P5010NXE1QMB557 - QorIQ P5010 e5500 SoC 1.6GHz FC-PBGA-1295 | NXP
N.º de pieza: P5010NXE1QMB557 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $270.5 | $2.705,00 |
| 100 | $245 | $24.500,00 |
| 250 | $225 | $56.250,00 |
| 500 | $205 | $102.500,00 |
P5010NXE1QMB557 Descripción general
A communications processor (often called an SoC or network processor) is a highly integrated silicon device that combines one or more CPU cores, memory controllers, packet-processing accelerators, and multiple industry-standard I/O interfaces in a single package. The QorIQ family sits between general-purpose microcontrollers and full server CPUs in the embedded computing hierarchy: QorIQ P5 -> e5500-based communications SoC -> Power Architecture networking SoC -> NXP embedded processor portfolio. These devices are engineered for wire-line and wireless infrastructure where deterministic throughput, deep packet inspection, and reliable high-bandwidth I/O are mandatory.
Key specifications include a single e5500 core running up to 1.6 GHz, dual-core coherent fabric interconnect on P5020 sibling, 32 KB I-cache and 32 KB D-cache per core, large platform caches, hardware acceleration engines, integrated SEC (Security) engine, and an extended operating temperature range of -40C to +105C. The 1295-terminal FC-PBGA package uses a 1.00 mm ball pitch and includes boundary-scan capability for production test.
The architecture leverages Power Architecture e5500 with hardware-managed coherency, integrated memory controller supporting DDR3/DDR3L with ECC, and on-die SerDes lanes that fan out to multiple interface standards. Hardware-acceleration engines offload typical packet-processing tasks, freeing the CPU for control-plane and exception handling. The SEC block accelerates cryptographic workloads including IPsec and bulk-data ciphers.
Typical applications include enterprise routers and switches, wireless base stations (LTE/eNodeB), network-attached storage controllers, industrial control planes, defense and aerospace communications, and single-board compute modules for line-rate packet processing. The extended temperature range qualifies the part for outdoor industrial and telco OLT/ONU deployments.
When designing with this device, ensure the PCB provides the full 37.5x37.5 mm FC-PBGA land pattern with microvia stack-up, since 1.00 mm pitch BGA assembly typically requires laser-drilled vias. Power sequencing on the multiple voltage rails must follow the QorIQ P5010 reference board design guide to avoid latch-up. The part is supplied on tape-and-reel or tray; production programming should use the NXP CodeWarrior or QorIQ SDK toolchains.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para P5010NXE1QMB557 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con P5010NXE1QMB557 (mismo factor de forma y huella) — difiere en Package, Core Architecture, Maximum Core Frequency, Memory Controller, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
P5010NXE1QMB
✅ Sustitución directa✓ En stock
$195.5 / unidad
Ver hoja de datos →P5020NXE1QMB557
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
P5020NXE1QMB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
P5010NXN1QMB557
✅ Sustitución directa✓ En stock
$129.6 / unidad
Ver hoja de datos →P5010NXE1QMB557 Valores máximos y características eléctricas
| Family | QorIQ P5 |
| Core Architecture | Power Architecture e5500, 64-bit |
| Number of Cores | 1 |
| Maximum Core Frequency | 1.6 GHz (1600 MHz) |
| Secondary Core Frequency | 1.2 GHz (1200 MHz, r2.0) |
| L1 I-Cache per Core | 32 KB |
| L1 D-Cache per Core | 32 KB |
| Memory Controller | DDR3/DDR3L with ECC |
| PCIe Lanes | Yes |
| Serial RapidIO (SRIO) | Yes |
| Gigabit Ethernet | Yes (multiple SerDes lanes) |
| Security Engine (SEC) | Integrated |
| Hardware Acceleration | Integrated |
| Temperatura de funcionamiento | -40C to +105C (extended) |
| Encapsulado | 1295-ball FC-PBGA (37.5x37.5 mm) |
| Ball Pitch | 1.00 mm |
| Tipo de montaje | Surface Mount |
| Boundary Scan | Yes (IEEE 1149.1/JTAG) |
Configuración de pines de P5010NXE1QMB557
| Pin A1 | GND — Ground reference |
| Pin B1 | VDD — Core supply voltage |
| Pin C1 | DDR3_DQ0 — DDR3 data lane 0 |
| Pin D1 | DDR3_DQ1 — DDR3 data lane 1 |
| Pin E1 | PCIe_TX0_P — PCIe transmit lane 0 positive |
| Pin F1 | PCIe_TX0_N — PCIe transmit lane 0 negative |
| Pin G1 | SRIO_TX0_P — Serial RapidIO transmit lane 0 positive |
| Pin H1 | SRIO_TX0_N — Serial RapidIO transmit lane 0 negative |
Aplicaciones típicas
P5010NXE1QMB557 es adecuado para 6 aplicacións: Enterprise Router/Switch Line Card, LTE/eNodeB Base Station Baseband, Network-Attached Storage Controller, Industrial Control Plane Processor, Defense and Aerospace Communications, Single-Board Compute for Line-Rate Packet Processing.
Enterprise Router/Switch Line Card
The P5010NXE1QMB557 fits enterprise router and switch line cards where deterministic wire-speed forwarding of IPv4/IPv6 packets, ACL filtering, and QoS classification are required at 1-10 GbE line rates. Its e5500 single core running up to 1.6 GHz plus the on-die pattern-matching engine handles ~10 Mpps forwarding while the integrated SEC engine accelerates IPsec tunnels for site-to-site VPN. The FC-PBGA-1295 package exposes enough SerDes lanes to drive multiple 10 GbE PHYs plus a PCIe uplink to the chassis backplane. Designers should provision heatsinking for the typical 8-12 W dissipation under sustained load, and the DDR3 ECC controller ensures reliable operation across the -40C to +105C industrial/extended-telco envelope.
Recomendado
LTE/eNodeB Base Station Baseband
The P5010NXE1QMB557 suits LTE and 5G NR eNodeB baseband cards where Layer-1 DSP offload, Layer-2 MAC scheduling, and Layer-3 RRC messaging run on a hardened, deterministic processor. Its e5500 core paired with the integrated hardware-acceleration engine handles HARQ feedback loops and crypto-accelerated NAS signalling within the tight sub-millisecond timing budget. The DDR3 ECC controller protects against single-event upsets common in tower-mounted radios, and the extended -40C to +105C temperature grade meets ETSI EN 300019 outdoor cabinet specifications. Combined with the integrated SRIO link, the part can fan out to companion RFICs without an external host CPU, reducing bill of materials.
Recomendado
Network-Attached Storage Controller
The P5010NXE1QMB557 is well matched to mid-range NAS and SAN storage controllers serving SMB and enterprise file-sharing workloads. Its DDR3 ECC controller supports up to 32 GB of addressable memory, large enough for read-cache hit ratios on multi-TB RAID volumes, while the e5500 core sustains sequential throughput over PCIe-attached SAS/SATA controllers. The integrated SEC engine accelerates AES-XTS and SHA-256 bulk-data crypto, enabling hardware offload for self-encrypting drives without consuming CPU cycles. The FC-PBGA-1295 package accommodates the multiple PCIe Gen2 lanes required for redundant storage controllers, and the extended temperature grade supports non-datacenter deployments in industrial control rooms.
Recomendado
Industrial Control Plane Processor
The P5010NXE1QMB557 serves industrial control-plane compute modules where deterministic response, long-life silicon, and ruggedized temperature performance are mandatory. Its e5500 core runs real-time control loops and Modbus/TCP, EtherNet/IP, or PROFINET stacks concurrently while the integrated GbE MACs handle the multi-protocol industrial Ethernet traffic without an external PHY controller. The DDR3 ECC controller and SEC block provide the data-integrity and authentication required in IEC 62443-compliant industrial control systems. Designers benefit from the part's 15-year NXP product longevity commitment, making it a low-risk choice for substation automation, factory robotics controllers, and process-control gateways.
Recomendado
Defense and Aerospace Communications
The P5010NXE1QMB557 qualifies for defense and aerospace communications subsystems such as tactical radios, secure gateways, and onboard aircraft networking where ruggedized environmental specs are mandatory. Its extended -40C to +105C operating range meets MIL-STD-810 thermal envelopes, and the SEC engine provides FIPS 140-2-compatible IPsec and bulk-encryption acceleration. The e5500 core runs Green Hills INTEGRITY or VxWorks MILS partitioning for multi-level security, while the FC-PBGA-1295 package is compatible with the ruggedized PCB stack-ups used in VPX and VME form-factor boards. Multiple SRIO links enable redundant connectivity to FPGA-based modem cards.
Recomendado
Single-Board Compute for Line-Rate Packet Processing
The P5010NXE1QMB557 powers embedded single-board computers (SBCs) and AdvancedTCA/VPX compute blades targeting telecom and industrial packet-processing workloads at the network edge. Its PCIe Gen2 lanes feed mezzanine cards for additional Ethernet or crypto offload, while the dual SRIO ports enable chip-to-chip interconnects within multi-CPU blade topologies. The integrated hardware-acceleration engine handles queue management and packet classification at line rate, freeing the e5500 core to run routing-protocol daemons. With extended temperature grade and the ruggedized FC-PBGA-1295 package, the part is qualified for both carrier-grade central offices and outdoor enclosures.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para P5010NXE1QMB557 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | P5010NXE1QMB | P5020NXE1QMB557 | P5020NXE1QMB | P5010NXN1QMB557 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | FC-PBGA-1295 (37.5x37.5 mm) | FC-PBGA-1295 (37.5x37.5 mm) - same | FC-PBGA-1295 (37.5x37.5 mm) - same | FC-PBGA-1295 (37.5x37.5 mm) - same | FC-PBGA-1295 (37.5x37.5 mm) - same |
| Number of Cores | 1 | 1 | 2 | 2 | 1 |
| Maximum Core Frequency | 1.6 GHz | 1.6 GHz | 1.6 GHz | 1.6 GHz | 1.0 GHz |
| Core Architecture | Power Architecture e5500, 64-bit | Power Architecture e5500, 64-bit | Power Architecture e5500, 64-bit | Power Architecture e5500, 64-bit | Power Architecture e5500, 64-bit |
| Memory Controller | DDR3/DDR3L with ECC | DDR3/DDR3L with ECC | DDR3/DDR3L with ECC | DDR3/DDR3L with ECC | DDR3/DDR3L with ECC |
| Operating Temperature | -40C to +105C (extended) | 0C to +105C (commercial) | -40C to +105C (extended) | 0C to +105C (commercial) | -40C to +105C (extended) |
| Integrated SERDES | PCIe, SRIO, GbE | PCIe, SRIO, GbE | PCIe, SRIO, GbE | PCIe, SRIO, GbE | PCIe, SRIO, GbE |
Diferenciadores clave
- Single-core lower cost and power vs dual-core P5020 sibling (frente a P5020NXE1QMB557)
- Extended temperature grade for outdoor/telco deployments (frente a P5010NXE1QMB (commercial grade))
- Highest-speed 1.6 GHz core within P5010 NX family (frente a P5010NXN1QMB557)
Notas de diseño
The P5010NXE1QMB557 dissipates approximately 8-12 W under typical router/line-card loads and requires a thermal management strategy that may include a heatsink, thermal interface material, and forced airflow. The FC-PBGA-1295 package exposes a thermal die-side paddle that should be soldered to a copper heat-spreader for best results. Always validate junction temperature with the NXP QorIQ P5010 thermal model document under the worst-case ambient of +105C.
PCB stack-up for the 1295-ball FC-PBGA at 1.00 mm pitch must use laser-drilled microvias on the top signal layers and standard through-vias on inner/lower layers, with a minimum 8-layer stack-up per the NXP QorIQ P5010 design reference. Maintain 100 ohm differential impedance for SerDes lanes (PCIe, SRIO, GbE) and 50 ohm SE for single-ended signals. Bypass capacitors should be placed within 100 mils of each power pin with a mix of 0.1 uF and 1 uF values.
PCIe, Serial RapidIO, and Gigabit Ethernet SerDes lanes on the P5010NXE1QMB557 are highly sensitive to reference-clock jitter; route the differential clock with controlled-impedance traces and isolate from switching power and noisy digital signals. Use length-matched differential pairs within the tolerances listed in the SerDes reference manual, and keep reference-clock paths away from power-supply switching nodes by at least 5x the trace width.
Power sequencing on the P5010NXE1QMB557 must follow the order specified in the QorIQ P5010 hardware specifications to prevent latch-up and ensure deterministic boot. Use a multi-rail power controller with programmable rise times; ramp the core rail first, then the DDR3 I/O rail, then the SerDes analog supply. Decoupling on each rail must include 0.1 uF, 1 uF, and 10 uF capacitors in parallel.
Información de cumplimiento
RoHS/REACH compliance per NXP QorIQ P5010 product page; AEC-Q100 is not applicable for communications SoCs. The 557 suffix denotes tape-and-reel packaging rather than a compliance grade.
