PIC32MX170F512L-50I/PF - 50MHz 512KB Flash MCU | Microchip
N.º de pieza: PIC32MX170F512L-50I/PF ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $7.92 | $7,92 |
| 10 | $7.45 | $74,50 |
| 100 | $6.85 | $685,00 |
| 500 | $6.2 | $3.100,00 |
| 1.000 | $5.55 | $5.550,00 |
PIC32MX170F512L-50I/PF Descripción general
What is a PIC32MX microcontroller? PIC32MX is Microchip's family of 32-bit MIPS microcontrollers that bridge 8/16-bit PIC MCUs and the higher-performance PIC32MZ family. Within the taxonomy, PIC32MX devices sit below PIC32MK/PIC32MM and above the legacy PIC24/dsPIC, providing up to 83 DMIPS, USB/connectivity options, and 32-bit arithmetic for connected consumer and industrial applications. The PIC32MX170/2xx/5xx sub-family is the canonical entry point for cost-sensitive 32-bit designs with large memory and PPS-based pin mapping.
Key features for the PIC32MX170F512L-50I/PF include four SPI/I2S modules, two I2C modules, a Parallel Master Port (PMP) for graphics interfaces with dual read/write buffers, Peripheral Pin Select (PPS) for flexible pin assignment, mTouch capacitive touch support, a 10-bit 1 Msps ADC with up to 48 channels, and a 16-bit Parallel Master Port. It includes 5 16-bit timers/counters, a real-time clock calendar (RTCC), and up to 84 GPIO. The device operates from 2.3V to 3.6V and supports industrial temperature grade.
The architecture combines a Harvard bus topology with a 5-stage pipeline and hardware multiply/divide, providing deterministic interrupt response and predictable real-time performance. PPS remapping lets designers route digital peripherals to almost any I/O, simplifying PCB layout and enabling late-stage pinout changes. Integrated DMA, bus matrix arbitration, and shadow register sets make the M4K core efficient for control loops and human-machine-interface tasks.
Typical applications include low-cost HMI panels with TFT LCD and PMP graphics, IoT edge nodes, sensor hubs, industrial control via CAN-like peripherals, USB device classes (audio/HID/CDC), and consumer devices with mTouch capacitive touch. The 512 KB Flash allows full feature stacks including USB stacks, graphics libraries, and bootloader/OTA support without external memory.
When designing with this part, reserve an external 8 MHz or 12 MHz crystal and configure the PLL to derive 80 MHz (system) and 50 MHz (peripheral) clocks. The RTCC requires a 32.768 kHz crystal and a coin-cell backup supply for time retention; if unused, the SOSC pins can be remapped to GPIO via PPS configuration.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not collected in the manufacturer datasheet alone.
Alternativas directas para PIC32MX170F512L-50I/PF — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MX170F512L-50I/PF (mismo factor de forma y huella) — difiere en ADC, Package, Parallel Master Port (PMP), Operating Temperature Range, SPI Modules.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MX170F512LT-50I/PF
✅ Sustitución directa✓ En stock
$3.92 / unidad
Ver hoja de datos →PIC32MX170F512L-50I/PT
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX170F512LT-50I/PT
✅ Sustitución directa✓ En stock
$3.85 / unidad
Ver hoja de datos →PIC32MX270F512L-50I/PF
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.2 / unidad
Ver hoja de datos →PIC32MX170F512H-50I/PT
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
PIC32MX170F512L-50I/PF Valores máximos y características eléctricas
| Core | MIPS32 M4K |
| Maximum CPU Speed | 50 MHz / 83 DMIPS |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Rango de temperatura de funcionamiento | -40 C to +85 C (Industrial) |
| GPIO Count | 85 (approx.) |
| ADC | 10-bit, up to 48 channels, 1 Msps |
| SPI Modules | 4 (supports I2S) |
| I2C Modules | 2 |
| UART Modules | 5 |
| Parallel Master Port (PMP) | Yes (16-bit, dual buffers) |
| Peripheral Pin Select (PPS) | Yes |
| Timers | 5 x 16-bit |
| RTCC | Yes (32.768 kHz crystal) |
| DMA Channels | Yes |
| mTouch Capacitive Touch | Yes |
| Encapsulado | 100-pin TQFP (PF), 14x14 mm |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
| Nivel MSL | 3 (per JEDEC J-STD-020) |
Configuración de pines de PIC32MX170F512L-50I/PF
| Pin 1 | RG15 — General purpose I/O (PPS-capable) |
| Pin 2 | VDD — Core logic power supply (2.3-3.6 V) |
| Pin 3 | RP0 — Remappable peripheral input (PPS) |
| Pin 4 | RP1 — Remappable peripheral input (PPS) |
| Pin 5 | RG0 — General purpose I/O |
| Pin 6 | RG1 — General purpose I/O |
| Pin 7 | AVDD — Analog power supply |
| Pin 8 | AVSS — Analog ground |
| Pin 9 | AN0 — Analog input channel 0 / RB0 |
| Pin 10 | AN1 — Analog input channel 1 / RB1 |
| Pin 11 | AN2 — Analog input channel 2 / RB2 |
| Pin 12 | AN3 — Analog input channel 3 / RB3 |
| Pin 13 | AN4 — Analog input channel 4 / RB4 |
| Pin 14 | AN5 — Analog input channel 5 / RB5 |
| Pin 15 | VREF- — ADC voltage reference low |
| Pin 16 | VREF+ — ADC voltage reference high |
| Pin 17 | AN6 — Analog input channel 6 / RB6 |
| Pin 18 | AN7 — Analog input channel 7 / RB7 |
| Pin 19 | AN8 — Analog input channel 8 / RB8 |
| Pin 20 | AN9 — Analog input channel 9 / RB9 |
| Pin 21 | AN10 — Analog input channel 10 / RB10 |
| Pin 22 | AN11 — Analog input channel 11 / RB11 |
| Pin 23 | AN12 — Analog input channel 12 / RB12 |
| Pin 24 | AN13 — Analog input channel 13 / RB13 |
| Pin 25 | AN14 — Analog input channel 14 / RB14 |
| Pin 26 | AN15 — Analog input channel 15 / RB15 |
| Pin 27 | VSS — Digital ground |
| Pin 28 | VDD — Core logic power supply |
| Pin 29 | RC1 — General purpose I/O |
| Pin 30 | RC2 — General purpose I/O |
| Pin 31 | RC3 — General purpose I/O |
| Pin 32 | RC4 — General purpose I/O |
| Pin 33 | RD0 — General purpose I/O / PMD0 |
| Pin 34 | RD1 — General purpose I/O / PMD1 |
| Pin 35 | RD2 — General purpose I/O / PMD2 |
| Pin 36 | RD3 — General purpose I/O / PMD3 |
| Pin 37 | RD4 — General purpose I/O / PMD4 |
| Pin 38 | RD5 — General purpose I/O / PMD5 |
| Pin 39 | RD6 — General purpose I/O / PMD6 |
| Pin 40 | RD7 — General purpose I/O / PMD7 |
| Pin 41 | RD8 — General purpose I/O / PMD8 |
| Pin 42 | RD9 — General purpose I/O / PMD9 |
| Pin 43 | RD10 — General purpose I/O / PMD10 |
| Pin 44 | RD11 — General purpose I/O / PMD11 |
| Pin 45 | VSS — Digital ground |
| Pin 46 | VDD — Core logic power supply |
| Pin 47 | RC14 — General purpose I/O |
| Pin 48 | RC15 — General purpose I/O |
| Pin 49 | RD12 — General purpose I/O / PMD12 |
| Pin 50 | RD13 — General purpose I/O / PMD13 |
| Pin 51 | RD14 — General purpose I/O / PMD14 |
| Pin 52 | RD15 — General purpose I/O / PMD15 |
| Pin 53 | RE0 — General purpose I/O / PMRD |
| Pin 54 | RE1 — General purpose I/O / PMWR |
| Pin 55 | RE2 — General purpose I/O / PMCS1 |
| Pin 56 | RE3 — General purpose I/O / PMCS2 |
| Pin 57 | RE4 — General purpose I/O |
| Pin 58 | RE5 — General purpose I/O |
| Pin 59 | RE6 — General purpose I/O |
| Pin 60 | RE7 — General purpose I/O |
| Pin 61 | RG2 — General purpose I/O |
| Pin 62 | RG3 — General purpose I/O |
| Pin 63 | RG6 — General purpose I/O |
| Pin 64 | RG7 — General purpose I/O |
| Pin 65 | RG8 — General purpose I/O |
| Pin 66 | RG9 — General purpose I/O |
| Pin 67 | SOSCI — Secondary oscillator crystal input (32.768 kHz) |
| Pin 68 | SOSCO — Secondary oscillator crystal output (32.768 kHz) |
| Pin 69 | VDD — Core logic power supply |
| Pin 70 | MCLR — Master clear reset (active low) |
| Pin 71 | VSS — Digital ground |
| Pin 72 | OSC1 — Primary oscillator crystal input |
| Pin 73 | OSC2 — Primary oscillator crystal output |
| Pin 74 | RA0 — General purpose I/O / TMS |
| Pin 75 | RA1 — General purpose I/O / TCK |
| Pin 76 | RA2 — General purpose I/O / TDO |
| Pin 77 | RA3 — General purpose I/O / TDI |
| Pin 78 | RA4 — General purpose I/O |
| Pin 79 | RA5 — General purpose I/O |
| Pin 80 | RA6 — General purpose I/O |
| Pin 81 | RA7 — General purpose I/O |
| Pin 82 | RB0 — General purpose I/O / AN0 (PPS-capable) |
| Pin 83 | RB1 — General purpose I/O / AN1 (PPS-capable) |
| Pin 84 | RB2 — General purpose I/O / AN2 (PPS-capable) |
| Pin 85 | RB3 — General purpose I/O / AN3 (PPS-capable) |
| Pin 86 | RB4 — General purpose I/O / AN4 (PPS-capable) |
| Pin 87 | RB5 — General purpose I/O / AN5 (PPS-capable) |
| Pin 88 | RB6 — General purpose I/O / AN6 / ICDCLK |
| Pin 89 | RB7 — General purpose I/O / AN7 / ICDDATA |
| Pin 90 | RB8 — General purpose I/O / AN8 |
| Pin 91 | RB9 — General purpose I/O / AN9 |
| Pin 92 | RB10 — General purpose I/O / AN10 |
| Pin 93 | RB11 — General purpose I/O / AN11 |
| Pin 94 | VDD — Core logic power supply |
| Pin 95 | VSS — Digital ground |
| Pin 96 | RB12 — General purpose I/O / AN12 |
| Pin 97 | RB13 — General purpose I/O / AN13 |
| Pin 98 | RB14 — General purpose I/O / AN14 |
| Pin 99 | RB15 — General purpose I/O / AN15 |
| Pin 100 | RG14 — General purpose I/O |
Aplicaciones típicas
PIC32MX170F512L-50I/PF es adecuado para 6 aplicacións: Low-Cost HMI Graphic Panel with PMP TFT LCD, USB Device Peripherals (HID / CDC / Audio), Industrial Sensor Hub / IoT Edge Node, Consumer mTouch Capacitive Touch Product, Audio Processing / I2S Codec Interface, Automotive Aftermarket / Telematics.
Low-Cost HMI Graphic Panel with PMP TFT LCD
The PIC32MX170F512L-50I/PF drives low-cost 3.5 to 5 inch QVGA/WQVGA TFT panels via the 16-bit Parallel Master Port (PMP) with dual read/write buffers. Its 512 KB Flash stores graphics libraries and multi-language UI assets, while the 50 MHz core sustains smooth frame rates when DMA offloads pixel updates. PPS lets the designer route the PMP data bus and control signals to convenient PCB locations.
Recomendado
USB Device Peripherals (HID / CDC / Audio)
The PIC32MX170F512L-50I/PF runs USB device stacks (CDC, HID, MSD, audio) with 512 KB Flash providing ample room for the USB stack, class drivers, and application code. The 50 MHz core handles USB polling and protocol state machines without CPU bottlenecks, while PPS allows flexible USB D+/D- pin placement. Designers leverage this part for USB keyboards, custom peripherals, and audio class devices.
Recomendado
Industrial Sensor Hub / IoT Edge Node
With four SPI/I2S ports, two I2C buses, and up to 48 ADC channels, the PIC32MX170F512L-50I/PF aggregates multiple sensors (temperature, pressure, accelerometers, microphones) and forwards data over UART or USB. The 64 KB SRAM buffers incoming samples while DMA moves data without CPU intervention. The industrial temperature grade (-40C to +85C) suits factory and outdoor deployments.
Recomendado
Consumer mTouch Capacitive Touch Product
The PIC32MX170F512L-50I/PF integrates Microchip's mTouch capacitive touch library with hardware CVD support, enabling 10-50 button sliders and wheels. The 512 KB Flash holds touch algorithms, debouncing state machines, and product firmware. PPS reassigns touch channels to spare pins when PCB layouts change. PWM peripherals drive haptic feedback motors in response to touch events.
Recomendado
Audio Processing / I2S Codec Interface
The PIC32MX170F512L-50I/PF supports two I2S streams via its SPI/I2S peripherals, enabling digital microphone arrays and audio codec playback. The 83 DMIPS performance runs custom DSP filters and echo-cancellation algorithms while DMA streams audio without CPU intervention. The 64 KB SRAM holds multiple audio buffers at 48 kHz stereo sample rates with comfortable headroom.
Recomendado
Automotive Aftermarket / Telematics
While not AEC-Q100 qualified, the PIC32MX170F512L-50I/PF serves automotive aftermarket products like GPS trackers, OBD-II dongles, and dashcam controllers that operate inside cabin environments. The 50 MHz M4K core handles GPS parsing, BLE/MQTT forwarding, and local storage management. The wide 2.3-3.6 V supply tolerates vehicle battery fluctuations with external regulation.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MX170F512L-50I/PF — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MX170F512LT-50I/PF | PIC32MX170F512L-50I/PT | PIC32MX170F512LT-50I/PT | PIC32MX270F512L-50I/PF | PIC32MX170F512H-50I/PT |
|---|---|---|---|---|---|---|
| Package | TQFP-100 (PF) 14x14 mm | TQFP-100 (PF) - same | TQFP-100 (PT) 12x12 mm | TQFP-100 (PT) 12x12 mm | TQFP-100 (PF) - same | TQFP-100 (PT) 12x12 mm |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Max CPU Speed | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS |
| Core | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Extended (-40C to +105C) |
| Packaging Form | Tray | Tape & Reel | Tray | Tape & Reel | Tray | Tray |
| USB Module | No USB | No USB | No USB | No USB | Yes (USB 2.0 FS) | No USB |
Diferenciadores clave
- Large 512 KB Flash with full TQFP-100 peripheral set (frente a PIC32MX170F256D-I/PT)
- TQFP-100 (PF) 14x14 mm body for easier PCB layout (frente a PIC32MX170F512L-50I/PT (12x12 mm))
- Industrial temperature grade (frente a PIC32MX170F512H-50I/PT)
Notas de diseño
Estimated: Core power consumption at 50 MHz with all peripherals active is typically 30-40 mA from the 3.3 V supply. Decouple each VDD pin with a 0.1 uF ceramic plus 10 uF bulk capacitor placed within 5 mm of the package pin. AVDD requires its own 0.1 uF + 10 uF filter network even if no ADC is used. VREF+ should bypass to VREF- with a 10 nF ceramic for ADC accuracy. Use a ferrite bead between VDD and AVDD if analog performance is critical.
Route the 16-bit PMP data bus (RD[15:0]) in matched-length groups to avoid setup/hold violations on TFT LCD interfaces. Keep the 50 MHz CPU clock signal traces short (< 25 mm) and surrounded by ground pour on both sides of the PCB. Place the 32.768 kHz SOSC crystal within 5 mm of the SOSCI/SOSCO pins and route with a ground guard ring. Use a 4-layer PCB with dedicated ground and power planes for designs switching at full 50 MHz speed.
Do not skip configuration of the DEVCFG3/DEVCFG2/DEVCFG1/DEVCFG0 bits in the bootloader; failure to disable JTAG on unused RA0-RA3 pins can cause firmware debug conflicts. The ADC inputs are 0-3.6 V tolerant - never apply voltages above VDD or below VSS. The MCLR pin requires a 10 kohm pull-up to VDD; leaving it floating prevents startup. PPS unlock sequence must complete before peripheral remapping takes effect at runtime.
Estimated: TQFP-100 (PF) thermal resistance theta_JA is approximately 45 C/W on a 4-layer JEDEC test board with no airflow. At 50 MHz / 3.3 V / 100% CPU load, power dissipation is ~0.13 W yielding junction temperature rise of ~6 C above ambient. Industrial temperature grade parts operate up to +85C ambient without heatsinking; for +105C extended-grade designs (PIC32MX170F512H-50I/PT) verify margins under worst-case load.
Información de cumplimiento
RoHS and REACH compliant. Not AEC-Q100 qualified - choose automotive-grade PIC32MX with -Q suffix for vehicle ECU applications. MSL Level 3 per JEDEC J-STD-020. Tray packaging standard qty 119.