SPC5746BSK1MKU2 vs SPC5645SF1VVU Comparación
Comparación detallada lado a lado de SPC5746BSK1MKU2 por NXP Semiconductors y SPC5645SF1VVU por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
SPC5746BSK1MKU2 - 120MHz 32-bit Automotive MCU 3MB | NXP
SPC5746BSK1MKU2 ✓ ActivoNXP Semiconductors
SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP
SPC5645SF1VVU ✓ ActivoComparación de especificaciones
| Parámetro | SPC5746BSK1MKU2 | SPC5645SF1VVU |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,25 | $27,10 |
| Core Processor | e200z4 (Power Architecture) | — |
| Core Size | 32-bit | — |
| Number of Cores | 1 (single core) | — |
| Frecuencia de reloj máxima | 120 MHz | 125 MHz |
| Flash Memory | 3 MB (3M x 8) | — |
| Data RAM Size | 384 kB | — |
| ADC Resolution | 10 bit, 12 bit | — |
| Number of I/Os | 129 I/O | — |
| Supply Voltage (Core) | 1.2 V to 1.32 V | — |
| Ancho del bus de datos | 32 bit | 32-bit |
| Connectivity | FlexRay | — |
| Temperatura de funcionamiento | -40C to +125C | — |
| Qualification | Automotive Qualified | — |
| Encapsulado / Carcasa | LQFP-176 (24x24 mm) | 416-PBGA (27x27 mm, 1.0 mm pitch) |
| Estilo de montaje | SMD/SMT | — |
| Product Family | MPC574xB/C/G (SPC57xx) | — |
| Moisture Sensitivity | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Core Architecture | — | Power Architecture e200z4d (dual-core lockstep option) |
| Program Memory Size | — | 2 MB Flash |
| Program Memory Type | — | Flash with ECC |
| SRAM Size | — | [DATA_NEEDED: SRAM size in KB] |
| Tensión de alimentación | — | 3.3 V / 5 V tolerant I/O |
| Rango de temperatura de funcionamiento | — | -40 C to +105 C |
| Tipo de montaje | — | Surface Mount |
| AEC-Q100 Qualification | — | Yes (Automotive Grade) |
| Functional Safety | — | Targeting ASIL-D (dual-core lockstep) |
| CAN Controllers | — | Dual CAN 2.0B (FlexCAN) |
| FlexRay | — | Yes, dual-channel FlexRay module |
| Ethernet | — | [DATA_NEEDED: Ethernet MAC availability] |
| Graphics Accelerator | — | Yes, integrated GFXPU for TFT cluster |
| ADC | — | 12-bit ADC, multi-channel |
| Timers | — | eMIOS unified channels |
| Debug Interface | — | JTAG / Nexus 5001 (Level 3 trace) |
| Process Technology | — | 90 nm CMOS |
| JEDEC MSL | — | MSL3 (per PBGA JEDEC J-STD-020) |