Microchip Technology

RTAX250S-1LG624B - Rad-Tolerant FPGA 250K Gates | Microchip

N.º de pieza: RTAX250S-1LG624B ✓ Activo
En stock Se envía en 1-3 días hábiles
1.5 V Vdss 624-Pin LGA (LG624), ceramic Package 649 MHz Speed Embedded SRAM with built-in FIFO control logic Memory
Desde $2020 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-09-02
Precios por volumen
Cant. Precio unitario Total
1 $2500 $2.500,00
10 $2380 $23.800,00
100 $2250 $225.000,00
500 $2130 $1.065.000,00
1.000 $2020 $2.020.000,00
ℹ️ Todos los precios están en USD

RTAX250S-1LG624B Descripción general

The Microchip Technology (Actel/Microsemi) RTAX250S-1LG624B is a radiation-tolerant FPGA from the RTAX-S family offering 250,000 equivalent system gates, 2816 logic cells, and up to 649 MHz system performance in a 624-pin ceramic LGA (LG624) package, operating from a 1.5V core supply at speed grade -1 with military screening.

A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of space: high total ionizing dose (TID), heavy-ion single-event effects (SEE), and proton exposure. Within the semiconductor hierarchy, the RTAX250S-1LG624B belongs to the RTAX-S family -> radiation-tolerant FPGA -> FPGA -> programmable logic IC, and is the space-flight counterpart of the commercial Axcelerator family from Microsemi.

Key features include single-chip, anti-fuse-based, live-at-power-up operation (no external configuration PROM needed, no configuration bitstream to upset), embedded SRAM blocks with built-in FIFO control logic, segmentable clock conditioning, and chip-wide highway routing. The -1 speed grade supports internal performance up to 649 MHz, and the CMOS 0.15um process with 1.5V core delivers low static power consumption, which is critical for solar- and battery-powered spacecraft.

Architecturally, the RTAX-S fabric combines patented antifuse interconnect with 3-input D-flip-flop-based logic modules, providing 100% routability and immunity to configuration memory upsets that plague SRAM-based FPGAs in orbit. The embedded FIFO control and chip-wide highway routing resources let designers implement high-throughput payload data paths with predictable timing.

Typical applications include satellite telemetry/command interfaces, payload data processing, orbital platform bus controllers, and launch-vehicle avionics, where the LG624 ceramic package provides hermetic, high-reliability mechanical and thermal integration.

Design tip: use the footprint-compatible Axcelerator prototyping flow (adaptor board plus EDIF netlist/pinout converter) to validate designs on commercial parts before committing to flight units.

This page synthesizes distributor inventory signals, drop-in alternatives, and practical design guidance not found in the manufacturer datasheet.

Alternativas directas para RTAX250S-1LG624B — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con RTAX250S-1LG624B (mismo factor de forma y huella) — difiere en Package, Configuration, Radiation Tolerance, Family, Equivalent System Gates.

Microchip Technology
Package: CG624, 624-pin ceramic column grid array
Configuration: Single-chip, live at power-up (no boot device required)
Equivalent System Gates: 2,000,000 gates
Comparar con RTAX250S-1LG624B →
Microsemi
Package: 624-ball ceramic CGA (CGS624)
Configuration: One-time programmable (OTP), live at power-up, single chip
Equivalent System Gates: 2000000
Comparar con RTAX250S-1LG624B →
Microchip Technology
Package: 624-terminal ceramic CGA (CG624)
Configuration: Live at power-up, single-chip (no external config storage)
Radiation Tolerance: Radiation-tolerant for space flight systems
Comparar con RTAX250S-1LG624B →
Microchip Technology
Package: 624-pin Ceramic Column Grid Array (CCGA-624)
Comparar con RTAX250S-1LG624B →
Microchip Technology
Package: 624-pin LGA
Configuration: Anti-fuse, live at power-up
Radiation Tolerance: Radiation-tolerant (space-flight qualified family)
Comparar con RTAX250S-1LG624B →
Microchip Technology
Package: CGA624 (LG624), 624-column ceramic column grid array
Configuration: Live at power-up, single chip, no boot PROM
Comparar con RTAX250S-1LG624B →
Microchip Technology
Package: 624-Pin LGA (LG624)
Configuration: Live-at-power-up, single chip
Radiation Tolerance: Radiation-tolerant (spaceflight qualified family)
Comparar con RTAX250S-1LG624B →
Microchip Technology
Package: 624-Pin LGA (LG624)
Radiation Tolerance: Radiation-tolerant (space-grade flow, V grade)
Comparar con RTAX250S-1LG624B →
Microchip Technology
Package: 624-Pin LGA (ceramic)
Family: RTAX-SL (Radiation-Tolerant FPGA)
Equivalent System Gates: 250,000
Comparar con RTAX250S-1LG624B →
Microchip Technology
Package: 624-terminal ceramic CGA (LG624), 1.270 mm terminal pitch
Family: RTAX-S/SL Radiation-Tolerant FPGA
Equivalent System Gates: 250,000 gates
Comparar con RTAX250S-1LG624B →
Microchip Technology
Package: 624-ball CCGA (CG624)
Radiation Tolerance: Radiation-tolerant (space-flight grade)
Family: RTAX-SL (Radiation-Tolerant FPGA)
Comparar con RTAX250S-1LG624B →
Microchip Technology
Package: 624-pin LGA
Radiation Tolerance: Radiation-tolerant (space flight use)
Comparar con RTAX250S-1LG624B →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

RTAX250SL-LG624B

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Microchip Technology
📦 624-Pin ceramic LGA (LG624)
RTAX-SL Radiation-Tolerant FPGA · 250,000 · 2816 · 4224 · 649 MHz · 0.15 um CMOS · 1.5 V · 624-pin LGA

✓ En stock

$2380 / unidad

Ver hoja de datos →

RTAX250SL-CG624B

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Microchip Technology
📦 624-Pin ceramic LGA (LG624)
RTAX-SL (Radiation-Tolerant FPGA) · 250000 gates · 2816 cells · 649 MHz · 0.930 ns max · 0.15 um antifuse · 1.5 V · 624-ball CCGA (CG624)

✓ En stock

$3950 / unidad

Ver hoja de datos →

RTAX250S-1LG624V

✅ Sustitución directa
Microchip Technology
📦 624-Pin ceramic LGA (LG624)
RTAX-S Radiation-Tolerant FPGA · 250000 gates · 2816 · 4224 · 248 · 1.5 V nominal · -1 · CGA624 (LG624), 624-column ceramic column grid array

✓ En stock

Consulte el precio

Ver hoja de datos →

RTAX250S-LG624V

✅ Sustitución directa
Microchip Technology
📦 624-Pin ceramic LGA (LG624)
4224 · 2816 · 250000 gates · 649 MHz · 0.15 um CMOS · 1.5 V · 248

✓ En stock

Consulte el precio

Ver hoja de datos →

RTAX250S-1LG624PROTO

✅ Sustitución directa
📦 624-Pin ceramic LGA (LG624)
same die, speed grade -1, and LG624 footprint but PROTO engineering-prototype flow - NOT for flight, development use only

📋 Alternativa de referencia (no en el catálogo)

RTAX250S-1LG624B Valores máximos y características eléctricas

Family RTAX-S Radiation-Tolerant FPGA
Equivalent System Gates 250000 gates
Logic Cells (Modules) 2816 cells
Registers / Logic Cells Total 4224 logic cells
User I/O 248 I/O
Core Supply Voltage 1.5 V
Maximum System Frequency 649 MHz
Process Technology 0.15 um CMOS
Speed Grade -1
Encapsulado 624-Pin LGA (LG624), ceramic
Temperatura de funcionamiento -55C to +125C
Configuration Anti-fuse, live at power-up (single chip)
Embedded Memory Embedded SRAM with built-in FIFO control logic
Radiation Tolerance Radiation-tolerant (RTAX-S class, per Microchip RTAX-S datasheet)
Tipo de montaje Surface Mount
Program Numbering B = Military program-level screening

Guía de configuración de pines de RTAX250S-1LG624B 624-pin lga (lg624), ceramic

Configuración de pines para RTAX250S-1LG624B (encapsulado 624-pin lga (lg624), ceramic). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 624-pin lga (lg624), ceramic para RTAX250S-1LG624B

No hay datos detallados de patillaje disponibles para RTAX250S-1LG624B.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

RTAX250S-1LG624B es adecuado para 6 aplicacións: Satellite Telemetry and Command (TM/TC) Interface, Payload Data Processing and Formatting, Onboard Bus Controller and Platform Avionics, Launch Vehicle Electronics, Radiation-Hardened Glue Logic Replacement, Space Instrumentation and Sensor Front-End Control.

🛰️

Satellite Telemetry and Command (TM/TC) Interface

The RTAX250S-1LG624B fits TM/TC controller roles because its anti-fuse configuration is live at power-up and immune to configuration-memory upsets, so the command chain is functional immediately after separation events without relying on an external PROM that could be corrupted in orbit. With 2816 logic cells and 248 user I/O, it implements CCSDS-style frame formatting, command decoders, and redundant UART/MIL-STD-1553-style interfaces simultaneously on one chip. The 1.5V core on a 0.15um process keeps static power low, easing power-budget constraints on eclipse-mode operation. Ceramic LG624 hermetic packaging rated -55C to +125C supports spacecraft thermal-vacuum environments.

🖥️

Payload Data Processing and Formatting

For payload data path control, the RTAX250S-1LG624B provides embedded SRAM with built-in FIFO control logic, letting designers implement elastic buffers between high-rate payload sensors and downlink formatters without external FIFO chips. Segmentable clocks and chip-wide highway routing support parallel data streams with predictable timing at speed grade -1 (up to 649 MHz internal performance class). The single-chip anti-fuse architecture eliminates configuration time after power-up, which matters for imaging payloads with short acquisition windows. Its 624-pin ceramic LGA supplies sufficient I/O (248 user pins) for wide data buses while maintaining hermeticity in vacuum.

✈️

Onboard Bus Controller and Platform Avionics

Spacecraft platform avionics need logic that works the moment the bus comes alive. The RTAX250S-1LG624B is live at power-up and requires no configuration sequence, making it ideal for bus arbiters, housekeeping controllers, and watchdog logic that must survive brownout and single-event upsets of other components. Its 250K-gate fabric is large enough to integrate a soft control core plus redundant interface state machines, while 1.5V core operation minimizes quiescent power in cruise mode. Military program-level screening (B suffix) and -55C to +125C ceramic LG624 construction align with platform avionics qualification flows.

✈️

Launch Vehicle Electronics

Launch-environment electronics demand extreme vibration tolerance and deterministic behavior within seconds of ignition. The RTAX250S-1LG624B contributes a hermetic 624-pin ceramic LGA that withstands mechanical stress better than organic-substrate packages, and its anti-fuse interconnect is static - no reconfiguration, scrubbing, or boot latency that could delay readiness. The 649 MHz-class fabric speed and -1 grade handle flight-sequence state machines, safing logic, and instrumentation interfaces. Operation from -55C to +125C covers booster thermal transients. Because it is single-chip, board area and mass are saved versus FPGA-plus-PROM solutions, an advantage on mass-critical stages.

🧩

Radiation-Hardened Glue Logic Replacement

Many space boards replace dozens of rad-hard ASSP glue functions (decoders, buffers, registers) with one RTAX250S-1LG624B. With 2816 logic cells and 248 user I/O, the device integrates address decoding, bus formatting, and sequencing logic while cutting component count, solder joints, and board mass. Anti-fuse configuration means the glue logic is correct at power-up and cannot be corrupted by SEUs in configuration memory - a decisive advantage over SRAM FPGAs in this role. The 1.5V, 0.15um CMOS fabric draws low static current. The LG624 footprint leaves I/O headroom for board-to-board interfaces and future netlist growth.

🔬

Space Instrumentation and Sensor Front-End Control

Scientific instruments - star trackers, spectrometers, particle detectors - need deterministic timing and clean clock segmentation close to the sensor. The RTAX250S-1LG624B provides segmentable clock conditioning and chip-wide highway routing to distribute sampling clocks with skew control, while embedded SRAM FIFOs absorb burst sensor data. Its 649 MHz-class internal fabric speed supports time-to-digital counting and coincidence logic implemented directly in fabric. The hermetic ceramic LG624 package with -55C to +125C rating suits instrument thermal cycles, and low 1.5V-core power reduces self-heating that would add sensor noise on thermally constrained optical benches.

What is the RTAX250S-1LG624B?
The RTAX250S-1LG624B is a radiation-tolerant FPGA from Microchip Technology (Actel/Microsemi) in the RTAX-S family, offering 250,000 equivalent system gates, 2816 logic cells, and 248 user I/O in a 624-pin ceramic LGA (LG624) package. It runs from a 1.5V core on a 0.15um CMOS process at speed grade -1 and is screened for military program-level use (B suffix). Per the Microchip RTAX-S datasheet, RTAX-S FPGAs are single-chip, anti-fuse devices that are live at power-up, making them a standard choice for space-flight electronics.
What are the key specifications of RTAX250S-1LG624B that engineers should know?
Key specifications are: 250K equivalent system gates, 2816 logic cells (4224 total logic cells per distributor data), 248 user I/O, 1.5V core supply, 649 MHz maximum system performance, 0.15um CMOS process, -1 speed grade, and a 624-pin ceramic LGA package rated -55C to +125C. According to the Microchip RTAX-S/SL datasheet, the family also provides embedded SRAM with FIFO control logic, segmentable clocks, and chip-wide highway routing, with live-at-power-up anti-fuse configuration that needs no external boot PROM.
Why is the RTAX250S-1LG624B suitable for space applications?
The RTAX250S-1LG624B is suitable for space because the RTAX-S family is radiation-tolerant: it withstands total ionizing dose and single-event effects that would upset SRAM-based FPGAs. Its anti-fuse interconnect cannot suffer configuration-memory upsets, and it is live at power-up with no configuration PROM that could be corrupted in orbit. The ceramic LG624 package is hermetic and rated -55C to +125C. Per Microchip product page, these features make RTAX-S the FPGA of choice for space-flight systems such as satellite payloads and telemetry/command electronics.
What is the difference between RTAX250S and RTAX250SL?
The RTAX250SL is an enhanced variant of the RTAX250S within the same RTAX-S/SL family, sharing the same 250K-gate fabric, 2816 logic cells, and LG624/CQ208 package options. Per the Microchip RTAX-S/SL datasheet (ds2169), the SL version improves on the original S with enhanced I/O features while remaining architecture- and footprint-compatible, so designs can migrate between S and SL devices on the same board with netlist and pinout conversion. Always verify per-pin electrical parameters against the latest RTAX-S/SL datasheet revision before dropping in an SL part.
Can RTAX250SL-LG624B replace RTAX250S-1LG624B as a drop-in?
Yes, RTAX250SL-LG624B is generally used as a footprint-compatible drop-in for RTAX250S-1LG624B because both use the identical 624-pin ceramic LGA package and the same 250K-gate RTAX-S/SL fabric. Per the Microchip RTAX-S/SL datasheet, the migration path uses an EDIF netlist and pinout converter for easy adaptation, and designs are typically prototyped on footprint-compatible boards. Because the SL variant has enhanced I/O, verify DC/AC I/O parameters and any radiation screening requirements (SL vs S screening levels) against your program specification before substitution.
What is the difference between RTAX250S-1LG624B and RTAX250S-1LG624V?
The B and V suffixes denote different screening/qualification flows for the same RTAX250S-1LG624 die and package. The B-graded part carries program-level (military-style) screening, while the V-graded part follows a different quality flow, per Microchip ordering information in the RTAX-S/SL datasheet. Electrically and pin-wise the two are identical in the same LG624 ceramic LGA package, so the choice is driven by your program's parts-screening requirements (e.g., DLA drawing requirements) rather than by circuit performance. Confirm the exact screening definition in the current Microchip ordering guide.
What is the best drop-in replacement for RTAX250S-1LG624B?
The best drop-in replacement is RTAX250SL-LG624B (Microchip, same 624-pin ceramic LGA footprint, same 250K-gate fabric, enhanced I/O). Alternatives in the same footprint include RTAX250SL-CG624B and same-die screening variants RTAX250S-1LG624V and RTAX250S-LG624V. According to the Microchip RTAX-S/SL datasheet, the family's antifuse architecture and footprint-compatible prototyping methodology (adaptor board plus netlist/pinout converter) make same-package migration straightforward, but radiation screening levels should be matched to your flight-program requirements.
How can I prototype a design intended for RTAX250S-1LG624B?
Microchip (formerly Microsemi) specifies a footprint-compatible prototyping methodology for RTAX-S devices. Per the RTAX-S/SL datasheet and the application note 'Prototyping for RTAX-S and RTAX-SL Devices', you place the commercial Axcelerator equivalent (AX250) on a footprint-compatible adaptor board, then convert the EDIF netlist and pinout for the RTAX target. For this 624-pin device, the LG624 footprint is supported by this flow, letting timing and functional verification occur on commercial silicon before flight units are programmed. Vendor prototyping tools such as Aldec RTAX adaptors support related packages like CQ208.
What is the price of RTAX250S-1LG624B?
The RTAX250S-1LG624B is a high-reliability space-grade FPGA with pricing available mainly on quote, as of 2026-09-02. Radiation-tolerant, military-screened devices of this density typically sell in the low thousands of US dollars per unit through authorized channels; XAIPART list tiers start at approximately $2,500.00 for qty 1, declining with volume to about $2,020.00 at qty 1000 (estimated reference tiers - request a formal quote). Because flight parts carry lot-based certification, final price depends on screening documentation, date codes, and availability. Contact XAIPART for a current quotation.
Where to buy RTAX250S-1LG624B online?
The RTAX250S-1LG624B can be requested via XAIPART's quote form, and is listed by specialty distributors such as Jotrin Electronics, FPGAkey, and FINDFPGA (which showed 1 unit in stock at time of listing). It is not a standard stock line at volume distributors like DigiKey or Mouser because it is a flight-grade part; orders usually go through broker or factory (Microchip) channels with lead times influenced by lot screening. As of 2026-09-02, availability is limited - request a quote and confirm date codes and screening documentation before committing the part to a build.
What is the lead time for RTAX250S-1LG624B?
Lead time for RTAX250S-1LG624B is typically quote-based; flight-grade RTAX-S parts ordered from the factory often carry multi-month lead times because they require program-level screening and sometimes ITAR-controlled logistics. Broker inventory (e.g., FINDFPGA listed 1 unit as of 2026-09-02) can ship in days, but date-code and screening verification is essential. For new production, plan for 16-52 weeks of factory lead time depending on quantity and screening level. Request a formal quote with your target delivery date so XAIPART can confirm real-time availability and lot documentation.
Is RTAX250S-1LG624B still in production?
Yes, the RTAX250S-1LG624B is part of Microchip's actively supported RTAX-S radiation-tolerant FPGA line; the RTAX250S product page on microchip.com remains live and the family datasheet (RTAX-S/SL and RTAX-DSP, document ds2169 series) is actively published. RTAX-S is a mature, long-lifecycle product family designed for decades-long space programs, and Microchip provides DLA-qualified drawing parts across this portfolio. As of 2026-09-02 there is no end-of-life announcement; lifecycle_status is active. Always confirm current ordering status with Microchip or your distributor before a new design-in.
Where to download the RTAX250S-1LG624B datasheet PDF?
Download the RTAX250S datasheet from Microchip at https://ww1.microchip.com/downloads/aemdocuments/documents/fpga/ProductDocuments/DataSheets/rtaxs_ds2169_v18.pdf - this is the 'RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs' datasheet covering the RTAX250S in all packages including LG624. The same document is mirrored by Mouser. The PDF covers features, package options, ordering information, electrical characteristics by speed grade (-1), and the footprint-compatible prototyping methodology. Mirror listings exist at datasheet4u.com and alldatasheet.com for older revisions of the Actel-era document.
Where can I find the RTAX250S-1LG624B pinout?
The per-pin assignment for the RTAX250S-1LG624B is defined in the RTAX-S/SL datasheet package tables and the Actel/Microchip Designer software package files for the LG624 ceramic LGA footprint. Because a 624-pin package has hundreds of user-configurable I/O (248 user I/O) plus power, ground, JTAG, and programming pins, the pinout is presented as package/ball tables rather than a simple diagram, and final I/O placement is user-defined in Libero SoC. Refer to the RTAX-S/SL datasheet (ds2169) package section and the Libero SoC I/O attribute editor for pin-level detail.
RTAX250S-1LG624B vs Xilinx Virtex radiation-tolerant FPGA - which for satellite design?
For the classic satellite FPGA trade, the RTAX250S-1LG624B (antifuse) wins on configuration robustness: live-at-power-up, no external PROM, and immunity to configuration-memory upsets from heavy ions. SRAM-based space FPGAs (e.g., Xilinx Virtex-QV class) win on reprogrammability, larger fabric, and embedded DSP resources, but need Triple-Module-Redundancy and configuration scrubbing. Per the Microchip RTAX-S page, RTAX-S offers low power, true single-chip form factor, and live-at-power-up operation, making it preferred for critical bus-controller and command functions where configuration integrity cannot be compromised.
Is RTAX250S-1LG624B RoHS compliant?
The RoHS status of RTAX250S-1LG624B is [DATA_NEEDED: RoHS status] from the provided distributor data and should be confirmed before ordering. Note, however, that hermetically sealed ceramic LGA space-grade parts are frequently exempt from RoHS because lead is used in hermetic lid-seal solder and the parts fall under the aerospace/defense exemption (RoHS exemption category for lead in high-temperature solder and military/aerospace applications). Request the Microchip product compliance certificate with your quote to get the authoritative, lot-applicable answer for flight documentation.
What companion power and configuration parts pair with RTAX250S-1LG624B?
Although RTAX-S is live at power-up (no configuration PROM), the 1.5V core and 2.5V/3.3V I/O rails need clean, sequenced supplies, and most designs add JTAG programming access. Common companions on RTAX-S boards include LDO or DC-DC power modules for the 1.5V core, level-compatible oscillator sources feeding the segmentable clock resources, and commercial Axcelerator (AX250) devices on the footprint-compatible prototyping adaptor board for pre-flight validation. Per the RTAX-S/SL datasheet, the prototyping flow with an EDIF netlist and pinout converter is the recommended pairing methodology during development.

Datos de referencia de ingeniería para RTAX250S-1LG624B — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose RTAX250S-1LG624B when your flight program requires the original RTAX-S (non-SL) I/O specification with military program-level B screening in the 624-pin ceramic LGA footprint - this is the conservative choice for heritage designs and DLA-drawing-driven programs. Choose RTAX250SL-LG624B or RTAX250SL-CG624B if your design benefits from the SL enhanced I/O features; they occupy the identical LG624 footprint and migrate via the EDIF netlist/pinout converter. Choose RTAX250S-1LG624V if your program accepts the V screening flow instead of B. Use RTAX250S-1LG624PROTO strictly for development - it is not flight hardware. Trade-offs: SL parts offer I/O enhancements but add a (small) migration step; V screening may be easier to source; PROTO is cheapest and fastest but flight-forbidden. All options share the same 250K-gate fabric, 1.5V core, and -55C to +125C ceramic package.

Comparación con alternativas

Parámetro Este producto RTAX250SL-LG624B RTAX250SL-CG624B RTAX250S-1LG624V RTAX250S-LG624V RTAX250S-1LG624PROTO
Package 624-Pin ceramic LGA (LG624) 624-Pin ceramic LGA (LG624) - same 624-Pin ceramic LGA (LG624) - same 624-Pin ceramic LGA (LG624) - same 624-Pin ceramic LGA (LG624) - same 624-Pin ceramic LGA (LG624) - same
Brand Microchip Technology (Actel/Microsemi) Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Equivalent System Gates 250000 gates 250000 gates 250000 gates 250000 gates 250000 gates 250000 gates
Logic Cells 2816 cells 2816 cells 2816 cells 2816 cells 2816 cells 2816 cells
User I/O 248 I/O 248 I/O (enhanced I/O features) 248 I/O (enhanced I/O features) 248 I/O 248 I/O 248 I/O
Core Supply Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Screening Flow B (military program-level) B (military program-level) C (program screening) V V PROTO (engineering only, not flight)
Operating Temperature -55C to +125C -55C to +125C -55C to +125C -55C to +125C -55C to +125C -55C to +125C

Diferenciadores clave

  • Single-chip live-at-power-up anti-fuse architecture (frente a RTAX250SL-LG624B)
  • Military program-level B screening (frente a RTAX250S-1LG624V)
  • Flight-qualified silicon (frente a RTAX250S-1LG624PROTO)

Notas de diseño

The LG624 ceramic LGA requires a carefully specified land pattern and flatness-controlled PCB because ceramic LGA warpage over temperature can stress solder joints. Follow the RTAX-S/SL datasheet (ds2169) land-pattern recommendations for the LG624 footprint, and support inspection via X-ray under the full-array footprint since perimeter optical inspection cannot verify inner-row joints. Plan test access: with 248 user I/O on 624 pads, reserve boundary-scan (JTAG) chains as the primary electrical test strategy, since bed-of-nails probing under an LGA is impractical.

Power the 1.5V core, 2.5V and 3.3V I/O banks with sequenced, low-noise rails and decouple each supply with bulk plus high-frequency ceramic capacitance at the package corners, per the RTAX-S/SL datasheet power guidelines. Although RTAX-S is live at power-up, supply ramp monotonicity still matters for I/O precharge behavior. Estimated: because the antifuse fabric has low static power, most consumption in a 250K-gate design is dynamic and I/O-driven - budget based on your actual toggle rates rather than worst-case gate count.

Use the official footprint-compatible prototyping methodology: prototype on commercial Axcelerator (AX250) silicon via an adaptor board and convert the EDIF netlist and pinout for the RTAX250S target, per the application note 'Prototyping for RTAX-S and RTAX-SL Devices'. Do not assume the PROTO-suffix part (RTAX250S-1LG624PROTO) is flight-eligible - it is an engineering flow device. When substituting SL parts for S parts, re-verify I/O DC/AC parameters and screening documentation against your program's DLA/drawing requirements before release.

Información de cumplimiento

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Libre de plomo
Unknown
Libre de halógenos
Unknown
Minerales en conflicto
Unknown

Space-grade hermetic ceramic LGA part; RoHS/REACH status not stated in provided data - hermetic aerospace parts are typically covered by aerospace/defense exemptions. Request Microchip compliance certificate with order.

Datos verificados el: 2026-09-02 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

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