XC3090L-6TQG176I - XC3000L 3.3V FPGA 900 Gates | Xilinx TQG176
N.º de pieza: XC3090L-6TQG176I ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.8 | $2.980,00 |
| 500 | $25.1 | $12.550,00 |
| 1.000 | $21.4 | $21.400,00 |
XC3090L-6TQG176I Descripción general
An FPGA (Field Programmable Gate Array) is a programmable logic device whose core is an array of configurable logic blocks (CLBs) surrounded by a perimeter of programmable input/output blocks (IOBs), with a programmable interconnect matrix tying them together. The hierarchy runs: logic cell -> CLB -> FPGA -> programmable logic -> digital IC. The XC3000L subfamily is one of the earliest commercial SRAM-based FPGA lines, and the 'L' suffix denotes the 3.3 V variant of the original XC3000 architecture, allowing operation in mixed-voltage boards that were already migrating from 5 V to 3.3 V logic rails.
Key features of the XC3090L include a 3.3 V core supply (VCC), 5 V tolerant I/O on selected parts, on-chip configuration logic with five configuration modes, boundary-scan (JTAG) support, and readback capability. The '6' speed grade corresponds to a combinatorial logic delay of roughly 6 ns and a flip-flop toggle rate near 80 MHz in the XC3000L process. The 'I' suffix indicates an industrial temperature grade of -40C to +85C.
Typical applications include telecom interface glue logic, industrial control and instrumentation front-ends, prototyping of ASIC designs before HardCopy migration, and legacy equipment where the XC3000L footprint is already committed on the PCB. Designers using the XC3090L can prototype on the SRAM-based FPGA and migrate to a HardCopy Stratix equivalent for volume production using the same package pinout.
Alternativas directas para XC3090L-6TQG176I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con XC3090L-6TQG176I (mismo factor de forma y huella) — difiere en Package, Configuration Memory, Process Technology, Family, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
XC3090L-6TQG176C
✅ Sustitución directa✓ En stock
$63 / unidad
Ver hoja de datos →XC3090L-6TQ176I
✅ Sustitución directa✓ En stock
$140 / unidad
Ver hoja de datos →XC3090L-6TQ176C
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$9.95 / unidad
Ver hoja de datos →XC3090L-8TQG176I
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$22.1 / unidad
Ver hoja de datos →XC3090L-6TQG176I Valores máximos y características eléctricas
| Family | XC3000L Low Voltage Logic Cell Array |
| Product Type | SRAM-based FPGA |
| Usable Gates | 900 |
| Speed Grade | -6 (approximately 6 ns combinatorial delay) |
| Supply Voltage (VCC) | 3.3 V |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Encapsulado | TQG176 (176-pin Thin Quad Flat Pack) |
| Configuration Modes | 5 (Master Serial, Slave Serial, Master Parallel, Slave Parallel, Peripheral) |
| Configuration Memory | SRAM (volatile, requires external configuration PROM) |
| Boundary Scan | JTAG IEEE 1149.1 |
| Readback | Supported |
| Process Technology | CMOS, 5 V tolerant I/O on selected variants |
| Tipo de montaje | Surface Mount |
Guía de configuración de pines de XC3090L-6TQG176I tqg176 (176-pin thin quad flat pack)
Configuración de pines para XC3090L-6TQG176I (encapsulado tqg176 (176-pin thin quad flat pack)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC3090L-6TQG176I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC3090L-6TQG176I es adecuado para 6 aplicacións: Legacy Telecom Interface Glue Logic, Industrial Control Front-End Logic, ASIC Prototype Pre-HardCopy, Legacy Test & Measurement Equipment, Avionics and Defense Retrofit Boards, Educational FPGA Lab Boards.
Legacy Telecom Interface Glue Logic
The XC3090L-6TQG176I fits legacy telecom interface glue logic because it provides 900 usable gates in a 3.3 V low-voltage variant that drops directly into existing TQG176 PCB footprints designed around the XC3000L family. The -6 speed grade gives roughly 6 ns combinatorial delay, enough for telecom backplane glue, framing, and protocol conversion at E1/T1 rates. Its JTAG boundary scan and readback features simplify board-level test, while SRAM-based reconfigurability allows field updates without replacing the part.
Recomendado
Industrial Control Front-End Logic
In industrial control front-ends the XC3090L-6TQG176I provides the industrial -40C to +85C operating range and 3.3 V core needed for PLC I/O expansion and motor-control co-processors. The 900-gate capacity is enough for state machines, encoder decoding, and PWM conditioning logic, while the 6 ns delay supports deterministic interrupt-handling glue. Its volatile SRAM configuration mandates an external configuration PROM, but allows in-system firmware updates for evolving control algorithms.
Recomendado
ASIC Prototype Pre-HardCopy
Designers use the XC3090L-6TQG176I as a prototype vehicle before migrating to a HardCopy Stratix structured ASIC. According to FPGAkey documentation, HardCopy Stratix devices are architecturally equivalent to the corresponding Stratix prototype and offer pin-to-pin compatibility in the same package, so a design validated on this part can move to volume HardCopy production without PCB changes. The TQG176 footprint is shared between prototype and HardCopy, simplifying the design hand-off.
Recomendado
Legacy Test & Measurement Equipment
The XC3090L-6TQG176I is used as a replacement FPGA in legacy oscilloscopes, logic analyzers, and bench instruments whose PCBs were designed around the XC3000L TQG176 footprint. Its 3.3 V operation matches newer analog front-ends, while the 6 ns delay is sufficient for trigger conditioning and timing logic. Industrial temperature rating supports repair of equipment deployed in factory-floor environments.
Recomendado
Avionics and Defense Retrofit Boards
In avionics and defense retrofits, the XC3090L-6TQG176I allows direct board-level replacement of failed legacy FPGAs without requalification of the surrounding analog and power circuits. Its industrial temperature grade, JTAG boundary scan, and readback features support the diagnostic needs of long-lifecycle platforms. The TQG176 surface-mount package is compatible with standard leaded and lead-free rework processes used in depot repair.
Recomendado
Educational FPGA Lab Boards
Universities and training labs sometimes retain the XC3090L-6TQG176I on teaching boards that demonstrate early SRAM-based FPGA concepts such as configuration modes, JTAG, and readback. The 3.3 V supply rail is safer for student lab benches than legacy 5 V parts, while the TQG176 package gives enough I/O for meaningful lab exercises. Used boards typically harvest this part from retired telecom gear as a low-cost teaching resource.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC3090L-6TQG176I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC3090L-6TQG176C | XC3090L-6TQ176I | XC3090L-6TQ176C | XC3090L-8TQG176I |
|---|---|---|---|---|---|
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Package | TQG176 | TQG176 | TQG176 (standard body) | TQG176 (standard body) | TQG176 |
| Speed Grade | -6 (approx. 6 ns) | -6 (approx. 6 ns) | -6 (approx. 6 ns) | -6 (approx. 6 ns) | -8 (approx. 8 ns) |
| Usable Gates | 900 | 900 | 900 | 900 | 900 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Temperature Grade | Industrial -40C to +85C | Commercial 0C to +70C | Industrial -40C to +85C | Commercial 0C to +70C | Industrial -40C to +85C |
| Package Body Thickness | 1.4 mm (thin) | 1.4 mm (thin) | 1.6 mm (standard) | 1.6 mm (standard) | 1.4 mm (thin) |
| Configuration Memory | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Industrial temperature grade (frente a XC3090L-6TQG176C)
- Thin 1.4 mm body (frente a XC3090L-6TQ176I)
- Faster -6 speed grade (frente a XC3090L-8TQG176I)
Notas de diseño
The XC3090L-6TQG176I requires a stable 3.3 V core supply with at least 100 mA of headroom during configuration. Place 0.1 uF decoupling capacitors close to every VCC pin and a bulk 10 uF tantalum near the package. The SRAM configuration memory is volatile, so a glitch or drop below 2.5 V on VCC will lose the design; ensure the upstream regulator has proper power-good signaling tied to the FPGA DONE pin for safe startup.
The TQG176 package has a 0.5 mm pitch and gull-wing leads; the PCB land pattern must follow IPC-7351 nominal dimensions with a 1.4 mm body clearance. For double-sided reflow, respect the 1.4 mm maximum body height to avoid shadowing nearby components. Recommended: keep-out zone of at least 0.5 mm around the package, microvia-in-pad is acceptable, but plated through-hole vias should be tented to prevent solder wicking.
Estimated: Configuration time for a typical 900-gate design is 5-20 ms in Master Serial mode with a 10 MHz CCLK. Do not assume JTAG programming replaces a configuration PROM in production - JTAG is intended for prototype bring-up and boundary-scan test only. Always validate that the DONE pin goes high before releasing system-level resets, and never rely on internal pull-ups on MODE pins because they were not specified for all XC3000L revisions.
Información de cumplimiento
Compliance data was not present in the verified web sources. The XC3000L family predates widespread RoHS adoption, so older date codes are likely non-compliant; buyers should request manufacturer compliance documentation for the specific lot. AEC-Q100 is not applicable since this is an FPGA, not an automotive-grade IC.
