RTAX250S-1CG624B - 250K-Gate Rad-Tolerant FPGA | Microchip
N.º de pieza: RTAX250S-1CG624B ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1 | $1,00 |
RTAX250S-1CG624B Descripción general
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the single-event effects and total ionizing dose environments of space flight. Within the programmable logic hierarchy, it sits above commercial FPGAs and below fully radiation-hardened ASICs, providing a single-chip, live-at-power-up solution for spacecraft avionics, payload processing, and telemetry systems. The RTAX-S family is based on the Microsemi Axcelerator commercial architecture adapted for space.
Key features include SEU-hardened flip-flops that eliminate the need for triple module redundancy (TMR) in many designs, immunity to single-event upsets, SEU error rates below 10-10 errors per bit-day, and embedded SRAM blocks with built-in FIFO control logic. The anti-fuse programmable fabric is inherently one-time programmable and immune to configuration upsets, giving a true single-chip form factor with no external configuration device required.
Technically, the device is fabricated on a 0.15 um CMOS process with a combinatorial CLB propagation delay of 0.95 ns maximum. Segmentable clock structures, chip-wide I/O features, and dedicated arithmetic support make it suitable for high-throughput spaceflight data paths. Embedded FIFO and dual-port SRAM resources offload external memory requirements in payload computers.
Typical applications include satellite onboard data handling, radiation-environmental payload processing, spacecraft command and telemetry interfaces, and deep-space instrument control where live-at-power-up operation and SEU robustness are mandatory.
Design consideration: budget the 1.5 V core supply rail within the 1.425 V to 1.575 V window and account for CCGA solder-column attachment and rework constraints at the board level; verify radiation lot acceptance data for the specific mission LET requirement.
This page synthesizes distributor pricing tiers, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para RTAX250S-1CG624B — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con RTAX250S-1CG624B (mismo factor de forma y huella) — difiere en Package, Embedded Memory, Configuration, Process Technology, Equivalent System Gates.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
RTAX250S-1CG624V
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →RTAX250S-CG624B
✅ Sustitución directa✓ En stock
$2800 / unidad
Ver hoja de datos →RTAX250S-1CG624E
✅ Sustitución directa✓ En stock
$960 / unidad
Ver hoja de datos →RTAX250S-1LG624B
✅ Sustitución directa✓ En stock
$2020 / unidad
Ver hoja de datos →RTAX250S-1CGS624B
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
RTAX250S-1CG624B Valores máximos y características eléctricas
| Family | RTAX-S Radiation-Tolerant FPGA |
| System Gates | 250,000 |
| Logic Cells (CLBs) | 2,816 |
| Frecuencia de reloj máxima | 649 MHz |
| CLB Combinatorial Delay | 0.95 ns |
| Process Technology | 0.15 um CMOS |
| Supply Voltage (Nominal) | 1.5 V |
| Supply Voltage Range | 1.425 V to 1.575 V |
| Temperatura de funcionamiento | -55C to +125C |
| Logic Family | CMOS |
| Encapsulado | 624-pin Ceramic Column Grid Array (CCGA-624) |
| Tipo de montaje | Surface Mount |
| Programmability | Anti-fuse, one-time programmable |
| SEU Immunity | SEU rate < 10-10 errors/bit-day, SEU-hardened registers |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Application Domain | Space flight / satellite systems |
Guía de configuración de pines de RTAX250S-1CG624B 624-pin ceramic column grid array (ccga-624)
Configuración de pines para RTAX250S-1CG624B (encapsulado 624-pin ceramic column grid array (ccga-624)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para RTAX250S-1CG624B.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
RTAX250S-1CG624B es adecuado para 6 aplicacións: Satellite Onboard Data Handling, Spacecraft Command and Telemetry, Payload Data Processing, Launch Vehicle Avionics, Deep-Space Instrument Control, Radiation-Tolerant Prototyping and Emulation.
Satellite Onboard Data Handling
The RTAX250S-1CG624B fits satellite onboard data handling (OBDH) because its 250K-gate fabric and 2,816 CLBs implement telemetry encoders, decoders, and bus controllers (MIL-STD-1553, SpaceWire) in one live-at-power-up chip. The anti-fuse configuration cannot suffer configuration-memory upsets, and SEU-hardened registers hold error rates below 10-10 errors/bit-day, so critical housekeeping logic needs little or no added TMR. Its 649 MHz capability easily covers typical OBDH clock rates, while the 624-pin CCGA offers hundreds of user I/O for board-level interfacing. The trade-off is one-time programmability: design freezes must be finalized before flight-lot programming.
Recomendado
Spacecraft Command and Telemetry
For command and telemetry subsystems, the RTAX250S-1CG624B provides deterministic, single-chip framing, CCSDS packetization, and time-tagging logic. Its embedded SRAM blocks with built-in FIFO control buffer asynchronous ground-link data without external FIFO chips, reducing parts count and board area in hermetic avionics. The -55C to +125C range and ceramic CCGA package survive launch vibration and eclipse thermal cycling. SEU-hardened registers protect command decoders, so an upset cannot produce an unintended command stream. Typical implementations run at tens of MHz, far below the 649 MHz device ceiling, leaving large timing margin against radiation-induced slowdown effects.
Recomendado
Payload Data Processing
Imaging and scientific payload processing benefits from the RTAX250S-1CG624B's combination of 250K usable gates, embedded dual-port SRAM, and segmentable clock domains, which support channelized front-end processing and high-rate data formatting. The 0.15 um CMOS fabric delivers 0.95 ns worst-case CLB combinatorial delay, sufficient for parallel datapaths at hundreds of MHz. Because the anti-fuse array draws no configuration current and exhibits low static power, payload duty-cycled power budgets are easier to meet than with SRAM-based FPGAs. Designers should pipeline deeply to recover timing margin and use Microchip's space design flow for timing sign-off.
Recomendado
Launch Vehicle Avionics
Launch vehicle flight computers and stage controllers use the RTAX250S-1CG624B for its live-at-power-up behavior: control logic is active the instant power is applied, with no configuration load time, which is essential for flight-critical sequencers. The ceramic column grid array maintains solder integrity under severe launch vibration and mechanical shock better than many plastic BGA alternatives. The -55C to +125C operating range covers ascent thermal transients, and the 1.5 V core (1.425 V to 1.575 V) interfaces with standard rad-hard point-of-load converters. SEU hardness eliminates forced TMR on safety-critical state machines, simplifying verification.
Recomendado
Deep-Space Instrument Control
Deep-space instruments such as spectrometers and imagers require electronics that tolerate extreme total ionizing dose and single-event environments over multi-year cruises. The RTAX250S-1CG624B addresses this with SEU-immune hardened flip-flops and anti-fuse fabric that cannot lose configuration, maintaining instrument control and science-data acquisition without watchdog reconfiguration. Its true single-chip form factor removes the external configuration memory that is itself a radiation weak point. Engineers must still verify the device radiation report against the mission LET spectrum and apply module-level mitigation on non-hardened RAM-backed state, per Microchip's space application guidance.
Recomendado
Radiation-Tolerant Prototyping and Emulation
During RTAX-S development, the design is validated on Aldec ACT-H3Ki-CG624 adaptor boards that mimic the CG624 footprint using a flash-based Microchip ProASIC3E (A3PE3000) device, allowing reprogrammable prototyping directly on the flight target board. The final RTAX250S-1CG624B then drops onto the same land pattern for flight units. This flow de-risks the one-time-programmable nature of the anti-fuse device: timing, pinout, and SEU-mitigation schemes are proven before committing expensive flight lots. The 624-position footprint compatibility between the adaptor and the CCGA device makes board reuse straightforward across EM, EQM, and FM builds.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para RTAX250S-1CG624B — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | RTAX250S-1CG624V | RTAX250S-CG624B | RTAX250S-1CG624E | RTAX250S-1CGS624B |
|---|---|---|---|---|---|
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microsemi Corporation |
| Package | CCGA-624 (624-pin ceramic column grid array) | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Cells (CLBs) | 2,816 | 2,816 | 2,816 | 2,816 | 2,816 |
| Supply Voltage | 1.5 V nominal (1.425 V to 1.575 V) | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| SEU Hardening | SEU-hardened registers, error rate < 10-10 errors/bit-day | Same | Same | Same | Same |
| Screening Suffix | B | V | B | E | B (S-code variant) |
Diferenciadores clave
- B-suffix screening flow for space programs requiring that documentation level (frente a RTAX250S-1CG624E)
- SEU-hardened registers without forced TMR (frente a RTAX250SL-1LG624B)
- 649 MHz system performance in a rad-tolerant fabric (frente a RTAX250S-CG624B)
Notas de diseño
Hold the 1.5 V core rail within 1.425 V to 1.575 V under all load and radiation conditions. Estimated: at the 250K-gate density, core current is dominated by I/O switching, so measure core and I/O rail currents in bench emulation before sizing the point-of-load converter; do not size regulators from gate count alone. Use rad-hard or space-qualified LDO/DC-DC sources with low output ripple, and decouple each supply pin group at the CCGA escapes with X7R ceramic capacitors qualified for the mission temperature profile.
The CCGA-624 package uses solder columns rather than solder balls, which accommodates CTE mismatch between the ceramic package and organic PCB. Follow the Microchip RTAX-S package land-pattern drawing for the column grid, and prefer symmetric copper balance to minimize warpage through rework cycles. Column attachment inspection requires X-ray or micro-section sampling per your quality plan. Plan test access: JTAG programming and boundary-scan verification use dedicated columns - route them to a test connector before layout freeze, since the anti-fuse device cannot be reprogrammed once blown.
The RTAX250S is one-time programmable: a pinout or power-up sequencing error discovered after programming ruins a flight-priced device. Complete full timing closure in the Microchip/Libero space flow, including SEU mitigation review, before submitting the fuse file. Remember that only the flip-flops are SEU-hardened - combinational nodes, embedded SRAM contents, and I/O registers still need architectural mitigation (TMR, EDAC, scrubbing) per Microchip application guidance. Budget this in the schedule; it routinely adds weeks to verification.
The ceramic CCGA package conducts heat through the columns and the package body; thermal resistance depends strongly on board construction and airflow (often natural convection only in spacecraft). Estimated: for a worst-case power estimate of a few watts, perform a board-level thermal analysis with the actual radiator interface rather than relying on theta-JA tables. Verify junction temperature stays within -55C to +125C limits across hot-case and cold-case mission orbits, including eclipse transients, before design sign-off.
Información de cumplimiento
Space-grade hermetic ceramic CCGA device; RoHS/REACH declarations must be requested directly from Microchip for the specific orderable part and screening flow.
