PIC32MX170F512L-50I/PF - 50MHz 512KB Flash MCU | Microchip
N.º da peça: PIC32MX170F512L-50I/PF ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.92 | $7,92 |
| 10 | $7.45 | $74,50 |
| 100 | $6.85 | $685,00 |
| 500 | $6.2 | $3.100,00 |
| 1.000 | $5.55 | $5.550,00 |
PIC32MX170F512L-50I/PF Visão geral
What is a PIC32MX microcontroller? PIC32MX is Microchip's family of 32-bit MIPS microcontrollers that bridge 8/16-bit PIC MCUs and the higher-performance PIC32MZ family. Within the taxonomy, PIC32MX devices sit below PIC32MK/PIC32MM and above the legacy PIC24/dsPIC, providing up to 83 DMIPS, USB/connectivity options, and 32-bit arithmetic for connected consumer and industrial applications. The PIC32MX170/2xx/5xx sub-family is the canonical entry point for cost-sensitive 32-bit designs with large memory and PPS-based pin mapping.
Key features for the PIC32MX170F512L-50I/PF include four SPI/I2S modules, two I2C modules, a Parallel Master Port (PMP) for graphics interfaces with dual read/write buffers, Peripheral Pin Select (PPS) for flexible pin assignment, mTouch capacitive touch support, a 10-bit 1 Msps ADC with up to 48 channels, and a 16-bit Parallel Master Port. It includes 5 16-bit timers/counters, a real-time clock calendar (RTCC), and up to 84 GPIO. The device operates from 2.3V to 3.6V and supports industrial temperature grade.
The architecture combines a Harvard bus topology with a 5-stage pipeline and hardware multiply/divide, providing deterministic interrupt response and predictable real-time performance. PPS remapping lets designers route digital peripherals to almost any I/O, simplifying PCB layout and enabling late-stage pinout changes. Integrated DMA, bus matrix arbitration, and shadow register sets make the M4K core efficient for control loops and human-machine-interface tasks.
Typical applications include low-cost HMI panels with TFT LCD and PMP graphics, IoT edge nodes, sensor hubs, industrial control via CAN-like peripherals, USB device classes (audio/HID/CDC), and consumer devices with mTouch capacitive touch. The 512 KB Flash allows full feature stacks including USB stacks, graphics libraries, and bootloader/OTA support without external memory.
When designing with this part, reserve an external 8 MHz or 12 MHz crystal and configure the PLL to derive 80 MHz (system) and 50 MHz (peripheral) clocks. The RTCC requires a 32.768 kHz crystal and a coin-cell backup supply for time retention; if unused, the SOSC pins can be remapped to GPIO via PPS configuration.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not collected in the manufacturer datasheet alone.
Alternativas drop-in para PIC32MX170F512L-50I/PF — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX170F512L-50I/PF (mesmo formato e footprint) — diferindo em ADC, Package, Parallel Master Port (PMP), Operating Temperature Range, SPI Modules.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX170F512LT-50I/PF
✅ Drop-In✓ Em estoque
$3.92 / unidade
Ver ficha técnica →PIC32MX170F512L-50I/PT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX170F512LT-50I/PT
✅ Drop-In✓ Em estoque
$3.85 / unidade
Ver ficha técnica →PIC32MX270F512L-50I/PF
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.2 / unidade
Ver ficha técnica →PIC32MX170F512H-50I/PT
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC32MX170F512L-50I/PF Classificações máximas e características elétricas
| Core | MIPS32 M4K |
| Maximum CPU Speed | 50 MHz / 83 DMIPS |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Faixa de temperatura de operação | -40 C to +85 C (Industrial) |
| GPIO Count | 85 (approx.) |
| ADC | 10-bit, up to 48 channels, 1 Msps |
| SPI Modules | 4 (supports I2S) |
| I2C Modules | 2 |
| UART Modules | 5 |
| Parallel Master Port (PMP) | Yes (16-bit, dual buffers) |
| Peripheral Pin Select (PPS) | Yes |
| Timers | 5 x 16-bit |
| RTCC | Yes (32.768 kHz crystal) |
| DMA Channels | Yes |
| mTouch Capacitive Touch | Yes |
| Encapsulamento | 100-pin TQFP (PF), 14x14 mm |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Nível MSL | 3 (per JEDEC J-STD-020) |
Configuração de pinos do PIC32MX170F512L-50I/PF
| Pino 1 | RG15 — General purpose I/O (PPS-capable) |
| Pino 2 | VDD — Core logic power supply (2.3-3.6 V) |
| Pino 3 | RP0 — Remappable peripheral input (PPS) |
| Pino 4 | RP1 — Remappable peripheral input (PPS) |
| Pino 5 | RG0 — General purpose I/O |
| Pino 6 | RG1 — General purpose I/O |
| Pino 7 | AVDD — Analog power supply |
| Pino 8 | AVSS — Analog ground |
| Pino 9 | AN0 — Analog input channel 0 / RB0 |
| Pino 10 | AN1 — Analog input channel 1 / RB1 |
| Pino 11 | AN2 — Analog input channel 2 / RB2 |
| Pino 12 | AN3 — Analog input channel 3 / RB3 |
| Pino 13 | AN4 — Analog input channel 4 / RB4 |
| Pino 14 | AN5 — Analog input channel 5 / RB5 |
| Pino 15 | VREF- — ADC voltage reference low |
| Pino 16 | VREF+ — ADC voltage reference high |
| Pino 17 | AN6 — Analog input channel 6 / RB6 |
| Pino 18 | AN7 — Analog input channel 7 / RB7 |
| Pino 19 | AN8 — Analog input channel 8 / RB8 |
| Pino 20 | AN9 — Analog input channel 9 / RB9 |
| Pino 21 | AN10 — Analog input channel 10 / RB10 |
| Pino 22 | AN11 — Analog input channel 11 / RB11 |
| Pino 23 | AN12 — Analog input channel 12 / RB12 |
| Pino 24 | AN13 — Analog input channel 13 / RB13 |
| Pino 25 | AN14 — Analog input channel 14 / RB14 |
| Pino 26 | AN15 — Analog input channel 15 / RB15 |
| Pino 27 | VSS — Digital ground |
| Pino 28 | VDD — Core logic power supply |
| Pino 29 | RC1 — General purpose I/O |
| Pino 30 | RC2 — General purpose I/O |
| Pino 31 | RC3 — General purpose I/O |
| Pino 32 | RC4 — General purpose I/O |
| Pino 33 | RD0 — General purpose I/O / PMD0 |
| Pino 34 | RD1 — General purpose I/O / PMD1 |
| Pino 35 | RD2 — General purpose I/O / PMD2 |
| Pino 36 | RD3 — General purpose I/O / PMD3 |
| Pino 37 | RD4 — General purpose I/O / PMD4 |
| Pino 38 | RD5 — General purpose I/O / PMD5 |
| Pino 39 | RD6 — General purpose I/O / PMD6 |
| Pino 40 | RD7 — General purpose I/O / PMD7 |
| Pino 41 | RD8 — General purpose I/O / PMD8 |
| Pino 42 | RD9 — General purpose I/O / PMD9 |
| Pino 43 | RD10 — General purpose I/O / PMD10 |
| Pino 44 | RD11 — General purpose I/O / PMD11 |
| Pino 45 | VSS — Digital ground |
| Pino 46 | VDD — Core logic power supply |
| Pino 47 | RC14 — General purpose I/O |
| Pino 48 | RC15 — General purpose I/O |
| Pino 49 | RD12 — General purpose I/O / PMD12 |
| Pino 50 | RD13 — General purpose I/O / PMD13 |
| Pino 51 | RD14 — General purpose I/O / PMD14 |
| Pino 52 | RD15 — General purpose I/O / PMD15 |
| Pino 53 | RE0 — General purpose I/O / PMRD |
| Pino 54 | RE1 — General purpose I/O / PMWR |
| Pino 55 | RE2 — General purpose I/O / PMCS1 |
| Pino 56 | RE3 — General purpose I/O / PMCS2 |
| Pino 57 | RE4 — General purpose I/O |
| Pino 58 | RE5 — General purpose I/O |
| Pino 59 | RE6 — General purpose I/O |
| Pino 60 | RE7 — General purpose I/O |
| Pino 61 | RG2 — General purpose I/O |
| Pino 62 | RG3 — General purpose I/O |
| Pino 63 | RG6 — General purpose I/O |
| Pino 64 | RG7 — General purpose I/O |
| Pino 65 | RG8 — General purpose I/O |
| Pino 66 | RG9 — General purpose I/O |
| Pino 67 | SOSCI — Secondary oscillator crystal input (32.768 kHz) |
| Pino 68 | SOSCO — Secondary oscillator crystal output (32.768 kHz) |
| Pino 69 | VDD — Core logic power supply |
| Pino 70 | MCLR — Master clear reset (active low) |
| Pino 71 | VSS — Digital ground |
| Pino 72 | OSC1 — Primary oscillator crystal input |
| Pino 73 | OSC2 — Primary oscillator crystal output |
| Pino 74 | RA0 — General purpose I/O / TMS |
| Pino 75 | RA1 — General purpose I/O / TCK |
| Pino 76 | RA2 — General purpose I/O / TDO |
| Pino 77 | RA3 — General purpose I/O / TDI |
| Pino 78 | RA4 — General purpose I/O |
| Pino 79 | RA5 — General purpose I/O |
| Pino 80 | RA6 — General purpose I/O |
| Pino 81 | RA7 — General purpose I/O |
| Pino 82 | RB0 — General purpose I/O / AN0 (PPS-capable) |
| Pino 83 | RB1 — General purpose I/O / AN1 (PPS-capable) |
| Pino 84 | RB2 — General purpose I/O / AN2 (PPS-capable) |
| Pino 85 | RB3 — General purpose I/O / AN3 (PPS-capable) |
| Pino 86 | RB4 — General purpose I/O / AN4 (PPS-capable) |
| Pino 87 | RB5 — General purpose I/O / AN5 (PPS-capable) |
| Pino 88 | RB6 — General purpose I/O / AN6 / ICDCLK |
| Pino 89 | RB7 — General purpose I/O / AN7 / ICDDATA |
| Pino 90 | RB8 — General purpose I/O / AN8 |
| Pino 91 | RB9 — General purpose I/O / AN9 |
| Pino 92 | RB10 — General purpose I/O / AN10 |
| Pino 93 | RB11 — General purpose I/O / AN11 |
| Pino 94 | VDD — Core logic power supply |
| Pino 95 | VSS — Digital ground |
| Pino 96 | RB12 — General purpose I/O / AN12 |
| Pino 97 | RB13 — General purpose I/O / AN13 |
| Pino 98 | RB14 — General purpose I/O / AN14 |
| Pino 99 | RB15 — General purpose I/O / AN15 |
| Pino 100 | RG14 — General purpose I/O |
Aplicações típicas
PIC32MX170F512L-50I/PF é adequado para 6 aplicaçãos: Low-Cost HMI Graphic Panel with PMP TFT LCD, USB Device Peripherals (HID / CDC / Audio), Industrial Sensor Hub / IoT Edge Node, Consumer mTouch Capacitive Touch Product, Audio Processing / I2S Codec Interface, Automotive Aftermarket / Telematics.
Low-Cost HMI Graphic Panel with PMP TFT LCD
The PIC32MX170F512L-50I/PF drives low-cost 3.5 to 5 inch QVGA/WQVGA TFT panels via the 16-bit Parallel Master Port (PMP) with dual read/write buffers. Its 512 KB Flash stores graphics libraries and multi-language UI assets, while the 50 MHz core sustains smooth frame rates when DMA offloads pixel updates. PPS lets the designer route the PMP data bus and control signals to convenient PCB locations.
Recomendado
USB Device Peripherals (HID / CDC / Audio)
The PIC32MX170F512L-50I/PF runs USB device stacks (CDC, HID, MSD, audio) with 512 KB Flash providing ample room for the USB stack, class drivers, and application code. The 50 MHz core handles USB polling and protocol state machines without CPU bottlenecks, while PPS allows flexible USB D+/D- pin placement. Designers leverage this part for USB keyboards, custom peripherals, and audio class devices.
Recomendado
Industrial Sensor Hub / IoT Edge Node
With four SPI/I2S ports, two I2C buses, and up to 48 ADC channels, the PIC32MX170F512L-50I/PF aggregates multiple sensors (temperature, pressure, accelerometers, microphones) and forwards data over UART or USB. The 64 KB SRAM buffers incoming samples while DMA moves data without CPU intervention. The industrial temperature grade (-40C to +85C) suits factory and outdoor deployments.
Recomendado
Consumer mTouch Capacitive Touch Product
The PIC32MX170F512L-50I/PF integrates Microchip's mTouch capacitive touch library with hardware CVD support, enabling 10-50 button sliders and wheels. The 512 KB Flash holds touch algorithms, debouncing state machines, and product firmware. PPS reassigns touch channels to spare pins when PCB layouts change. PWM peripherals drive haptic feedback motors in response to touch events.
Recomendado
Audio Processing / I2S Codec Interface
The PIC32MX170F512L-50I/PF supports two I2S streams via its SPI/I2S peripherals, enabling digital microphone arrays and audio codec playback. The 83 DMIPS performance runs custom DSP filters and echo-cancellation algorithms while DMA streams audio without CPU intervention. The 64 KB SRAM holds multiple audio buffers at 48 kHz stereo sample rates with comfortable headroom.
Recomendado
Automotive Aftermarket / Telematics
While not AEC-Q100 qualified, the PIC32MX170F512L-50I/PF serves automotive aftermarket products like GPS trackers, OBD-II dongles, and dashcam controllers that operate inside cabin environments. The 50 MHz M4K core handles GPS parsing, BLE/MQTT forwarding, and local storage management. The wide 2.3-3.6 V supply tolerates vehicle battery fluctuations with external regulation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX170F512L-50I/PF — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX170F512LT-50I/PF | PIC32MX170F512L-50I/PT | PIC32MX170F512LT-50I/PT | PIC32MX270F512L-50I/PF | PIC32MX170F512H-50I/PT |
|---|---|---|---|---|---|---|
| Package | TQFP-100 (PF) 14x14 mm | TQFP-100 (PF) - same | TQFP-100 (PT) 12x12 mm | TQFP-100 (PT) 12x12 mm | TQFP-100 (PF) - same | TQFP-100 (PT) 12x12 mm |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Max CPU Speed | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS |
| Core | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Extended (-40C to +105C) |
| Packaging Form | Tray | Tape & Reel | Tray | Tape & Reel | Tray | Tray |
| USB Module | No USB | No USB | No USB | No USB | Yes (USB 2.0 FS) | No USB |
Principais diferenciais
- Large 512 KB Flash with full TQFP-100 peripheral set (vs PIC32MX170F256D-I/PT)
- TQFP-100 (PF) 14x14 mm body for easier PCB layout (vs PIC32MX170F512L-50I/PT (12x12 mm))
- Industrial temperature grade (vs PIC32MX170F512H-50I/PT)
Notas de projeto
Estimated: Core power consumption at 50 MHz with all peripherals active is typically 30-40 mA from the 3.3 V supply. Decouple each VDD pin with a 0.1 uF ceramic plus 10 uF bulk capacitor placed within 5 mm of the package pin. AVDD requires its own 0.1 uF + 10 uF filter network even if no ADC is used. VREF+ should bypass to VREF- with a 10 nF ceramic for ADC accuracy. Use a ferrite bead between VDD and AVDD if analog performance is critical.
Route the 16-bit PMP data bus (RD[15:0]) in matched-length groups to avoid setup/hold violations on TFT LCD interfaces. Keep the 50 MHz CPU clock signal traces short (< 25 mm) and surrounded by ground pour on both sides of the PCB. Place the 32.768 kHz SOSC crystal within 5 mm of the SOSCI/SOSCO pins and route with a ground guard ring. Use a 4-layer PCB with dedicated ground and power planes for designs switching at full 50 MHz speed.
Do not skip configuration of the DEVCFG3/DEVCFG2/DEVCFG1/DEVCFG0 bits in the bootloader; failure to disable JTAG on unused RA0-RA3 pins can cause firmware debug conflicts. The ADC inputs are 0-3.6 V tolerant - never apply voltages above VDD or below VSS. The MCLR pin requires a 10 kohm pull-up to VDD; leaving it floating prevents startup. PPS unlock sequence must complete before peripheral remapping takes effect at runtime.
Estimated: TQFP-100 (PF) thermal resistance theta_JA is approximately 45 C/W on a 4-layer JEDEC test board with no airflow. At 50 MHz / 3.3 V / 100% CPU load, power dissipation is ~0.13 W yielding junction temperature rise of ~6 C above ambient. Industrial temperature grade parts operate up to +85C ambient without heatsinking; for +105C extended-grade designs (PIC32MX170F512H-50I/PT) verify margins under worst-case load.
Informações de conformidade
RoHS and REACH compliant. Not AEC-Q100 qualified - choose automotive-grade PIC32MX with -Q suffix for vehicle ECU applications. MSL Level 3 per JEDEC J-STD-020. Tray packaging standard qty 119.