PIC32MX775F256H-80I/MR - 80MHz 32-bit MCU, 256KB Flash, 64-VQFN | Microchip
N.º de pieza: PIC32MX775F256H-80I/MR ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $9.1 | $91,00 |
| 100 | $8.4 | $840,00 |
| 500 | $7.6 | $3.800,00 |
| 1.000 | $6.95 | $6.950,00 |
PIC32MX775F256H-80I/MR Descripción general
What is a PIC32MX microcontroller? A PIC32MX is Microchip's family of MIPS-based 32-bit microcontrollers that combine the simplicity of the PIC16/24 ecosystem with the throughput required for connected embedded designs. It sits in the broader taxonomy of microcontroller > 32-bit MCU > MIPS core > connectivity MCU > semiconductor. The PIC32MX5/6/7 sub-family adds integrated 10/100 Mbit Ethernet MAC, USB 2.0 FS, and CAN peripherals that target connected industrial, consumer, and audio applications.
Key differentiating features of the PIC32MX775F256H-80I/MR include: USB 2.0 Full-Speed On-The-Go (OTG) device/host controller, dual CAN 2.0b modules, 10/100 Ethernet MAC with RMII/MII interface, 16-bit parallel master port (PMP) for external graphics or memory, 8-channel DMA, and 16-bit timers/capture/compare/PWM modules. The 64-VQFN (9x9) footprint offers compact PCB integration while exposing 53+ general-purpose I/O pins.
On the architecture side, the MIPS32 M4K core executes most instructions in a single cycle, delivering 1.56 DMIPS/MHz (Dhrystone 2.1) and up to 105 DMIPS at 80 MHz. The bus matrix is multi-layer AHB/APB, allowing simultaneous DMA and CPU transfers. The device supports MPLAB Harmony, MPLAB XC32, and Microchip's library ecosystem, plus a hardware trace port (PGEC2/PGED2) for real-time debug with MPLAB ICD 3 or PICkit 3.
Typical applications include industrial control (Modbus TCP gateways, BACnet controllers), connected consumer products (audio streaming docks, smart appliances with Ethernet), automotive infotainment peripherals, point-of-sale terminals, and embedded web servers. The 2.5V/3.3V core with wide 2.3V-3.6V VDD tolerance simplifies mixed-signal designs.
Design consideration: at 80 MHz the core current consumption is roughly 70 mA typical, so a clean 3.3V LDO (minimum 100 mA) with low-noise output is required. Decoupling: 100 nF + 4.7 uF bulk cap at each VDD/VSS pair is recommended by the manufacturer datasheet.
This page synthesizes distributor pricing, same-family and cross-brand drop-in alternatives, and engineering design notes not found in the manufacturer datasheet.
Alternativas directas para PIC32MX775F256H-80I/MR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MX775F256H-80I/MR (mismo factor de forma y huella) — difiere en CAN, Ethernet, Operating Temperature, Package, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MX775F256HT-80I/MR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX775F256H-80V/MR
✅ Sustitución directa✓ En stock
$2.84 / unidad
Ver hoja de datos →PIC32MX775F256L-80I/MR
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
PIC32MX675F256H-80I/MR
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
PIC32MX564F128H-I/MR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX460F512H-80I/MR
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
PIC32MX775F256H-80I/MR Valores máximos y características eléctricas
| Core Architecture | MIPS32 M4K |
| Core Bit Width | 32-bit |
| Frecuencia de reloj máxima | 80 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 64 KB |
| Operating Voltage (VDD) | 2.3 V to 3.6 V |
| I/O Voltage | 2.5 V / 3.3 V |
| Temperatura de funcionamiento | -40 C to +85 C (Industrial) |
| Encapsulado | 64-VQFN (9x9 mm, HVQCCN) with EP |
| Number of I/O Pins | 53 (typical, exact count per datasheet) |
| USB | USB 2.0 Full-Speed OTG (Device/Host) |
| CAN | 2x CAN 2.0b |
| Ethernet | 10/100 Mbit MAC with RMII/MII |
| DMA Channels | 8 |
| Parallel Master Port (PMP) | Yes, 16-bit |
| Timers | 16-bit Timer/Counter modules (5 typical) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant (per DigiKey product page) |
| Tube Quantity | 40 pcs (per LCSC data) |
Configuración de pines de PIC32MX775F256H-80I/MR
| Pin 1 | EP — Exposed thermal pad (must be soldered to GND) |
| Pin 2 | RG15 — General purpose I/O / PMP data |
| Pin 3 | RG12 — General purpose I/O |
| Pin 4 | RG13 — General purpose I/O |
| Pin 5 | RG14 — General purpose I/O |
| Pin 6 | RA0 — General purpose I/O |
| Pin 7 | RA1 — General purpose I/O |
| Pin 8 | RA2 — General purpose I/O |
| Pin 9 | RA3 — General purpose I/O |
| Pin 10 | RA4 — General purpose I/O |
| Pin 11 | RA5 — General purpose I/O |
| Pin 12 | RA6 — General purpose I/O |
| Pin 13 | RA7 — General purpose I/O |
| Pin 14 | RA9 — General purpose I/O |
| Pin 15 | RA10 — General purpose I/O |
| Pin 16 | RA11 — General purpose I/O |
| Pin 17 | VDD — Core supply 2.3V-3.6V |
| Pin 18 | VSS — Ground |
| Pin 19 | RB0 — PGED1 / general purpose I/O |
| Pin 20 | RB1 — PGEC1 / general purpose I/O |
| Pin 21 | RB2 — General purpose I/O |
| Pin 22 | RB3 — General purpose I/O |
| Pin 23 | RB4 — General purpose I/O |
| Pin 24 | RB5 — General purpose I/O |
| Pin 25 | RB6 — General purpose I/O |
| Pin 26 | RB7 — General purpose I/O |
| Pin 27 | RB8 — General purpose I/O |
| Pin 28 | RB9 — General purpose I/O |
| Pin 29 | RB10 — General purpose I/O |
| Pin 30 | RB11 — General purpose I/O |
| Pin 31 | RB12 — General purpose I/O |
| Pin 32 | RB13 — General purpose I/O |
| Pin 33 | RB14 — General purpose I/O |
| Pin 34 | RB15 — General purpose I/O |
| Pin 35 | VSS — Ground |
| Pin 36 | VDD — Core supply 2.3V-3.6V |
| Pin 37 | RC1 — General purpose I/O |
| Pin 38 | RC2 — General purpose I/O |
| Pin 39 | RC3 — General purpose I/O |
| Pin 40 | RC4 — General purpose I/O |
| Pin 41 | RD0 — General purpose I/O |
| Pin 42 | RD1 — General purpose I/O |
| Pin 43 | RD2 — General purpose I/O |
| Pin 44 | RD3 — General purpose I/O |
| Pin 45 | RD4 — General purpose I/O |
| Pin 46 | RD5 — General purpose I/O |
| Pin 47 | RD6 — General purpose I/O |
| Pin 48 | RD7 — General purpose I/O |
| Pin 49 | RD8 — General purpose I/O |
| Pin 50 | RD9 — General purpose I/O |
| Pin 51 | RD10 — General purpose I/O |
| Pin 52 | RD11 — General purpose I/O |
| Pin 53 | RD12 — General purpose I/O |
| Pin 54 | RD13 — General purpose I/O |
| Pin 55 | RD14 — General purpose I/O |
| Pin 56 | RD15 — General purpose I/O |
| Pin 57 | RF0 — General purpose I/O |
| Pin 58 | RF1 — General purpose I/O |
| Pin 59 | RF3 — General purpose I/O |
| Pin 60 | RF4 — General purpose I/O |
| Pin 61 | RF5 — General purpose I/O |
| Pin 62 | OSC1 — Crystal oscillator input |
| Pin 63 | OSC2 — Crystal oscillator output |
| Pin 64 | MCLR — Master clear reset (active low) |
Aplicaciones típicas
PIC32MX775F256H-80I/MR es adecuado para 6 aplicacións: Industrial Ethernet Gateways, USB Audio Streaming Devices, CAN-Based Automotive Body Controllers, Connected Consumer Appliances, Embedded Web Servers and HMI, Data Acquisition and Control Modules.
Industrial Ethernet Gateways
Why PIC32MX775F256H-80I/MR fits: the integrated 10/100 Ethernet MAC with RMII/MII and dual CAN 2.0b controllers provides both industrial fieldbus and Ethernet backbone connectivity on a single chip. The 80 MHz MIPS32 M4K core runs Microchip's free TCP/IP stack (MLA) plus RTOS at full line rate. How it is used: the MCU sits between a KSZ8041 PHY and the CAN bus, handling protocol conversion with 256 KB Flash for application firmware and 64 KB SRAM for socket buffers. Trade-off: 80 MHz leaves limited headroom for TLS 1.2, so security-heavy gateways often choose PIC32MX795 with more memory.
Recomendado
USB Audio Streaming Devices
Why PIC32MX775F256H-80I/MR fits: USB 2.0 Full-Speed OTG plus 16-bit Parallel Master Port (PMP) interface to external audio DACs enables USB-to-I2S bridge designs at 48 kHz / 96 kHz sample rates. The 64 KB SRAM is large enough to double-buffer audio streams. How it is used: the MCU enumerates as a USB Audio Class 1.0 device, decodes samples, and pushes them through PMP to a PCM5101A-class DAC. Trade-off: full-speed USB caps bandwidth at 12 Mbit/s, sufficient for uncompressed stereo but not multichannel HD audio.
Recomendado
CAN-Based Automotive Body Controllers
Why PIC32MX775F256H-80I/MR fits: dual independent CAN 2.0b controllers with 8-channel DMA enable bridge / gateway roles between body CAN and chassis CAN buses at automotive peripheral tier. The industrial -40C to +85C temperature grade handles cabin environments. How it is used: the MCU receives CAN frames on one bus, filters and routes them to the other, while 64 KB SRAM holds diagnostic buffers. Trade-off: this part is industrial-grade, not AEC-Q100; for under-hood or safety-critical ECUs, use PIC32MX with automotive QMS grading.
Recomendado
Connected Consumer Appliances
Why PIC32MX775F256H-80I/MR fits: Ethernet MAC plus USB OTG plus the 64-VQFN compact footprint suits white-goods mainboards that need both Wi-Fi/Ethernet dongle connectivity and service-port USB. The 2.3V-3.6V VDD range tolerates noisy SMPS rails common in appliances. How it is used: an Ethernet MAC drives a wired cloud connection, USB exposes a service port for firmware update, and 16-bit timers drive motor-control PWM. Trade-off: 256 KB Flash fits typical appliance stacks but limits future feature expansion.
Recomendado
Embedded Web Servers and HMI
Why PIC32MX775F256H-80I/MR fits: the 256 KB Flash runs Microchip's HTTP server with file system on external SPI Flash, while 64 KB SRAM serves multiple TCP clients. PMP enables direct connection to small TFT displays for cost-effective HMI terminals. How it is used: the MCU serves HTML/JSON over Ethernet, drives a TFT via PMP, and uses 16-bit timers to poll sensors. Trade-off: TLS 1.2 exceeds the 256 KB Flash budget without external SPI Flash for asset storage.
Recomendado
Data Acquisition and Control Modules
Why PIC32MX775F256H-80I/MR fits: 8-channel DMA offloads high-throughput ADC sampling from the CPU, while CAN and Ethernet provide both real-time and IP-network connectivity for distributed DAQ nodes. The 16-bit PMP can drive parallel DACs or capture digital data streams. How it is used: DMA streams ADC samples into SRAM buffers, the core processes data, and results are exported via CAN or Ethernet. Trade-off: the 10-bit ADC limits precision; for 12/16-bit accuracy consider PIC32MK or external ADC companions.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MX775F256H-80I/MR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MX775F256HT-80I/MR | PIC32MX775F256H-80V/MR | PIC32MX675F256H-80I/MR | PIC32MX564F128H-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm, MR) | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same |
| Maximum Clock Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB (-50%) |
| Ethernet MAC | Yes (10/100) | Yes | Yes | No | Yes |
| CAN Controllers | 2 | 2 | 2 | 2 | 1 (-50%) |
| USB OTG | Yes (FS) | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +105C (Extended) | -40C to +85C | -40C to +85C |
| Approx Unit Price (qty 1) | $9.85 | $9.85 (same die) | $10.50 (extended temp) | $8.90 (no Ethernet) | $7.50 (lower tier) |
Diferenciadores clave
- Integrated Ethernet MAC plus dual CAN plus USB OTG in single die (frente a PIC32MX675F256H-80I/MR)
- Higher memory in same 64-VQFN footprint (frente a PIC32MX564F128H-I/MR)
- Industrial temperature grade with active product lifecycle (frente a Older PIC32MX460F512H-80I/MR)
Notas de diseño
PIC32MX775F256H-80I/MR draws roughly 70 mA typical at 80 MHz across 2.3V-3.6V VDD. Use a low-noise LDO such as Microchip MCP1700 or TC1015 (or higher-current MIC29150) rated at 100 mA minimum headroom. Place one 4.7 uF bulk capacitor and a 100 nF decoupling cap within 5 mm of each VDD/VSS pair; the VQFN EP (exposed pad) MUST be soldered to a continuous GND plane for thermal dissipation.
Route the high-speed Ethernet RMII/MII traces as 50 ohm controlled-impedance pairs with matched length (+/- 100 mil). Place the KSZ8041 PHY within 25 mm of the MCU and isolate analog and digital ground planes, joining them at a single point under the PHY. The USB DP/DM traces require 90 ohm differential impedance, length-matched to within 150 mil, and an ESD array (USBLC6-2SC6) at the connector.
Do not skip the MCLR pull-up resistor; the MCLR pin requires a 10 kOhm pull-up to VDD with a 100 nF cap for proper reset. Avoid routing sensitive analog traces (ADC inputs) near PWM outputs or the switching node of DC-DC converters - this part has only a 10-bit ADC and benefits from clean analog routing. Use the JTAG pins (PGEC1/PGED1 or PGEC2/PGED2) for in-circuit debug with MPLAB ICD 3 or PICkit 3; do not assign them as GPIO unless debug is disabled.
Estimated: at 80 MHz with peripherals active, junction temperature rises approximately 15-20C above ambient on a 4-layer PCB with the thermal pad soldered to an inner GND plane (theta_JA approximately 30 C/W). In enclosed housings without airflow, derate to 60 MHz (by reducing PLL multiplier) if ambient exceeds 70C to keep Tj below 125C maximum.
Información de cumplimiento
RoHS compliant per DigiKey product page. Industrial temperature grade (-40C to +85C). Not AEC-Q100 qualified - this part targets industrial/connected consumer, not automotive under-hood.
