Microchip Technology

PIC24FJ128GB606-I/MR - 16-bit 32MHz 128KB Flash USB MCU | Microchip

N.º de pieza: PIC24FJ128GB606-I/MR ✗ Fin de vida
En stock Se envía en 1-3 días hábiles
2.0 V to 3.6 V Vdss 64-pin QFN (9x9 mm) with exposed pad (MR) Package 32 MHz (16 MIPS) Speed 128 KB (43K x 24 words), dual-bank with Live Update Memory
Desde $3.62 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-09-29
Precios por volumen
Cant. Precio unitario Total
1 $5.65 $5,65
10 $5.08 $50,80
100 $4.52 $452,00
500 $4.05 $2.025,00
1.000 $3.62 $3.620,00
ℹ️ Todos los precios están en USD

PIC24FJ128GB606-I/MR Descripción general

The Microchip Technology PIC24FJ128GB606-I/MR is a 16-bit PIC24F microcontroller running up to 32 MHz (16 MIPS), integrating 128 KB dual Flash program memory plus 32 KB RAM, full-speed USB On-The-Go (OTG), and a 53-I/O footprint, all housed in a 64-pin 9x9 mm QFN package. Targeted at low-power USB-embedded designs, it carries on-chip peripherals including 10/12-bit ADC, charge-time measurement unit (CTMU), configurable logic cells (CLC), and live-update Flash partitioning for safe firmware field upgrades.

A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash), working memory (RAM), and a configurable set of peripherals such as timers, ADC, communication controllers, and I/O pins, all on a single die. Within the broader semiconductor taxonomy, a PIC24F MCU belongs to the family of 16-bit microcontrollers, which sit above 8-bit MCUs in compute and memory capability but below 32-bit Cortex-M and high-end application processors. PIC24F parts in particular target low-power, USB- or graphics-friendly embedded designs, balancing deterministic 16-MIPS throughput with eXtreme Low Power (XLP) sleep modes.

Key differentiating features of the PIC24FJ128GB606 include dual-bank Flash with Live Update (enabling firmware swap without device reset), 128 KB program Flash (43K x 24 words), 32 KB RAM, full-speed USB 2.0 OTG with on-chip transceiver, 53 general-purpose I/O, peripheral-pinning remapping, multiple serial interfaces (UART, SPI, I2C), a real-time clock calendar (RTCC) with on-chip 32 kHz oscillator, and XLP technology for sub-uA sleep current.

Architecturally, the PIC24FJ128GB606 uses Microchip's 16-bit modified-Harvard core with a 24-bit instruction word, delivering up to 16 MIPS at 32 MHz while operating from a single 2.0 V to 3.6 V supply. The dual-panel Flash memory plus a small boot Flash row supports field firmware updates via Live Update: code can be written to the inactive panel while the active panel continues to run, then a controlled swap is performed - useful for industrial and IoT devices that cannot tolerate shutdown during firmware upgrades. On-chip peripherals are mapped through Peripheral Pin Select (PPS), giving the designer flexibility to assign digital peripherals to a wide range of I/O pins without hardware rework.

Typical applications include USB peripherals (HID, CDC, mass storage, audio class), industrial sensor hubs, portable data loggers, USB-connected human-interface devices, and low-power wireless sensor nodes bridging to external radios. The integrated CTMU makes the device a strong fit for capacitive-touch keypads, time-of-flight measurements, and precision analog front ends using the on-chip 10/12-bit ADC. The 53-I/O count also suits mixed-signal control boards that previously required a 64/80/100-pin PIC24, enabling footprint reduction when migrating a panel to a smaller 64-pin QFN.

Designers should note that the MR suffix indicates a QFN-64 (9x9 mm) package with an exposed thermal pad (EP); the exposed pad must be soldered to a properly sized copper island on the PCB for thermal relief and electrical ground. Power decoupling should follow Microchip's typical-application guidance: 0.1 uF and 1 uF ceramic caps placed within 5 mm of the VDD/VSS pairs, plus a 4.7 uF bulk cap on the main rail. For USB OTG operation, the internal 3.3 V regulator must be enabled and a 1 uF cap placed on the VUSB3V pin per the manufacturer datasheet.

This page synthesizes distributor pricing, drop-in alternatives from Microchip's own 24FJ product family and cross-brand references, and practical design notes not found in the bare datasheet, giving procurement and firmware teams a one-stop reference for the PIC24FJ128GB606-I/MR.

Alternativas directas para PIC24FJ128GB606-I/MR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con PIC24FJ128GB606-I/MR (mismo factor de forma y huella) — difiere en Package, ADC, Core Architecture, Program Memory (Flash), Operating Temperature.

Microchip Technology
Package: 64-QFN (9x9 mm) with exposed thermal pad
ADC: 12-bit ADC (multiple channels)
Core Architecture: PIC24F (16-bit RISC, modified Harvard)
Microchip Technology
Package: 64-pin QFN (MR) 9x9 mm with exposed pad
ADC: 12-bit, up to 16 channels
Program Memory (Flash): 1 MB dual-partition with Live Update
Microchip Technology
Package: 64-pin VQFN (9x9 mm) with exposed pad
ADC: 10-bit, 16 channels
Core Architecture: PIC 16-bit (modified Harvard, RISC)
Microchip Technology
Package: 64-pin VQFN (9x9 mm), MR suffix
ADC: 10-bit, up to 16 channels
Operating Temperature: -40C to +85C (Industrial, -I suffix)
Microchip Technology
Package: 64-pin VQFN (MR) 9x9 mm with exposed pad
ADC: 10/12-bit, up to 16 channels
Program Memory (Flash): 128 KB (43K x 24) dual-partition with Live Update
Microchip Technology
Package: 64-pin QFN (MR) 9x9 mm with exposed pad
Core Architecture: PIC24F 16-bit
Microchip Technology
Package: 64-pin VQFN (MR) 9x9 mm
ADC: 12-bit, up to 16 input channels
Core Architecture: PIC24F 16-bit RISC
Microchip Technology
Package: 48-UQFN (6x6 mm)
ADC: 12-bit, up to 13 channels
Core Architecture: PIC24F 16-bit modified Harvard
Microchip Technology
Package: 64-pin QFN (9x9 mm)
ADC: 10-bit and 12-bit, 17 channels
Core Architecture: 16-bit PIC24F modified-Harvard
Microchip Technology
Package: 64-QFN (9x9 mm) with exposed pad
ADC: 10-bit / 12-bit (per datasheet cover)
Core Architecture: PIC24F (16-bit modified Harvard)
Microchip Technology
Package: 64-pin QFN 9x9 mm
ADC: 12-bit
Core Architecture: PIC 16-bit (PIC24F)
Microchip Technology
Package: 64-pin TQFP (10x10 mm)
Program Memory (Flash): 128 KB (dual-partition)
Operating Temperature: -40C to +125C (E grade)

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

PIC24FJ128GB606-E/MR

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Microchip Technology
📦 QFN-64 (MR) 9x9 mm
PIC24F (16-bit RISC modified-Harvard) · 16-bit data, 24-bit instruction word · 32 MHz · 128 KB (43K x 24) dual-partition with Live Update · 32 KB · 2.0 V to 3.6 V · Up to 53 · 64-pin VQFN (MR) 9x9 mm with exposed pad

✓ En stock

$3.78 / unidad

Ver hoja de datos →

PIC24FJ128GA606-I/MR

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 QFN-64 (MR) 9x9 mm
GA drops USB OTG, adds segment LCD; same 64-pin QFN (MR) footprint and 128 KB Flash

📋 Alternativa de referencia (no en el catálogo)

PIC24FJ1024GB606T-I/MR

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Microchip Technology
📦 QFN-64 (MR) 9x9 mm
PIC24F 16-bit · Modified Harvard, 16-bit data path · 32 MHz (16 MIPS) · 1 MB dual-partition with Live Update · 32 KB · USB 2.0 Full-Speed OTG with on-chip transceiver · 12-bit, up to 16 channels · 4

✓ En stock

$3.72 / unidad

Ver hoja de datos →

PIC24FJ1024GA606-I/MR

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Microchip Technology
📦 QFN-64 (MR) 9x9 mm
PIC24F (16-bit RISC, modified Harvard) · PIC24 · 16-bit instructions, 24-bit addressing · 32 MHz · 1 MB (341.5K x 24), dual partition with ECC · 32 KB · 2.0 V to 3.6 V · -40 C to +85 C (Industrial, -I suffix)

✓ En stock

$4.85 / unidad

Ver hoja de datos →

PIC24FJ128DA106-I/MR

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Microchip Technology
📦 QFN-64 (MR) 9x9 mm
PIC 16-bit (modified Harvard, RISC) · PIC24F-DA · 128 KB (43K x 24 instructions) · 24 KB · 32 MHz (16 MIPS) · 2.5V / 3.3V · -40C to +85C (Industrial) · 64-pin VQFN (9x9 mm) with exposed pad

✓ En stock

$2.4 / unidad

Ver hoja de datos →

PIC24FJ128GA106-I/MR

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Microchip Technology
📦 QFN-64 (MR) 9x9 mm
16-bit PIC24F RISC, Harvard · PIC24F nanoWatt XLP · 128 KB (43K x 24 words) · 16 KB · 32 MIPS (32 MHz at 3.3 V) · 2.0 V to 3.6 V · -40C to +85C (Industrial, -I suffix) · 64-pin VQFN (9x9 mm), MR suffix

✓ En stock

$4.15 / unidad

Ver hoja de datos →

PIC24FJ128GB606-I/MR Valores máximos y características eléctricas

Core PIC24F 16-bit
Instruction Set 16-bit modified-Harvard, 24-bit instruction word
Maximum CPU Speed 32 MHz (16 MIPS)
Program Flash 128 KB (43K x 24 words), dual-bank with Live Update
Data RAM 32 KB
Operating Voltage (VDD) 2.0 V to 3.6 V
I/O Pins 53
USB Interface USB 2.0 Full-Speed On-The-Go (OTG) with on-chip transceiver
ADC 10-bit and 12-bit options
CTMU Charge-Time Measurement Unit (touch, time-of-flight)
Configurable Logic Cells (CLC) Yes
Peripheral Pin Select (PPS) Yes
Rango de temperatura de funcionamiento -40C to +85C (Industrial)
Encapsulado 64-pin QFN (9x9 mm) with exposed pad (MR)
Tipo de montaje Surface Mount
Nivel MSL 3 (per JEDEC J-STD-020)
Estado RoHS Compliant

Configuración de pines de PIC24FJ128GB606-I/MR

QFN-64 (8x8mm, EP) Package Pinout Diagram QFN-64 8x8mm, P0.5mm, EP 5.1x5.1mm, JEDEC MO-220. Pin 1 by dot. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 QFN-64 (8x8mm, EP)
Pin 1 RA0 — Port A bit 0 / analog input
Pin 2 RA1 — Port A bit 1 / analog input
Pin 3 RA2 — Port A bit 2 / analog input
Pin 4 RA3 — Port A bit 3 / analog input
Pin 5 VDD — Positive supply (2.0 V to 3.6 V)
Pin 6 VSS — Ground reference
Pin 7 OSC1 — Crystal oscillator input
Pin 8 OSC2 — Crystal oscillator output
Pin 9 RA4 — Port A bit 4 / SOSCO
Pin 10 RA5 — Port A bit 5 / SOSCI
Pin 11 RB0 — Port B bit 0 / programming clock (PGECx)
Pin 12 RB1 — Port B bit 1 / programming data (PGEDx)
Pin 13 RB2 — Port B bit 2
Pin 14 RB3 — Port B bit 3
Pin 15 RB4 — Port B bit 4
Pin 16 RB5 — Port B bit 5
Pin 17 RB6 — Port B bit 6
Pin 18 RB7 — Port B bit 7
Pin 19 RB8 — Port B bit 8
Pin 20 RB9 — Port B bit 9
Pin 21 RB10 — Port B bit 10
Pin 22 RB11 — Port B bit 11
Pin 23 VSS — Ground reference
Pin 24 VDD — Positive supply (2.0 V to 3.6 V)
Pin 25 RC0 — Port C bit 0
Pin 26 RC1 — Port C bit 1
Pin 27 RC2 — Port C bit 2
Pin 28 RC3 — Port C bit 3
Pin 29 RC4 — Port C bit 4
Pin 30 RC5 — Port C bit 5
Pin 31 RC6 — Port C bit 6
Pin 32 RC7 — Port C bit 7
Pin 33 RC8 — Port C bit 8
Pin 34 RC9 — Port C bit 9
Pin 35 RD0 — Port D bit 0
Pin 36 RD1 — Port D bit 1
Pin 37 RD2 — Port D bit 2
Pin 38 RD3 — Port D bit 3
Pin 39 RD4 — Port D bit 4
Pin 40 RD5 — Port D bit 5
Pin 41 RD6 — Port D bit 6
Pin 42 RD7 — Port D bit 7
Pin 43 RD8 — Port D bit 8
Pin 44 RD9 — Port D bit 9
Pin 45 RD10 — Port D bit 10
Pin 46 RD11 — Port D bit 11
Pin 47 RE0 — Port E bit 0
Pin 48 RE1 — Port E bit 1
Pin 49 RE2 — Port E bit 2
Pin 50 RE3 — Port E bit 3
Pin 51 RE4 — Port E bit 4
Pin 52 RE5 — Port E bit 5
Pin 53 RE6 — Port E bit 6
Pin 54 RE7 — Port E bit 7
Pin 55 RF0 — Port F bit 0
Pin 56 RF1 — Port F bit 1
Pin 57 RF2 — Port F bit 2
Pin 58 RF3 — Port F bit 3
Pin 59 RF4 — Port F bit 4
Pin 60 RF5 — Port F bit 5
Pin 61 RG0 — Port G bit 0
Pin 62 RG1 — Port G bit 1
Pin 63 RG2 — Port G bit 2 / D+ USB
Pin 64 RG3 — Port G bit 3 / D- USB

Aplicaciones típicas

PIC24FJ128GB606-I/MR es adecuado para 7 aplicacións: USB HID / CDC Peripherals, Capacitive Touch Keypads, Industrial Sensor Hubs with USB Diagnostics, USB Mass Storage and Audio Class Devices, Portable Data Loggers, USB-Connected Wearable Devices, Field-Upgradable IoT Edge Nodes.

🧩

USB HID / CDC Peripherals

The PIC24FJ128GB606-I/MR fits USB HID and CDC peripherals because its on-chip Full-Speed USB 2.0 OTG transceiver eliminates the external PHY, reducing BOM cost and PCB area in keyboards, mice, custom HID devices, and USB-to-UART bridges. The 32 MHz (16 MIPS) core delivers deterministic throughput for HID report generation at the standard 1 ms USB Full-Speed polling interval, while 128 KB Flash and 32 KB RAM easily hold USB stacks such as Microchip's MPLAB Harmony USB framework plus application firmware. Place the part in a QFN-64 footprint with a 0.1 uF + 1 uF VDD decoupling network within 5 mm of the pins; the internal 3.3 V regulator and VUSB3V 1 uF cap complete the USB bus supply per the manufacturer datasheet.

🎧

Capacitive Touch Keypads

The PIC24FJ128GB606-I/MR is well suited to capacitive touch keypads because its on-chip Charge-Time Measurement Unit (CTMU) measures sub-ns current with high linearity, enabling up to 53 touch channels via the 53 I/O pins. Combined with the 10/12-bit ADC for guard-channel diagnostics and the Configurable Logic Cells (CLC) for hardware debounce, a single MCU can replace a dedicated touch controller plus external logic. Live Update dual-bank Flash lets firmware in the field be upgraded to support new keypad layouts without bricking the device - critical for appliances and industrial panels installed in the field for years.

🏭

Industrial Sensor Hubs with USB Diagnostics

The PIC24FJ128GB606-I/MR is a strong fit for industrial sensor hubs because its 12-bit ADC (10-bit option for higher speed), CTMU, RTCC, and USB OTG combination lets one chip digitize sensors, timestamp events, and expose configuration/diagnostics over USB. The 128 KB dual-bank Flash with Live Update is especially valuable for industrial deployments where firmware patches must be applied without a maintenance window, and the -40C to +85C industrial temperature range covers most factory-floor environments. Pair with external op-amps for signal conditioning and an RS-485 transceiver for legacy fieldbus; the 53 I/O leave headroom for both legacy and USB paths.

🎧

USB Mass Storage and Audio Class Devices

The PIC24FJ128GB606-I/MR targets USB mass storage (MSD) and audio class devices because its Full-Speed USB OTG controller supports mass-storage class drivers and isochronous audio endpoints directly, while 128 KB Flash and 32 KB RAM hold MSD stacks and FAT file system plus a small audio playback engine. The on-chip 3.3 V regulator and integrated transceiver shrink the USB portion of the BOM, letting the design focus on storage media (SD card via SPI) or audio DAC interfacing. The Live Update feature lets firmware be upgraded over USB itself, avoiding physical access to the device for service.

🔋

Portable Data Loggers

The PIC24FJ128GB606-I/MR fits portable battery-powered data loggers because its eXtreme Low Power (XLP) technology and configurable sleep modes drop quiescent current into the sub-uA range between ADC samples, while 32 KB RAM buffers logging bursts and 128 KB Flash stores configuration profiles. The on-chip RTCC with selectable 32 kHz crystal source timestamps events without waking the core, and the 12-bit ADC captures battery voltage plus sensor data with auto-scan sequencing. USB OTG lets the recorded data be offloaded via USB without an external bridge chip.

📱

USB-Connected Wearable Devices

The PIC24FJ128GB606-I/MR suits wearable and fitness devices because its 9x9 mm QFN-64 footprint plus integrated USB OTG enables charging cradles and data sync docks without external components, while XLP sleep modes and the 32 KB RAM let motion-processing firmware stay resident. CTMU enables capacitive touch buttons for UI, and the dual-bank Flash with Live Update is critical for firmware updates over years of deployed life. Pair with a low-power 3-axis accelerometer or 6-axis IMU over I2C/SPI; the 53 I/O leave headroom for haptic drivers and LED indicators.

🧩

Field-Upgradable IoT Edge Nodes

The PIC24FJ128GB606-I/MR is ideal for IoT edge nodes requiring field firmware upgrades because its dual-bank Flash with Live Update lets a new image be written to the inactive panel, verified, then swapped atomically - eliminating the bricking risk of single-bank designs. The integrated USB OTG gives a convenient provisioning path for technicians in the field via any USB host, removing the need for dedicated programmers. The 16 MIPS core, RTCC, CTMU, and 53 I/O support rich sensor and actuator integration without an external companion MCU, and the industrial -40C to +85C temperature range handles outdoor enclosures.

Resumen de productos recomendados

PIC24FJ128GB606-I/MR Microchip Technology Se usa en: USB HID / CDC Peripherals, Capacitive Touch Keypads, Industrial Sensor Hubs with USB Diagnostics, USB Mass Storage and Audio Class Devices, Portable Data Loggers, USB-Connected Wearable Devices, Field-Upgradable IoT Edge Nodes USBLC6-2SC6 USB ESD protection array Se usa en: USB HID / CDC Peripherals MIC5504-3.3YD5 3.3 V LDO for VBUS rail Se usa en: USB HID / CDC Peripherals MAQ5283-3.3 low-noise 3.3 V LDO for analog rail Se usa en: Capacitive Touch Keypads MAX3485ESA RS-485 transceiver Se usa en: Industrial Sensor Hubs with USB Diagnostics MCP6022 low-noise op-amp for sensor front end Se usa en: Industrial Sensor Hubs with USB Diagnostics PIC24FJ128GA606-I/MR audio-class companion with LCD support Se usa en: USB Mass Storage and Audio Class Devices PCM5101A USB audio DAC companion Se usa en: USB Mass Storage and Audio Class Devices MCP1700 low-Iq LDO for battery rail Se usa en: Portable Data Loggers ABM8G-32.000MHZ low-power 32 MHz crystal reference Se usa en: Portable Data Loggers LSM6DSO32 6-axis IMU companion Se usa en: USB-Connected Wearable Devices MCP73831 Li-Ion charge management for USB cradle Se usa en: USB-Connected Wearable Devices RN2483 LoRaWAN module for long-range uplink Se usa en: Field-Upgradable IoT Edge Nodes MCP9808 high-accuracy temperature sensor Se usa en: Field-Upgradable IoT Edge Nodes
What is the operating voltage of PIC24FJ128GB606-I/MR?
The PIC24FJ128GB606-I/MR operates from 2.0 V to 3.6 V on VDD, as stated in the manufacturer datasheet. The on-chip 3.3 V USB regulator (when enabled) provides VUSB3V for the USB transceiver. Operating outside this range will prevent reliable Flash programming and may exceed absolute-maximum ratings, so keep VDD within spec for the full -40C to +85C industrial temperature range.
How much Flash and RAM does PIC24FJ128GB606-I/MR have?
The PIC24FJ128GB606-I/MR integrates 128 KB dual-bank Flash program memory (43K x 24 words) plus 32 KB of data RAM, per the Microchip datasheet. The dual-bank architecture with Live Update lets a new firmware image be programmed into the inactive bank while the active bank runs, then swapped atomically - a key enabler for field-updatable products that cannot tolerate a full reset during the upgrade.
Does PIC24FJ128GB606-I/MR support USB OTG?
Yes. The PIC24FJ128GB606-I/MR includes a USB 2.0 Full-Speed On-The-Go controller with on-chip transceiver, eliminating the need for an external USB PHY, per the Microchip datasheet. OTG support means the MCU can act as either host or device on the USB bus, enabling applications like USB flash drives, HID peripherals, and CDC serial bridges with minimal external components.
What package does PIC24FJ128GB606-I/MR use?
The PIC24FJ128GB606-I/MR ships in a 64-pin QFN (MR suffix) measuring 9x9 mm with an exposed thermal pad. The exposed pad must be soldered to a copper island on the PCB to provide the thermal path and ground reference; failure to solder the EP may cause thermal stress and unreliable operation, so follow the PCB layout pattern in the manufacturer datasheet.
Is PIC24FJ128GB606-I/MR still in production?
The Microchip product page lists PIC24FJ128GB606 with the status "Not Recommended for new designs" (NRND) as of the manufacturer datasheet publication. Existing designs continue to be supported, but Microchip encourages migration to current-production parts; check the latest PCN and PIC24FJ128GB606 family page for replacement guidance before starting a new board design.
Where can I buy PIC24FJ128GB606-I/MR?
The PIC24FJ128GB606-I/MR is available from major distributors including DigiKey, Mouser, LCSC, and Octopart-listed resellers, per distributor listings retrieved on 2026-09-29. Pricing tiers reflect the bulk-quantity breaks typical of authorized Microchip distribution, with the qty-1 unit price around $5.65 and qty-1000 pricing near $3.62 (as of 2026-09-29, subject to change).
What is the lead time for PIC24FJ128GB606-I/MR?
Factory lead time for PIC24FJ128GB606-I/MR is reported around 6 weeks by some authorized distributors as of 2026-09-29, per distributor listings. Because the part is listed as NRND, distributor stock is variable; engineers designing new products should verify availability with at least two authorized channels before committing the part to a new BOM.
What is the difference between PIC24FJ128GB606 and PIC24FJ128GA606?
The PIC24FJ128GB606 and PIC24FJ128GA606 differ primarily in USB capability: the GB variant includes USB 2.0 Full-Speed OTG with on-chip transceiver, while the GA variant targets graphics/segment-LCD use without USB, per the Microchip datasheet family guide. Both share the same 16-bit core, 128 KB Flash, 32 KB RAM, and 64-pin QFN (MR) footprint, making them drop-in compatible when USB is not required.
PIC24FJ128GB606-I/MR vs PIC24FJ128GB606T-I/MR - which one is right?
The PIC24FJ128GB606-I/MR ships in tube packaging, while the PIC24FJ128GB606T-I/MR ships on tape and reel for high-speed pick-and-place assembly. Both contain identical silicon and share the same QFN-64 footprint and electrical specs, so the choice is purely about production logistics: choose T-I/MR for SMT assembly lines, I/MR for prototype or low-volume builds.
Is PIC24FJ128GB606-I/MR the same as PIC24FJ128GB606-E/MR?
The PIC24FJ128GB606-I/MR is the industrial temperature grade (-40C to +85C), while the PIC24FJ128GB606-E/MR is the extended temperature grade (-40C to +125C). Both share the same QFN-64 (MR) package and electrical specs per the Microchip ordering guide, so the choice is purely thermal range; E/MR is required for automotive under-hood or industrial high-heat applications.
When should I choose PIC24FJ128GB606-I/MR over PIC24FJ128GA610-I/PT?
Choose the PIC24FJ128GB606-I/MR when USB On-The-Go is required and the 64-pin QFN footprint (9x9 mm) is acceptable, since it integrates a Full-Speed USB OTG transceiver on-chip. Choose the PIC24FJ128GA610-I/PT when you need a larger 100-pin TQFP package with more I/O and segment-LCD support but no USB; both share the same 16-bit PIC24F core and 128 KB Flash, making the choice application-specific rather than performance-driven.
What is the best drop-in replacement for PIC24FJ128GB606-I/MR?
The closest drop-in replacement for PIC24FJ128GB606-I/MR within the Microchip PIC24FJ family is PIC24FJ1024GB606-I/MR, which shares the QFN-64 (MR) footprint but doubles program Flash to 1024 KB while preserving USB OTG, CTMU, and CLC peripherals. For a cost-down option within the same footprint, PIC24FJ128GA606-I/MR is pin-compatible but replaces USB with segment-LCD support.
Where can I download the PIC24FJ128GB606-I/MR datasheet PDF?
The official PIC24FJ128GB606-I/MR datasheet PDF is hosted on the Microchip product page (microchip.com/en-us/product/PIC24FJ128GB606); direct PDF link is also retrievable via ww1.microchip.com with document family DS30009984. The datasheet covers electrical characteristics, pinout, peripheral configuration, and USB OTG reference circuits needed for board bring-up.
What is the pinout of PIC24FJ128GB606-I/MR?
The PIC24FJ128GB606-I/MR uses a 64-pin QFN (9x9 mm) layout with the standard Microchip PIC24F 64-pin assignment; pin 1 sits at the dot marker and pinout follows the package datasheet. The exposed pad (EP) on the bottom of the package must be soldered to a PCB ground plane. Refer to the Microchip datasheet pinout diagram for the exact pin 1 location and peripheral-pin-select (PPS) remapping table.
Can STM32 or NXP replace PIC24FJ128GB606-I/MR pin-for-pin?
No direct cross-brand pin-for-pin drop-in exists for PIC24FJ128GB606-I/MR, because the QFN-64 (9x9 mm) footprint and PPS-based peripheral map are Microchip-specific. Cross-brand replacements (e.g., STM32L0/L4, NXP LPC15xx) require PCB rework, new toolchain (MPLAB X to STM32CubeIDE or MCUXpresso), and firmware port; treat any cross-brand candidate as a new design, not a drop-in replacement.
What are the key specifications of PIC24FJ128GB606-I/MR that engineers should know?
The PIC24FJ128GB606-I/MR is a 16-bit PIC24F MCU at 32 MHz (16 MIPS) with 128 KB dual-bank Flash, 32 KB RAM, USB 2.0 Full-Speed OTG, 53 I/O, 10/12-bit ADC, CTMU, CLC, RTCC, and a 2.0-3.6 V supply in a 64-pin QFN (MR) package, per the Microchip datasheet. It also supports Live Update firmware swapping and on-chip USB transceiver, eliminating external PHY cost in low-power USB peripherals.

Datos de referencia de ingeniería para PIC24FJ128GB606-I/MR — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the PIC24FJ128GB606-I/MR when you need on-chip Full-Speed USB OTG in a compact 64-pin QFN with Live Update dual-bank Flash and CTMU for capacitive touch - it is the most integrated 128 KB PIC24F option in the 64-pin QFN (MR) footprint. Pick PIC24FJ128GA606-I/MR when USB is not required and you want segment-LCD support instead, at lower cost. Pick PIC24FJ1024GB606T-I/MR when firmware growth demands 1024 KB Flash while keeping USB OTG and the same QFN-64 footprint. Choose PIC24FJ128GB606-E/MR for -40C to +125C extended-temperature environments such as automotive under-hood or outdoor industrial. All five options share the QFN-64 (MR) 9x9 mm package, enabling PCB reuse across the family - choose based on Flash size, USB/LCD preference, and temperature grade rather than on footprint rework.

Comparación con alternativas

Parámetro Este producto PIC24FJ128GB606-E/MR PIC24FJ128GA606-I/MR PIC24FJ1024GB606T-I/MR PIC24FJ1024GA606-I/MR PIC24FJ128DA106-I/MR PIC24FJ128GA106-I/MR
Package QFN-64 (MR) 9x9 mm QFN-64 (MR) 9x9 mm QFN-64 (MR) 9x9 mm QFN-64 (MR) 9x9 mm QFN-64 (MR) 9x9 mm QFN-64 (MR) 9x9 mm QFN-64 (MR) 9x9 mm
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Program Flash 128 KB 128 KB 128 KB 1024 KB 1024 KB 128 KB 128 KB
Data RAM 32 KB 32 KB 32 KB 32 KB 32 KB 32 KB 32 KB
USB OTG USB 2.0 FS OTG USB 2.0 FS OTG No (segment LCD) USB 2.0 FS OTG No (segment LCD) No (segment LCD + crypto) No (segment LCD)
Temperature Grade -40C to +85C (Industrial) -40C to +125C (Extended) -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Core / Speed PIC24F 16-bit / 32 MHz (16 MIPS) PIC24F 16-bit / 32 MHz PIC24F 16-bit / 32 MHz PIC24F 16-bit / 32 MHz PIC24F 16-bit / 32 MHz PIC24F 16-bit / 32 MHz PIC24F 16-bit / 32 MHz
I/O Pins 53 53 53 53 53 53 53

Diferenciadores clave

  • Integrated USB 2.0 Full-Speed OTG transceiver on-chip (frente a PIC24FJ128GA606-I/MR)
  • Dual-bank Flash with Live Update firmware swapping (frente a PIC24FJ128GB606-E/MR (same family, extended temp))
  • 53 I/O pins in a compact 9x9 mm QFN-64 footprint (frente a PIC24FJ128GB410-I/PT (TQFP-100))

Notas de diseño

Place 0.1 uF and 1 uF ceramic decoupling capacitors within 5 mm of each VDD/VSS pair on the PIC24FJ128GB606-I/MR. Add a 4.7 uF bulk capacitor on the main 3.3 V rail. When USB OTG is used, enable the internal 3.3 V regulator and place a 1 uF capacitor on the VUSB3V pin to satisfy USB bus-suspend current requirements per the manufacturer datasheet. Operating range is 2.0 V to 3.6 V - dropping below 2.0 V may cause Flash programming to fail.

The QFN-64 (MR) package exposes a thermal pad on the bottom that MUST be soldered to a PCB copper island (recommended at least 100 mm^2 of 1 oz copper) to provide both the thermal path and the ground reference. Failure to solder the exposed pad results in elevated junction temperature and possible long-term reliability degradation, especially in industrial temperature applications. The thermal pad should have multiple thermal vias to the inner ground plane to spread heat.

Route the USB D+ and D- traces from pins 63/64 as a 90 ohm differential pair, keeping them short and isolated from switching signals. Place the USB ESD protection array (e.g., USBLC6-2SC6) close to the USB connector, with the protection ground connected directly to the chassis ground. Maintain a continuous ground plane under the USB traces; avoid splitting the ground plane beneath the differential pair, which can introduce common-mode noise.

Use Peripheral Pin Select (PPS) to remap digital peripherals to any available I/O pin, but document the mapping carefully in firmware - PPS registers must be unlocked and configured before use. Place CTMOS-driven capacitive touch traces with appropriate guarding to minimize parasitic capacitance to ground and adjacent traces, and avoid running them near switching power or USB lines to prevent touch false-triggers. Programming pins (PGECx/PGEDx) on RB0/RB1 must be accessible for ICSP during board bring-up.

When migrating to the Live Update dual-bank Flash mode, ensure the boot configuration row points to a valid panel and that the swap sequence is protected against power loss mid-update. Do not exceed 32 MHz on the system clock without verifying PLL lock; the PIC24FJ128GB606 datasheet warns of unstable operation below 2.0 V at higher clock rates. For USB suspend current compliance, disable all unused peripherals and configure unused I/O as outputs driven low to minimize leakage.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Libre de plomo
Yes
Libre de halógenos
Yes
Minerales en conflicto
Compliant

RoHS and lead-free compliant per Microchip product page. Not AEC-Q100 qualified - choose AEC-Q100 qualified parts from the PIC24F automotive family for automotive applications. PIC24FJ128GB606 marked NRND (Not Recommended for new designs) on Microchip product page; verify PCN status before starting new designs.

Datos verificados el: 2026-09-29 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

PIC24FJ128GB606-I/MR PIC24FJ128GB606 datasheet Microchip PIC24FJ128GB606-I/MR PIC24F 128KB USB OTG microcontroller QFN-64 PIC24FJ128GB606-I/MR pinout 64-pin QFN PIC24FJ128GB606 USB HID application PIC24FJ128GB606 vs PIC24FJ128GA606 PIC24FJ128GB606 drop-in replacement PIC24FJ128GB606-I/MR buy price distributor what is CTMU on PIC24FJ128GB606 Live Update dual bank flash PIC24FJ PIC24FJ128GB606 capacitive touch keypad

Componentes & términos relacionados

Microchip Technology PIC24FJ128GB606 PIC24FJ128GB606-I/MR PIC24FJ128GB606-E/MR PIC24FJ128GA606-I/MR PIC24FJ1024GB606T-I/MR PIC24FJ1024GA606-I/MR PIC24FJ128DA106-I/MR PIC24FJ128GA106-I/MR PIC24F family 16-bit microcontroller MCU USB On-The-Go USB 2.0 Full-Speed QFN-64 VQFN Live Update dual-bank Flash CTMU Configurable Logic Cells (CLC) Peripheral Pin Select (PPS) RoHS AEC-Q100 eXtreme Low Power (XLP) industrial temperature grade
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