RTAX2000S-CG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX2000S-CG1152V β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4620 | $46,200.00 |
| 100 | $4390 | $439,000.00 |
| 500 | $4180 | $2,090,000.00 |
| 1,000 | $3960 | $3,960,000.00 |
Drop-in alternatives for RTAX2000S-CG1152V β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
RTAX2000S-1CG1152V
β Drop-Inπ Reference alternative (not in catalog)
RTAX2000S-1CG1152PROTO
β Drop-Inπ Reference alternative (not in catalog)
RTAX2000S-1LG1152V
β Drop-Inβ In Stock
Contact for price
View Datasheet βRTAX2000S-CG1152V Maximum Ratings & Electrical Characteristics
| Equivalent System Gates | 2,000,000 |
| CLBs (Logic Modules) | 21,504 |
| Logic Cells | 32,256 |
| User I/O | 684 inputs / 684 outputs |
| Core Supply Voltage | 1.5 V nominal |
| Process Technology | CMOS |
| Programming Technology | Anti-fuse (OTP), live at power-up |
| Radiation Tolerance | Radiation-tolerant (RadTolerant, RTAX-S family) |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Arithmetic Support | Dedicated carry logic |
| Operating Temperature | -55C to +125C |
| Package | CG1152 - 1152-terminal ceramic metal-sealed cofired CBGA |
| Mounting Type | Surface Mount (BGA) |
| Maximum Density in Family | Up to 4,000,000 equivalent system gates (RTAX-S/SL family) |
RTAX2000S-CG1152V cg1152 - 1152-terminal ceramic metal-sealed cofired cbga Pin Configuration Guide
Complete pinout information for RTAX2000S-CG1152V (cg1152 - 1152-terminal ceramic metal-sealed cofired cbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX2000S-CG1152V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX2000S-CG1152V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft On-Board Computer (OBC) Logic, Radiation-Hardened Bus and Interface Electronics, Instrument Sensor Data Acquisition, Secure Aerospace Communication Systems, Prototyping and Emulation of Space Flight Designs.
Satellite Payload Data Processing
The RTAX2000S-CG1152V fits payload data-processing chains where 2,000,000 system gates of reconfigurable logic must run continuously in a radiation environment. With 32,256 logic cells, embedded SRAM blocks with built-in FIFO control, and 684 user I/O, it implements high-throughput parallel datapaths, format converters, and compression engines on a single chip. Its anti-fuse fabric is live at power-up, removing external configuration devices that add failure modes in orbit. Placed in the metal-sealed CG1152 ceramic package rated -55C to +125C, the device withstands launch vibration and orbital thermal cycling, while the 1.5V nominal core keeps static power low within the spacecraft power budget.
Recommended
Spacecraft On-Board Computer (OBC) Logic
In spacecraft on-board computers, the RTAX2000S-CG1152V implements bus interfaces (MIL-STD-1553, SpaceWire), memory controllers, watchdog and health-monitoring logic around a processor core. The segmentable clock structure and chip-wide highway routing support multiple independent clock domains typical of command/telemetry subsystems, while dedicated carry logic accelerates CRC and error-correction arithmetic. Because the device is radiation-tolerant and live at power-up, reset behavior is deterministic - a critical property for autonomy. Designers combine the fabric with application-level triple-module redundancy; the CG1152 hermetic package and 684 I/O provide the connectivity and environmental margin required for multi-year missions.
Recommended
Radiation-Hardened Bus and Interface Electronics
The RTAX2000S-CG1152V is well suited to interface and bridge electronics that connect spacecraft payloads, instruments, and avionics to the vehicle bus. With 684 inputs and 684 outputs, a single device terminates wide parallel instrument interfaces, LVDS-style links via supported I/O standards, and redundant bus masters. Embedded SRAM with FIFO control buffers asynchronous data-rate matching between instruments and downlink chains without external FIFO chips, reducing part count and reliability risk. Operating from a 1.5V nominal core across -55C to +125C, and packaged in the hermetic CG1152 ceramic CBGA, the device maintains interface integrity under radiation and thermal stress.
Recommended
Instrument Sensor Data Acquisition
Scientific instruments on orbital platforms - imagers, spectrometers, particle detectors - generate high-volume data streams that the RTAX2000S-CG1152V conditions, sequences, and packetizes. Its 32,256 logic cells implement multichannel timing generators, ADC framing logic, and real-time co-adders, while embedded SRAM FIFOs absorb burst data before downlink. The device's deterministic live-at-power-up behavior ensures acquisition begins as soon as instrument power arrives, without configuration latency. The CG1152 metal-sealed ceramic package protects die integrity through launch loads and vacuum thermal cycles, and low 1.5V-core power helps fit within the strict power allocation typical of instrument electronics boards.
Recommended
Secure Aerospace Communication Systems
Secure communication payloads and encryption front-ends benefit from the RTAX2000S-CG1152V's one-time-programmable anti-fuse fabric: once programmed, the configuration physically resides in the silicon and cannot be read back or disturbed by radiation-induced configuration upsets, a meaningful security property absent from SRAM-based FPGAs. The 2,000,000-gate capacity accommodates cipher cores, key-handling logic, and multiple redundant channel engines simultaneously. Dedicated carry logic accelerates arithmetic in stream-cipher datapaths, and 684 user I/O support wide, redundant RF-chain interfaces. The hermetic CG1152 package with -55C to +125C rating matches ground-station and space-segment environmental requirements.
Recommended
Prototyping and Emulation of Space Flight Designs
Because RTAX-S anti-fuse devices are programmed once, the design flow relies on reprogrammable prototyping. The Aldec ACT-H3Ki-CQ256-class adaptors pair flash-based Microchip ProASIC3E technology with an RTAX-compatible footprint, allowing the prototype adaptor to mount directly in the RTAX2000S-CG1152V board location with no PCB change. Engineers iterate RTL and timing in flash, then transfer the verified design to the flight RTAX2000S. XAIPART lists the RTAX2000S-1CG1152PROTO device specifically designated for this prototyping flow, plus the same-family A3PE/M1AFS ProASIC/flash parts that populate the adaptors, enabling full board-level emulation before committing a flight unit.
Recommended
Recommended Products Summary
Engineering reference data for RTAX2000S-CG1152V β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX2000S-1CG1152V | RTAX2000S-1CG1152PROTO | RTAX2000S-1LG1152V |
|---|---|---|---|---|
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | CG1152 ceramic metal-sealed CBGA | CG1152 ceramic metal-sealed CBGA - same | CG1152 ceramic metal-sealed CBGA - same | LG1152 ceramic CBGA (standard ceramic variant) |
| Equivalent System Gates | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 |
| Logic Cells / CLBs | 32,256 / 21,504 | 32,256 / 21,504 | 32,256 / 21,504 | 32,256 / 21,504 |
| Speed Grade | [DATA_NEEDED] | -1 (standard) | -1 (standard, prototyping flow) | -1 (standard) |
| Core Supply Voltage | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Intended Use / Screening | Flight (space-grade) | Flight (space-grade, -1 speed grade) | Prototyping flow (non-flight designation) | Flight (space-grade, LG ceramic package) |
Key Differentiators
- Metal-sealed hermetic ceramic package (vs RTAX2000S-1LG1152V)
- Flight-grade screening on identical die (vs RTAX2000S-1CG1152PROTO)
- Cost-optimized density point (vs RTAX4000SL-CG1272V)
Design Notes
RTAX-S anti-fuse FPGAs are one-time programmable. Never program the flight RTAX2000S-CG1152V before functional verification: validate the design on a reprogrammable prototyping adaptor (Aldec ACT-H3Ki series using flash ProASIC3E technology) that mounts directly in the RTAX footprint, then transfer the verified netlist to the flight device. Once programmed, an error requires scrapping a several-thousand-dollar space-grade part and repeating lot traceability.
With up to 684 outputs switching in a 1152-ball BGA, simultaneous switching noise is the dominant signal-integrity risk. Separate I/O bank supplies with dedicated planes, place decoupling capacitors beneath the CG1152 body on the opposite side of the board, and stagger output switching by assigning related signals to adjacent balls within a bank. Follow the RTAX-S/SL datasheet I/O banking rules - mixing incompatible I/O standards in one bank degrades noise margins.
The RTAX2000S core runs from a 1.5V nominal supply, which keeps static power low - a key family advantage per Microchip. Estimated: size the core rail for the datasheet ICC figures at your clock frequency plus I/O current for your termination scheme; rail sag below the 1.5V nominal minimum under switching load is a common cause of marginal timing in flight builds. Add bulk capacitance at the VRM in addition to per-bank decoupling.
The CG1152 is a 1152-terminal ceramic CBGA requiring a matched 1.0 mm-pitch land pattern per the datasheet package drawing and controlled reflow profile; ceramic packages have different CTE than FR-4, so underfill or compliant-layer decisions should follow your space-qualified assembly process. Verify ball-map assignments in Libero Designer before routing and reserve a few spare balls near each bank for engineering changes.
Compliance Information
Space-grade component; compliance data not stated in retrieved distributor listings. Hermetic ceramic metal-sealed packages in this class commonly use lead-containing seal materials under RoHS exemptions - confirm with Microchip product page and program environmental requirements.
