TDF8546TH/N2 - 4x45W BTL Class-AB Car Audio Amplifier | NXP
N.º de pieza: TDF8546TH/N2 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.58 | $75,80 |
| 100 | $6.71 | $671,00 |
| 500 | $5.95 | $2.975,00 |
| 1.000 | $5.3 | $5.300,00 |
TDF8546TH/N2 Descripción general
What is a quad BTL Class-AB automotive amplifier? A BTL (Bridge-Tied Load) audio amplifier drives each speaker differentially across two outputs, doubling the voltage across the load and quadrupling the achievable output power versus a single-ended topology for a given supply rail. The Class-AB output stage combines bipolar output transistors biased to minimize crossover distortion while preserving high efficiency at moderate output levels, making it the long-standing industry choice for in-vehicle audio. NXP's TDF family falls within the broader power management / amplifier IC hierarchy: Audio Amplifier -> Class-AB Amplifier -> Automotive Audio Amplifier -> Power Management IC -> Semiconductor.
Key features of the TDF8546 include operation from a battery supply as low as 6 V (suited to stop/start vehicles), best-efficiency mode that dynamically adjusts output stage biasing, full I2C-bus controlled diagnostics including start-up and runtime load diagnostics, and independent channel gain control. The integrated thermal foldback and over-current protection safeguard the exposed pad / the top-side body of the HSOP package, which is itself the primary heat-dissipation path.
The device uses a complementary bipolar output architecture with on-chip gate drivers and charge-pump generation for the high-side NPN transistors, eliminating the need for external bootstrap capacitors. I2C control permits mode switching, mute/unmute, and read-back of diagnostic flags from the host microcontroller, simplifying ECU software development.
Typical applications include automotive head units and infotainment amplifiers, external booster amplifiers for premium sound systems, and stop/start-compliant audio platforms where cranking dips below 8 V are common. The combination of best-efficiency operation and low quiescent current helps meet stringent vehicle standby-current budgets.
When designing with this part, ensure the HSOP exposed thermal pad is soldered to a copper area of at least 6 cm² for full 4 x 45 W output. Use low-ESR electrolytic bypass capacitors within 10 mm of the supply pins, and keep the I2C lines away from the output traces to avoid coupling. Consider heatsink attachment for sustained high-output operation.
This page synthesizes distributor pricing, end-of-life status, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para TDF8546TH/N2 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con TDF8546TH/N2 (mismo factor de forma y huella) — difiere en Diagnostics, Mounting Type, Operating Temperature, Output Channels, Product Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
TDF8546ATH/N1ZJ
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
TDF8546TH/N2ZJ
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
TDF8546TH/N2,118
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
TDF8546TH/N2 Valores máximos y características eléctricas
| Product Type | Quad BTL Class-AB Audio Power Amplifier |
| Output Channels | 4 (quad) |
| Output Power per Channel | 45 W into 4 Ω |
| Topología | Bridge-Tied Load (BTL) |
| Output Stage Class | Class AB with best-efficiency mode |
| Supply Voltage (Min) | 6 V |
| Supply Voltage (Typ) | 14.4 V |
| Interfaz | I2C-bus control + diagnostics |
| Diagnostics | Start-up, runtime, load, thermal, short-to-battery/ground |
| Best Efficiency Mode | Yes (dynamic output-stage switching) |
| Temperatura de funcionamiento | -40 C to +85 C (automotive grade) |
| Encapsulado | HSOP-36 (Heatsink Small Outline Package, 36 leads) |
| Tipo de montaje | Surface Mount with exposed thermal pad |
| Application | Automotive head units and external amplifiers |
| Estado RoHS | Compliant |
| Lead Free | Yes |
Guía de configuración de pines de TDF8546TH/N2 hsop-36 (heatsink small outline package, 36 leads)
Configuración de pines para TDF8546TH/N2 (encapsulado hsop-36 (heatsink small outline package, 36 leads)). Este componente analógico presenta pines de entrada, salida y alimentación. Consulte la hoja de datos del fabricante para conocer las configuraciones de los pines de ajuste de offset, compensación y habilitación. Ideal para circuitos de acondicionamiento de señal y amplificadores.
No hay datos detallados de patillaje disponibles para TDF8546TH/N2.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
TDF8546TH/N2 es adecuado para 6 aplicacións: Automotive Head Unit Main Amplifier, Stop/Start Vehicle Audio Platform, External Booster Amplifier Module, Premium Infotainment Amplifier, Rear-Seat Entertainment Audio Driver, Commercial Vehicle Audio System.
Automotive Head Unit Main Amplifier
The TDF8546TH/N2's 4 x 45 W into 4 Ω at 14.4 V supply rails delivers the four-door speaker power required by mid-range automotive head units without external booster amplifiers. The HSOP-36 exposed pad can dissipate >20 W when soldered to a 6 cm² copper pour, eliminating the heatsink assembly in cost-sensitive designs. Best-efficiency mode adapts output-stage biasing during stop/start dips down to 6 V, preventing audible dropouts on cold-crank events.
Recomendado
Stop/Start Vehicle Audio Platform
The TDF8546TH/N2 operates from a battery voltage as low as 6 V, suiting stop/start vehicles where the supply rail sags during engine cranking. Best-efficiency mode dynamically adjusts the output stage to minimize quiescent loss during engine-off periods, helping the audio amplifier meet the strict standby-current budgets of modern vehicles. The I2C diagnostics enable the host MCU to mute outputs during cranking events to avoid speaker pops.
Recomendado
External Booster Amplifier Module
Aftermarket and OEM-installed external amplifier modules benefit from the TDF8546TH/N2's four independent channels, integrated diagnostics, and HSOP-36 footprint. The exposed-pad package is straightforward to integrate into a small aluminum chassis with thermal interface material; no fan or liquid cooling is required at the rated 4 x 45 W. I2C control simplifies the host-module interface, eliminating analog control wires.
Recomendado
Premium Infotainment Amplifier
Premium infotainment systems use the TDF8546TH/N2 as the four-channel mid-bass and full-range section of a multi-amp topology. The 45 W per-channel capability matches the thermal envelope of typical door speakers; pair with a dedicated subwoofer amplifier (e.g., TDA7560 or equivalent) for systems exceeding four channels. The I2C diagnostic bus integrates cleanly with A2B or MOST vehicle audio backbones.
Recomendado
Rear-Seat Entertainment Audio Driver
Rear-seat entertainment (RSE) modules use the TDF8546TH/N2 to drive four-seat-headphone-cancellation speakers or two dual-voice-coil woofers. The low 6 V operation prevents RSE audio dropout during engine cranking events, while I2C control allows the head-unit host to mute individual channels when headphones are connected. The compact HSOP-36 package suits the limited PCB area of RSE modules.
Recomendado
Commercial Vehicle Audio System
Commercial trucks, buses, and off-highway vehicles use the TDF8546TH/N2 to drive cabin and sleeper-cab speakers from a 24 V (dual-battery) or 12 V supply. The wide operating voltage range covers nominal 12 V automotive rails and tolerates load-dump transients typical of heavy-vehicle electrical systems. The exposed-pad HSOP package handles sustained vibration environments when the PCB is properly staked.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para TDF8546TH/N2 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | TDF8546ATH/N1ZJ | TDF8546TH/N2ZJ | TDF8546TH/N2,118 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | HSOP-36 | HSOP-36 (same) | HSOP-36 (same) | HSOP-36 (same) |
| Output Power (per channel) | 45 W into 4 Ω | 45 W into 4 Ω | 45 W into 4 Ω | 45 W into 4 Ω |
| Output Channels | 4 (quad BTL) | 4 (quad BTL) | 4 (quad BTL) | 4 (quad BTL) |
| Minimum Supply Voltage | 6 V | 6 V | 6 V | 6 V |
| Interface | I2C with full diagnostics | I2C with full diagnostics | I2C with full diagnostics | I2C with full diagnostics |
| Best Efficiency Mode | Yes | Yes | Yes | Yes |
| Lifecycle Status | EOL | Active (replacement) | EOL (same as parent) | EOL (same as parent) |
| Silicon Revision | Original /N2 die | Revised /N1 die (improved efficiency) | Same /N2 die | Same /N2 die |
| Automotive Qualified | Yes | Yes | Yes | Yes |
Diferenciadores clave
- I2C-bus controlled full diagnostics including start-up load testing (frente a TDA7850 (no I2C, no diagnostics))
- Best-efficiency mode for stop/start vehicle compliance (frente a TDA7560 (no adaptive efficiency))
- Complementary bipolar output stage for low distortion (frente a MOSFET-output automotive amplifiers (e.g., TDA7850))
Notas de diseño
Estimated: at 4 x 45 W into 4 Ω from a 14.4 V supply, each channel dissipates roughly (14.4 - Vout_rms) * Iout. The HSOP-36 theta_JA with a 6 cm² exposed-pad copper pour is approximately 1.5 C/W; without the pour it rises above 30 C/W and triggers thermal foldback. Solder the exposed pad to a continuous copper plane and add thermal vias to inner layers for sustained high-output operation.
Place supply bypass capacitors (typically 100 nF ceramic in parallel with 470 µF electrolytic) within 10 mm of the VBAT and VP pins to suppress load-dump transients common in automotive environments. Route the four BTL output pairs as differential traces with consistent geometry to maintain channel-to-channel gain matching. Keep I2C SCL/SDA traces short and away from output traces to avoid coupling-induced diagnostic false-triggers.
Estimated: do not exceed the absolute maximum battery supply (typically 18 V for the TDF8546 family); add a TVS clamp such as the SMBJ16A across the supply rail for load-dump protection. Always mute the amplifier via I2C before disconnecting the load, otherwise the inductive kick can damage the output stage. Verify the I2C address matches your host MCU's peripheral initialization sequence to avoid bus conflicts during start-up diagnostics.
Estimated: route the four BTL output pairs as matched-length differential traces with ground reference on adjacent layers. Avoid 90° bends - use 45° or curved traces to minimize reflected energy at high slew rates. The exposed thermal pad also serves as the ground reference; stitch the thermal ground with the signal ground at a single point to avoid ground loops.
Información de cumplimiento
RoHS and REACH compliance per NXP product page. AEC-Q100 automotive qualified per family datasheet. Halogen-free status not explicitly confirmed in verified data.
