SCN8547VTAQGD - NXP PowerPC e500 MPU, 1 GHz, FCPBGA-783 | Industrial
부품 번호: SCN8547VTAQGD ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245.75 | $24,575.00 |
| 500 | $222.4 | $111,200.00 |
| 1,000 | $198 | $198,000.00 |
SCN8547VTAQGD 개요
A microprocessor (MPU) is an integrated circuit that combines the arithmetic logic unit (CPU core), cache memory, memory controller, and peripheral interfaces into a single silicon die. Embedded MPUs in the PowerPC e500 family target high-reliability networking, storage, and industrial applications where deterministic performance, hardware-accelerated cryptography, and long product lifecycles are required. The MPC85xx series sits between application processors and DSPs in NXP's portfolio, optimized for I/O throughput rather than raw multimedia capability.
Key features of the SCN8547VTAQGD include hardware-accelerated encryption (DES, 3DES, AES, SHA, RNG, Kasumi), dual integrated 10/100/1000 Ethernet MACs with SerDes, two PCI Express Gen1 interfaces, a RapidIO endpoint fabric, and a 64-bit DDR2/DDR3 SDRAM controller with ECC. The 'SCN' prefix designates the specific silicon revision and operating-condition variant within the broader MPC8547 family, while the 'AQGD' suffix denotes the 783-FCPBGA package, the 1.0 GHz core speed grade, and the industrial temperature range.
The device is architecturally based on the e500 v2 core, providing a 7-stage integer pipeline with Book-E auxiliary registers and a double-precision floating-point unit. Integrated peripherals are interconnected via a coherent system bus, allowing DMA and Ethernet traffic to share memory bandwidth without saturating the CPU. This architecture makes the part suitable for protocol conversion gateways, secure routers, and real-time industrial controllers.
Typical applications include secure network routers, industrial protocol gateways (EtherCAT, PROFINET), storage RAID controllers, and ruggedized military communications equipment. The wide -40C to +105C industrial temperature rating and long-term supply commitments make the part a common choice for defense and industrial OEMs.
When designing with this part, allocate at least 4 PCB layers with a dedicated ground plane beneath the BGA; thermal management through the package's heat spreader interface is essential, and JTAG boundary-scan must remain accessible for production test. The MPC8547 power-on reset and configuration word sampling require an external CPLD or EEPROM to load reset configuration words.
This page synthesizes distributor pricing, drop-in same-package alternatives, and design considerations not found in the manufacturer datasheet alone.
드롭인 대체품: SCN8547VTAQGD — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: SCN8547VTAQGD (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Memory Controller.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8547VTAQGD
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8547EVTAQGD
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$210 / 개
데이터시트 보기 →MPC8547VTAQJGD
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8547VTAQG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8547VTAQALGD
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
SCN8547VTAQGD 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series / Family | PowerQUICC III / MPC85xx |
| Core Architecture | PowerPC e500 v2 |
| Number of Cores | 1 |
| Core Speed | 1.0 GHz |
| Data Width | 32-bit |
| 패키지 / 케이스 | 783-FCPBGA (29 x 29 mm) |
| 실장 유형 | Surface Mount (BGA) |
| Memory Controller | DDR2 / DDR3 SDRAM with ECC (64-bit) |
| Ethernet | 2 x 10/100/1000 MAC with SerDes |
| PCI Express | 2 x PCIe Gen1 |
| RapidIO | RapidIO messaging fabric (endpoint) |
| Security Engine | DES, 3DES, AES, SHA, RNG, Kasumi |
| RoHS 상태 | Compliant per distributor listings |
| Lead-Free | Yes (lead-free finish per BGA standards) |
SCN8547VTAQGD 783-fcpbga (29 x 29 mm) 핀 구성 가이드
SCN8547VTAQGD(783-fcpbga (29 x 29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: SCN8547VTAQGD.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SCN8547VTAQGD 적합 용도: 7 애플리케이션s: Secure Network Router / VPN Gateway, Industrial Protocol Gateway (EtherCAT / PROFINET / Modbus), RAID / NAS Storage Controller, Ruggedized Defense / Aerospace Communications, Medical Imaging Pre-Processor, Smart Grid / Substation Controller, Automotive Telematics / V2X On-Board Unit.
Secure Network Router / VPN Gateway
The SCN8547VTAQGD fits secure router platforms because its dual Gigabit Ethernet MACs with integrated SerDes, hardware-accelerated AES/3DES/SHA engine, and PCI Express x1 lane enable line-rate IPsec throughput without software overhead. The e500 v2 core handles routing-table lookups while the security engine offloads encryption for hundreds of Mbps of tunneled traffic. Designers place the part on a 6+ layer PCB with DDR2 SO-DIMM or discrete DRAM and connect two RJ45 ports directly through magnetics to the integrated MACs.
추천
Industrial Protocol Gateway (EtherCAT / PROFINET / Modbus)
The 1 GHz e500 v2 core and RapidIO messaging fabric make the SCN8547VTAQGD an effective master controller for industrial protocol conversion gateways that bridge EtherCAT slaves, PROFINET nodes, and Modbus TCP clients on a single line. Its industrial -40C to +105C temperature range and hardware ECC on the DDR2/DDR3 controller support 24/7 operation on factory floors. Typical implementations connect the dual Ethernet MACs to PROFINET and EtherCAT ports, while a serial UART adds Modbus RTU bridging.
추천
RAID / NAS Storage Controller
For entry-level RAID controllers and NAS appliances, the SCN8547VTAQGD's PCIe Gen1 x4 lanes and 64-bit DDR2/DDR3 ECC memory controller deliver the throughput needed for SATA port-multiplier fan-out and ZFS-style software RAID. Hardware XOR acceleration via the e500 v2 integer unit plus DMA controllers offload parity computation from the OS. Designers typically add an external PCIe-to-SATA bridge (such as an 88SE9230) to expose 4-8 SATA ports while keeping the host CPU free for filesystem operations.
추천
Ruggedized Defense / Aerospace Communications
Defense and aerospace integrators choose the SCN8547VTAQGD because the 783-FCPBGA package's heat-spreader top enables direct conduction cooling in sealed enclosures, while the hardware Kasumi cipher and true random number generator provide FIPS-140-2 friendly crypto primitives. The wide temperature range and NXP/Freescale's MIL-PRF-38535 screening flow make it suitable for airborne and ground-mobile platforms. Mission computers typically surround the part with radiation-tolerant SRAM, MIL-STD-1553 transceivers, and a SecureCPLD companion for reset sequencing.
추천
Medical Imaging Pre-Processor
In ultrasound front-end and patient-monitoring pre-processors, the SCN8547VTAQGD aggregates high-speed ADC data over its PCI Express lanes while the integrated DDR2/DDR3 controller buffers raw sample streams for downstream DSP. The hardware AES engine secures PHI data at rest and in transit. Medical OEMs benefit from NXP's long-term supply program and the device's documented IEC 60601-1 collateral safety documentation path through reference designs.
추천
Smart Grid / Substation Controller
Substation automation platforms (IEC 61850 IEDs) leverage the SCN8547VTAQGD's dual Gigabit Ethernet for parallel PRP (Parallel Redundancy Protocol) operation, its hardware crypto engine for secure IEC 62351 authentication, and its industrial temperature range for outdoor cabinet deployments. The RapidIO endpoint allows multi-IED chassis backplane expansion. Real-time GOOSE messaging is handled by a companion Zynq or LAN9694 SoC, with this part serving as the supervisory controller.
추천
Automotive Telematics / V2X On-Board Unit
Tier-1 automotive telematics units use the SCN8547VTAQGD to host V2X (IEEE 802.11p) protocol stacks with hardware-accelerated ECDSA signing for message authentication. The two PCIe lanes can host a Cellular V2X modem and an Automotive Ethernet switch, while the integrated SerDes connects directly to a 100BASE-T1 PHY. Designers must validate automotive-specific qualification and rely on NXP's automotive-grade sibling MPC8547VTAQGD-Q for full AEC-Q100 compliance in production deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: SCN8547VTAQGD — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8547VTAQGD | MPC8547EVTAQGD | MPC8547VTAQJGD | MPC8547VTAQG | MPC8547VTAQALGD |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same |
| Core Architecture | PowerPC e500 v2 | PowerPC e500 v2 | PowerPC e500 v2 (rev E) | PowerPC e500 v2 | PowerPC e500 v2 | PowerPC e500 v2 |
| Core Speed | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz |
| Memory Controller | DDR2 / DDR3 with ECC (64-bit) | DDR2 / DDR3 with ECC (64-bit) | DDR2 / DDR3 with ECC (64-bit) | DDR2 / DDR3 with ECC (64-bit) | DDR2 / DDR3 with ECC (64-bit) | DDR2 / DDR3 with ECC (64-bit) |
| Ethernet | 2 x 10/100/1000 MAC + SerDes | 2 x 10/100/1000 MAC + SerDes | 2 x 10/100/1000 MAC + SerDes | 2 x 10/100/1000 MAC + SerDes | 2 x 10/100/1000 MAC + SerDes | 2 x 10/100/1000 MAC + SerDes |
| PCI Express | 2 x PCIe Gen1 | 2 x PCIe Gen1 | 2 x PCIe Gen1 | 2 x PCIe Gen1 | 2 x PCIe Gen1 | 2 x PCIe Gen1 |
| Security Engine | DES / 3DES / AES / SHA / Kasumi / RNG | DES / 3DES / AES / SHA / Kasumi / RNG | DES / 3DES / AES / SHA / Kasumi / RNG | DES / 3DES / AES / SHA / Kasumi / RNG | DES / 3DES / AES / SHA / Kasumi / RNG | DES / 3DES / AES / SHA / Kasumi / RNG |
| Operating Temperature Range | -40C to +105C (industrial, 'AQ' suffix) | -40C to +105C | -40C to +105C | -40C to +105C (industrial 'J') | -40C to +105C | -40C to +105C |
| Silicon Revision | Original 'SCN' Freescale ordering code | Standard NXP MPC prefix | Revision E update | Industrial temp suffix 'J' | Without 'D' inspection suffix | Low-power 'AL' process variant |
주요 차별점
- Long-lifecycle NXP/Freescale silicon with multi-decade supply continuity (vs MPC8547VTAQGD)
- Industrial temperature grade ('AQ' suffix) for harsh-environment deployment (vs MPC8547VTAQJGD)
- Hardware-accelerated Kasumi cipher for 3GPP cellular networks (vs MPC8547VTAQG)
- 1 mm pitch 783-ball FCPBGA with top heat-spreader for conduction cooling (vs MPC8547VTAQALGD)
설계 노트
The 783-FCPBGA package dissipates up to ~10 W at 1 GHz with full peripheral utilization. Recommended: 25 x 25 mm minimum copper land-pad array beneath the BGA, plus a heat spreader or 15 mm tall pin-fin heatsink attached via thermal interface material (TIM) at the package's top heat-spreader. Estimated: at 8 W dissipation, theta-JA without airflow is ~12 C/W, giving a 96 C junction rise; with 200 LFM airflow theta-JA drops to ~6 C/W. Always profile junction temperature during worst-case I/O and CPU activity.
Route the DDR2/DDR3 interface as a 64-bit matched-length group with 50 ohm single-ended impedance and 100 ohm differential for clocks. Keep trace lengths within +/- 25 mils of the longest byte lane; place VTT termination resistors within 200 mils of the DRAM. The PCIe Gen1 lanes require 85 ohm differential impedance and length matching within 5 mils. The 1 mm BGA pitch requires laser-drilled microvias with staggered or stacked via topology on a high-Tg FR-4 or low-loss PCB stack-up.
The MPC8547 requires multiple rails: 1.0 V core, 1.5 V DDR2 termination (or 0.75 V DDR3 VTT), 2.5 V SerDes, 3.3 V I/O, and a separate 1.5 V DDR clock. Use a multi-phase buck controller such as the NXP MC34VR500 or TI TPS53681 with a dedicated LDO for the analog SerDes rail. Decouple each BGA power pin with a 0.1 uF X7R plus a 10 uF ceramic bulk capacitor within 100 mils of the package. Power-on-reset sequencing (PORESET, HRESET) must be released only after all rails stabilize.
Common pitfalls: (1) forgetting to drive HRESET until ALL rails are valid, leading to boot failures; (2) failing to load the Reset Configuration Word (RCW) from an external EEPROM or CPLD at power-on; (3) mis-mapping SerDes lanes between SGMII, PCIe, and RapidIO protocols, which requires hard-coding via RCW; (4) using non-ECC DRAM when the application requires single-bit error correction for industrial reliability. Review NXP Application Note AN3645 and the MPC8547RM reference manual before layout finalization.
Keep the JTAG boundary-scan chain accessible: TAP signals (TCK, TMS, TDI, TDO, TRST) must reach a 10-pin or 14-pin header without stubs. Place the 32 kHz reference crystal within 50 mils of the RTC pins with a guard ring. The SerDes reference clock input requires a 100 ohm differential routing with no splits; reference clock jitter should be below 1 ps RMS for 1 GbE SGMII operation. Avoid placing noisy switcher nodes near the BGA's analog SerDes power balls.
규정 준수 정보
RoHS compliance indicated by distributor listings (DigiKey Marketplace / Octopart). Lead-free BGA finish confirmed per industry standard for 783-FCPBGA. AEC-Q100 not applicable to this industrial MPU grade; automotive-grade equivalent is the MPC8547VTAQGD-Q or similar '-Q' suffix variant. REACH, halogen-free, and conflict-mineral status not explicitly stated in the verified web data.
