XC7Z010-1CLG400C - 667MHz Zynq SoC, 28K Logic | AMD
MPN: XC7Z010-1CLG400C ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $57.4859 | $57.49 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
XC7Z010-1CLG400C Overview
What is a Zynq-7000 All Programmable SoC? A system on chip, or SoC, combines multiple functional subsystems into one integrated semiconductor. In this case, the XC7Z010-1CLG400C integrates an Arm Cortex-A9 MPCore processing system with CoreSight debug support and Artix-7 FPGA logic. This hierarchical relationship places the device between a conventional microprocessor and a programmable-logic accelerator, allowing software tasks and parallel hardware pipelines to share one package.
The principal features are the dual Arm Cortex-A9 cores, 667 MHz operation, and 28K programmable logic cells. The supplied data also identifies 240 Kbit of RAM, 80 multipliers, 60 block RAMs, 80 dedicated DSP slices, two Ethernet MACs, and support for differential I/O standards including LVDS, SSTL, and HSTL. These resources make the device suitable for systems that need deterministic hardware pipelines alongside general-purpose software.
The FPGA fabric provides programmable parallel logic for acquisition, filtering, protocol conversion, video processing, and cryptographic workloads. The processor subsystem supports software applications and operating-system-based control, while the DSP, block RAM, and Ethernet resources can accelerate data-intensive operations without requiring separate programmable-logic devices. The 400-CSBGA package exposes up to 128 user I/Os for board-level connectivity.
Typical uses include industrial factory controllers, networked embedded gateways, camera and image-processing systems, communications equipment, data-acquisition platforms, and compact control systems. The integrated architecture can reduce the number of external chips when software control and FPGA acceleration are both required. The 667 MHz processor and parallel fabric provide a flexible split between sequential software processing and hardware pipelines.
Designers should verify power sequencing, signal-integrity requirements, differential I/O implementation, thermal conditions, and the complete pinout against the AMD documentation. The supplied data does not provide a manufacturer datasheet URL, exact voltage limits, operating-temperature range, or detailed package dimensions, so those values are not inferred here.
This product data consolidates verified distributor and comparison information with practical selection context, package identity, core architecture, programmable resources, and application guidance for engineers evaluating the XC7Z010-1CLG400C.
Drop-in alternatives for XC7Z010-1CLG400C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC7Z010-1CLG400C (same form factor and footprint) — differing in Package, DSP Slices, FPGA Logic Cells, Mounting Type, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC7Z010-1CLG225I
✅ Drop-In✓ In Stock
$40 / Unit
View Datasheet →XC7Z020-1CLG400C
✅ Drop-In📋 Reference alternative (not in catalog)
XC7Z015-1CLG485C
✅ Drop-In📋 Reference alternative (not in catalog)
XC7Z010-1CLG400C Maximum Ratings & Electrical Characteristics
| Product Type | Zynq-7000 All Programmable System on Chip |
| Processor Core | Dual Arm Cortex-A9 MPCore |
| Processor Frequency | 667 MHz |
| FPGA Logic Cells | 28,000 cells |
| Registers | 35,200 registers |
| Block RAM | 60 block RAMs |
| Block RAM Capacity | 240 Kbit |
| Multipliers | 80 multipliers (18x25) |
| DSP Slices | 80 dedicated DSP slices |
| Ethernet MACs | 2 Ethernet MACs |
| Maximum User I/O | 128 I/Os |
| Process Technology | 28 nm |
| Differential I/O Standards | LVDS, SSTL, and HSTL |
| Package | 400-CSBGA |
| Package Dimensions | 17 mm x 17 mm |
| Architecture | MCU and FPGA |
| CoreSight Support | CoreSight |
XC7Z010-1CLG400C 17 mm x 17 mm Pin Configuration Guide
Pin configuration for XC7Z010-1CLG400C (17 mm x 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC7Z010-1CLG400C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC7Z010-1CLG400C is suitable for 6 applications: Industrial Automation Controller, Industrial Network Gateway, Image and Video Processing, Data Acquisition and Signal Processing, Communications Equipment, Embedded Software and Hardware Acceleration.
Industrial Automation Controller
The XC7Z010-1CLG400C fits industrial automation systems that require deterministic hardware logic alongside a software-control processor. Its dual Arm Cortex-A9 cores can run supervisory control, communications, diagnostics, and configuration services, while the 28,000 FPGA logic cells can implement timing-critical sequences and parallel I/O processing. The 80 DSP slices and 240 Kbit of block RAM are useful for signal conditioning or motion-related pipelines. With up to 128 user I/Os, the device can connect sensors, actuators, counters, and fieldbus circuitry. The main design consideration is validating power sequencing, I/O-bank voltage compatibility, and industrial temperature requirements against the current AMD documentation before production release.
Recommended
Industrial Network Gateway
The XC7Z010-1CLG400C is suitable for industrial gateways where network termination must be combined with programmable packet processing. The verified data lists two Ethernet MACs, a 667 MHz processor, and a programmable Artix-7 logic fabric, allowing software to manage routing or protocol services while hardware handles fast filtering, buffering, and data movement. Its 60 block RAMs and 240 Kbit of block RAM capacity can support local packet queues or staging buffers, although the exact supported memory interface must be checked in the datasheet. The 400-CSBGA package provides a dense integration point for compact gateway designs, but high-speed differential routing, isolation, grounding, and thermal verification remain essential.
Recommended
Image and Video Processing
The XC7Z010-1CLG400C can accelerate image-processing pipelines by mapping parallel pixel operations into FPGA logic and using the Arm Cortex-A9 subsystem for control, configuration, and higher-level decisions. The verified specifications include 80 dedicated DSP slices, 240 Kbit of block RAM, and 28,000 logic cells, providing resources suitable for filtering, thresholding, color conversion, and frame-buffer control. Its LVDS, SSTL, and HSTL support is relevant to high-speed interfaces, while the processor can coordinate capture and display workflows. Actual video throughput depends on resolution, frame rate, memory mapping, and the selected I/O standards; those details are not supplied and must be verified from the AMD documentation.
Recommended
Data Acquisition and Signal Processing
The XC7Z010-1CLG400C suits acquisition platforms that need high-throughput sampling control and flexible post-processing. FPGA logic can implement parallel ADC capture, digital filtering, trigger logic, and timing sequences, while the 667 MHz Arm subsystem handles configuration, logging, and communication. The 80 DSP slices can be assigned to multiply-accumulate operations, and the 240 Kbit of block RAM can support short local buffers or intermediate pipeline stages. Differential I/O standards including LVDS, SSTL, and HSTL are specifically identified in the verified data. Designers should still determine whether the target converter interface requires unsupported voltage levels or dedicated clocking resources and should verify package-level routing and power integrity.
Recommended
Communications Equipment
The XC7Z010-1CLG400C provides a flexible platform for communications equipment requiring programmable throughput and embedded processing. The two Ethernet MACs listed in the verified data can support network-connected equipment, while the FPGA fabric can accelerate framing, filtering, buffering, or protocol conversion. The dual Cortex-A9 processors provide a platform for control software, diagnostics, and configuration management. Its 60 block RAMs and 80 DSP slices allow hardware designers to implement parallel pipelines without moving every operation into software. The design must account for high-speed differential signal integrity, clock jitter, isolation requirements, and the exact I/O-bank assignments for the selected communication standards. Final protocol and throughput claims depend on the implemented design rather than the device name alone.
Recommended
Embedded Software and Hardware Acceleration
The XC7Z010-1CLG400C is useful when a product needs a general-purpose processor for Linux or real-time software plus dedicated hardware for performance-sensitive operations. The dual Cortex-A9 subsystem can execute application logic, device management, and networking, while FPGA logic can accelerate filters, encryption, compression, or custom interfaces. The supplied 28K logic-cell count and 80 DSP slices provide a meaningful hardware acceleration budget without requiring a separate FPGA in the architecture. In a compact system, the 400-CSBGA package can also reduce board-level component count. Migration and reuse require careful attention to memory maps, interrupt routing, clocking, pin constraints, and toolchain support because a change in device identifier can affect software initialization and security configuration.
Recommended
Recommended Products Summary
Engineering reference data for XC7Z010-1CLG400C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7Z010-1CLG400I | XC7Z010-1CLG225I | XC7Z010-2CLG225I | XC7Z020-1CLG400C | XC7Z015-1CLG485C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 400-CSBGA | 400-CSBGA - related package listed in cross-reference data | 225-CSBGA | 225-CSBGA | 400-CSBGA - package family reported | 485-CSBGA |
| Processor | Dual Arm Cortex-A9 | Dual Arm Cortex-A9 family context; exact value not supplied | Arm Cortex-A9 family context; exact value not supplied | Arm Cortex-A9 family context; exact value not supplied | Dual Arm Cortex-A9 family context | Arm Cortex-A9 family context; exact value not supplied |
Key Differentiators
- Integrated processor and programmable FPGA architecture (vs XC7Z010-1CLG225I)
- 667 MHz processor operation with 28K logic cells (vs XC7Z010-2CLG225I)
- 400-CSBGA package for higher I/O density (vs XC7Z010-1CLG225I)
- Same package family as XC7Z020 but not automatic interchangeability (vs XC7Z020-1CLG400C)
Design Notes
Verify all supply rails, I/O-bank voltages, sequencing, and decoupling against the current AMD XC7Z010 documentation before layout release. The supplied data confirms a mixed 1.8 V/3.3 V context for related Zynq-7000 devices but does not provide the exact power table for this MPN. Treat the listed voltage information as incomplete and use the manufacturer pinout and datasheet as the authority.
Design the 400-CSBGA footprint from the official AMD package and pinout files rather than inferring ball assignments from a generic BGA library. Pay particular attention to power distribution, ground reference, high-speed differential pairs, and the placement of decoupling close to supply pins. The verified package is 17 mm by 17 mm, but ball coordinates and land geometry are not included in the supplied data.
Route LVDS, SSTL, or HSTL interfaces using the exact voltage, impedance, and timing rules specified for the selected bank. These standards are listed as supported by the verified data, but supported status does not establish that every interface can be used simultaneously at the target data rate. Review clocking, skew, termination, series resistance, and neighboring aggressor paths in the AMD design guidance.
Estimate processor, FPGA, and I/O power separately under the expected workload before selecting board copper and cooling. The supplied data provides no power dissipation or junction-temperature values, so thermal calculations cannot be completed responsibly from the supplied information. Use the manufacturer power estimates and the actual board stackup, airflow, ambient temperature, and package map to validate junction temperature.
Do not assume that a related Zynq device with the same package name is a drop-in replacement. The cross-reference data identifies XC7Z020-1CLG400C as using the same CLG400 package but reports different FPGA capacity, while AMD warns that XC7Z020 may fail to initialize an XC7Z010 design. Check device ID handling, boot images, FPGA bitstreams, memory interfaces, and software initialization before substitution.
Compliance Information
The supplied search results do not provide verified RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements for the exact XC7Z010-1CLG400C.
