NTS0304EUKZ - 4-Bit Dual-Supply Level Translator | NXP
부품 번호: NTS0304EUKZ ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1.45 | $1.45 |
| 10 | $1.35 | $13.50 |
| 100 | $1.18 | $118.00 |
| 500 | $1.05 | $525.00 |
| 1,000 | $0.92 | $920.00 |
NTS0304EUKZ 개요
A dual-supply level translator is a type of voltage-level conversion IC, part of the broader logic family of buffers, drivers and transceivers within the signal-integration hierarchy of semiconductor components. Its role is to safely connect digital devices operating at different supply rails, such as a 1.8 V microcontroller and a 3.3 V peripheral, preventing overvoltage damage and logic-level misreads that would occur with direct connection.
Key features include four independent bidirectional channels with automatic direction sensing, which eliminates the need for a DIR pin and simplifies bus designs; open-drain outputs supporting open-drain buses such as I2C-style topologies; and a single output enable (OE) input that places all I/O in a high-impedance state when deasserted.
Architecturally, the device features eight 1-bit input-output ports (A and B ports), one OE input, and two supply pins (VCC(A) and VCC(B)). Because outputs are open-drain, external pull-up resistors set the logic-high level on each side, allowing rail levels to be chosen almost independently of the supply voltages. According to the NXP NTS0304E product data sheet Rev. 1.3 (9 October 2023), this makes the family well suited to mixed-voltage bidirectional signaling.
Typical applications include I2C and SMBus level shifting between controllers and peripherals, bidirectional GPIO translation between MCUs of different voltage classes, and mixed-voltage board-to-board communication. The WLCSP package suits space-constrained portable and wearable designs.
Design consideration: because the outputs are open drain, always provide appropriate pull-up resistors sized for the bus capacitance and desired rise time; the auto-direction sensing requires the bus to default high.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and application guidance not found in the manufacturer datasheet.
드롭인 대체품: NTS0304EUKZ — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
NTS0304EUK
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
NTS0304EUKZ 최대 정격 & 전기적 특성
| 기능 | 4-bit dual-supply translating transceiver, open drain, auto direction sensing |
| Number of Channels | 4 bidirectional (8 I/O ports A and B) |
| VCC(A) Supply Range | 0.95 V to 3.6 V |
| 출력 유형 | Open drain |
| Direction Control | Auto-direction sensing (no DIR pin) |
| Output Enable | Yes (OE input, high-impedance when disabled) |
| 패키지 | 12-WLCSP (1.42 x 1.97 mm) |
| 실장 유형 | Surface Mount |
| Applications | Voltage level translation, I2C-style buses, mixed-voltage interfaces |
| Family | NTS0302 / NTS0304E translating transceivers |
| Data Sheet Revision | Rev. 1.3 - 9 October 2023 |
| RoHS 상태 | Compliant (Z suffix = lead-free/RoHS version) |
NTS0304EUKZ 12-wlcsp (1.42 x 1.97 mm) 핀 구성 가이드
NTS0304EUKZ(12-wlcsp (1.42 x 1.97 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: NTS0304EUKZ.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
NTS0304EUKZ 적합 용도: 6 애플리케이션s: I2C / SMBus Level Shifting, Mixed-Voltage GPIO Translation, Portable and Wearable Devices, Board-to-Board Communication, Automotive Body and Comfort Electronics, Industrial Control and Sensor Hubs.
I2C / SMBus Level Shifting
The NTS0304EUKZ is a natural fit for I2C and SMBus level shifting because its open-drain outputs mirror the open-drain nature of SDA and SCL lines, and its auto-direction sensing handles the bus's bidirectional traffic with no DIR pin to manage. With VCC(A) supported down to 0.95 V, it can bridge a sub-1V-class controller to a 3.3 V peripheral domain; pull-up resistors on each side independently set the logic-high level of each domain per the NXP data sheet. In a typical circuit, the four channels carry SDA/SCL pairs of two independent I2C buses, with 2.2k-10k ohm pull-ups sized for bus capacitance and target rise time. The OE input can tri-state the bus during power sequencing or fault conditions, and the 1.42 x 1.97 mm WLCSP keeps translator overhead minimal in dense sensor hubs and wearable designs.
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Mixed-Voltage GPIO Translation
General-purpose IO signals between a low-voltage MCU (for example a 1.2 V or 1.8 V core-domain port) and 3.3 V board-level logic can be translated bidirectionally with the NTS0304EUKZ. Its auto direction sensing means a single 4-bit translator handles signals whose direction changes dynamically, avoiding firmware-driven DIR toggling and the race conditions that come with it. Because outputs are open drain, each signal's high level is set by its own pull-up to the receiving domain's rail, so a mix of 1.8 V and 3.3 V signals can share one device. VCC(A) operating from 0.95 V to 3.6 V per the NXP data sheet covers all common low-voltage rails. Designers should account for the pull-up rise time on capacitive lines and deassert OE during reset to keep the port high-impedance while the MCU pins are still tristated.
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Portable and Wearable Devices
The 12-ball WLCSP package measuring only 1.42 x 1.97 mm makes the NTS0304EUKZ attractive for smartphones, wearables, hearables, and other battery-powered products where board area is the scarcest resource. It provides four bidirectional translation channels in roughly the footprint of a 0402 passive component pair, interfacing between a low-voltage application processor IO bank and peripheral ICs on higher rails such as 1.8 V or 3.3 V sensors and codecs. VCC(A) down to 0.95 V supports modern sub-1V-class core rails, and the open-drain architecture is directly compatible with the I2C buses ubiquitous in these systems. Care is required in assembly since WLCSP ball pitch demands standard fine-pitch SMT processes; no special handling beyond typical MSL storage practice was specified in the verified data.
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Board-to-Board Communication
When two PCBs in one system run different logic rails - for example a 1.8 V baseboard processor and a 3.3 V module - the NTS0304EUKZ placed on the baseboard safely bridges the four most critical control and data lines across the connector. Open-drain outputs make it tolerant of the shared, multidrop nature of many board-to-board buses (status lines, interrupts, configuration I2C), and auto direction sensing means one part serves lines whose direction changes per transaction. The NXP data sheet specifies VCC(A) from 0.95 V to 3.6 V, so either side of the connector can be the low rail. Designers should place pull-ups near the receiving side, keep the WLCSP traces short to limit stub effects, and use OE to isolate the interconnect during power-up sequencing of the two boards.
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Automotive Body and Comfort Electronics
Mixed-voltage translation between a 3.3 V or 5 V-tolerant body controller domain and lower-voltage sensor or switch-monitoring circuitry is a common requirement in automotive body, door, and comfort modules. The NTS0304EUKZ's auto-direction open-drain channels suit bidirectional status and control lines such as switch busses and configuration interfaces, while its tiny WLCSP conserves PCB area in dense junction boxes. Note that AEC-Q100 qualification status for this part was not stated in the verified data, so automotive designers must confirm grade requirements with NXP before use in safety-relevant positions. VCC(A) operating down to 0.95 V supports modern low-voltage processor IO, and pull-up resistor choice sets each side's high level; add series resistors and local TVS protection at connectors per standard automotive EMC practice.
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Industrial Control and Sensor Hubs
Industrial controllers frequently combine legacy 3.3 V or 5 V logic with newer low-voltage MCUs and sensors; the NTS0304EUKZ translates four bidirectional lines between these domains in one tiny package. Open-drain outputs are compatible with shared status and alert buses (for example open-drain interrupt or SMBus alert lines), and auto direction sensing removes direction control firmware entirely on multidrop lines. With VCC(A) from 0.95 V to 3.6 V per the NXP data sheet, the device bridges modern 1.2 V/1.8 V FPGA or MCU banks to 3.3 V sensor and actuator interfaces. In noisy environments, choose pull-up values that dominate line capacitance for sharp edges, keep OE deasserted until both rails are stable, and route the WLCSP short traces with solid ground reference for EMI robustness.
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추천 제품 요약
엔지니어링 참조 데이터: NTS0304EUKZ — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | NTS0304EUK |
|---|---|---|
| Package | 12-WLCSP (1.42 x 1.97 mm) | 12-WLCSP (same UK ball map) |
| Brand | NXP Semiconductors | NXP Semiconductors |
| Channels | 4 bidirectional (8 I/O) | 4 bidirectional (8 I/O) |
| VCC(A) Range | 0.95 V to 3.6 V | 0.95 V to 3.6 V |
| Output Type | Open drain | Open drain |
| Direction Control | Auto-direction sensing | Auto-direction sensing |
| Output Enable (OE) | Yes | Yes |
주요 차별점
- Auto direction sensing eliminates DIR pin (vs Push-pull DIR-controlled translators (e.g., standard 74LVC transceivers))
- Extreme board-space efficiency (vs Same-function SOIC/QFN level translators)
- Per-side independent pull-up rail levels (vs Fixed-ratio push-pull translators)
설계 노트
The NTS0304EUKZ uses a 12-ball WLCSP (1.42 x 1.97 mm) with a proprietary ball map. Follow the NXP NTS0304E data sheet (Rev. 1.3, October 2023) land-pattern recommendations exactly - WLCSP pads require the specified non-solder-mask-defined (NSMD) geometry for reliable ball joints. Route A-side and B-side traces short and direct, keep pull-up resistors close to their respective I/O balls, and pour a solid ground plane on the layer immediately beneath the device for signal return integrity.
Because the outputs are open drain, omitting pull-up resistors leaves the bus floating and the auto-direction sensing cannot resolve line state - the most common bring-up failure with this family. Size pull-ups (typically 2.2k-10k ohms) for total bus capacitance and required rise time on each domain. Also deassert OE until both VCC(A) and VCC(B) are stable to prevent partially-powered logic levels from propagating across voltage domains during power sequencing.
Supply VCC(A) within its 0.95 V to 3.6 V range and VCC(B) per the data sheet limits; a 100 nF ceramic decoupling capacitor at each supply ball is standard practice for WLCSP logic. Estimated: the translator's own supply current is small compared with the pull-up resistor current it must sink - for example, a 3.3 V rail with a 3.3k ohm pull-up draws about 1 mA per active-low channel, which is within the device's drive capability but should be summed across all four channels when budgeting the low-voltage rail.
규정 준수 정보
Z suffix denotes NXP RoHS-compliant, lead-free packaging per standard NXP ordering-code convention. REACH, halogen-free, and conflict-minerals declarations were not present in the verified data - consult the NXP product page compliance portal.
