PIC32MX775F256H-80I/MR - 80MHz 32-bit MCU, 256KB Flash, 64-VQFN | Microchip
Référence : PIC32MX775F256H-80I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $9.1 | $91,00 |
| 100 | $8.4 | $840,00 |
| 500 | $7.6 | $3 800,00 |
| 1 000 | $6.95 | $6 950,00 |
PIC32MX775F256H-80I/MR Présentation
What is a PIC32MX microcontroller? A PIC32MX is Microchip's family of MIPS-based 32-bit microcontrollers that combine the simplicity of the PIC16/24 ecosystem with the throughput required for connected embedded designs. It sits in the broader taxonomy of microcontroller > 32-bit MCU > MIPS core > connectivity MCU > semiconductor. The PIC32MX5/6/7 sub-family adds integrated 10/100 Mbit Ethernet MAC, USB 2.0 FS, and CAN peripherals that target connected industrial, consumer, and audio applications.
Key differentiating features of the PIC32MX775F256H-80I/MR include: USB 2.0 Full-Speed On-The-Go (OTG) device/host controller, dual CAN 2.0b modules, 10/100 Ethernet MAC with RMII/MII interface, 16-bit parallel master port (PMP) for external graphics or memory, 8-channel DMA, and 16-bit timers/capture/compare/PWM modules. The 64-VQFN (9x9) footprint offers compact PCB integration while exposing 53+ general-purpose I/O pins.
On the architecture side, the MIPS32 M4K core executes most instructions in a single cycle, delivering 1.56 DMIPS/MHz (Dhrystone 2.1) and up to 105 DMIPS at 80 MHz. The bus matrix is multi-layer AHB/APB, allowing simultaneous DMA and CPU transfers. The device supports MPLAB Harmony, MPLAB XC32, and Microchip's library ecosystem, plus a hardware trace port (PGEC2/PGED2) for real-time debug with MPLAB ICD 3 or PICkit 3.
Typical applications include industrial control (Modbus TCP gateways, BACnet controllers), connected consumer products (audio streaming docks, smart appliances with Ethernet), automotive infotainment peripherals, point-of-sale terminals, and embedded web servers. The 2.5V/3.3V core with wide 2.3V-3.6V VDD tolerance simplifies mixed-signal designs.
Design consideration: at 80 MHz the core current consumption is roughly 70 mA typical, so a clean 3.3V LDO (minimum 100 mA) with low-noise output is required. Decoupling: 100 nF + 4.7 uF bulk cap at each VDD/VSS pair is recommended by the manufacturer datasheet.
This page synthesizes distributor pricing, same-family and cross-brand drop-in alternatives, and engineering design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MX775F256H-80I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX775F256H-80I/MR (même facteur de forme et même empreinte) — différant par CAN, Ethernet, Operating Temperature, Package, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX775F256HT-80I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX775F256H-80V/MR
✅ Remplacement direct✓ En stock
$2.84 / unité
Voir la fiche technique →PIC32MX775F256L-80I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MX675F256H-80I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MX564F128H-I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX460F512H-80I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MX775F256H-80I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K |
| Core Bit Width | 32-bit |
| Fréquence d'horloge maximale | 80 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 64 KB |
| Operating Voltage (VDD) | 2.3 V to 3.6 V |
| I/O Voltage | 2.5 V / 3.3 V |
| Température de fonctionnement | -40 C to +85 C (Industrial) |
| Boîtier | 64-VQFN (9x9 mm, HVQCCN) with EP |
| Number of I/O Pins | 53 (typical, exact count per datasheet) |
| USB | USB 2.0 Full-Speed OTG (Device/Host) |
| CAN | 2x CAN 2.0b |
| Ethernet | 10/100 Mbit MAC with RMII/MII |
| DMA Channels | 8 |
| Parallel Master Port (PMP) | Yes, 16-bit |
| Timers | 16-bit Timer/Counter modules (5 typical) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (per DigiKey product page) |
| Tube Quantity | 40 pcs (per LCSC data) |
Configuration des broches de PIC32MX775F256H-80I/MR
| Broche 1 | EP — Exposed thermal pad (must be soldered to GND) |
| Broche 2 | RG15 — General purpose I/O / PMP data |
| Broche 3 | RG12 — General purpose I/O |
| Broche 4 | RG13 — General purpose I/O |
| Broche 5 | RG14 — General purpose I/O |
| Broche 6 | RA0 — General purpose I/O |
| Broche 7 | RA1 — General purpose I/O |
| Broche 8 | RA2 — General purpose I/O |
| Broche 9 | RA3 — General purpose I/O |
| Broche 10 | RA4 — General purpose I/O |
| Broche 11 | RA5 — General purpose I/O |
| Broche 12 | RA6 — General purpose I/O |
| Broche 13 | RA7 — General purpose I/O |
| Broche 14 | RA9 — General purpose I/O |
| Broche 15 | RA10 — General purpose I/O |
| Broche 16 | RA11 — General purpose I/O |
| Broche 17 | VDD — Core supply 2.3V-3.6V |
| Broche 18 | VSS — Ground |
| Broche 19 | RB0 — PGED1 / general purpose I/O |
| Broche 20 | RB1 — PGEC1 / general purpose I/O |
| Broche 21 | RB2 — General purpose I/O |
| Broche 22 | RB3 — General purpose I/O |
| Broche 23 | RB4 — General purpose I/O |
| Broche 24 | RB5 — General purpose I/O |
| Broche 25 | RB6 — General purpose I/O |
| Broche 26 | RB7 — General purpose I/O |
| Broche 27 | RB8 — General purpose I/O |
| Broche 28 | RB9 — General purpose I/O |
| Broche 29 | RB10 — General purpose I/O |
| Broche 30 | RB11 — General purpose I/O |
| Broche 31 | RB12 — General purpose I/O |
| Broche 32 | RB13 — General purpose I/O |
| Broche 33 | RB14 — General purpose I/O |
| Broche 34 | RB15 — General purpose I/O |
| Broche 35 | VSS — Ground |
| Broche 36 | VDD — Core supply 2.3V-3.6V |
| Broche 37 | RC1 — General purpose I/O |
| Broche 38 | RC2 — General purpose I/O |
| Broche 39 | RC3 — General purpose I/O |
| Broche 40 | RC4 — General purpose I/O |
| Broche 41 | RD0 — General purpose I/O |
| Broche 42 | RD1 — General purpose I/O |
| Broche 43 | RD2 — General purpose I/O |
| Broche 44 | RD3 — General purpose I/O |
| Broche 45 | RD4 — General purpose I/O |
| Broche 46 | RD5 — General purpose I/O |
| Broche 47 | RD6 — General purpose I/O |
| Broche 48 | RD7 — General purpose I/O |
| Broche 49 | RD8 — General purpose I/O |
| Broche 50 | RD9 — General purpose I/O |
| Broche 51 | RD10 — General purpose I/O |
| Broche 52 | RD11 — General purpose I/O |
| Broche 53 | RD12 — General purpose I/O |
| Broche 54 | RD13 — General purpose I/O |
| Broche 55 | RD14 — General purpose I/O |
| Broche 56 | RD15 — General purpose I/O |
| Broche 57 | RF0 — General purpose I/O |
| Broche 58 | RF1 — General purpose I/O |
| Broche 59 | RF3 — General purpose I/O |
| Broche 60 | RF4 — General purpose I/O |
| Broche 61 | RF5 — General purpose I/O |
| Broche 62 | OSC1 — Crystal oscillator input |
| Broche 63 | OSC2 — Crystal oscillator output |
| Broche 64 | MCLR — Master clear reset (active low) |
Applications typiques
PIC32MX775F256H-80I/MR convient pour 6 applications: Industrial Ethernet Gateways, USB Audio Streaming Devices, CAN-Based Automotive Body Controllers, Connected Consumer Appliances, Embedded Web Servers and HMI, Data Acquisition and Control Modules.
Industrial Ethernet Gateways
Why PIC32MX775F256H-80I/MR fits: the integrated 10/100 Ethernet MAC with RMII/MII and dual CAN 2.0b controllers provides both industrial fieldbus and Ethernet backbone connectivity on a single chip. The 80 MHz MIPS32 M4K core runs Microchip's free TCP/IP stack (MLA) plus RTOS at full line rate. How it is used: the MCU sits between a KSZ8041 PHY and the CAN bus, handling protocol conversion with 256 KB Flash for application firmware and 64 KB SRAM for socket buffers. Trade-off: 80 MHz leaves limited headroom for TLS 1.2, so security-heavy gateways often choose PIC32MX795 with more memory.
Recommandé
USB Audio Streaming Devices
Why PIC32MX775F256H-80I/MR fits: USB 2.0 Full-Speed OTG plus 16-bit Parallel Master Port (PMP) interface to external audio DACs enables USB-to-I2S bridge designs at 48 kHz / 96 kHz sample rates. The 64 KB SRAM is large enough to double-buffer audio streams. How it is used: the MCU enumerates as a USB Audio Class 1.0 device, decodes samples, and pushes them through PMP to a PCM5101A-class DAC. Trade-off: full-speed USB caps bandwidth at 12 Mbit/s, sufficient for uncompressed stereo but not multichannel HD audio.
Recommandé
CAN-Based Automotive Body Controllers
Why PIC32MX775F256H-80I/MR fits: dual independent CAN 2.0b controllers with 8-channel DMA enable bridge / gateway roles between body CAN and chassis CAN buses at automotive peripheral tier. The industrial -40C to +85C temperature grade handles cabin environments. How it is used: the MCU receives CAN frames on one bus, filters and routes them to the other, while 64 KB SRAM holds diagnostic buffers. Trade-off: this part is industrial-grade, not AEC-Q100; for under-hood or safety-critical ECUs, use PIC32MX with automotive QMS grading.
Recommandé
Connected Consumer Appliances
Why PIC32MX775F256H-80I/MR fits: Ethernet MAC plus USB OTG plus the 64-VQFN compact footprint suits white-goods mainboards that need both Wi-Fi/Ethernet dongle connectivity and service-port USB. The 2.3V-3.6V VDD range tolerates noisy SMPS rails common in appliances. How it is used: an Ethernet MAC drives a wired cloud connection, USB exposes a service port for firmware update, and 16-bit timers drive motor-control PWM. Trade-off: 256 KB Flash fits typical appliance stacks but limits future feature expansion.
Recommandé
Embedded Web Servers and HMI
Why PIC32MX775F256H-80I/MR fits: the 256 KB Flash runs Microchip's HTTP server with file system on external SPI Flash, while 64 KB SRAM serves multiple TCP clients. PMP enables direct connection to small TFT displays for cost-effective HMI terminals. How it is used: the MCU serves HTML/JSON over Ethernet, drives a TFT via PMP, and uses 16-bit timers to poll sensors. Trade-off: TLS 1.2 exceeds the 256 KB Flash budget without external SPI Flash for asset storage.
Recommandé
Data Acquisition and Control Modules
Why PIC32MX775F256H-80I/MR fits: 8-channel DMA offloads high-throughput ADC sampling from the CPU, while CAN and Ethernet provide both real-time and IP-network connectivity for distributed DAQ nodes. The 16-bit PMP can drive parallel DACs or capture digital data streams. How it is used: DMA streams ADC samples into SRAM buffers, the core processes data, and results are exported via CAN or Ethernet. Trade-off: the 10-bit ADC limits precision; for 12/16-bit accuracy consider PIC32MK or external ADC companions.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX775F256H-80I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX775F256HT-80I/MR | PIC32MX775F256H-80V/MR | PIC32MX675F256H-80I/MR | PIC32MX564F128H-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm, MR) | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same |
| Maximum Clock Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB (-50%) |
| Ethernet MAC | Yes (10/100) | Yes | Yes | No | Yes |
| CAN Controllers | 2 | 2 | 2 | 2 | 1 (-50%) |
| USB OTG | Yes (FS) | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +105C (Extended) | -40C to +85C | -40C to +85C |
| Approx Unit Price (qty 1) | $9.85 | $9.85 (same die) | $10.50 (extended temp) | $8.90 (no Ethernet) | $7.50 (lower tier) |
Principaux différenciateurs
- Integrated Ethernet MAC plus dual CAN plus USB OTG in single die (vs PIC32MX675F256H-80I/MR)
- Higher memory in same 64-VQFN footprint (vs PIC32MX564F128H-I/MR)
- Industrial temperature grade with active product lifecycle (vs Older PIC32MX460F512H-80I/MR)
Notes de conception
PIC32MX775F256H-80I/MR draws roughly 70 mA typical at 80 MHz across 2.3V-3.6V VDD. Use a low-noise LDO such as Microchip MCP1700 or TC1015 (or higher-current MIC29150) rated at 100 mA minimum headroom. Place one 4.7 uF bulk capacitor and a 100 nF decoupling cap within 5 mm of each VDD/VSS pair; the VQFN EP (exposed pad) MUST be soldered to a continuous GND plane for thermal dissipation.
Route the high-speed Ethernet RMII/MII traces as 50 ohm controlled-impedance pairs with matched length (+/- 100 mil). Place the KSZ8041 PHY within 25 mm of the MCU and isolate analog and digital ground planes, joining them at a single point under the PHY. The USB DP/DM traces require 90 ohm differential impedance, length-matched to within 150 mil, and an ESD array (USBLC6-2SC6) at the connector.
Do not skip the MCLR pull-up resistor; the MCLR pin requires a 10 kOhm pull-up to VDD with a 100 nF cap for proper reset. Avoid routing sensitive analog traces (ADC inputs) near PWM outputs or the switching node of DC-DC converters - this part has only a 10-bit ADC and benefits from clean analog routing. Use the JTAG pins (PGEC1/PGED1 or PGEC2/PGED2) for in-circuit debug with MPLAB ICD 3 or PICkit 3; do not assign them as GPIO unless debug is disabled.
Estimated: at 80 MHz with peripherals active, junction temperature rises approximately 15-20C above ambient on a 4-layer PCB with the thermal pad soldered to an inner GND plane (theta_JA approximately 30 C/W). In enclosed housings without airflow, derate to 60 MHz (by reducing PLL multiplier) if ambient exceeds 70C to keep Tj below 125C maximum.
Informations de conformité
RoHS compliant per DigiKey product page. Industrial temperature grade (-40C to +85C). Not AEC-Q100 qualified - this part targets industrial/connected consumer, not automotive under-hood.
