PIC32MZ2025DAL169-I/HF - 32-bit 200MHz MCU 2MB Flash | Microchip
N.º de pieza: PIC32MZ2025DAL169-I/HF ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6.13 | $6,13 |
| 10 | $5.83 | $58,30 |
| 100 | $5.5 | $550,00 |
| 500 | $5.2 | $2.600,00 |
| 1.000 | $4.95 | $4.950,00 |
PIC32MZ2025DAL169-I/HF Descripción general
A microcontroller (MCU) is an integrated circuit that combines a processor core, program and data memory, peripherals, and I/O on a single die. The PIC32MZ DAL family extends this concept by integrating a dedicated Graphics Controller, Graphics Processor, and DDR2 memory interface, positioning the part as a system-on-chip for HMI (human-machine interface) designs. The 32-bit MIPS microAptiv core delivers 1.59 DMIPS/MHz with single-cycle multiply, DSP extensions, and a double-precision FPU, enabling efficient handling of complex graphics stacks such as Microchip's MPLAB Harmony and Segger emWin.
Key features include a 12-bit 18 MSPS ADC module supporting up to 45 analog inputs, a 9-bit 200 kHz GPU/display pipeline, integrated High-Speed USB 2.0 with PHY, two CAN 2.0b modules, 10/100 Ethernet MAC with IEEE 1588 PTP support, and multiple communication peripherals including UART, SPI, I2C, I2S, and SQI. The PIC32MZ DA family shares the same peripherals and pinout across memory variants, allowing designers to scale memory (2 MB, 1 MB, 512 KB Flash) without board rework.
Typical applications include industrial HMI panels, medical device displays, automotive instrument clusters, smart home control panels, point-of-sale terminals, and portable instrumentation. The wide integration minimizes external components, reducing BOM cost and PCB area in compact graphical products. Compared to using a discrete host MCU plus external GPU, the PIC32MZ DAL reduces system complexity while preserving the deterministic real-time behavior required in industrial and medical environments.
When designing with this device, allocate adequate PCB area for the 11x11 mm BGA fanout and ensure proper DDR2 PCB routing with controlled-impedance traces, length-matched DQS signals, and a solid ground reference plane. Use Microchip's MPLAB Harmony Configurator (MHC) to initialize the DDR2 controller and graphics stack; an improper sequence can prevent the controller from completing calibration and lock the display pipeline.
Alternativas directas para PIC32MZ2025DAL169-I/HF — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MZ2025DAL169-I/HF (mismo factor de forma y huella) — difiere en USB, Graphics Controller, Operating Temperature, CAN, Core Architecture.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
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Ver hoja de datos →PIC32MZ2025DAL169-I/HF Valores máximos y características eléctricas
| Core Architecture | MIPS32 microAptiv (PIC32MZ DAL) |
| Core Width | 32-bit |
| Maximum CPU Speed | 200 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| SRAM | 640 KB |
| External DRAM Interface | DDR2 up to 32 MB or 128 MB addressable |
| Encapsulado | 169-LFBGA (11x11 mm) |
| Temperatura de funcionamiento | -40C to +85C (industrial, I-temp) |
| Tensión de alimentación | 1.8 V (core), 3.3 V (I/O) |
| ADC | 12-bit, up to 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated (TFT-LCD, 24-bit) |
| Graphics Processor | Integrated (GPU for image and text) |
| USB | Hi-Speed USB 2.0 with on-chip PHY |
| CAN | 2x CAN 2.0b |
| Ethernet | 10/100 MAC with IEEE 1588 PTP |
| Estado RoHS | Compliant |
| Tipo de montaje | Surface Mount (BGA) |
Guía de configuración de pines de PIC32MZ2025DAL169-I/HF 169-lfbga (11x11 mm)
Configuración de pines para PIC32MZ2025DAL169-I/HF (encapsulado 169-lfbga (11x11 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para PIC32MZ2025DAL169-I/HF.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
PIC32MZ2025DAL169-I/HF es adecuado para 6 aplicacións: Industrial HMI Control Panel, Medical Device Display, Smart Home Control Panel, Point-of-Sale Terminal, Portable Test & Measurement, Building Automation Display.
Industrial HMI Control Panel
The PIC32MZ2025DAL169-I/HF is ideal for industrial human-machine interface (HMI) panels with TFT-LCD displays from QVGA to WVGA. Its integrated Graphics Controller and Graphics Processor eliminate the need for an external GPU, while the 200 MHz MIPS core executes real-time control logic concurrently with GUI rendering. The on-chip DDR2 controller supports frame buffers up to 128 MB, sufficient for smooth 24-bit color animation at WVGA resolutions. Combined with 10/100 Ethernet and two CAN 2.0b ports, the device serves as a single-chip solution for factory automation panels networked to PLCs.
Recomendado
Medical Device Display
Medical monitors and portable diagnostic devices benefit from the PIC32MZ2025DAL169-I/HF's combination of MIPS deterministic real-time response, 12-bit 18 MSPS ADC for sensor readout, and integrated graphics for waveform rendering. The 200 MHz core runs RTOS-driven display updates while maintaining predictable interrupt latency for safety-critical tasks. Industrial temperature rating (-40C to +85C) and Hi-Speed USB 2.0 enable USB-based data transfer to host PCs. The integrated DDR2 interface supports large grayscale and color buffers for ultrasound and patient monitor displays.
Recomendado
Smart Home Control Panel
Wall-mounted smart home controllers use the PIC32MZ2025DAL169-I/HF to drive capacitive-touch TFT displays while running Wi-Fi/BLE gateway logic. The 2 MB Flash holds the entire GUI stack (emWin or Harmony) plus application firmware, and the 640 KB SRAM supports touch debouncing and animation buffers. Ethernet MAC provides wired backbone connectivity, while the integrated Hi-Speed USB supports firmware update from a USB stick. The LFBGA-169 package keeps the PCB footprint small enough for slim in-wall enclosures.
Recomendado
Point-of-Sale Terminal
POS terminals and self-service kiosks leverage the PIC32MZ2025DAL169-I/HF's integrated graphics and DDR2 interface to render product catalogs, payment screens, and receipt printers. The 200 MHz MIPS core processes barcode scanner input via UART while refreshing the display at 60 fps. Hi-Speed USB 2.0 supports barcode scanners, receipt printers, and customer-facing displays. Two CAN ports enable optional connectivity to back-office equipment, and the 10/100 Ethernet MAC links to store networks for inventory updates.
Recomendado
Portable Test & Measurement
Handheld oscilloscopes, data loggers, and field instruments benefit from the PIC32MZ2025DAL169-I/HF's 12-bit 18 MSPS ADC (up to 45 channels) and integrated display driver for waveform visualization. The 200 MHz MIPS core performs DSP tasks such as FFT and filtering in real time, while the Graphics Controller renders gridded waveforms and measurement readouts. Industrial temperature range supports outdoor field use. Hi-Speed USB and Ethernet enable rapid data offload to PCs and cloud servers.
Recomendado
Building Automation Display
Building management system (BMS) touch panels use the PIC32MZ2025DAL169-I/HF to drive wall-mounted TFT displays controlling HVAC, lighting, and access. The 10/100 Ethernet MAC connects directly to building networks using protocols such as BACnet/IP and Modbus TCP. Two CAN 2.0b ports link to HVAC and lighting controllers, while the integrated graphics pipeline renders floor plans and equipment status in real time. The 2 MB Flash stores multilingual GUI assets without external memory expansion.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MZ2025DAL169-I/HF — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MZ2025DAB169T-I/HF | PIC32MZ2025DAB169-I/HF | PIC32MZ2025DAG169T-I/6J | PIC32MZ2025DAH169T-I/6J | PIC32MZ1064DAB169-I/HF |
|---|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA - same | 169-LFBGA - same | 169-LFBGA - same | 169-LFBGA - same | 169-LFBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit |
| Max CPU Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 1064 KB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Operating Temperature | -40C to +85C (I-temp) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Integrated Graphics | Yes (GPU + LCD Controller) | Yes | Yes | Yes | Yes | Yes |
Diferenciadores clave
- Highest-density pin variant in PIC32MZ DAL family (frente a PIC32MZ2025DAL176-I/2J)
- Industrial temperature grade I (-40C to +85C) (frente a PIC32MZ2025DAL169-V/HF (V-temp, -40C to +105C))
- No cross-brand equivalent in same footprint (frente a STM32H7 + external SDRAM + external GPU)
Notas de diseño
The 169-LFBGA at 11x11 mm uses a 0.8 mm ball pitch, requiring microvia (HDI) PCB technology with laser-drilled stacked vias on 4-6 layer stack-ups. Use Microchip's recommended footprint from the PIC32MZ DA Family Datasheet and ensure adequate BGA fanout escape routing in the inner layers. Maintain a continuous reference ground plane under the BGA for signal integrity of the DDR2 interface, which operates at up to 200 MHz.
The DDR2 controller requires proper initialization sequence through MPLAB Harmony Configurator (MHC). Skipping the DDR2 calibration routine or using incorrect timing parameters will cause display artifacts or boot failures. Always validate the DDR2 interface with Microchip's DDR2 stress test before connecting the TFT panel. The 32 kHz low-power oscillator must be enabled before configuring the DDR2 PLL or the calibration will fail.
Estimated: at 200 MHz operation with DDR2 active and USB Hi-Speed enabled, total power dissipation is approximately 0.8-1.2 W. The 169-LFBGA package has a typical theta_JA of 18-22 C/W on a 4-layer JEDEC test board, resulting in a junction temperature rise of 15-25 C above ambient. Provide at least 4 thermal vias in the center pad array and connect them to a solid internal ground plane for heat spreading.
Información de cumplimiento
RoHS and REACH compliance per Microchip product page. Not AEC-Q100 qualified - select automotive-grade PIC32MZ DA variant for vehicle applications. Lead-free and halogen-free packaging.