PIC32MX170F512L-50I/PF - 50MHz 512KB Flash MCU | Microchip
部品番号: PIC32MX170F512L-50I/PF ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $7.92 | $7.92 |
| 10 | $7.45 | $74.50 |
| 100 | $6.85 | $685.00 |
| 500 | $6.2 | $3,100.00 |
| 1,000 | $5.55 | $5,550.00 |
PIC32MX170F512L-50I/PF 概要
What is a PIC32MX microcontroller? PIC32MX is Microchip's family of 32-bit MIPS microcontrollers that bridge 8/16-bit PIC MCUs and the higher-performance PIC32MZ family. Within the taxonomy, PIC32MX devices sit below PIC32MK/PIC32MM and above the legacy PIC24/dsPIC, providing up to 83 DMIPS, USB/connectivity options, and 32-bit arithmetic for connected consumer and industrial applications. The PIC32MX170/2xx/5xx sub-family is the canonical entry point for cost-sensitive 32-bit designs with large memory and PPS-based pin mapping.
Key features for the PIC32MX170F512L-50I/PF include four SPI/I2S modules, two I2C modules, a Parallel Master Port (PMP) for graphics interfaces with dual read/write buffers, Peripheral Pin Select (PPS) for flexible pin assignment, mTouch capacitive touch support, a 10-bit 1 Msps ADC with up to 48 channels, and a 16-bit Parallel Master Port. It includes 5 16-bit timers/counters, a real-time clock calendar (RTCC), and up to 84 GPIO. The device operates from 2.3V to 3.6V and supports industrial temperature grade.
The architecture combines a Harvard bus topology with a 5-stage pipeline and hardware multiply/divide, providing deterministic interrupt response and predictable real-time performance. PPS remapping lets designers route digital peripherals to almost any I/O, simplifying PCB layout and enabling late-stage pinout changes. Integrated DMA, bus matrix arbitration, and shadow register sets make the M4K core efficient for control loops and human-machine-interface tasks.
Typical applications include low-cost HMI panels with TFT LCD and PMP graphics, IoT edge nodes, sensor hubs, industrial control via CAN-like peripherals, USB device classes (audio/HID/CDC), and consumer devices with mTouch capacitive touch. The 512 KB Flash allows full feature stacks including USB stacks, graphics libraries, and bootloader/OTA support without external memory.
When designing with this part, reserve an external 8 MHz or 12 MHz crystal and configure the PLL to derive 80 MHz (system) and 50 MHz (peripheral) clocks. The RTCC requires a 32.768 kHz crystal and a coin-cell backup supply for time retention; if unused, the SOSC pins can be remapped to GPIO via PPS configuration.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not collected in the manufacturer datasheet alone.
ドロップイン代替品: PIC32MX170F512L-50I/PF — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MX170F512L-50I/PF （同一形状・フットプリント） — 相違点: ADC, Package, Parallel Master Port (PMP), Operating Temperature Range, SPI Modules.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MX170F512LT-50I/PF
✅ ドロップイン✓ 在庫あり
$3.92 / 個
データシートを見る →PIC32MX170F512L-50I/PT
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MX170F512LT-50I/PT
✅ ドロップイン✓ 在庫あり
$3.85 / 個
データシートを見る →PIC32MX270F512L-50I/PF
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$5.2 / 個
データシートを見る →PIC32MX170F512H-50I/PT
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
PIC32MX170F512L-50I/PF 最大定格＆電気的特性
| Core | MIPS32 M4K |
| Maximum CPU Speed | 50 MHz / 83 DMIPS |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| 動作温度範囲 | -40 C to +85 C (Industrial) |
| GPIO Count | 85 (approx.) |
| ADC | 10-bit, up to 48 channels, 1 Msps |
| SPI Modules | 4 (supports I2S) |
| I2C Modules | 2 |
| UART Modules | 5 |
| Parallel Master Port (PMP) | Yes (16-bit, dual buffers) |
| Peripheral Pin Select (PPS) | Yes |
| Timers | 5 x 16-bit |
| RTCC | Yes (32.768 kHz crystal) |
| DMA Channels | Yes |
| mTouch Capacitive Touch | Yes |
| パッケージ | 100-pin TQFP (PF), 14x14 mm |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| MSLレベル | 3 (per JEDEC J-STD-020) |
PIC32MX170F512L-50I/PF ピン構成
| ピン 1 | RG15 — General purpose I/O (PPS-capable) |
| ピン 2 | VDD — Core logic power supply (2.3-3.6 V) |
| ピン 3 | RP0 — Remappable peripheral input (PPS) |
| ピン 4 | RP1 — Remappable peripheral input (PPS) |
| ピン 5 | RG0 — General purpose I/O |
| ピン 6 | RG1 — General purpose I/O |
| ピン 7 | AVDD — Analog power supply |
| ピン 8 | AVSS — Analog ground |
| ピン 9 | AN0 — Analog input channel 0 / RB0 |
| ピン 10 | AN1 — Analog input channel 1 / RB1 |
| ピン 11 | AN2 — Analog input channel 2 / RB2 |
| ピン 12 | AN3 — Analog input channel 3 / RB3 |
| ピン 13 | AN4 — Analog input channel 4 / RB4 |
| ピン 14 | AN5 — Analog input channel 5 / RB5 |
| ピン 15 | VREF- — ADC voltage reference low |
| ピン 16 | VREF+ — ADC voltage reference high |
| ピン 17 | AN6 — Analog input channel 6 / RB6 |
| ピン 18 | AN7 — Analog input channel 7 / RB7 |
| ピン 19 | AN8 — Analog input channel 8 / RB8 |
| ピン 20 | AN9 — Analog input channel 9 / RB9 |
| ピン 21 | AN10 — Analog input channel 10 / RB10 |
| ピン 22 | AN11 — Analog input channel 11 / RB11 |
| ピン 23 | AN12 — Analog input channel 12 / RB12 |
| ピン 24 | AN13 — Analog input channel 13 / RB13 |
| ピン 25 | AN14 — Analog input channel 14 / RB14 |
| ピン 26 | AN15 — Analog input channel 15 / RB15 |
| ピン 27 | VSS — Digital ground |
| ピン 28 | VDD — Core logic power supply |
| ピン 29 | RC1 — General purpose I/O |
| ピン 30 | RC2 — General purpose I/O |
| ピン 31 | RC3 — General purpose I/O |
| ピン 32 | RC4 — General purpose I/O |
| ピン 33 | RD0 — General purpose I/O / PMD0 |
| ピン 34 | RD1 — General purpose I/O / PMD1 |
| ピン 35 | RD2 — General purpose I/O / PMD2 |
| ピン 36 | RD3 — General purpose I/O / PMD3 |
| ピン 37 | RD4 — General purpose I/O / PMD4 |
| ピン 38 | RD5 — General purpose I/O / PMD5 |
| ピン 39 | RD6 — General purpose I/O / PMD6 |
| ピン 40 | RD7 — General purpose I/O / PMD7 |
| ピン 41 | RD8 — General purpose I/O / PMD8 |
| ピン 42 | RD9 — General purpose I/O / PMD9 |
| ピン 43 | RD10 — General purpose I/O / PMD10 |
| ピン 44 | RD11 — General purpose I/O / PMD11 |
| ピン 45 | VSS — Digital ground |
| ピン 46 | VDD — Core logic power supply |
| ピン 47 | RC14 — General purpose I/O |
| ピン 48 | RC15 — General purpose I/O |
| ピン 49 | RD12 — General purpose I/O / PMD12 |
| ピン 50 | RD13 — General purpose I/O / PMD13 |
| ピン 51 | RD14 — General purpose I/O / PMD14 |
| ピン 52 | RD15 — General purpose I/O / PMD15 |
| ピン 53 | RE0 — General purpose I/O / PMRD |
| ピン 54 | RE1 — General purpose I/O / PMWR |
| ピン 55 | RE2 — General purpose I/O / PMCS1 |
| ピン 56 | RE3 — General purpose I/O / PMCS2 |
| ピン 57 | RE4 — General purpose I/O |
| ピン 58 | RE5 — General purpose I/O |
| ピン 59 | RE6 — General purpose I/O |
| ピン 60 | RE7 — General purpose I/O |
| ピン 61 | RG2 — General purpose I/O |
| ピン 62 | RG3 — General purpose I/O |
| ピン 63 | RG6 — General purpose I/O |
| ピン 64 | RG7 — General purpose I/O |
| ピン 65 | RG8 — General purpose I/O |
| ピン 66 | RG9 — General purpose I/O |
| ピン 67 | SOSCI — Secondary oscillator crystal input (32.768 kHz) |
| ピン 68 | SOSCO — Secondary oscillator crystal output (32.768 kHz) |
| ピン 69 | VDD — Core logic power supply |
| ピン 70 | MCLR — Master clear reset (active low) |
| ピン 71 | VSS — Digital ground |
| ピン 72 | OSC1 — Primary oscillator crystal input |
| ピン 73 | OSC2 — Primary oscillator crystal output |
| ピン 74 | RA0 — General purpose I/O / TMS |
| ピン 75 | RA1 — General purpose I/O / TCK |
| ピン 76 | RA2 — General purpose I/O / TDO |
| ピン 77 | RA3 — General purpose I/O / TDI |
| ピン 78 | RA4 — General purpose I/O |
| ピン 79 | RA5 — General purpose I/O |
| ピン 80 | RA6 — General purpose I/O |
| ピン 81 | RA7 — General purpose I/O |
| ピン 82 | RB0 — General purpose I/O / AN0 (PPS-capable) |
| ピン 83 | RB1 — General purpose I/O / AN1 (PPS-capable) |
| ピン 84 | RB2 — General purpose I/O / AN2 (PPS-capable) |
| ピン 85 | RB3 — General purpose I/O / AN3 (PPS-capable) |
| ピン 86 | RB4 — General purpose I/O / AN4 (PPS-capable) |
| ピン 87 | RB5 — General purpose I/O / AN5 (PPS-capable) |
| ピン 88 | RB6 — General purpose I/O / AN6 / ICDCLK |
| ピン 89 | RB7 — General purpose I/O / AN7 / ICDDATA |
| ピン 90 | RB8 — General purpose I/O / AN8 |
| ピン 91 | RB9 — General purpose I/O / AN9 |
| ピン 92 | RB10 — General purpose I/O / AN10 |
| ピン 93 | RB11 — General purpose I/O / AN11 |
| ピン 94 | VDD — Core logic power supply |
| ピン 95 | VSS — Digital ground |
| ピン 96 | RB12 — General purpose I/O / AN12 |
| ピン 97 | RB13 — General purpose I/O / AN13 |
| ピン 98 | RB14 — General purpose I/O / AN14 |
| ピン 99 | RB15 — General purpose I/O / AN15 |
| ピン 100 | RG14 — General purpose I/O |
主な用途
PIC32MX170F512L-50I/PF の用途: 6 件s: Low-Cost HMI Graphic Panel with PMP TFT LCD, USB Device Peripherals (HID / CDC / Audio), Industrial Sensor Hub / IoT Edge Node, Consumer mTouch Capacitive Touch Product, Audio Processing / I2S Codec Interface, Automotive Aftermarket / Telematics.
Low-Cost HMI Graphic Panel with PMP TFT LCD
The PIC32MX170F512L-50I/PF drives low-cost 3.5 to 5 inch QVGA/WQVGA TFT panels via the 16-bit Parallel Master Port (PMP) with dual read/write buffers. Its 512 KB Flash stores graphics libraries and multi-language UI assets, while the 50 MHz core sustains smooth frame rates when DMA offloads pixel updates. PPS lets the designer route the PMP data bus and control signals to convenient PCB locations.
おすすめ
USB Device Peripherals (HID / CDC / Audio)
The PIC32MX170F512L-50I/PF runs USB device stacks (CDC, HID, MSD, audio) with 512 KB Flash providing ample room for the USB stack, class drivers, and application code. The 50 MHz core handles USB polling and protocol state machines without CPU bottlenecks, while PPS allows flexible USB D+/D- pin placement. Designers leverage this part for USB keyboards, custom peripherals, and audio class devices.
おすすめ
Industrial Sensor Hub / IoT Edge Node
With four SPI/I2S ports, two I2C buses, and up to 48 ADC channels, the PIC32MX170F512L-50I/PF aggregates multiple sensors (temperature, pressure, accelerometers, microphones) and forwards data over UART or USB. The 64 KB SRAM buffers incoming samples while DMA moves data without CPU intervention. The industrial temperature grade (-40C to +85C) suits factory and outdoor deployments.
おすすめ
Consumer mTouch Capacitive Touch Product
The PIC32MX170F512L-50I/PF integrates Microchip's mTouch capacitive touch library with hardware CVD support, enabling 10-50 button sliders and wheels. The 512 KB Flash holds touch algorithms, debouncing state machines, and product firmware. PPS reassigns touch channels to spare pins when PCB layouts change. PWM peripherals drive haptic feedback motors in response to touch events.
おすすめ
Audio Processing / I2S Codec Interface
The PIC32MX170F512L-50I/PF supports two I2S streams via its SPI/I2S peripherals, enabling digital microphone arrays and audio codec playback. The 83 DMIPS performance runs custom DSP filters and echo-cancellation algorithms while DMA streams audio without CPU intervention. The 64 KB SRAM holds multiple audio buffers at 48 kHz stereo sample rates with comfortable headroom.
おすすめ
Automotive Aftermarket / Telematics
While not AEC-Q100 qualified, the PIC32MX170F512L-50I/PF serves automotive aftermarket products like GPS trackers, OBD-II dongles, and dashcam controllers that operate inside cabin environments. The 50 MHz M4K core handles GPS parsing, BLE/MQTT forwarding, and local storage management. The wide 2.3-3.6 V supply tolerates vehicle battery fluctuations with external regulation.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MX170F512L-50I/PF — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MX170F512LT-50I/PF | PIC32MX170F512L-50I/PT | PIC32MX170F512LT-50I/PT | PIC32MX270F512L-50I/PF | PIC32MX170F512H-50I/PT |
|---|---|---|---|---|---|---|
| Package | TQFP-100 (PF) 14x14 mm | TQFP-100 (PF) - same | TQFP-100 (PT) 12x12 mm | TQFP-100 (PT) 12x12 mm | TQFP-100 (PF) - same | TQFP-100 (PT) 12x12 mm |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Max CPU Speed | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS |
| Core | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Extended (-40C to +105C) |
| Packaging Form | Tray | Tape & Reel | Tray | Tape & Reel | Tray | Tray |
| USB Module | No USB | No USB | No USB | No USB | Yes (USB 2.0 FS) | No USB |
主な差別化要因
- Large 512 KB Flash with full TQFP-100 peripheral set （vs PIC32MX170F256D-I/PT)
- TQFP-100 (PF) 14x14 mm body for easier PCB layout （vs PIC32MX170F512L-50I/PT (12x12 mm))
- Industrial temperature grade （vs PIC32MX170F512H-50I/PT)
設計ノート
Estimated: Core power consumption at 50 MHz with all peripherals active is typically 30-40 mA from the 3.3 V supply. Decouple each VDD pin with a 0.1 uF ceramic plus 10 uF bulk capacitor placed within 5 mm of the package pin. AVDD requires its own 0.1 uF + 10 uF filter network even if no ADC is used. VREF+ should bypass to VREF- with a 10 nF ceramic for ADC accuracy. Use a ferrite bead between VDD and AVDD if analog performance is critical.
Route the 16-bit PMP data bus (RD[15:0]) in matched-length groups to avoid setup/hold violations on TFT LCD interfaces. Keep the 50 MHz CPU clock signal traces short (< 25 mm) and surrounded by ground pour on both sides of the PCB. Place the 32.768 kHz SOSC crystal within 5 mm of the SOSCI/SOSCO pins and route with a ground guard ring. Use a 4-layer PCB with dedicated ground and power planes for designs switching at full 50 MHz speed.
Do not skip configuration of the DEVCFG3/DEVCFG2/DEVCFG1/DEVCFG0 bits in the bootloader; failure to disable JTAG on unused RA0-RA3 pins can cause firmware debug conflicts. The ADC inputs are 0-3.6 V tolerant - never apply voltages above VDD or below VSS. The MCLR pin requires a 10 kohm pull-up to VDD; leaving it floating prevents startup. PPS unlock sequence must complete before peripheral remapping takes effect at runtime.
Estimated: TQFP-100 (PF) thermal resistance theta_JA is approximately 45 C/W on a 4-layer JEDEC test board with no airflow. At 50 MHz / 3.3 V / 100% CPU load, power dissipation is ~0.13 W yielding junction temperature rise of ~6 C above ambient. Industrial temperature grade parts operate up to +85C ambient without heatsinking; for +105C extended-grade designs (PIC32MX170F512H-50I/PT) verify margins under worst-case load.
コンプライアンス情報
RoHS and REACH compliant. Not AEC-Q100 qualified - choose automotive-grade PIC32MX with -Q suffix for vehicle ECU applications. MSL Level 3 per JEDEC J-STD-020. Tray packaging standard qty 119.