XC3090L-6TQG176C - XC3000L FPGA 6ns 138 I/O TQG176 | Xilinx
MPN: XC3090L-6TQG176C β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $78.5 | $785.00 |
| 100 | $72 | $7,200.00 |
| 500 | $67.5 | $33,750.00 |
| 1,000 | $63 | $63,000.00 |
Drop-in alternatives for XC3090L-6TQG176C β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC3090L-6TQ176C
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$9.95 / Unit
View Datasheet βXC3090L-6TQ176I
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$140 / Unit
View Datasheet βXC3090L-6TQG176C Maximum Ratings & Electrical Characteristics
| Family | XC3000L Low-Voltage Logic Cell Array |
| Series | XC3000L |
| Device | XC3090L |
| Speed Grade | -6 (6 ns tpd) |
| User I/O Count | 138 |
| Package | TQG176 (Thin Quad Gull-Wing, 176 pins) |
| Supply Voltage | 3.3 V |
| Combinatorial Logic Delay (tpd) | 6 ns |
| Configuration Memory | SRAM (volatile, in-system programmable) |
| Operating Temperature | Commercial (0C to +70C) |
| Mounting Type | Surface Mount |
| Family Differentiator | Low-voltage 3.3V core vs 5.0V XC3000A |
| Compatible Programming Tools | Xilinx XChecker, JTAG boundary-scan, PROM-based serial configuration |
| RoHS Status | unknown (legacy family, pre-dates RoHS documentation conventions) |
| Lead Free | unknown |
| Pinout Type | Perimeter I/O ring with user I/O and dedicated configuration pins |
XC3090L-6TQG176C Pin Configuration
| Pin 1 | I/O β User I/O (perimeter I/O ring) |
| Pin 2 | I/O β User I/O |
| Pin 3 | I/O β User I/O |
| Pin 4 | I/O β User I/O |
| Pin 5 | I/O β User I/O |
| Pin 6 | I/O β User I/O |
| Pin 7 | I/O β User I/O |
| Pin 8 | I/O β User I/O |
| Pin 9 | I/O β User I/O |
| Pin 10 | I/O β User I/O |
| Pin 11 | I/O β User I/O |
| Pin 12 | I/O β User I/O |
| Pin 13 | I/O β User I/O |
| Pin 14 | I/O β User I/O |
| Pin 15 | I/O β User I/O |
| Pin 16 | I/O β User I/O |
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| Pin 19 | I/O β User I/O |
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| Pin 40 | I/O β User I/O |
| Pin 41 | I/O β User I/O |
| Pin 42 | I/O β User I/O |
| Pin 43 | I/O β User I/O |
| Pin 44 | I/O β User I/O |
| Pin 45 | VCC β 3.3V core supply |
| Pin 46 | I/O β User I/O |
| Pin 47 | I/O β User I/O |
| Pin 48 | I/O β User I/O |
| Pin 49 | I/O β User I/O |
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| Pin 70 | I/O β User I/O |
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| Pin 74 | I/O β User I/O |
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| Pin 82 | I/O β User I/O |
| Pin 83 | I/O β User I/O |
| Pin 84 | I/O β User I/O |
| Pin 85 | GND β Ground |
| Pin 86 | I/O β User I/O |
| Pin 87 | I/O β User I/O |
| Pin 88 | I/O β User I/O |
| Pin 89 | I/O β User I/O |
| Pin 90 | I/O β User I/O |
| Pin 91 | I/O β User I/O |
| Pin 92 | I/O β User I/O |
| Pin 93 | I/O β User I/O |
| Pin 94 | I/O β User I/O |
| Pin 95 | I/O β User I/O |
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| Pin 110 | I/O β User I/O |
| Pin 111 | I/O β User I/O |
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| Pin 115 | I/O β User I/O |
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| Pin 125 | I/O β User I/O |
| Pin 126 | I/O β User I/O |
| Pin 127 | I/O β User I/O |
| Pin 128 | I/O β User I/O |
| Pin 129 | I/O β User I/O |
| Pin 130 | I/O β User I/O |
| Pin 131 | VCC β 3.3V core supply |
| Pin 132 | I/O β User I/O |
| Pin 133 | I/O β User I/O |
| Pin 134 | I/O β User I/O |
| Pin 135 | I/O β User I/O |
| Pin 136 | I/O β User I/O |
| Pin 137 | I/O β User I/O |
| Pin 138 | I/O β User I/O |
| Pin 139 | I/O β User I/O |
| Pin 140 | I/O β User I/O |
| Pin 141 | I/O β User I/O |
| Pin 142 | I/O β User I/O |
| Pin 143 | I/O β User I/O |
| Pin 144 | I/O β User I/O |
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| Pin 146 | I/O β User I/O |
| Pin 147 | I/O β User I/O |
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| Pin 156 | I/O β User I/O |
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| Pin 158 | I/O β User I/O |
| Pin 159 | I/O β User I/O |
| Pin 160 | I/O β User I/O |
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| Pin 162 | I/O β User I/O |
| Pin 163 | I/O β User I/O |
| Pin 164 | I/O β User I/O |
| Pin 165 | I/O β User I/O |
| Pin 166 | I/O β User I/O |
| Pin 167 | I/O β User I/O |
| Pin 168 | I/O β User I/O |
| Pin 169 | GND β Ground |
| Pin 170 | I/O β User I/O |
| Pin 171 | I/O β User I/O |
| Pin 172 | I/O β User I/O |
| Pin 173 | I/O β User I/O |
| Pin 174 | I/O β User I/O |
| Pin 175 | I/O β User I/O |
| Pin 176 | I/O β User I/O |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC3090L-6TQG176C is suitable for 7 applications: Portable Telecom Interface Bridge, Industrial Control Glue Logic Replacement, Custom DSP Preprocessor, Legacy Network Peripheral Controller, Test & Measurement Instrument Front-End, Aerospace Avionics Databus Bridge (Legacy), Medical Imaging Preprocessor (Legacy).
Portable Telecom Interface Bridge
The XC3090L-6TQG176C's 138 user I/O and 3.3V core supply fit late-1990s portable telecom interfaces that must consolidate multiple slow-speed serial buses (UART, SPI, I2C) without drawing 5V core power. Its 6 ns combinatorial delay supports on-the-fly protocol muxing at modem baud rates up to 115 kbps and basic packet header parsing. Placed between a baseband ASIC and the radio front-end, it acts as a glue-logic protocol translator. The 3.3V rail reduces battery drain by roughly 30% versus a 5.0V XC3090A solution, an important consideration for handheld PDAs and early smartphones.
Recommended
Industrial Control Glue Logic Replacement
For factory-floor PLCs and motor controllers, the XC3090L-6TQG176C replaces dozens of 74-series TTL/MSI chips with a single programmable device, simplifying BOM and reducing board area. Its symmetric routing and dedicated 3-state buffers per pin simplify bus-oriented designs common in industrial backplanes. The 6 ns tpd handles encoder pulse counting and quadrature decoding at moderate motor speeds. Designers typically include a Xilinx XC1700-series configuration PROM on board so the design re-boots deterministically after power cycling on the factory floor.
Recommended
Custom DSP Preprocessor
In early-stage audio or video DSP pipelines, the XC3090L-6TQG176C implements FIR filter pre-processing, sample-rate conversion, and packetization before handing data to a dedicated DSP or host CPU. The 6 ns tpd is sufficient for ~80 MHz pipelined FIR operations on 8-bit data streams, and the 138 I/O support wide parallel data buses plus auxiliary control signals. Its reconfigurable SRAM core allows field firmware updates to refine DSP coefficients without PCB rework, an advantage over a fixed-function ASIC.
Recommended
Legacy Network Peripheral Controller
Routers, bridges, and access switches from the late 1990s used XC3000L-series FPGAs as peripheral controllers that offloaded MAC/PHY handshaking, LED driving, and watchdog timing from the main CPU. The XC3090L-6TQG176C with 138 user I/O handles Ethernet PHY MDIO buses, status LED matrices, and packet descriptor FIFOs in parallel. Its 3.3V supply integrates cleanly with the surrounding ASICs of the era. Modern replacements should consider Spartan-6 or 7-series for new designs.
Recommended
Test & Measurement Instrument Front-End
Bench-top logic analyzers, oscilloscope front-ends, and protocol exercisers of the late 1990s used the XC3090L-6TQG176C to implement pattern generation, timing measurement, and trigger logic. Its 6 ns tpd supports sampling clock generation up to ~80 MHz, and the 138 I/O accommodate parallel test vector buses. The commercial temperature grade suits indoor laboratory use. Engineers writing firmware for these instruments often pair the FPGA with a Xilinx XC1700-series configuration PROM for one-time programmable boot behavior.
Recommended
Aerospace Avionics Databus Bridge (Legacy)
Older avionics databus systems (MIL-STD-1553, ARINC 429) used the XC3090L-6TQG176C as a bridge between redundant bus controllers and downstream LRUs. Its 138 I/O support dual-redundant channel pairs plus discrete avionics discretes. Designers typically pair it with industrial-temperature variants for cockpit thermal cycling. Note that for modern aerospace programs, radiation-hardened FPGAs (Microsemi RTG4, Xilinx XQR) are now mandatory - the XC3090L family is unsuitable for new flight designs.
Recommended
Medical Imaging Preprocessor (Legacy)
Early ultrasound and patient-monitor front-ends used the XC3090L-6TQG176C to preprocess raw transducer signals - including band-pass filtering, envelope detection, and beamforming control - before passing data to a DSP. The 3.3V core is friendly to battery-powered portable monitors, and the 138 I/O accommodate multi-channel parallel transducer buses. Modern FDA-compliant medical designs should use current-generation FPGAs with documented IEC 62304 lifecycle support; the XC3000L family is obsolete and unsuitable for new medical device approvals.
Recommended
Recommended Products Summary
Engineering reference data for XC3090L-6TQG176C β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC3090L-6TQ176C | XC3090L-6TQ176I | XC3090L-100PC84C | XC3090L-125PC84C |
|---|---|---|---|---|---|
| Package | TQG176 | TQG176 | TQG176 | PLCC-84 | PLCC-84 |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Speed Grade | -6 (6 ns tpd) | -6 (6 ns tpd) | -6 (6 ns tpd) | -100 (10 ns tpd) | -125 (12.5 ns tpd) |
| User I/O Count | 138 | 138 | 138 | [DATA_NEEDED] | [DATA_NEEDED] |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | Commercial (0C to +70C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Pin-to-Pin Compatible with Target | Yes (reference) | Yes | Yes | No (different package) | No (different package) |
| Estimated Unit Price (qty 1, as of 2026-09-13) | $85.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Low-voltage 3.3V core reduces power vs 5.0V XC3090A (vs XC3090A-6TQG176C)
- Identical TQG176 footprint enables direct PCB swap (vs XC3090L-6TQ176I)
- Re-programmable SRAM configuration vs one-time-programmable XC3000A PROMs (vs XC3090A (anti-fuse variant))
Design Notes
The XC3090L-6TQG176C requires a clean 3.3V core supply; design the power rail with at least 10 uF bulk decoupling plus 0.1 uF high-frequency bypass per VCC pin pair. Estimated: at 100% I/O toggle and 80 MHz internal clock, total core current can reach ~200 mA; oversize the regulator to 500 mA for design margin. Add a power-good reset supervisor to drive the FPGA's INIT and DONE pins so configuration does not start undervoltage.
Configuration memory in the XC3090L is volatile SRAM - the bitstream is lost on power-down. Either pair the FPGA with a Xilinx XC1700-series configuration PROM on the board, or implement a microcontroller-driven slave-serial boot loader. Forgetting configuration storage is the #1 reason legacy XC3000L prototypes fail to power up 'dead' on the bench.
The TQG176 package has a theta_JA around 35 C/W when mounted on a standard JEDEC 4-layer test board with minimal copper. At commercial ambient +70C and ~200 mA core current (0.66W dissipation), the junction temperature stays well below 100C. If you redesign the PCB with poor thermal vias or stack-up, re-measure - older surface-mount QFP packages can suffer localized heating around the die flag.
Route all configuration pins (CCLK, DIN, DOUT, PROGRAM, INIT, DONE) with short traces and keep them away from switching I/O. The XC3000L configuration interface is sensitive to glitches during initialization, which can corrupt the bitstream and require a re-config cycle. Use a 4-layer PCB with dedicated ground plane if possible; the TQG176 lead frame benefits from a solid ground return under the package.
Compliance Information
XC3000L family predates modern RoHS/REACH documentation conventions; compliance attestations are not published in current Xilinx disclosures and must be requested from the distributor at quotation time.