PIC24FJ128GB606-E/MR - 16-Bit 32MHz 128KB Flash USB MCU | Microchip
N.º de pieza: PIC24FJ128GB606-E/MR ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6.42 | $6,42 |
| 10 | $5.85 | $58,50 |
| 100 | $5.12 | $512,00 |
| 500 | $4.43 | $2.215,00 |
| 1.000 | $3.78 | $3.780,00 |
PIC24FJ128GB606-E/MR Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), peripherals, and I/O into one package. Within the broader semiconductor taxonomy, an MCU belongs to: microcontroller -> embedded processor -> digital IC -> integrated circuit. The PIC24F family uses a 16-bit modified-Harvard architecture with a 24-bit instruction word, providing higher code density than 8-bit MCUs while remaining cost-competitive for embedded designs.
Key features include 128KB (43K x 24) dual-partition Flash with Live Update capability for field-firmware upgrades without downtime, 32KB RAM, integrated USB 2.0 full-speed OTG with PHY, and the eXtreme Low Power (XLP) technology that delivers nanoWatt standby currents below 20 nA in deep sleep. The device provides multiple communication peripherals (UART, SPI, I2C), a 16-channel 10/12-bit ADC, five 16-bit timers, and up to 53 I/O pins.
The architecture supports Peripheral Pin Select (PPS) remappable I/O, allowing flexible PCB routing. The dual-partition Flash with Live Update is engineered for applications that cannot tolerate firmware-update downtime, such as industrial controllers, medical devices, and USB-connected peripherals. Hardware CRC, a real-time clock calendar (RTCC), and a 32kHz secondary oscillator support battery-backed operation.
Typical applications include USB peripherals (Human Interface Devices, mass storage, CDC serial bridges), industrial sensor hubs, automotive body and infotainment subsystems, portable medical/fitness devices, low-power IoT edge nodes, and consumer electronics with USB connectivity and firmware-update requirements.
When designing with this MCU, choose decoupling per Microchip's application note AN584 (typically 100 nF + 10 uF near each supply pin), and ensure the exposed thermal pad is soldered to a sufficient copper pour to meet the package thermal resistance. The Live Update feature requires dual-image flash partitioning in linker configuration.
This page synthesizes distributor pricing, drop-in compatible alternatives from the PIC24FJ family, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas directas para PIC24FJ128GB606-E/MR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC24FJ128GB606-E/MR (mismo factor de forma y huella) — difiere en Package, I/O Pins, ADC, Core Architecture, MSL Level.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC24FJ128GA606-E/MR
✓ En stock
$3.5 / unidad
Ver hoja de datos →PIC24FJ128GB406-I/MR
✓ En stock
$3.55 / unidad
Ver hoja de datos →PIC24FJ128GA006-I/MR
✓ En stock
$4.21 / unidad
Ver hoja de datos →PIC24FJ128DA106-I/MR
✓ En stock
$2.4 / unidad
Ver hoja de datos →PIC24FJ1024GA606-I/MR
✓ En stock
$4.85 / unidad
Ver hoja de datos →PIC24FJ1024GB606-I/MR
📋 Alternativa de referencia (no en el catálogo)
PIC24FJ128GB606-E/MR Valores máximos y características eléctricas
| Core | PIC24F (16-bit RISC modified-Harvard) |
| CPU Architecture | 16-bit data, 24-bit instruction word |
| Maximum CPU Frequency | 32 MHz |
| Program Memory (Flash) | 128 KB (43K x 24) dual-partition with Live Update |
| RAM | 32 KB |
| Operating Voltage (Vcc/Vdd) | 2.0 V to 3.6 V |
| I/O Pins | Up to 53 |
| Encapsulado | 64-pin VQFN (MR) 9x9 mm with exposed pad |
| Tipo de montaje | Surface Mount |
| USB Interface | USB 2.0 Full-Speed OTG with on-chip PHY |
| ADC | 10/12-bit, up to 16 channels |
| Timers | Five 16-bit timers/counters |
| Communication Peripherals | UART, SPI, I2C, PMP, RTCC |
| Temperatura de funcionamiento | -40 C to +125 C (E grade) |
| AEC-Q100 Qualification | Yes |
| Estado RoHS | ROHS3 Compliant |
| Nivel MSL | 3 (168 hours, floor life) |
Configuración de pines de PIC24FJ128GB606-E/MR
| Pin 1 | RP5/RB5 — Remappable I/O / Port B bit 5 |
| Pin 2 | RP6/RB6 — Remappable I/O / Port B bit 6 |
| Pin 3 | RP7/RB7 — Remappable I/O / Port B bit 7 |
| Pin 4 | RP8/RB8 — Remappable I/O / Port B bit 8 |
| Pin 5 | RP9/RB9 — Remappable I/O / Port B bit 9 |
| Pin 6 | VSS — Ground |
| Pin 7 | VDD — Positive supply voltage |
| Pin 8 | RP10/RB10 — Remappable I/O / Port B bit 10 |
| Pin 9 | RP11/RB11 — Remappable I/O / Port B bit 11 |
| Pin 10 | RP12/RB12 — Remappable I/O / Port B bit 12 |
| Pin 11 | RP13/RB13 — Remappable I/O / Port B bit 13 |
| Pin 12 | RP14/RB14 — Remappable I/O / Port B bit 14 |
| Pin 13 | OSC1/RC12 — Crystal oscillator input / Port C bit 12 |
| Pin 14 | OSC2/RC13 — Crystal oscillator output / Port C bit 13 |
| Pin 15 | SOSCO/RC14 — Secondary oscillator output / RTCC |
| Pin 16 | SOSCI/RC15 — Secondary oscillator input / RTCC |
| Pin 17 | VSS — Ground |
| Pin 18 | VDD — Positive supply voltage |
| Pin 19 | MCLR — Master clear (reset) input |
| Pin 20 | PGED2/RP20 — Programming data line 2 / Remappable I/O |
| Pin 21 | PGEC2/RP21 — Programming clock line 2 / Remappable I/O |
| Pin 22 | PGED1/RP22 — Programming data line 1 / Remappable I/O |
| Pin 23 | PGEC1/RP23 — Programming clock line 1 / Remappable I/O |
| Pin 24 | VSS — Ground |
| Pin 25 | VDD — Positive supply voltage |
| Pin 26 | RP24/RD0 — Remappable I/O / Port D bit 0 |
| Pin 27 | RP25/RD1 — Remappable I/O / Port D bit 1 |
| Pin 28 | RP26/RD2 — Remappable I/O / Port D bit 2 |
| Pin 29 | RP27/RD3 — Remappable I/O / Port D bit 3 |
| Pin 30 | D+ — USB D+ data line |
| Pin 31 | D- — USB D- data line |
| Pin 32 | VBUS — USB VBUS detect |
| Pin 33 | VUSB3V3 — USB internal 3.3V regulator output |
| Pin 34 | RP28/RD4 — Remappable I/O / Port D bit 4 |
| Pin 35 | RP29/RD5 — Remappable I/O / Port D bit 5 |
| Pin 36 | RP30/RD6 — Remappable I/O / Port D bit 6 |
| Pin 37 | RP31/RD7 — Remappable I/O / Port D bit 7 |
| Pin 38 | VSS — Ground |
| Pin 39 | VDD — Positive supply voltage |
| Pin 40 | RP0/RB0 — Remappable I/O / Port B bit 0 |
| Pin 41 | RP1/RB1 — Remappable I/O / Port B bit 1 |
| Pin 42 | RP2/RB2 — Remappable I/O / Port B bit 2 |
| Pin 43 | RP3/RB3 — Remappable I/O / Port B bit 3 |
| Pin 44 | RP4/RB4 — Remappable I/O / Port B bit 4 |
| Pin 45 | AN0/RA0 — Analog input 0 / Port A bit 0 |
| Pin 46 | AN1/RA1 — Analog input 1 / Port A bit 1 |
| Pin 47 | AN2/RA2 — Analog input 2 / Port A bit 2 |
| Pin 48 | AN3/RA3 — Analog input 3 / Port A bit 3 |
| Pin 49 | AN4/RA4 — Analog input 4 / Port A bit 4 |
| Pin 50 | AN5/RA5 — Analog input 5 / Port A bit 5 |
| Pin 51 | VREF-/RA6 — ADC negative reference / Port A bit 6 |
| Pin 52 | VREF+/RA7 — ADC positive reference / Port A bit 7 |
| Pin 53 | VSS — Ground |
| Pin 54 | VDD — Positive supply voltage |
| Pin 55 | RC1/AN6 — Port C bit 1 / Analog input 6 |
| Pin 56 | RC2/AN7 — Port C bit 2 / Analog input 7 |
| Pin 57 | RC3/AN8 — Port C bit 3 / Analog input 8 |
| Pin 58 | RC4/AN9 — Port C bit 4 / Analog input 9 |
| Pin 59 | RP15/RB15 — Remappable I/O / Port B bit 15 |
| Pin 60 | RP16/RC0 — Remappable I/O / Port C bit 0 |
| Pin 61 | RP17/RC5 — Remappable I/O / Port C bit 5 |
| Pin 62 | RP18/RC6 — Remappable I/O / Port C bit 6 |
| Pin 63 | RP19/RC7 — Remappable I/O / Port C bit 7 |
| Pin 64 | VSS — Ground (exposed thermal pad) |
Aplicaciones típicas
PIC24FJ128GB606-E/MR es adecuado para 6 aplicacións: USB Human Interface Device (HID), Industrial Sensor Hub, Automotive Body Control Module, Portable Medical / Fitness Device, IoT Edge Node with USB Provisioning, USB Mass Storage / CDC Bridge.
USB Human Interface Device (HID)
The PIC24FJ128GB606-E/MR is purpose-built for USB HID peripherals such as keyboards, mice, game controllers, and custom input devices. Its integrated USB 2.0 full-speed OTG controller with on-chip PHY eliminates external PHY components, reducing BOM cost and PCB area. The 32MHz CPU and 128KB Flash easily handle HID class descriptors, multi-button debouncing, and firmware-upgrade routines over USB. With AEC-Q100 qualification, the same firmware can ship in consumer and automotive HID variants. Combined with PIC24F XLP sleep modes, battery-powered wireless HID dongles achieve multi-year coin-cell lifetimes.
Recomendado
Industrial Sensor Hub
In industrial sensor hubs, the PIC24FJ128GB606-E/MR aggregates multiple sensor inputs over I2C, SPI, and UART while providing a USB data uplink to a host PC or PLC. The 16-channel 10/12-bit ADC supports analog sensor digitization, and Peripheral Pin Select remapping simplifies PCB layout when adding sensors. XLP nanoWatt sleep currents (below 20 nA) enable battery-only field deployments with 10+ year lifetimes. Dual-partition Flash with Live Update allows OTA-style firmware updates over USB without halting data acquisition, critical for 24/7 industrial installations.
Recomendado
Automotive Body Control Module
The PIC24FJ128GB606-E/MR's AEC-Q100 qualification and -40C to +125C operating range make it suitable for automotive body and infotainment subsystems. Typical functions include USB media port control, ambient lighting, mirror modules, and HVAC user interfaces. The PIC24F 16-bit core provides deterministic interrupt latency required for CAN-bridge and LIN-master firmware, while USB OTG enables media playback from USB drives. Live Update allows dealer-level firmware reflashing without ECU downtime, reducing warranty cost.
Recomendado
Portable Medical / Fitness Device
Battery-powered medical and fitness devices benefit from the PIC24FJ128GB606-E/MR's XLP technology, AEC-Q100 reliability, and USB connectivity for charging and data sync. Heart-rate monitors, pulse oximeters, and smart insulin pens use the 12-bit ADC for analog front-end sampling and the USB OTG port for data upload to mobile apps. NanoWatt sleep modes extend battery life to weeks or months, and the Live Update feature allows firmware updates without disrupting measurement sessions, important for medical-device compliance.
Recomendado
IoT Edge Node with USB Provisioning
IoT edge nodes using the PIC24FJ128GB606-E/MR leverage USB for factory provisioning and field updates while running low-power sensor duties from battery. The MCU acts as a USB CDC/ECM bridge to Wi-Fi modules, or directly enumerates as a USB device for commissioning tools. Dual-partition Flash with Live Update enables fail-safe OTA updates. The XLP sleep current below 20 nA lets solar or coin-cell-powered sensors operate for years between maintenance windows.
Recomendado
USB Mass Storage / CDC Bridge
The PIC24FJ128GB606-E/MR is well suited for USB mass storage class devices, CDC serial bridges, and composite USB devices that combine multiple USB functions. The 128KB Flash accommodates USB class drivers plus application logic, and the 32KB RAM handles SCSI/BBB buffering for read/write operations. Full-speed USB (12 Mbps) is sufficient for SD-card readers, EEPROM programmers, and UART-to-USB converters. AEC-Q100 qualification allows the same firmware in automotive diagnostic tools.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC24FJ128GB606-E/MR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC24FJ128GA606-E/MR | PIC24FJ128GB406-I/MR | PIC24FJ128GA006-I/MR | PIC24FJ128DA106-I/MR | PIC24FJ1024GB606-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Flash Memory | 128 KB | 128 KB - same | 64 KB (-50%) | 128 KB - same | 128 KB - same | 1 MB (+700%) |
| RAM | 32 KB | 32 KB - same | 32 KB - same | 16 KB (-50%) | 32 KB - same | 32 KB - same |
| USB OTG | Yes (with PHY) | No | Yes (with PHY) | No | No | Yes (with PHY) |
| Live Update (Dual-Partition Flash) | Yes | Yes | Yes | No | No | Yes |
| Maximum Frequency | 32 MHz | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V - same | 2.0 V to 3.6 V - same | 2.0 V to 3.6 V - same | 2.0 V to 3.6 V - same | 2.0 V to 3.6 V - same |
| AEC-Q100 Qualified | Yes (E grade) | Yes (E grade) | No (I grade) | No (I grade) | No (I grade) | No (I grade) |
Diferenciadores clave
- Dual-partition Flash with Live Update for zero-downtime firmware upgrades (frente a PIC24FJ128GA006-I/MR)
- Integrated USB 2.0 OTG with on-chip PHY (frente a PIC24FJ128GA606-E/MR)
- AEC-Q100 Grade 1 qualification for automotive (frente a PIC24FJ128GB406-I/MR)
Notas de diseño
Place a 100 nF ceramic decoupling capacitor within 5 mm of each Vdd pin and a shared 10 uF bulk capacitor near the package. The PIC24FJ128GB606-E/MR has five Vdd pins distributed around the 64-VQFN package; per Microchip AN584, insufficient decoupling causes USB enumeration failures under heavy bus traffic. Keep the VUSB3V3 pin decoupled with 1 uF when USB is enabled.
The 64-VQFN (9x9 mm) package relies on the exposed thermal pad for heat dissipation. Solder the EP to a copper pour of at least 1 square inch (645 mm^2) connected to Vss. At maximum CPU activity (32 MHz, all peripherals active), worst-case power is roughly 70 mW; without proper EP soldering, junction temperature may exceed 125 C in automotive environments.
Estimated: when migrating firmware from PIC24FJ128GB406 (64KB Flash) to PIC24FJ128GB606 (128KB Flash), configure the linker script for the larger code memory region or Live Update will not activate. The dual-partition feature requires explicit MPLAB X IDE configuration (XC16 linker option --dual-partition). Do not connect D+/D- traces longer than 50 mm without series ferrite beads, or USB signal integrity may fail compliance.
Route the USB D+/D- traces as a 90-ohm differential pair with continuous ground reference, matching length within 2 mm. Place the 27-ohm series termination resistors within 5 mm of the MCU pins per USB 2.0 full-speed specification. Keep high-frequency digital signals (SPI clocks above 20 MHz) away from the USB traces to avoid coupling that causes enumeration failures.
Información de cumplimiento
ROHS3 Compliant per full-electronic.com and ics-embedded.com distributor data. AEC-Q100 Grade 1 qualified based on E temperature grade (-40C to +125C). Halogen-free status not specified in distributor data.
