RTAX250S-1CG624V - 250k Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX250S-1CG624V ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for RTAX250S-1CG624V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX250S-1CG624E
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View Datasheet →RTAX250SL-CG624V
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View Datasheet →RTAX250SL-1CG624B
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View Datasheet →RTAX250SL-CG624B
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View Datasheet →RTAX250S-1LG624V
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View Datasheet →RTAX250S-1CG624V Maximum Ratings & Electrical Characteristics
| Equivalent System Gates | 250,000 |
| Configurable Logic Blocks (CLBs) | 2816 |
| Cell Organization | 4224 cells |
| Family | RTAX-S Radiation-Tolerant FPGA |
| Programmable Technology | Antifuse (CMOS) |
| Speed Grade | -1 |
| Combinatorial CLB Delay (Max) | 0.930 ns |
| Package | 624-terminal Ceramic Grid Array (CGA) |
| Package Code | CG624 |
| Operating Temperature | -55C to +125C |
| Qualification / Screening | V grade (space screening) |
| Mounting Type | Surface Mount |
| Configuration | Live at power-up, single-chip |
| Embedded Memory | Embedded SRAM with FIFO control logic |
RTAX250S-1CG624V cg624 Pin Configuration Guide
Complete pinout information for RTAX250S-1CG624V (cg624 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX250S-1CG624V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX250S-1CG624V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control and Command Interfaces, Radiation-Environment Instrumentation, Launch Vehicle Avionics, Remote Sensing and Earth Observation Imagers, Spaceflight Engineering Development and Prototyping.
Satellite Payload Data Processing
The RTAX250S-1CG624V is widely used as the main data-handling FPGA on satellite payloads, where its 250,000-gate fabric and 2,816 CLBs implement packetizers, channelizers, and compression engines. Live-at-power-up antifuse configuration means the payload logic is functional the instant spacecraft power is applied, with no configuration readout delay and no configuration-memory upset risk in orbit. The embedded SRAM with FIFO control logic buffers high-rate instrument data before downlink formatting. Designers place the FPGA between sensor front ends and downlink modulators, and because the fabric is one-time programmable, the design is frozen and verified on commercial Axcelerator prototypes per application note AC170 before flight units are burned. The -1 speed grade (0.930 ns CLB delay) covers typical payload clock rates of tens to hundreds of MHz.
Recommended
Spacecraft Bus Control and Command Interfaces
Spacecraft on-board computers and bus controllers use the RTAX250S-1CG624V to glue together processors, MRAM/EEPROM memories, telemetry encoders, and 1553 or SpaceWire-style interfaces. The true single-chip form factor removes external configuration devices, improving reliability in the harshest mission phases such as launch and separation. Its -55C to +125C hermetic ceramic CGA package tolerates the thermal cycling of eclipse transitions, and the low static power suits eclipse-mode power budgets. The V-grade screening aligns with standard flight program flows. Because the fabric cannot lose configuration, watchdog resets restore function deterministically, an important property for command interface availability. Design teams typically implement redundant command decoders and chip-wide reset logic across the 4,224-cell fabric.
Recommended
Radiation-Environment Instrumentation
Scientific instruments that must operate through heavy-ion passes - space telescopes, particle detectors, and planetary probes - select the RTAX250S-1CG624V because its antifuse configuration fabric is inherently immune to configuration upset, unlike SRAM FPGAs that require constant scrubbing. The 250k-gate fabric implements detector readout pipelines, event triggers, and histogramming engines, while embedded SRAM FIFOs decouple bursty detector output from telemetry. The 0.930 ns maximum CLB combinatorial delay supports tight trigger-latency budgets. Hermetic CG624 ceramic packaging withstands vacuum and thermal stress. Teams validate logic on the commercial Axcelerator equivalent using the Microchip extender-board approach (AC170) before committing scarce flight units, keeping program schedule and screening budget under control.
Recommended
Launch Vehicle Avionics
Launch vehicle flight computers, stage sequencers, and telemetry muxes adopt the RTAX250S-1CG624V for its deterministic live-at-power-up behavior: avionics must be fully operational within milliseconds of power application with no boot image to load. The military -55C to +125C operating range and hermetic 624-terminal ceramic grid array package withstand launch vibration-induced thermal transients and hold board-level reliability. The antifuse fabric's immunity to configuration single-event upsets eliminates the need for external configuration scrubbers in short-duration missions, saving board area and mass. Designers partition sequencing state machines, redundancy voters, and PCM telemetry formatters across the 2,816 CLBs, with chip-wide reset providing a known-good recovery state.
Recommended
Remote Sensing and Earth Observation Imagers
Earth-observation camera chains use the RTAX250S-1CG624V between image sensor arrays and mass-storage units, implementing sensor timing generation, defect correction, and CCSDS-compliant frame formatting. The embedded SRAM with FIFO control logic provides line buffering for multi-tap CCD/CMOS sensors, while the 250k-gate fabric absorbs compression preprocessing that would otherwise burden the spacecraft processor. Low static power matters in sun-synchronous orbit where eclipse power is battery-supplied. Because image pipelines are timing-critical, teams close timing in Microchip Libero against the -1 speed grade's 0.930 ns CLB combinatorial delay. The same design can be accelerated on commercial Axcelerator silicon during algorithm bring-up, per the AC170 prototyping flow, before antifuse programming.
Recommended
Spaceflight Engineering Development and Prototyping
Before any RTAX250S-1CG624V flight unit is programmed, programs use the Microchip-validated prototyping path: application note AC170 targets the RTAX-S design at the equivalent commercial Axcelerator device, and extender boards map the commercial package onto the CG624 footprint so real I/O and board timing are exercised. Aldec's RTAX prototyping adaptors offer a reprogrammable flash-based (ProASIC3E) alternative for iterative debugging that one-time-programmable antifuse silicon cannot support. This two-stage flow catches functional and timing defects cheaply, reserving V-screened RTAX250S units for final flight builds. It also provides a regression platform that continues to serve qualification campaigns after the flight units are burned.
Recommended
Recommended Products Summary
Engineering reference data for RTAX250S-1CG624V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX250S-1CG624E | RTAX250SL-CG624V | RTAX250SL-1CG624B |
|---|---|---|---|---|
| Package | 624-terminal CGA (CG624) | 624-terminal CGA (CG624) - same | 624-terminal CGA (CG624) - same | 624-terminal CGA (CG624) - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 250,000 | 250,000 | 250,000 | 250,000 |
| CLBs / Cells | 2816 CLBs / 4224 cells | 2816 CLBs / 4224 cells | 2816 CLBs / 4224 cells (SL die) | 2816 CLBs / 4224 cells (SL die) |
| Speed Grade | -1 (0.930 ns CLB delay max) | -1 (0.930 ns CLB delay max) | Standard (see SL datasheet timing) | -1 |
| Screening Level | V grade | E grade (engineering) | V grade | B grade |
| Die Subfamily | RTAX-S | RTAX-S | RTAX-SL (radiation-enhanced) | RTAX-SL (radiation-enhanced) |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Configuration | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up |
Key Differentiators
- Single-chip live-at-power-up operation (vs SRAM-based space FPGAs (generic))
- Choice of screening grades in the same footprint (vs RTAX250S-1CG624E)
- Radiation-enhanced SL upgrade path (vs RTAX250SL-CG624V)
Design Notes
The RTAX250S uses one-time-programmable antifuse technology: there is no design iteration after programming. Complete all functional, timing, and radiation-margin verification using the commercial Axcelerator prototyping flow described in Microchip application note AC170, including extender boards that map the commercial package to the CG624 footprint, before ordering V-screened flight units. A burned flight unit with a logic bug cannot be reprogrammed - it is scrap with long lead-time replacement.
The CG624 ceramic grid array requires a controlled-expansion PCB stackup; ceramic package CTE differs significantly from standard FR-4, so use high-reliability laminate or intrapositioned copper planes for thermal cycling over mission life. Follow the RTAX-S datasheet power/ground ball assignment exactly: dedicate one via per power/ground pair where feasible, and place low-ESR decoupling at the die-side cluster groups. Verify reflow or hand-assembly profile against Microchip's space-grade assembly guidance, as column array inspection requires X-ray.
On a 624-ball space-grade package, route high-speed payload clocks first with length-matched series-terminated lines, and keep the segmentable clock networks within a single clock region when possible to minimize skew. For I/O leaving the FPGA toward radiation-sensitive circuits, add board-level latch-up protection per the RTAX-S datasheet I/O current limits. Re-run full timing analysis in Libero whenever substituting an SL die, since AC parameters differ slightly between RTAX-S and RTAX-SL.
Compliance Information
Space-grade hermetic ceramic packaging; radiation screening per Microchip V-grade flow. Environmental compliance declarations not stated in the provided web data.
