RTAX2000DL-CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip
N.º de pieza: RTAX2000DL-CQ352V ✓ Activo| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
RTAX2000DL-CQ352V Descripción general
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of space. Within the semiconductor hierarchy, it sits under programmable logic devices alongside SRAM-based and flash-based FPGAs; the RTAX family is distinguished by its nonvolatile antifuse interconnect, which is programmed once and cannot be upset by a single charged particle, giving the device live-at-power-up operation without an external configuration flash.
Key features of the RTAX2000DL variant include up to 120 DSP mathblocks performing 18-bit x 18-bit multiply-accumulate operations at up to 125 MHz, up to 540 kbits of embedded SRAM with optional EDAC protection, and a maximum combinatorial delay of 1.100 ns. Total ionizing dose capability is rated at 300 krad (functional), with a 200 krad specification also cited in the datasheet family data.
The device is fabricated in advanced CMOS technology and operates from a 1.5V nominal core supply (1.425V to 1.575V range) across a military temperature range of -55C to +125C. The DL suffix denotes the DSP-enhanced (mathblock-rich) die; the metal-sealed ceramic CQFP-352 package provides the hermeticity required for space-flight assembly flows.
Typical applications include satellite payload processing, onboard signal processing, spacecraft bus control, and radiation-exposed instrumentation where single-event upset immunity and true single-chip form factor matter.
When designing with this device, plan programming via the standard antifuse programming flow (one-time programmable) and validate timing against the 1.5V supply corner conditions.
This page synthesizes distributor listings, family datasheet data, and drop-in alternatives within the RTAX CQFP-352 ecosystem not consolidated in the manufacturer datasheet.
Alternativas directas para RTAX2000DL-CQ352V — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con RTAX2000DL-CQ352V (mismo factor de forma y huella) — difiere en Package, Configuration, Technology, Embedded Memory, Equivalent System Gates.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
RTAX2000DL-1CQ352V
✅ Sustitución directa✓ En stock
$2950 / unidad
Ver hoja de datos →RTAX2000DL-CQ352B
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →RTAX2000DL-1CQ352B
✅ Sustitución directa✓ En stock
$3420 / unidad
Ver hoja de datos →RTAX2000D-CQ352V
✅ Sustitución directa✓ En stock
$2560 / unidad
Ver hoja de datos →RTAX2000D-1CQ352V
✅ Sustitución directa✓ En stock
$3950 / unidad
Ver hoja de datos →RTAX2000DL-CQ352V Valores máximos y características eléctricas
| Equivalent System Gates | 2,000,000 |
| Logic Cells | 29,568 |
| CLBs | 19,712 |
| Technology | CMOS, antifuse (nonvolatile, one-time programmable) |
| Core Supply Voltage | 1.5 V nominal (1.425 V to 1.575 V) |
| DSP Mathblocks | Up to 120 (18-bit x 18-bit MAC, up to 125 MHz) |
| Embedded Memory | Up to 540 kbits SRAM with optional EDAC |
| Maximum Combinatorial Delay | 1.100 ns |
| Total Ionizing Dose (TID) | 300 krad (functional); 200 krad (per family data) |
| Encapsulado | CQFP-352, hermetically sealed ceramic, metal-sealed cofired |
| Terminal Pitch | 0.500 mm |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -55C to +125C |
| Configuration | Live-at-power-up (antifuse, no external boot device) |
| Family | RTAX-DSP (RTAX-S/SL and RTAX-DSP radiation-tolerant FPGAs) |
Guía de configuración de pines de RTAX2000DL-CQ352V cqfp-352, hermetically sealed ceramic, metal-sealed cofired
Configuración de pines para RTAX2000DL-CQ352V (encapsulado cqfp-352, hermetically sealed ceramic, metal-sealed cofired). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para RTAX2000DL-CQ352V.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
RTAX2000DL-CQ352V es adecuado para 6 aplicacións: Satellite Payload Signal Processing, Spacecraft Bus Control and Avionics, Radiation-Exposed Instrumentation, High-Reliability Defense and Aerospace Electronics, Onboard Data Storage and Formatting, Launch Vehicle and Missile Electronics.
Satellite Payload Signal Processing
The RTAX2000DL-CQ352V fits satellite payload processing because its up to 120 DSP mathblocks deliver 18-bit x 18-bit multiply-accumulate at up to 125 MHz, sufficient for FFT, digital filtering, and modulation chains in communications and Earth-observation payloads. Its antifuse fabric is configuration-upset immune and operates live at power-up, eliminating external boot-flash failure modes that matter in orbit. Implemented between ADC front ends and downlink formatters, the 540 kbits of embedded SRAM with optional EDAC buffers sample streams while designer-applied TMR protects control logic. The trade-off versus SRAM FPGAs is one-time programmability, requiring thorough pre-flight verification in Libero.
Recomendado
Spacecraft Bus Control and Avionics
For spacecraft bus control, the RTAX2000DL-CQ352V provides 2,000,000 gates of glueless integration for telemetry, telecommand, attitude-control interfaces, and error-corrected memory controllers in a single hermetic CQFP-352 device. Live-at-power-up antifuse configuration means control logic is functional the instant spacecraft power is applied - critical during launch and safe-mode events. Operating from a 1.5V nominal core (1.425V to 1.575V) across -55C to +125C, it tolerates bus-voltage and thermal variation. Because the fabric is one-time programmable, designers should freeze interface standards (MIL-STD-1553, SpaceWire companions) early and verify timing at both supply corners.
Recomendado
Radiation-Exposed Instrumentation
Scientific instruments on interplanetary probes and Earth-orbiting platforms use the RTAX2000DL-CQ352V to perform detector interfacing, time-tagging, and on-board data reduction. The family datasheet cites 300 krad (functional) total ionizing dose capability, adequate for many LEO and MEO missions, and antifuse interconnect eliminates configuration-memory single-event upset as a failure mode. Embedded SRAM with optional EDAC protects accumulated science data, while the 1.100 ns maximum combinatorial delay supports fast coincidence logic. The principal design consideration is TID margin: missions approaching the 300 krad limit should apply derating or confirm lot-level qualification data with Microchip.
Recomendado
High-Reliability Defense and Aerospace Electronics
Defense programs leverage the RTAX2000DL-CQ352V where the -55C to +125C military temperature range, hermetic metal-sealed ceramic CQFP-352 package, and known-good single-chip integration simplify qualification to military screening flows. The DSP mathblocks accelerate radar pulse processing, electronic-warfare channelization, and secure-communications encoding at up to 125 MHz MAC rates. Unlike SRAM FPGAs, the bitstream is never stored externally, reducing reverse-engineering and upset risks in contested environments. Design teams should note the one-time-programmable antifuse flow: prototype on the RTAX250SL-CQ352V or commercial ProASIC3 equivalents before committing flight devices to programming.
Recomendado
Onboard Data Storage and Formatting
Solid-state recorders and payload-data formatters use the RTAX2000DL-CQ352V's 540 kbits of embedded SRAM (with built-in FIFO control logic and optional EDAC) alongside external SDRAM controllers implemented in the 19,712-CLB fabric. The device performs lossless compression pre-processing, CCSDS framing, and Reed-Solomon encoding using its DSP mathblocks, offloading the spacecraft computer. Running at a nominal 1.5V core keeps static power low for eclipse operation. Designers should reserve EDAC-protected blocks for metadata and apply TMR to the external-memory controller, since SEU mitigation in user logic remains the designer's responsibility on this antifuse architecture.
Recomendado
Launch Vehicle and Missile Electronics
Flight-control and sequencing electronics in launch vehicles benefit from the RTAX2000DL-CQ352V's deterministic, single-chip implementation: antifuse configuration is present at power application with zero boot latency, timing is fixed once programmed (1.100 ns maximum combinatorial delay simplifies worst-case analysis), and the hermetic CQFP-352 survives high-shock, thermal-cycling environments. The -55C to +125C operating range covers externally mounted avionics bays. Typical designs implement redundant voter logic, sequencer state machines, and telemetry encoders with triple-modular redundancy. Because the part is one-time programmable, hardware-in-the-loop testing must conclude before flight-lot programming commits the design.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para RTAX2000DL-CQ352V — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | RTAX2000DL-1CQ352V | RTAX2000D-CQ352V | RTAX2000D-1CQ352V |
|---|---|---|---|---|
| Package | CQFP-352 ceramic, 0.500 mm pitch | CQFP-352 - same | CQFP-352 - same | CQFP-352 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 |
| Logic Cells / CLBs | 29,568 / 19,712 | 29,568 / 19,712 | 29,568 / 19,712 | 29,568 / 19,712 |
| DSP Mathblocks | Up to 120 (18x18 MAC, 125 MHz) | Up to 120 (18x18 MAC, 125 MHz) | Non-DL die (fewer/no mathblocks) | Non-DL die (fewer/no mathblocks) |
| Speed Grade | Standard | -1 (faster) | Standard | -1 (faster) |
| Core Supply Voltage | 1.5 V nominal (1.425-1.575 V) | 1.5 V nominal (1.425-1.575 V) | 1.5 V nominal (1.425-1.575 V) | 1.5 V nominal (1.425-1.575 V) |
| Max Combinatorial Delay | 1.100 ns | Lower than standard grade (-1 speed) | 1.100 ns | Lower than standard grade (-1 speed) |
| Embedded Memory | Up to 540 kbits with EDAC | Up to 540 kbits with EDAC | Up to 540 kbits with EDAC | Up to 540 kbits with EDAC |
Diferenciadores clave
- DSP-enhanced die with up to 120 mathblocks (frente a RTAX2000D-CQ352V)
- Identical footprint with faster speed-grade option (frente a RTAX2000DL-1CQ352V)
- Configuration-upset-immune antifuse fabric (frente a SRAM-based space FPGAs (e.g., Virtex-QV class))
Notas de diseño
Power the 1.5V core rail within the 1.425V to 1.575V window across all temperature and load conditions; timing is specified against this rail and violations at the low corner can break static timing closure. Estimate static and dynamic current from Libero SmartPower reports before sizing the rail - DSP-mathblock-heavy designs switching at 125 MHz dominate dynamic power. Decouple with a network of ceramic capacitors distributed across the 352-terminal package, and sequence I/O banks per the datasheet power-up requirements to avoid latch-up during spacecraft power transients.
The RTAX2000DL-CQ352V is one-time programmable: there is no rework path once the antifuse array is blown. Complete full hardware verification - ideally prototyping logic on a commercial ProASIC3 (A3PE) device or an RTAX evaluation board such as the RTAX2000S-CG624PROTO - before programming flight devices. Also confirm speed-grade ordering: '-1' parts are faster than standard grade, and substituting a slower standard-grade part (this MPN) for a '-1' design without re-running static timing analysis in Libero will cause field failures discovered only at integration.
Lay out the CQFP-352 land pattern to the 0.500 mm terminal pitch with gull-wing leads supporting visual solder-joint inspection required by high-reliability assembly flows. Place 0.1 uF decoupling capacitors within a few millimeters of power/ground terminal pairs around the package perimeter, and keep configuration-JTAG and programming-access traces routed for post-assembly programming access. For space boards, follow the datasheet thermal pad guidance and verify junction temperature at -55C to +125C extremes; the metal-sealed ceramic package conducts heat primarily through its leads and ground planes.
Información de cumplimiento
Compliance data not stated in provided distributor listings. Space-grade ceramic-package devices often use gold lead finishes and may fall under RoHS exemptions; request material declarations from Microchip during quotation.
