores at 1 GHz handle ~600-1000 simultaneous VoIP transcodes with margin depending on codec complexity.
추천
Defense Signal-Intelligence Platform
Defense SIGINT and ELINT systems demand deterministic DSP throughput for wideband captures, and the MSC8157TAG1000A's six SC3850 cores deliver the predictable per-core performance needed for bulk demodulation, decryption front-ends, and pattern-matching pipelines. The -40C to +105C qualification supports field-deployed chassis, while the FC-PBGA package's high pin count exposes SRIO for chaining multiple MSC8157 cards into a single SIGINT rack. MAPLE-B2 acceleration reduces CPU burden for convolutional-code workflows common in SIGINT. The part's EOL status means defense programs typically establish long-term Rochester Electronics supply agreements to guarantee multi-year field life.
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Industrial Multi-Channel DSP Aggregator
Industrial monitoring, vibration analysis, and machine-learning front-ends use the MSC8157TAG1000A to aggregate many analog channels into one DSP farm, exploiting the six cores to run parallel FFT, filter, and feature-extraction pipelines. The wide operating-temperature range tolerates factory-floor enclosures, and the dual GbE ports carry aggregated results upstream to a host controller. MAPLE-B2 provides additional FEC for noisy industrial links. The 783-ball FC-PBGA at 1.0 mm pitch requires microvia PCB stack-up but is well within standard high-density industrial designs.
추천
Packet-Processing Line Card
Although primarily a DSP, the MSC8157TAG1000A's 2x SRIO, 2x PCIe, and 2x GbE plus six SC3850 cores make it useful in custom packet-processing line cards where programmable per-packet logic is required. SC3850 cores run microcode for header parsing, classification, and policy enforcement, while the FC-PBGA's high pin count exposes a clean multi-fabric interface. ECC-protected DDR2/DDR3 maintains table consistency under heavy update churn. Estimated: 1 GHz per core supports line-rate processing for ~1-2 Gbps aggregate traffic per device, scaling linearly across multiple MSC8157s on the card.
추천
추천 제품 요약
엔지니어링 참조 데이터: MSC8157TAG1000A — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MSC8156ESAG1000B | MSC8156HAG1000B | MSC8251SVT1000B |
|---|---|---|---|---|
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) | 783-FCBGA |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP USA Inc. |
| Core Count | 6x SC3850 | 4x SC3850 | 4x SC3850 | 1x SC3850 |
| Core Frequency | 1 GHz | 1 GHz | 1 GHz | 1 GHz |
| Accelerator | MAPLE-B2 (turbo/Viterbi) | MAPLE-B2 | MAPLE-B2 | MAPLE (no -B2) |
| Memory Interface | Dual DDR2/DDR3 w/ ECC | Dual DDR2/DDR3 w/ ECC | Dual DDR2/DDR3 w/ ECC | DDR3 |
| Lifecycle Status | Last-time-buy (EOL announced) | Last-time-buy (per NXP EOL) | Active (per Xecor) | Last-time-buy (last buy 2017) |
주요 차별점
- Highest core count in MSC815x family (vs MSC8156ESAG1000B)
- MAPLE-B2 with dual SRIO/CIPRI for multi-DSP scaling (vs MSC8251SVT1000B)
- Industrial-grade thermal envelope (vs Typical commercial DSP competitors)
설계 노트
The 783-ball FC-PBGA at 1.0 mm pitch requires a high-density PCB stack-up with microvias (laser-drilled 1:1 stack-ups preferred). Plan at least 8-10 PCB layers to break out the dual DDR2/DDR3 buses, dual SRIO, dual PCIe, dual GbE, and dual CIPRI without exceeding 2 signal layers per ball row. Follow NXP's hardware-design guide for via-in-pad and pad diameter recommendations; the FC-PBGA is flip-chip, so direct attach to PCB balls mandates precise paste-mask and reflow profiles.
Estimated: at full load with six SC3850 cores at 1 GHz and MAPLE-B2 active, the MSC8157TAG1000A dissipates roughly 5-8 W depending on workload and voltage. The 29x29 mm FC-PBGA spreads heat adequately for fan-cooled enclosures, but the PCB thermal via array under the die must be sized for ~0.5-1.0 W/cm^2 continuous dissipation. Use NXP's thermal model to compute junction-to-ambient theta_JA for your specific stack-up; derate for -40C to +105C industrial operation.
DDR2/DDR3 memory interfaces require strict trace-length matching per byte lane plus matched impedance to 50 ohm single-ended / 100 ohm differential. SRIO and PCIe links need AC-coupling capacitors and reference-clock routing with skew under 50 ps; SerDes layout should follow NXP's reference designators with ground shielding on both sides of the differential pairs. Estimated: at 1.0 mm ball pitch the breakout escape is feasible with 0.1 mm trace-and-space on outer layers.
Boot ROM configuration must match the actual boot interface (SRIO, PCIe, or serial flash) - misconfiguring boot mode bricks the device until JTAG recovery. MAPLE-B2 firmware version must match the SC3850 core revision; mixing firmware loads from older MSC8156 builds can cause MAPLE fault states. Ensure SC3850 toolchain (CodeWarrior / StarCore) matches the silicon revision; consult NXP errata documents before sign-off.
규정 준수 정보
Compliance flags were not present in the verified web data; consult NXP product page environmental documentation for definitive RoHS/REACH status.
