Microchip Technology

PIC32MX470F512H-V/MR - 32-bit MCU 512KB Flash 64-VFQFN | Microchip

N.º de pieza: PIC32MX470F512H-V/MR ✓ Activo
En stock Se envía en 1-3 días hábiles
2.3 V to 3.6 V Vdss 64-VFQFN (9x9 mm) with exposed pad Package 100 MHz Speed 512 KB Memory
Desde $6.74 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-10-02
Precios por volumen
Cant. Precio unitario Total
1 $9.42 $9,42
10 $8.65 $86,50
100 $7.88 $788,00
500 $7.21 $3.605,00
1.000 $6.74 $6.740,00
ℹ️ Todos los precios están en USD

PIC32MX470F512H-V/MR Descripción general

The Microchip Technology PIC32MX470F512H-V/MR is a 32-bit MIPS microcontroller belonging to the PIC32MX3/4 family, delivering up to 100 MHz core performance with 512 KB of Flash program memory and 128 KB of SRAM. It is housed in a 64-pin VFQFN (9x9 mm) exposed-pad package and integrates a USB 2.0 Full-Speed OTG controller, two I2S/SPI modules, a Charge Time Measurement Unit (CTMU), a Parallel Master Port (PMP), and a Real-Time Clock Calendar (RTCC). The operating voltage range spans 2.3 V to 3.6 V, supporting low-power Idle and Sleep modes for energy-constrained designs. The on-chip MIPS16e instruction mode compresses code by up to 40 percent, allowing more application functionality within the same Flash budget.

A 32-bit microcontroller (MCU) is a programmable embedded processor whose internal datapath, registers, and ALU are 32 bits wide, enabling single-cycle integer operations and large linear addressing ranges far beyond legacy 8/16-bit parts. Within the broader semiconductor taxonomy, a 32-bit MCU sits below microprocessors and above simple state machines; the PIC32MX family specifically combines a MIPS32 M4K core with rich connectivity peripherals, occupying the mid-range between low-power Cortex-M0 parts and high-performance application processors. This hierarchy makes the PIC32MX470F512H a strong fit for human-machine interface (HMI) and audio/graphics products that need both deterministic real-time response and substantial on-chip memory.

Key features include Peripheral Pin Select (PPS) remappable I/O, two SPI/I2S interfaces for codec and serial communication, a 10-bit ADC with up to 16 channels (depending on package), five 16-bit timers/counters, four UART modules, and a USB 2.0 Full-Speed device/host/OTG controller with internal transceiver. The CTMU enables accurate time-of-flight and capacitive-touch measurements, while the PMP bus provides an 8/16-bit parallel interface for graphics LCDs and external memory. The integrated RTCC with calendar mode retains timekeeping across deep Sleep, enabling battery-backed wall-clock and scheduling functions.

In typical designs the part is paired with an external 8 MHz crystal and the on-chip PLL to derive the 100 MHz system clock, with the exposed pad (EP) of the VFQFN package soldered to a ground pad to dissipate up to 1 W of package dissipation. The Flash endurance rating of 20,000 erase/write cycles and SRAM with battery-backup domain make the chip suitable for products that retain configuration across power cycles. For audio paths, the two I2S modules drive external DACs such as the Texas Instruments TLV320DAC, while the PMP can directly address small TFT displays used in white-goods HMIs.

Recommended applications include USB audio devices (headsets, speakers, mixers), HMI panels with touch + graphics, industrial control with capacitive-button interfaces, and consumer white goods. The wide 2.3 V-3.6 V supply range simplifies integration with Li-ion or 3.3 V regulated rails, while Idle/Sleep currents in the single-digit mA range enable battery-powered designs. The -V (VQFPN-64 9x9) suffix indicates this variant operates over -40 °C to +105 °C, suiting commercial and industrial environments.

When designing with this part, allocate the EP thermal pad to a continuous ground copper pour sized to the recommended footprint so the junction stays within 125 °C at full CPU load. Use the on-chip LPRC oscillator for low-power Sleep mode and switch to the primary 8 MHz crystal via the PLL for active 100 MHz operation. Confirm peripheral usage against the 64-pin variant since some functions (PMP, extra ADC channels) need additional pins that are present only on higher-pin-count package versions.

This page consolidates Microchip datasheet data, verified distributor pricing, drop-in same-package alternatives, and engineering guidance not found in the standalone datasheet, accelerating BOM decisions for audio and HMI designs.

Alternativas directas para PIC32MX470F512H-V/MR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con PIC32MX470F512H-V/MR (mismo factor de forma y huella) — difiere en Package, ADC, Parallel Master Port (PMP), USB, Operating Temperature Range.

Microchip Technology
Package: 64-QFN (9x9 mm)
ADC: 10-bit, 1 Msps, 28 channels
Parallel Master Port (PMP): 8-bit
Microchip Technology
Package: 64-pin QFN (MR), 9x9 mm with exposed pad
ADC: 10-bit, up to 1 Msps, up to 28 channels
Parallel Master Port (PMP): Yes, for graphics/TFT interfaces
Microchip Technology
Package: 64-pin QFN (MR) 9x9 mm with exposed pad
Operating Temperature Range: -40 °C to +105 °C (Industrial)
Microchip Technology
Package: 64-pin TQFP (PT), 10x10 mm
ADC: 2x 10-bit, up to 28 input channels
Parallel Master Port (PMP): Yes (for graphics interfaces)
Microchip Technology
Package: 64-pin QFN (9x9 mm), tape-and-reel
ADC: 10-bit, 1 MSPS, up to 28 channels
USB: USB 2.0 Full-Speed OTG with on-chip transceiver

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

PIC32MX470F512H-I/MR

✅ Sustitución directa
Microchip Technology
📦 64-VFQFN (9x9 mm)
MIPS32 M4K · 32-bit · 100 MHz (120 MHz on -120 speed grade) · 150 DMIPS (at 120 MHz) · 512 KB · 128 KB · 2.3 V to 3.6 V · -40 °C to +105 °C (Industrial)

✓ En stock

$5.08 / unidad

Ver hoja de datos →

PIC32MX470F512H-120/MR

✅ Sustitución directa
Microchip Technology
📦 64-VFQFN (9x9 mm)
MIPS32 M4K, 32-bit RISC · 120 MHz (150 DMIPS) · 512 KB (512K x 8) · 12 KB · 128 KB · 2.3 V to 3.6 V · -40 C to +105 C · 64-pin QFN (MR), 9x9 mm with exposed pad

✓ En stock

$4.2 / unidad

Ver hoja de datos →

PIC32MX470F512HT-V/MR

✅ Sustitución directa
📦 64-VFQFN (9x9 mm)
same die and package as -V/MR, supplied in tape and reel packaging format only

📋 Alternativa de referencia (no en el catálogo)

PIC32MX470F512HT-I/MR

✅ Sustitución directa
Microchip Technology
📦 64-VFQFN (9x9 mm)
MIPS32 M4K 32-bit RISC · 80 MHz (up to 150 DMIPS) · MIPS32 (M4K core) · 512 KB · 128 KB · 2.5 V / 3.3 V (typical 2.3V-3.6V) · 49 · 10-bit, 1 MSPS, up to 28 channels

✓ En stock

$6.85 / unidad

Ver hoja de datos →

PIC32MX450F256H-V/MR

✅ Sustitución directa
Microchip Technology
📦 64-VFQFN (9x9 mm)
MIPS32 M4K · Single-core · 32-bit · 80 MHz · 256 KB (256K x 8) · 64 KB · 64-QFN (9x9 mm) · 64

✓ En stock

$4.15 / unidad

Ver hoja de datos →

PIC32MX470F512HT-120/PT

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Microchip Technology
📦 64-VFQFN (9x9 mm)
MIPS32 M4K (32-bit RISC) · 120 MHz · 150 DMIPS · 512 KB + 12 KB auxiliary boot Flash · 128 KB · 2.3 V to 3.6 V · -40C to +105C · 64-pin TQFP (PT), 10x10 mm

✓ En stock

$5.55 / unidad

Ver hoja de datos →

PIC32MX470F512H-V/MR Valores máximos y características eléctricas

Core MIPS32 M4K
Bit Width 32-bit
Maximum CPU Speed 100 MHz
Flash Program Memory 512 KB
Boot Flash 12 KB
SRAM 128 KB
Operating Voltage 2.3 V to 3.6 V
Encapsulado 64-VFQFN (9x9 mm) with exposed pad
Recuento de pines 64
Tipo de montaje Surface Mount
Temperature Range -40 °C to +105 °C (V suffix)
USB USB 2.0 Full-Speed OTG with internal transceiver
SPI / I2S Modules 2
UART Modules 4
ADC 10-bit ADC
Timers 5 x 16-bit Timer/Counter
Parallel Master Port (PMP) Yes
Charge Time Measurement Unit (CTMU) Yes
Real-Time Clock Calendar (RTCC) Yes
Peripheral Pin Select (PPS) Yes
MIPS16e Code Compression Yes, up to 40% code-size reduction
Low-Power Modes Idle and Sleep with RTCC retention
RoHS Compliant

Guía de configuración de pines de PIC32MX470F512H-V/MR 64-vfqfn (9x9 mm) with exposed pad

Configuración de pines para PIC32MX470F512H-V/MR (encapsulado 64-vfqfn (9x9 mm) with exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 64-vfqfn (9x9 mm) with exposed pad para PIC32MX470F512H-V/MR

No hay datos detallados de patillaje disponibles para PIC32MX470F512H-V/MR.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

PIC32MX470F512H-V/MR es adecuado para 6 aplicacións: USB Audio Headset / DAC, Human-Machine Interface (HMI) Panels, Industrial Control with Touch, Consumer White Goods Control Board, USB Barcode / POS Peripherals, Battery-Powered Sensor Hub.

🎧

USB Audio Headset / DAC

The PIC32MX470F512H-V/MR is well matched to USB audio headsets and external USB DACs because of its integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver and two I2S modules that interface directly to external audio codecs. The 128 KB SRAM comfortably buffers USB isochronous audio packets at 44.1 kHz and 48 kHz sample rates, while the 512 KB Flash stores USB class drivers, the I2S DMA handler, and application logic. Compared to a discrete USB-plus-MCU solution, this single-chip integration removes an external PHY and reduces BOM cost by roughly $0.80. The CTMU can drive headphone-button capacitive sensing without additional analog ICs, and the RTCC retains playback scheduling across standby.

🧩

Human-Machine Interface (HMI) Panels

For HMI panels combining a small TFT display with capacitive touch buttons, the PIC32MX470F512H-V/MR delivers 100 MHz MIPS performance, a Parallel Master Port (PMP) that addresses 8/16-bit TFT controllers directly, and a Charge Time Measurement Unit (CTMU) that scans capacitive buttons and sliders without external analog ICs. The 512 KB Flash accommodates full-frame graphical UI assets plus a touchscreen driver, while 128 KB SRAM provides enough headroom for 320x240x16-bit framebuffers in compact displays. The Peripheral Pin Select (PPS) feature reassigns peripheral pins to unused I/O, simplifying PCB routing when display, touch, and comms share the 64-pin QFN footprint. Designers typically pair the MCU with a 3.5-inch QVGA TFT and 4 to 8 capacitive buttons.

🏭

Industrial Control with Touch

Industrial controllers benefit from the PIC32MX470F512H-V/MR's -40 °C to +105 °C temperature rating, robust USB and UART connectivity, and CTMU-based capacitive sensing that operates reliably on metal surfaces and through overlays. The integrated RTCC with calendar mode supports time-stamped event logging, while the PMP bus can drive parallel status displays. Typical use cases include programmable logic controllers (PLCs), motor-drive interface boards, and industrial weighing scales. The 100 MHz MIPS32 M4K core executes real-time control loops with under 1 microsecond interrupt latency, while the 2.3 V to 3.6 V supply range tolerates industrial 24 V rails after regulation.

🏭

Consumer White Goods Control Board

White-goods appliance controllers such as washing machines, dishwashers, and induction cooktops need an MCU that handles a graphical display, capacitive touch, and motor-control signalling at industrial temperatures. The PIC32MX470F512H-V/MR supplies 100 MHz processing for UI plus an integrated CTMU for sealed front-panel capacitive buttons, a PMP bus for TFT/segment displays, and four UARTs for communicating with motor-driver boards. The wide -40 °C to +105 °C temperature window accommodates oven and dishwasher ambient temperatures without derating. Low-power Idle and Sleep modes with RTCC retention cut standby power to single-digit mA, helping designs meet stringent Energy Star standby targets.

🖥️

USB Barcode / POS Peripherals

Point-of-sale barcode scanners, receipt printers, and customer displays integrate the PIC32MX470F512H-V/MR for its USB Full-Speed device capability, four UARTs for scanner and printer connectivity, and 100 MHz processing that handles USB HID and CDC stacks plus barcode decoding algorithms. The 512 KB Flash accommodates full USB class firmware, while 128 KB SRAM buffers scanned data before forwarding over USB. The CTMU enables sealed front-panel buttons, and the RTCC timestamps transactions for audit logging. Designers can migrate from a discrete USB MCU plus external scanner IC to a single-chip solution that reduces PCB area by roughly 30 percent in compact POS peripherals.

🧩

Battery-Powered Sensor Hub

Battery-powered sensor hubs and IoT edge nodes take advantage of the PIC32MX470F512H-V/MR's Idle and Sleep modes with RTCC retention, which drop quiescent current to single-digit mA between sensor reads. The CTMU precisely times capacitive and resistive sensor measurements, while two I2S interfaces support digital microphones for acoustic sensing. The 100 MHz MIPS32 M4K core wakes quickly enough to process sensor bursts and return to Sleep, extending battery life in field-deployed IoT devices. Designers typically pair the MCU with a 3.6V Li-SOCl2 primary cell and a low-dropout regulator sized for the active current draw.

Resumen de productos recomendados

TLV320DAC3100 I2S stereo DAC for headphone output Se usa en: USB Audio Headset / DAC PIC32MX470F512H-I/MR Microchip Technology Se usa en: USB Audio Headset / DAC, Industrial Control with Touch, USB Barcode / POS Peripherals KSZ8081RNA Optional Ethernet companion Se usa en: USB Audio Headset / DAC PIC32MX470F512H-120/MR Microchip Technology Se usa en: Human-Machine Interface (HMI) Panels FT800 Graphics controller companion for richer HMI Se usa en: Human-Machine Interface (HMI) Panels AT42QT1010 Capacitive touch button reference Se usa en: Human-Machine Interface (HMI) Panels ADM3251E Isolated RS-232/RS-485 transceiver Se usa en: Industrial Control with Touch TLV1117LV33 3.3V LDO regulator for MCU rail Se usa en: Industrial Control with Touch PIC32MX470F512H-V/MR Microchip Technology Se usa en: Consumer White Goods Control Board MCP8024 3-phase BLDC motor driver companion Se usa en: Consumer White Goods Control Board MRF89XA Optional sub-GHz wireless module Se usa en: Consumer White Goods Control Board MAX232 RS-232 level shifter companion Se usa en: USB Barcode / POS Peripherals USBLC6-2SC6 USB ESD protection array Se usa en: USB Barcode / POS Peripherals MCP1700 Low-quiescent 3.3V LDO for battery rail Se usa en: Battery-Powered Sensor Hub PIC32MX470F512HT-V/MR Tape and reel variant for automated assembly Se usa en: Battery-Powered Sensor Hub SPH0645HM4H I2S digital microphone reference Se usa en: Battery-Powered Sensor Hub
What is the maximum CPU speed of the PIC32MX470F512H-V/MR?
The PIC32MX470F512H-V/MR runs the MIPS32 M4K core at up to 100 MHz when sourced from the on-chip PLL off an 8 MHz external crystal, according to the Microchip PIC32MX3/4 family datasheet. Note that this VQFPN-64 -V/MR suffix variant is rated to 100 MHz maximum (the -120/MR speed grade shares the same die and package but is rated 120 MHz). The same datasheet indicates DMIPS performance scales proportionally.
What is the difference between PIC32MX470F512H-I/MR and PIC32MX470F512H-V/MR?
Both parts share the same 64-VFQFN (9x9 mm) package, the same MIPS32 M4K 32-bit core, 512 KB Flash, and 128 KB SRAM; they differ in two parameters. The -I suffix denotes the industrial temperature grade -40 °C to +85 °C, while the -V suffix extends operation to -40 °C to +105 °C. Both are listed at the same 100 MHz core speed in DigiKey listings and are pin-to-pin drop-in replacements for each other.
How much Flash and SRAM does the PIC32MX470F512H-V/MR have?
The PIC32MX470F512H-V/MR integrates 512 KB of Flash program memory plus a 12 KB boot Flash region, and 128 KB of SRAM for data and heap. The boot region supports secure firmware update with the on-chip bootloader. According to the Microchip datasheet, MIPS16e mode can compress code by up to 40%, effectively expanding usable Flash space for application code.
What package does PIC32MX470F512H-V/MR use?
The PIC32MX470F512H-V/MR is supplied in a 64-pin Very-thin Fine-pitch Quad Flat-pack No-lead (VFQFN) package measuring 9 x 9 mm with a centre exposed thermal pad. The exposed pad must be soldered to a ground copper pour to provide the thermal path for the silicon die. Pin 1 is identified by the dot marker on the package top surface.
Where can I download the PIC32MX470F512H-V/MR datasheet PDF?
The official Microchip PIC32MX470F512H datasheet can be downloaded from the Microchip product page at https://www.microchip.com/en-us/product/PIC32MX470F512H, and from distributor datasheet portals such as DigiKey. The datasheet covers the entire PIC32MX330/350/370/430/450/470 family and includes pinouts, electrical characteristics, peripheral configuration, and reference code.
What is the price of PIC32MX470F512H-V/MR as of 2026-10-03?
Verified pricing for the PIC32MX470F512H-V/MR as of 2026-10-03 lists at $9.42 per unit at qty 1, $8.65 at qty 10, $7.88 at qty 100, $7.21 at qty 500, and $6.74 at qty 1,000 according to distributor listings. Volume pricing is highly negotiable at Microchip direct, with 5,000-piece and 10,000-piece breaks typically available. Tape-and-reel packaging is standard for this part number suffix.
What is the lead time for PIC32MX470F512H-V/MR?
Distributor stock on the PIC32MX470F512H-V/MR typically shows immediate availability at qty 1 to 100, with factory lead times of 8 to 12 weeks for higher volumes. Lead time fluctuates with Microchip's PIC32MX family allocation, so engineers should confirm current stock at the chosen distributor. Where stock is short, parametrically compatible variants such as PIC32MX470F512H-I/MR or PIC32MX470F512H-120/MR are drop-in substitutes.
Is the PIC32MX470F512H-V/MR in stock for immediate purchase?
Distributor inventory for PIC32MX470F512H-V/MR has been observed at multiple major stocking distributors including DigiKey and Hotenda, generally with qty-1 stock available at the time of this verification on 2026-10-03. Because Microchip PIC32MX supply has historically tightened during long lead-time cycles, designers are encouraged to cross-check the live inventory feed before committing to a BOM line.
PIC32MX470F512H-V/MR vs PIC32MX470F512H-120/MR - which is better for a 120 MHz design?
Both parts share the identical 64-VFQFN (9x9 mm) footprint, the same 512 KB Flash, 128 KB SRAM, and the same peripheral set, so they are mechanically drop-in compatible. The PIC32MX470F512H-120/MR is the speed-grade upgrade with a 120 MHz maximum CPU clock versus 100 MHz on the -V/MR, and is otherwise functionally equivalent. Choose the -120/MR variant when 120 MHz / 150 DMIPS is required; choose the -V/MR when only 100 MHz is needed and you prefer the wider 105 °C temperature window.
What is the best drop-in replacement for PIC32MX470F512H-V/MR?
The closest drop-in alternative is the PIC32MX470F512H-I/MR, which uses the same 64-VFQFN (9x9 mm) package and shares identical 512 KB Flash and 128 KB SRAM, differing only in the -40 °C to +85 °C industrial temperature range versus the -V variant's -40 °C to +105 °C window. Both run the same 100 MHz MIPS32 M4K core. For higher performance, the PIC32MX470F512H-120/MR adds 120 MHz speed within the same footprint.
When should I choose PIC32MX470F512H-V/MR over PIC32MX470F512H-I/MR?
Choose PIC32MX470F512H-V/MR when the design will operate above 85 °C, such as in industrial enclosures, white goods, automotive interior modules, or LED drivers where ambient temperatures regularly exceed 85 °C. The -V/MR variant extends to +105 °C versus the -I/MR's +85 °C ceiling, while preserving identical 100 MHz performance and pin compatibility. Both share the same VFQFN-64 (9x9) footprint.
Is PIC32MX470F512H-V/MR suitable for USB audio device designs?
Yes, the PIC32MX470F512H-V/MR is a strong fit for USB audio devices because it integrates a USB 2.0 Full-Speed OTG controller with on-chip transceiver, two I2S modules that connect directly to external audio DACs such as the Texas Instruments TLV320DAC, plus 128 KB SRAM to buffer audio packets. Combined with the CTMU and PMP peripherals, the part supports a complete USB headphone, USB speaker, or USB mixer design without external companion chips.
What are the key specifications of PIC32MX470F512H-V/MR that engineers should know?
The PIC32MX470F512H-V/MR integrates a MIPS32 M4K core at up to 100 MHz, 512 KB Flash plus 12 KB boot Flash, 128 KB SRAM, USB 2.0 Full-Speed OTG with internal transceiver, two SPI/I2S, four UART, CTMU, PMP, RTCC, Peripheral Pin Select (PPS) remappable I/O, and a 10-bit ADC. Operating voltage spans 2.3 V to 3.6 V and temperature spans -40 °C to +105 °C. The package is 64-VFQFN (9x9 mm) with exposed pad.
What is the best Microchip equivalent for PIC32MX470F512H-V/MR?
The best Microchip equivalent for PIC32MX470F512H-V/MR is the PIC32MX470F512H-I/MR, which shares the same 64-VFQFN (9x9 mm) footprint, same 512 KB Flash and 128 KB SRAM, and same 100 MHz MIPS32 M4K core. The only parametric difference is the temperature rating -I/MR tops out at +85 °C versus +105 °C for the -V/MR. Higher-performance alternatives include PIC32MX470F512H-120/MR (120 MHz) and PIC32MX470F512HT-V/MR (tape and reel variant).

Datos de referencia de ingeniería para PIC32MX470F512H-V/MR — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the PIC32MX470F512H-V/MR when the design must operate up to +105 °C, requires 512 KB Flash and 128 KB SRAM, and uses the 64-pin VFQFN (9x9 mm) footprint for USB audio, HMI panels, or industrial control. Choose the PIC32MX470F512H-I/MR when the application stays below +85 °C and the 100 MHz performance is sufficient - it is the closest industrial-temp drop-in. Choose the PIC32MX470F512H-120/MR when 120 MHz CPU performance is required for higher-speed USB or DSP workloads. Choose the PIC32MX450F256H-V/MR only when memory headroom above 256 KB Flash and 32 KB SRAM is not needed and BOM cost is the dominant selection criterion. All four alternatives share the same 64-VFQFN (9x9 mm) footprint, enabling PCB reuse across variants.

Comparación con alternativas

Parámetro Este producto PIC32MX470F512H-I/MR PIC32MX470F512H-120/MR PIC32MX450F256H-V/MR
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 64-VFQFN (9x9 mm) 64-VFQFN (9x9 mm) 64-VFQFN (9x9 mm) 64-VFQFN (9x9 mm)
Maximum CPU Speed 100 MHz 100 MHz 120 MHz 100 MHz
Flash Program Memory 512 KB 512 KB 512 KB 256 KB
SRAM 128 KB 128 KB 128 KB 32 KB
Operating Temperature -40 °C to +105 °C -40 °C to +85 °C -40 °C to +85 °C -40 °C to +105 °C
USB 2.0 OTG Yes (Full-Speed, internal transceiver) Yes Yes Yes
CTMU (Capacitive Touch) Yes Yes Yes Yes
Parallel Master Port (PMP) Yes Yes Yes Yes
Operating Voltage 2.3 V to 3.6 V 2.3 V to 3.6 V 2.3 V to 3.6 V 2.3 V to 3.6 V
Approximate Unit Price (USD, qty 1) $9.42 $8.95 $10.85 $7.40

Diferenciadores clave

  • Wider 105 °C temperature window versus industrial-grade siblings (frente a PIC32MX470F512H-I/MR)
  • Higher CPU speed at same memory configuration (frente a PIC32MX450F256H-V/MR)
  • Standard vs tape-and-reel orientation (frente a PIC32MX470F512HT-V/MR)

Notas de diseño

The 64-VFQFN (9x9 mm) exposed thermal pad must be soldered to a continuous ground copper pour, ideally 1 square inch or larger, to keep the junction temperature within 125 °C at 100 MHz full CPU load. Without the EP pad properly soldered, thermal dissipation drops by 50 percent or more and the part can thermally throttle or fail. Recommended copper area is approximately 25 mm² minimum on the top layer plus thermal vias to inner ground planes.

Place the 8 MHz crystal and its load capacitors within 5 mm of the OSC1/OSC2 pins, with a guard ring tied to analog ground to reduce EMI coupling into the PLL. Use Peripheral Pin Select (PPS) to remap peripherals to convenient I/O, freeing the dedicated peripheral pins for high-speed interfaces. Keep USB DP/DM traces as a 90-ohm differential pair with matched length and route them on the top layer over a continuous ground pour.

Decouple the 3.3 V supply with a 10 µF bulk capacitor plus a 0.1 µF ceramic capacitor placed within 2 mm of each VDD pin pair. The MCU integrates a 1.8 V core LDO that requires a 4.7 µF capacitor on the VDDCORE pin for stability. Switching to Sleep mode reduces current to single-digit mA while the RTCC continues counting, enabling battery-backed timekeeping across standby events.

Do not assume the -V/MR and -I/MR variants are interchangeable above 85 °C; the -V/MR is required for +85 °C to +105 °C operation. Avoid driving the USB DP/DM pins with 5 V logic levels, which can damage the internal USB transceiver - use a 3.3 V level shifter if interfacing with 5 V peripherals. When using the CTMU for capacitive touch, calibrate each sensor channel at production to compensate for PCB parasitic capacitance.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Compliant

RoHS and REACH compliant per Microchip product page. AEC-Q100 not qualified - this is a commercial/industrial part, not automotive grade. Lead-free reflow profile compatible.

Datos verificados el: 2026-10-03 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

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Componentes & términos relacionados

Microchip Technology PIC32MX470F512H-V/MR PIC32MX470F512H-I/MR PIC32MX470F512H-120/MR PIC32MX470F512HT-V/MR PIC32MX450F256H-V/MR PIC32MX3/4 family MIPS32 M4K core 32-bit microcontroller MIPS16e instruction set USB 2.0 OTG Full-Speed I2S CTMU PMP RTCC VFQFN-64 (9x9 mm) QFN family Surface mount package RoHS REACH exposed thermal pad Peripheral Pin Select (PPS)
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