XC2C256-7FT256C - 256-Macrocell 7 ns CPLD | AMD | FTBGA
N.º de pieza: XC2C256-7FT256C ✗ Fin de vidaXC2C256-7FT256C Descripción general
A complex programmable logic device, or CPLD, is a user-programmable semiconductor within the broader FPGA and programmable-logic hierarchy. Unlike a soft microcontroller core, a CPLD implements Boolean equations, counters, state machines, interfaces, and control logic directly in a non-volatile configuration fabric. This makes the XC2C256 well suited to boot-time logic, deterministic control paths, signal conditioning, protocol bridging, and fixed-function logic replacement.
The CoolRunner-II architecture provides 256 macrocells, approximately 6000 system gates, and a 7.5 ns propagation-delay grade. The device supports 184 I/O operations according to product listings, while its 256-pin FTBGA package provides the required interconnect density for a logic-dense design. Non-volatile configuration allows the programmed function to become available without an external configuration PROM after power-up.
This device belongs to the speed-grade and package family identified as XC2C256. The “-7” designation identifies the 7.5 ns performance class, while the “FT256C” portion identifies the 256-pin package and commercial temperature option. The 1.55 mm seated-height measurement and the 256-pin BGA format should be considered together when defining PCB stack-up, solder-mask and paste patterns, component placement, and board-level inspection requirements.
Typical uses include industrial control and sequencing, communications infrastructure, embedded system glue logic, programmable interface consolidation, and compact control systems requiring non-volatile configuration. In each case, the CoolRunner-II fabric can combine multiple finite-state machines and datapath elements while retaining deterministic behavior after power restoration.
PCB implementation requires particular care because the 256-pin FTBGA has a dense ball pitch and cannot be inspected visually after soldering in the same way as a leaded package. Follow AMD's package and PCB design guidance, preserve the recommended power and ground-plane arrangement, and qualify the solder-paste stencil, reflow profile, and X-ray inspection process before volume production.
This page organizes the principal device characteristics, package information, practical application guidance, and traceable replacement options around the XC2C256-7FT256C. It also distinguishes device-family alternatives from true pin-compatible drop-in choices so engineers can assess timing, package, temperature grade, and programmed-logic implications before making a design change.
Alternativas directas para XC2C256-7FT256C — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
XC2C256-7FT256I
✅ Sustitución directaConsulte el precio
Ver hoja de datos →XC2C256-7FTG256C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC2C256-7FTG256I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC2C256-6FTG256C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC2C256-6FT256C
✅ Sustitución directaConsulte el precio
Ver hoja de datos →XC2C256-7FT256C Valores máximos y características eléctricas
| Device Type | CoolRunner-II complex programmable logic device |
| Macrocells | 256 macrocells |
| System Gates | Approximately 6000 gates |
| Propagation Delay | 7.5 ns |
| Frecuencia de reloj máxima | 108 MHz |
| Input/Output Operations | 184 I/O operations |
| Encapsulado | 256-pin FTBGA |
| Seated Height | 1.55 mm |
| Configuration Technology | Non-volatile, instant-on configuration |
| Architecture | High-performance CoolRunner-II CPLD |
| Speed Grade | -7, 7.5 ns class |
| Temperature Grade | Commercial, C suffix |
| Tipo de montaje | Surface-mount BGA |
| Logic Density | 256 macrocells |
Guía de configuración de pines de XC2C256-7FT256C 256-pin ftbga
Configuración de pines para XC2C256-7FT256C (encapsulado 256-pin ftbga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC2C256-7FT256C.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC2C256-7FT256C es adecuado para 6 aplicacións: Industrial Sequencing and Machine Control, Communications Interface Consolidation, Embedded System Glue Logic, Programmable Signal Conditioning, Compact Consumer Controller, LED Display and Illumination Control.
Industrial Sequencing and Machine Control
The XC2C256-7FT256C is suitable for deterministic sequencing, interlocks, state-machine control, and actuator logic in industrial equipment. Its 256 macrocells provide substantial capacity for combining parallel control paths, while the 7.5 ns propagation-delay class supports operation up to 108 MHz. The device can hold its logic configuration in non-volatile memory, allowing the controller to restart with a defined behavior. Confirm the commercial-temperature limits against the enclosure environment and use the package ball map in AMD datasheet DS094 when assigning I/O.
Recomendado
Communications Interface Consolidation
The XC2C256-7FT256C can consolidate protocol framing, channel control, byte alignment, and system-specific interface logic around a communications subsystem. Its 184 I/O operations give designers substantial connectivity for parallel buses and control signals, while the 108 MHz maximum clock frequency provides a deterministic basis for synchronous logic. Engineers should calculate setup and hold margins for every external device and ensure that the selected I/O standard is compatible with the FT256 package pin assignments.
Recomendado
Embedded System Glue Logic
The XC2C256-7FT256C is useful for boot control, peripheral arbitration, interrupt routing, watchdog supervision, and programmable glue logic around a host processor. Its 256 macrocells allow multiple small finite-state machines to operate concurrently, while non-volatile configuration supports predictable behavior after reset. The 7.5 ns timing grade should be checked against the slowest clock domain, and power sequencing requirements should be implemented explicitly rather than inferred from device position in the design.
Recomendado
Programmable Signal Conditioning
The XC2C256-7FT256C can implement signal conditioning, pulse shaping, counter chains, and protocol-specific transformation between sensors, converters, and actuators. The 184 I/O operations support multiple parallel channels, while the 7.5 ns propagation delay allows timing paths to be budgeted precisely at up to 108 MHz. Account for the commercial temperature grade in deployed environments and validate signal integrity at each interface, especially where programmable logic drives external clock, data, or isolation components.
Recomendado
Compact Consumer Controller
The XC2C256-7FT256C can implement control logic for compact consumer products that require multiple modes, sequencing functions, and non-volatile behavior without a large FPGA. Its 256 macrocells and 184 I/O operations offer more logic and interface capacity than small PAL-style devices, while the 256-pin FTBGA package supports dense board layouts. The 1.55 mm seated height must be reflected in the PCB assembly process, and production hardware should undergo appropriate solder-joint and electrical test coverage.
Recomendado
LED Display and Illumination Control
The XC2C256-7FT256C can coordinate LED matrix scanning, illumination patterns, dimming sequences, and display diagnostics through parallel or multiplexed control logic. Its 7.5 ns propagation delay and 108 MHz clock capability are more than adequate for many scanning architectures, while the non-volatile configuration preserves operating patterns across power cycles. Engineers should separate high-current LED drive paths from the CPLD, use appropriate output buffering, and verify timing margins across every display scan and blanking interval.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC2C256-7FT256C — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC2C256-7FT256I | XC2C256-7FTG256C | XC2C256-7FTG256I | XC2C256-6FTG256C |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 256-pin FTBGA | 256-pin FTBGA | 256-pin FTBGA | 256-pin FTBGA | 256-pin FTBGA |
| Speed Grade | -7, 7.5 ns propagation delay | -7, 7.5 ns propagation delay | -7, 7.5 ns propagation delay | -7, 7.5 ns propagation delay | -6 speed grade, one class slower |
| Macrocells | 256 macrocells | 256 macrocells | 256 macrocells | 256 macrocells | 256 macrocells |
| System Gates | Approximately 6000 gates | Approximately 6000 gates | Approximately 6000 gates | Approximately 6000 gates | Approximately 6000 gates |
| Input/Output Operations | 184 I/O operations | 184 I/O operations | 184 I/O operations | 184 I/O operations | 184 I/O operations |
| Temperature Suffix | C, commercial | I, industrial | C, commercial | I, industrial | C, commercial |
| Configuration Technology | Non-volatile, instant-on CoolRunner-II configuration | Non-volatile, instant-on CoolRunner-II configuration | Non-volatile, instant-on CoolRunner-II configuration | Non-volatile, instant-on CoolRunner-II configuration | Non-volatile, instant-on CoolRunner-II configuration |
Diferenciadores clave
- Retains the -7 timing class across the primary package-level alternatives (frente a XC2C256-6FT256C)
- Documented complete-replacement relationship within the XC2C256 family (frente a XC2C256-7FTG256C)
- Commercial-temperature configuration with immediate source confirmation (frente a XC2C256-7FT256I)
Notas de diseño
Treat the 256-pin FTBGA as a fine-pitch assembly process rather than a visually inspectable package. Follow the land pattern, solder-mask, paste, and reflow guidance in AMD datasheet DS094, and match the PCB stack-up to the 1.55 mm seated-height specification. Validate the stencil aperture count and paste volume before production because insufficient solder can create hidden inter-BGA voids, while excessive solder can produce bridging.
Assign external clock and high-speed interface pins from the manufacturer pin-description table, then preserve continuous return paths beneath those routes. The device's 7.5 ns propagation-delay class does not remove board-level skew, crosstalk, or loading effects. Use the 108 MHz maximum clock frequency as a device-level limit rather than a guaranteed system frequency, and validate the complete interface with realistic traces, terminations, connectors, and external-device timing.
Do not approve a replacement solely because its suffix looks similar. Compare the exact FTBGA ball map, speed grade, temperature suffix, configuration interface, I/O standards, and timing limits in AMD datasheet DS094. The XC2C256-7FTG256C is reported as completely replaceable in a cross-reference comparison, but the board design must still be checked against the target footprint and all programmed pin constraints before substitution.
Plan the supply network so each power pin receives a direct low-impedance path and every ground reference has a nearby return connection. Separate noisy or switching-converter nodes from programmable-logic traces, and confirm bypass-capacitor values and placement against the device's recommended application circuit. Review both static supply limits and configuration-current behavior because non-volatile instant-on architectures can impose startup requirements beyond ordinary operating current.
Información de cumplimiento
The manufacturer datasheet identifies the device as a programmable-logic IC; no specific RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 status was established.
