PIC24FJ128GB606-E/MR - 16-Bit 32MHz 128KB Flash USB MCU | Microchip
Référence : PIC24FJ128GB606-E/MR ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.42 | $6,42 |
| 10 | $5.85 | $58,50 |
| 100 | $5.12 | $512,00 |
| 500 | $4.43 | $2 215,00 |
| 1 000 | $3.78 | $3 780,00 |
PIC24FJ128GB606-E/MR Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), peripherals, and I/O into one package. Within the broader semiconductor taxonomy, an MCU belongs to: microcontroller -> embedded processor -> digital IC -> integrated circuit. The PIC24F family uses a 16-bit modified-Harvard architecture with a 24-bit instruction word, providing higher code density than 8-bit MCUs while remaining cost-competitive for embedded designs.
Key features include 128KB (43K x 24) dual-partition Flash with Live Update capability for field-firmware upgrades without downtime, 32KB RAM, integrated USB 2.0 full-speed OTG with PHY, and the eXtreme Low Power (XLP) technology that delivers nanoWatt standby currents below 20 nA in deep sleep. The device provides multiple communication peripherals (UART, SPI, I2C), a 16-channel 10/12-bit ADC, five 16-bit timers, and up to 53 I/O pins.
The architecture supports Peripheral Pin Select (PPS) remappable I/O, allowing flexible PCB routing. The dual-partition Flash with Live Update is engineered for applications that cannot tolerate firmware-update downtime, such as industrial controllers, medical devices, and USB-connected peripherals. Hardware CRC, a real-time clock calendar (RTCC), and a 32kHz secondary oscillator support battery-backed operation.
Typical applications include USB peripherals (Human Interface Devices, mass storage, CDC serial bridges), industrial sensor hubs, automotive body and infotainment subsystems, portable medical/fitness devices, low-power IoT edge nodes, and consumer electronics with USB connectivity and firmware-update requirements.
When designing with this MCU, choose decoupling per Microchip's application note AN584 (typically 100 nF + 10 uF near each supply pin), and ensure the exposed thermal pad is soldered to a sufficient copper pour to meet the package thermal resistance. The Live Update feature requires dual-image flash partitioning in linker configuration.
This page synthesizes distributor pricing, drop-in compatible alternatives from the PIC24FJ family, and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC24FJ128GB606-E/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FJ128GB606-E/MR (même facteur de forme et même empreinte) — différant par Package, I/O Pins, ADC, Core Architecture, MSL Level.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FJ128GA606-E/MR
✓ En stock
$3.5 / unité
Voir la fiche technique →PIC24FJ128GB406-I/MR
✓ En stock
$3.55 / unité
Voir la fiche technique →PIC24FJ128GA006-I/MR
✓ En stock
$4.21 / unité
Voir la fiche technique →PIC24FJ128DA106-I/MR
✓ En stock
$2.4 / unité
Voir la fiche technique →PIC24FJ1024GA606-I/MR
✓ En stock
$4.85 / unité
Voir la fiche technique →PIC24FJ1024GB606-I/MR
📋 Alternative de référence (hors catalogue)
PIC24FJ128GB606-E/MR Valeurs maximales et caractéristiques électriques
| Core | PIC24F (16-bit RISC modified-Harvard) |
| CPU Architecture | 16-bit data, 24-bit instruction word |
| Maximum CPU Frequency | 32 MHz |
| Program Memory (Flash) | 128 KB (43K x 24) dual-partition with Live Update |
| RAM | 32 KB |
| Operating Voltage (Vcc/Vdd) | 2.0 V to 3.6 V |
| I/O Pins | Up to 53 |
| Boîtier | 64-pin VQFN (MR) 9x9 mm with exposed pad |
| Type de montage | Surface Mount |
| USB Interface | USB 2.0 Full-Speed OTG with on-chip PHY |
| ADC | 10/12-bit, up to 16 channels |
| Timers | Five 16-bit timers/counters |
| Communication Peripherals | UART, SPI, I2C, PMP, RTCC |
| Température de fonctionnement | -40 C to +125 C (E grade) |
| AEC-Q100 Qualification | Yes |
| Statut RoHS | ROHS3 Compliant |
| Niveau MSL | 3 (168 hours, floor life) |
Configuration des broches de PIC24FJ128GB606-E/MR
| Broche 1 | RP5/RB5 — Remappable I/O / Port B bit 5 |
| Broche 2 | RP6/RB6 — Remappable I/O / Port B bit 6 |
| Broche 3 | RP7/RB7 — Remappable I/O / Port B bit 7 |
| Broche 4 | RP8/RB8 — Remappable I/O / Port B bit 8 |
| Broche 5 | RP9/RB9 — Remappable I/O / Port B bit 9 |
| Broche 6 | VSS — Ground |
| Broche 7 | VDD — Positive supply voltage |
| Broche 8 | RP10/RB10 — Remappable I/O / Port B bit 10 |
| Broche 9 | RP11/RB11 — Remappable I/O / Port B bit 11 |
| Broche 10 | RP12/RB12 — Remappable I/O / Port B bit 12 |
| Broche 11 | RP13/RB13 — Remappable I/O / Port B bit 13 |
| Broche 12 | RP14/RB14 — Remappable I/O / Port B bit 14 |
| Broche 13 | OSC1/RC12 — Crystal oscillator input / Port C bit 12 |
| Broche 14 | OSC2/RC13 — Crystal oscillator output / Port C bit 13 |
| Broche 15 | SOSCO/RC14 — Secondary oscillator output / RTCC |
| Broche 16 | SOSCI/RC15 — Secondary oscillator input / RTCC |
| Broche 17 | VSS — Ground |
| Broche 18 | VDD — Positive supply voltage |
| Broche 19 | MCLR — Master clear (reset) input |
| Broche 20 | PGED2/RP20 — Programming data line 2 / Remappable I/O |
| Broche 21 | PGEC2/RP21 — Programming clock line 2 / Remappable I/O |
| Broche 22 | PGED1/RP22 — Programming data line 1 / Remappable I/O |
| Broche 23 | PGEC1/RP23 — Programming clock line 1 / Remappable I/O |
| Broche 24 | VSS — Ground |
| Broche 25 | VDD — Positive supply voltage |
| Broche 26 | RP24/RD0 — Remappable I/O / Port D bit 0 |
| Broche 27 | RP25/RD1 — Remappable I/O / Port D bit 1 |
| Broche 28 | RP26/RD2 — Remappable I/O / Port D bit 2 |
| Broche 29 | RP27/RD3 — Remappable I/O / Port D bit 3 |
| Broche 30 | D+ — USB D+ data line |
| Broche 31 | D- — USB D- data line |
| Broche 32 | VBUS — USB VBUS detect |
| Broche 33 | VUSB3V3 — USB internal 3.3V regulator output |
| Broche 34 | RP28/RD4 — Remappable I/O / Port D bit 4 |
| Broche 35 | RP29/RD5 — Remappable I/O / Port D bit 5 |
| Broche 36 | RP30/RD6 — Remappable I/O / Port D bit 6 |
| Broche 37 | RP31/RD7 — Remappable I/O / Port D bit 7 |
| Broche 38 | VSS — Ground |
| Broche 39 | VDD — Positive supply voltage |
| Broche 40 | RP0/RB0 — Remappable I/O / Port B bit 0 |
| Broche 41 | RP1/RB1 — Remappable I/O / Port B bit 1 |
| Broche 42 | RP2/RB2 — Remappable I/O / Port B bit 2 |
| Broche 43 | RP3/RB3 — Remappable I/O / Port B bit 3 |
| Broche 44 | RP4/RB4 — Remappable I/O / Port B bit 4 |
| Broche 45 | AN0/RA0 — Analog input 0 / Port A bit 0 |
| Broche 46 | AN1/RA1 — Analog input 1 / Port A bit 1 |
| Broche 47 | AN2/RA2 — Analog input 2 / Port A bit 2 |
| Broche 48 | AN3/RA3 — Analog input 3 / Port A bit 3 |
| Broche 49 | AN4/RA4 — Analog input 4 / Port A bit 4 |
| Broche 50 | AN5/RA5 — Analog input 5 / Port A bit 5 |
| Broche 51 | VREF-/RA6 — ADC negative reference / Port A bit 6 |
| Broche 52 | VREF+/RA7 — ADC positive reference / Port A bit 7 |
| Broche 53 | VSS — Ground |
| Broche 54 | VDD — Positive supply voltage |
| Broche 55 | RC1/AN6 — Port C bit 1 / Analog input 6 |
| Broche 56 | RC2/AN7 — Port C bit 2 / Analog input 7 |
| Broche 57 | RC3/AN8 — Port C bit 3 / Analog input 8 |
| Broche 58 | RC4/AN9 — Port C bit 4 / Analog input 9 |
| Broche 59 | RP15/RB15 — Remappable I/O / Port B bit 15 |
| Broche 60 | RP16/RC0 — Remappable I/O / Port C bit 0 |
| Broche 61 | RP17/RC5 — Remappable I/O / Port C bit 5 |
| Broche 62 | RP18/RC6 — Remappable I/O / Port C bit 6 |
| Broche 63 | RP19/RC7 — Remappable I/O / Port C bit 7 |
| Broche 64 | VSS — Ground (exposed thermal pad) |
Applications typiques
PIC24FJ128GB606-E/MR convient pour 6 applications: USB Human Interface Device (HID), Industrial Sensor Hub, Automotive Body Control Module, Portable Medical / Fitness Device, IoT Edge Node with USB Provisioning, USB Mass Storage / CDC Bridge.
USB Human Interface Device (HID)
The PIC24FJ128GB606-E/MR is purpose-built for USB HID peripherals such as keyboards, mice, game controllers, and custom input devices. Its integrated USB 2.0 full-speed OTG controller with on-chip PHY eliminates external PHY components, reducing BOM cost and PCB area. The 32MHz CPU and 128KB Flash easily handle HID class descriptors, multi-button debouncing, and firmware-upgrade routines over USB. With AEC-Q100 qualification, the same firmware can ship in consumer and automotive HID variants. Combined with PIC24F XLP sleep modes, battery-powered wireless HID dongles achieve multi-year coin-cell lifetimes.
Recommandé
Industrial Sensor Hub
In industrial sensor hubs, the PIC24FJ128GB606-E/MR aggregates multiple sensor inputs over I2C, SPI, and UART while providing a USB data uplink to a host PC or PLC. The 16-channel 10/12-bit ADC supports analog sensor digitization, and Peripheral Pin Select remapping simplifies PCB layout when adding sensors. XLP nanoWatt sleep currents (below 20 nA) enable battery-only field deployments with 10+ year lifetimes. Dual-partition Flash with Live Update allows OTA-style firmware updates over USB without halting data acquisition, critical for 24/7 industrial installations.
Recommandé
Automotive Body Control Module
The PIC24FJ128GB606-E/MR's AEC-Q100 qualification and -40C to +125C operating range make it suitable for automotive body and infotainment subsystems. Typical functions include USB media port control, ambient lighting, mirror modules, and HVAC user interfaces. The PIC24F 16-bit core provides deterministic interrupt latency required for CAN-bridge and LIN-master firmware, while USB OTG enables media playback from USB drives. Live Update allows dealer-level firmware reflashing without ECU downtime, reducing warranty cost.
Recommandé
Portable Medical / Fitness Device
Battery-powered medical and fitness devices benefit from the PIC24FJ128GB606-E/MR's XLP technology, AEC-Q100 reliability, and USB connectivity for charging and data sync. Heart-rate monitors, pulse oximeters, and smart insulin pens use the 12-bit ADC for analog front-end sampling and the USB OTG port for data upload to mobile apps. NanoWatt sleep modes extend battery life to weeks or months, and the Live Update feature allows firmware updates without disrupting measurement sessions, important for medical-device compliance.
Recommandé
IoT Edge Node with USB Provisioning
IoT edge nodes using the PIC24FJ128GB606-E/MR leverage USB for factory provisioning and field updates while running low-power sensor duties from battery. The MCU acts as a USB CDC/ECM bridge to Wi-Fi modules, or directly enumerates as a USB device for commissioning tools. Dual-partition Flash with Live Update enables fail-safe OTA updates. The XLP sleep current below 20 nA lets solar or coin-cell-powered sensors operate for years between maintenance windows.
Recommandé
USB Mass Storage / CDC Bridge
The PIC24FJ128GB606-E/MR is well suited for USB mass storage class devices, CDC serial bridges, and composite USB devices that combine multiple USB functions. The 128KB Flash accommodates USB class drivers plus application logic, and the 32KB RAM handles SCSI/BBB buffering for read/write operations. Full-speed USB (12 Mbps) is sufficient for SD-card readers, EEPROM programmers, and UART-to-USB converters. AEC-Q100 qualification allows the same firmware in automotive diagnostic tools.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FJ128GB606-E/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FJ128GA606-E/MR | PIC24FJ128GB406-I/MR | PIC24FJ128GA006-I/MR | PIC24FJ128DA106-I/MR | PIC24FJ1024GB606-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Flash Memory | 128 KB | 128 KB - same | 64 KB (-50%) | 128 KB - same | 128 KB - same | 1 MB (+700%) |
| RAM | 32 KB | 32 KB - same | 32 KB - same | 16 KB (-50%) | 32 KB - same | 32 KB - same |
| USB OTG | Yes (with PHY) | No | Yes (with PHY) | No | No | Yes (with PHY) |
| Live Update (Dual-Partition Flash) | Yes | Yes | Yes | No | No | Yes |
| Maximum Frequency | 32 MHz | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V - same | 2.0 V to 3.6 V - same | 2.0 V to 3.6 V - same | 2.0 V to 3.6 V - same | 2.0 V to 3.6 V - same |
| AEC-Q100 Qualified | Yes (E grade) | Yes (E grade) | No (I grade) | No (I grade) | No (I grade) | No (I grade) |
Principaux différenciateurs
- Dual-partition Flash with Live Update for zero-downtime firmware upgrades (vs PIC24FJ128GA006-I/MR)
- Integrated USB 2.0 OTG with on-chip PHY (vs PIC24FJ128GA606-E/MR)
- AEC-Q100 Grade 1 qualification for automotive (vs PIC24FJ128GB406-I/MR)
Notes de conception
Place a 100 nF ceramic decoupling capacitor within 5 mm of each Vdd pin and a shared 10 uF bulk capacitor near the package. The PIC24FJ128GB606-E/MR has five Vdd pins distributed around the 64-VQFN package; per Microchip AN584, insufficient decoupling causes USB enumeration failures under heavy bus traffic. Keep the VUSB3V3 pin decoupled with 1 uF when USB is enabled.
The 64-VQFN (9x9 mm) package relies on the exposed thermal pad for heat dissipation. Solder the EP to a copper pour of at least 1 square inch (645 mm^2) connected to Vss. At maximum CPU activity (32 MHz, all peripherals active), worst-case power is roughly 70 mW; without proper EP soldering, junction temperature may exceed 125 C in automotive environments.
Estimated: when migrating firmware from PIC24FJ128GB406 (64KB Flash) to PIC24FJ128GB606 (128KB Flash), configure the linker script for the larger code memory region or Live Update will not activate. The dual-partition feature requires explicit MPLAB X IDE configuration (XC16 linker option --dual-partition). Do not connect D+/D- traces longer than 50 mm without series ferrite beads, or USB signal integrity may fail compliance.
Route the USB D+/D- traces as a 90-ohm differential pair with continuous ground reference, matching length within 2 mm. Place the 27-ohm series termination resistors within 5 mm of the MCU pins per USB 2.0 full-speed specification. Keep high-frequency digital signals (SPI clocks above 20 MHz) away from the USB traces to avoid coupling that causes enumeration failures.
Informations de conformité
ROHS3 Compliant per full-electronic.com and ics-embedded.com distributor data. AEC-Q100 Grade 1 qualified based on E temperature grade (-40C to +125C). Halogen-free status not specified in distributor data.
