Xilinx의 XC3090L-6TQG176I - XC3000L 3.3V FPGA 900 Gates | Xilinx TQG176 XC3090L-6TQG176I - 전자 부품
Xilinx

XC3090L-6TQG176I - XC3000L 3.3V FPGA 900 Gates | Xilinx TQG176

부품 번호: XC3090L-6TQG176I ✗ 단종
재고 있음 영업일 기준 1~3일 내 발송
3.3 V Vdss TQG176 (176-pin Thin Quad Flat Pack) Package -6 (approximately 6 ns combinatorial delay) Speed SRAM (volatile, requires external configuration PROM) Memory
시작가 $21.4 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-13
볼륨 가격
수량 단가 합계
1 $38.5 $38.50
10 $34.2 $342.00
100 $29.8 $2,980.00
500 $25.1 $12,550.00
1,000 $21.4 $21,400.00
ℹ️ 모든 가격은 USD 기준입니다
데이터시트 보기 (PDF) 대체품 보기

XC3090L-6TQG176I 개요

The Xilinx XC3090L-6TQG176I is a 3.3 V low-voltage member of the Xilinx XC3000L Logic Cell Array family, packaged in a 176-pin Thin Quad Flat Pack (TQG176) and providing approximately 900 usable gates with 6 ns combinatorial delay. It is part of the original Xilinx XC3000 generation of SRAM-look-up-table FPGAs, targeting low-voltage 3.3 V systems where the original 5 V XC3000 family could not be used directly.

An FPGA (Field Programmable Gate Array) is a programmable logic device whose core is an array of configurable logic blocks (CLBs) surrounded by a perimeter of programmable input/output blocks (IOBs), with a programmable interconnect matrix tying them together. The hierarchy runs: logic cell -> CLB -> FPGA -> programmable logic -> digital IC. The XC3000L subfamily is one of the earliest commercial SRAM-based FPGA lines, and the 'L' suffix denotes the 3.3 V variant of the original XC3000 architecture, allowing operation in mixed-voltage boards that were already migrating from 5 V to 3.3 V logic rails.

Key features of the XC3090L include a 3.3 V core supply (VCC), 5 V tolerant I/O on selected parts, on-chip configuration logic with five configuration modes, boundary-scan (JTAG) support, and readback capability. The '6' speed grade corresponds to a combinatorial logic delay of roughly 6 ns and a flip-flop toggle rate near 80 MHz in the XC3000L process. The 'I' suffix indicates an industrial temperature grade of -40C to +85C.

Typical applications include telecom interface glue logic, industrial control and instrumentation front-ends, prototyping of ASIC designs before HardCopy migration, and legacy equipment where the XC3000L footprint is already committed on the PCB. Designers using the XC3090L can prototype on the SRAM-based FPGA and migrate to a HardCopy Stratix equivalent for volume production using the same package pinout.

드롭인 대체품: XC3090L-6TQG176I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: XC3090L-6TQG176I (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Memory, Process Technology, Family, Speed Grade.

Xilinx
Package: TQFP-176 (TQ)
Configuration Memory: SRAM (volatile, requires boot PROM)
Process Technology: 0.8 um CMOS
비교 대상: XC3090L-6TQG176I →
Xilinx
Package: TQFP-176 (TQ176)
Configuration Memory: SRAM (volatile, external PROM required)
Speed Grade: -6
비교 대상: XC3090L-6TQG176I →
Xilinx
Package: TQG176 (Thin Quad Gull-Wing, 176 pins)
Configuration Memory: SRAM (volatile, in-system programmable)
Family: XC3000L Low-Voltage Logic Cell Array
비교 대상: XC3090L-6TQG176I →
Xilinx
Package: TQFP-176
Configuration Memory: SRAM (volatile, external config required)
Family: XC3000L Low-Voltage Logic Cell Array
비교 대상: XC3090L-6TQG176I →
Xilinx
Package: TQFP-176
Configuration Memory: SRAM (volatile)
Family: XC3000L Low-Voltage Logic Cell Array
비교 대상: XC3090L-6TQG176I →
Xilinx
Package: 176-pin TQFP (TQG176), 1.4 mm height, surface-mount
Configuration Memory: SRAM (volatile, requires external PROM)
Process Technology: 0.8 micron CMOS
비교 대상: XC3090L-6TQG176I →
Xilinx
Package: TQG-176 (Thin Quad Gulp, 176-pin)
Process Technology: 0.6 um CMOS SRAM
Family: XC3000L Field Programmable Gate Array
비교 대상: XC3090L-6TQG176I →
Xilinx
Package: TQFP-176 (TQ176) 24x24 mm, gull-wing leads
Process Technology: CMOS, 0.6 um
비교 대상: XC3090L-6TQG176I →
Xilinx
Package: TQFP-176 (TQG176)
Configuration Memory: Internal SRAM (reprogrammable)
Process Technology: CMOS, low-voltage
비교 대상: XC3090L-6TQG176I →
Xilinx
Package: 176-pin TQG (LQFP, 0.5 mm pitch, gull wing)
Configuration Memory: On-chip SRAM-based, in-system programmable
Process Technology: CMOS
비교 대상: XC3090L-6TQG176I →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

XC3090L-6TQG176C

✅ 드롭인
Xilinx
📦 TQG176
XC3000L Low-Voltage Logic Cell Array · XC3000L · XC3090L · -6 (6 ns tpd) · 138 · TQG176 (Thin Quad Gull-Wing, 176 pins) · 3.3 V · 6 ns

✓ 재고 있음

$63 / 개

데이터시트 보기 →

XC3090L-6TQ176I

✅ 드롭인
Xilinx
📦 TQG176
XC3000L Low Voltage Logic Cell Array · 100 · 4 · SRAM (volatile, external PROM required) · -6 · up to 320 MHz · TQFP-176 (TQ176)

✓ 재고 있음

$140 / 개

데이터시트 보기 →

XC3090L-6TQ176C

✅ 드롭인 ⚠️ 사양 미검증
Xilinx
📦 TQG176
XC3000L Logic Cell Array · 320 CLBs (16 x 16 array) · Approximately 9,000 system gates · -6 · 3.3 V · 3.3 V CMOS (5 V tolerant inputs per datasheet family) · 144 user I/O · 176 pins

✓ 재고 있음

$9.95 / 개

데이터시트 보기 →

XC3090L-8TQG176I

✅ 드롭인 ⚠️ 사양 미검증
Xilinx
📦 TQG176
XC3000L Low Voltage Logic Cell Array · XC3090L · -8 · 5000 usable gates (up to 9000 system gates equivalent) · 320 · 6.7 ns maximum · 80 MHz · 176-pin TQG (LQFP, 0.5 mm pitch, gull wing)

✓ 재고 있음

$22.1 / 개

데이터시트 보기 →

XC3090L-6TQG176I 최대 정격 & 전기적 특성

Family XC3000L Low Voltage Logic Cell Array
Product Type SRAM-based FPGA
Usable Gates 900
Speed Grade -6 (approximately 6 ns combinatorial delay)
Supply Voltage (VCC) 3.3 V
Operating Temperature Grade Industrial (-40C to +85C)
패키지 TQG176 (176-pin Thin Quad Flat Pack)
Configuration Modes 5 (Master Serial, Slave Serial, Master Parallel, Slave Parallel, Peripheral)
Configuration Memory SRAM (volatile, requires external configuration PROM)
Boundary Scan JTAG IEEE 1149.1
Readback Supported
Process Technology CMOS, 5 V tolerant I/O on selected variants
실장 유형 Surface Mount

XC3090L-6TQG176I tqg176 (176-pin thin quad flat pack) 핀 구성 가이드

XC3090L-6TQG176I(tqg176 (176-pin thin quad flat pack) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

XC3090L-6TQG176I의 tqg176 (176-pin thin quad flat pack) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: XC3090L-6TQG176I.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

XC3090L-6TQG176I 적합 용도: 6 애플리케이션s: Legacy Telecom Interface Glue Logic, Industrial Control Front-End Logic, ASIC Prototype Pre-HardCopy, Legacy Test & Measurement Equipment, Avionics and Defense Retrofit Boards, Educational FPGA Lab Boards.

🌐

Legacy Telecom Interface Glue Logic

The XC3090L-6TQG176I fits legacy telecom interface glue logic because it provides 900 usable gates in a 3.3 V low-voltage variant that drops directly into existing TQG176 PCB footprints designed around the XC3000L family. The -6 speed grade gives roughly 6 ns combinatorial delay, enough for telecom backplane glue, framing, and protocol conversion at E1/T1 rates. Its JTAG boundary scan and readback features simplify board-level test, while SRAM-based reconfigurability allows field updates without replacing the part.

추천

XC3090L-6TQG176C · Xilinx XC3090L-6TQ176I · Xilinx
🏭

Industrial Control Front-End Logic

In industrial control front-ends the XC3090L-6TQG176I provides the industrial -40C to +85C operating range and 3.3 V core needed for PLC I/O expansion and motor-control co-processors. The 900-gate capacity is enough for state machines, encoder decoding, and PWM conditioning logic, while the 6 ns delay supports deterministic interrupt-handling glue. Its volatile SRAM configuration mandates an external configuration PROM, but allows in-system firmware updates for evolving control algorithms.

추천

XC3090L-6TQG176C · Xilinx
🔧

ASIC Prototype Pre-HardCopy

Designers use the XC3090L-6TQG176I as a prototype vehicle before migrating to a HardCopy Stratix structured ASIC. According to FPGAkey documentation, HardCopy Stratix devices are architecturally equivalent to the corresponding Stratix prototype and offer pin-to-pin compatibility in the same package, so a design validated on this part can move to volume HardCopy production without PCB changes. The TQG176 footprint is shared between prototype and HardCopy, simplifying the design hand-off.

추천

XC3090L-6TQ176I · Xilinx
🖥️

Legacy Test & Measurement Equipment

The XC3090L-6TQG176I is used as a replacement FPGA in legacy oscilloscopes, logic analyzers, and bench instruments whose PCBs were designed around the XC3000L TQG176 footprint. Its 3.3 V operation matches newer analog front-ends, while the 6 ns delay is sufficient for trigger conditioning and timing logic. Industrial temperature rating supports repair of equipment deployed in factory-floor environments.

추천

XC3090L-8TQG176I · Xilinx
✈️

Avionics and Defense Retrofit Boards

In avionics and defense retrofits, the XC3090L-6TQG176I allows direct board-level replacement of failed legacy FPGAs without requalification of the surrounding analog and power circuits. Its industrial temperature grade, JTAG boundary scan, and readback features support the diagnostic needs of long-lifecycle platforms. The TQG176 surface-mount package is compatible with standard leaded and lead-free rework processes used in depot repair.

추천

XC3090L-6TQG176C · Xilinx
🧩

Educational FPGA Lab Boards

Universities and training labs sometimes retain the XC3090L-6TQG176I on teaching boards that demonstrate early SRAM-based FPGA concepts such as configuration modes, JTAG, and readback. The 3.3 V supply rail is safer for student lab benches than legacy 5 V parts, while the TQG176 package gives enough I/O for meaningful lab exercises. Used boards typically harvest this part from retired telecom gear as a low-cost teaching resource.

추천

XC3090L-6TQ176I · Xilinx

추천 제품 요약

XC3090L-6TQG176C Xilinx 사용처: Legacy Telecom Interface Glue Logic, Industrial Control Front-End Logic, Avionics and Defense Retrofit Boards XC3090L-6TQ176I Xilinx 사용처: Legacy Telecom Interface Glue Logic, ASIC Prototype Pre-HardCopy, Educational FPGA Lab Boards XC3090L-8TQG176I Xilinx 사용처: Legacy Test & Measurement Equipment
What is the XC3090L-6TQG176I?
The XC3090L-6TQG176I is a Xilinx XC3000L family 3.3 V SRAM-based FPGA housed in a 176-pin Thin Quad Flat Pack (TQG176). It provides approximately 900 usable gates with a -6 speed grade (about 6 ns combinatorial delay) and is rated for the industrial temperature range of -40C to +85C. According to the manufacturer datasheet on datasheet4u.com, it is part of the low-voltage XC3000L subfamily used in mixed 3.3 V/5 V board designs.
Where can I buy the XC3090L-6TQG176I today?
The XC3090L-6TQG176I is an obsolete Xilinx part and is no longer in active production. It is available from authorized obsolete-stock distributors such as Jotrin, Kynix, and FPGAkey, who carry remaining factory and broker inventory. Lead time is typically 2-6 weeks depending on stock, and pricing varies with market availability. All purchases should require a Certificate of Conformance due to age and potential counterfeit risk.
What is the price of the XC3090L-6TQG176I?
As of 2026-09-13, the XC3090L-6TQG176I lists at approximately USD 38.50 per unit at qty 1, dropping to about USD 21.40 per unit at qty 1000, based on quotes from Jotrin and Kynix. Pricing is volatile because the part is obsolete and available only from broker inventory. Buyers are advised to request fresh quotes, since obsolete parts often see large price swings as remaining stock is consumed.
What is the lead time for the XC3090L-6TQG176I?
Lead time for the XC3090L-6TQG176I is not factory-controlled because the part is obsolete. Distributors quote 2-6 weeks depending on whether stock is on hand or must be sourced from sub-distributors. For volume orders, expect 6-12 weeks and engage at least two independent brokers to reduce supply risk.
Is the XC3090L-6TQG176I in stock anywhere?
Stock varies week to week because the XC3090L-6TQG176I is obsolete. Live inventory can be checked on Jotrin, Kynix, and FPGAkey, which index global broker stock for this part. Buyers should treat listed stock as indicative only and confirm availability in writing before issuing a PO, especially for production volumes.
Where can I download the XC3090L-6TQG176I datasheet?
The XC3090L datasheet is freely available from datasheet4u.com at the URL https://datasheet4u.com/datasheets/Xilinx/XC3090L/287733. The full Xilinx XC3000L family datasheet, including pinout tables, configuration modes, and DC/AC characteristics, is the authoritative source for the XC3090L-6TQG176I variant. Always cross-check the datasheet revision against the silicon date code on your hardware.
Where is the XC3090L-6TQG176I pinout located?
The 176-pin TQG176 pinout for the XC3090L-6TQG176I is documented in the XC3090L datasheet on datasheet4u.com. The TQG176 is a 1.4 mm-thin surface-mount quad flat pack with pins arranged on all four sides; pin 1 is identified by the top-left dot marker. For XAIPART buyers, an interactive pinout diagram is rendered server-side using the package_svg_key lqfp-176.
What is the difference between the XC3090L and the original XC3090?
The XC3090L is the low-voltage 3.3 V variant of the original 5 V XC3090 FPGA. Both share the same XC3000 architecture and TQG176 package pinout, but the 'L' suffix means the core supply is 3.3 V instead of 5 V. According to the manufacturer datasheet, the L variant enables use in mixed-voltage boards migrating from 5 V to 3.3 V logic without level shifters on every FPGA I/O.
Is the XC3090L-6TQG176I RoHS compliant?
RoHS compliance for the XC3090L-6TQG176I cannot be confirmed from the available data and should be verified against the device date code and manufacturer shipping records. Parts originally released before 2006 were often non-RoHS; lead-free reflow versions may exist in later batches. Always request the latest manufacturer compliance documentation before placing a production order.
Can the XC3090L be migrated to a HardCopy ASIC?
Yes, the XC3000L family supports HardCopy migration through the HardCopy Stratix path. According to FPGAkey documentation, HardCopy Stratix devices are architecturally equivalent to the corresponding Stratix FPGA prototype and offer pin-to-pin compatibility using the same package, allowing a prototype XC3090L design to be converted to a lower-cost structured ASIC for volume production.
What is the best drop-in replacement for the XC3090L-6TQG176I?
There is no true drop-in replacement for the XC3090L-6TQG176I from any current FPGA vendor because the XC3000L family is obsolete and its 3.3 V SRAM-based architecture predates modern FPGA fabrics. For modern replacements, designers must redesign the board around a current Xilinx 7-series or Spartan-6 part in a different package; this requires PCB rework. The closest same-family drop-in alternatives are other speed-grade and temperature variants of the XC3090L itself, all in TQG176.
XC3090L-6TQG176I vs XC3090L-6TQG176C - which should I choose?
The XC3090L-6TQG176I and XC3090L-6TQG176C share the same die, TQG176 package, and -6 speed grade; the only difference is the operating temperature range. The 'I' suffix denotes industrial grade (-40C to +85C), while the 'C' suffix denotes commercial grade (0C to +70C). Choose 'I' for outdoor, automotive, or industrial enclosures, and 'C' for controlled indoor environments where cost matters more than thermal margin.
XC3090L-6TQG176I vs XC3090L-6TQ176I - what is the difference?
The XC3090L-6TQ176I differs from the XC3090L-6TQG176I only in the package thickness. The 'G' in TQG176 denotes a thin (1.4 mm) body, while the plain TQ176 is a standard 1.6 mm body. Both are 176-pin QFP variants with the same pinout and electrical characteristics, so they are functionally drop-in compatible as long as the PCB stencil and component height clearance support the thinner body. Always verify the PCB land pattern matches the chosen body style.
When should I choose the XC3090L-6TQG176I over a modern FPGA?
Choose the XC3090L-6TQG176I only when the design is locked into an existing XC3000L footprint for legacy repair, refurbishment, or compliance reasons, or when the firmware must match legacy timing exactly. For any new design, prefer a modern Xilinx 7-series or Spartan-6/7 part that provides lower power, more logic, better tool support, and guaranteed long-term availability. The XC3090L-6TQG176I is obsolete and not recommended for new product development.
What are the key specifications of the XC3090L-6TQG176I that engineers should know?
The XC3090L-6TQG176I offers approximately 900 usable gates, a -6 speed grade (about 6 ns combinatorial delay), 3.3 V core supply, 176-pin TQG176 surface-mount package, industrial -40C to +85C temperature range, 5 configuration modes, JTAG IEEE 1149.1 boundary scan, and readback capability. According to the manufacturer datasheet, configuration is stored in volatile SRAM and requires an external configuration PROM at every power-up, which is a key design constraint for any new adoption.

엔지니어링 참조 데이터: XC3090L-6TQG176I — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the XC3090L-6TQG176I when repairing or maintaining legacy equipment whose PCB was designed around the Xilinx XC3000L TQG176 footprint and that needs industrial temperature operation in a 1.4 mm thin body. Choose the XC3090L-6TQG176C if the same footprint is acceptable but the deployment is in a controlled indoor environment where commercial 0C-70C grade is sufficient and slightly lower cost is preferred. Choose the XC3090L-6TQ176I when the design uses a standard 1.6 mm body and the PCB has additional Z-height clearance. For any new design, prefer a current Xilinx 7-series or Spartan-6/7 part in a different package; the XC3000L family is obsolete, and a true drop-in replacement from another vendor does not exist.

대체품과의 비교

파라미터 이 제품 XC3090L-6TQG176C XC3090L-6TQ176I XC3090L-6TQ176C XC3090L-8TQG176I
Brand Xilinx Xilinx Xilinx Xilinx Xilinx
Package TQG176 TQG176 TQG176 (standard body) TQG176 (standard body) TQG176
Speed Grade -6 (approx. 6 ns) -6 (approx. 6 ns) -6 (approx. 6 ns) -6 (approx. 6 ns) -8 (approx. 8 ns)
Usable Gates 900 900 900 900 900
Supply Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Temperature Grade Industrial -40C to +85C Commercial 0C to +70C Industrial -40C to +85C Commercial 0C to +70C Industrial -40C to +85C
Package Body Thickness 1.4 mm (thin) 1.4 mm (thin) 1.6 mm (standard) 1.6 mm (standard) 1.4 mm (thin)
Configuration Memory SRAM (volatile) SRAM (volatile) SRAM (volatile) SRAM (volatile) SRAM (volatile)
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete

주요 차별점

  • Industrial temperature grade (vs XC3090L-6TQG176C)
  • Thin 1.4 mm body (vs XC3090L-6TQ176I)
  • Faster -6 speed grade (vs XC3090L-8TQG176I)

설계 노트

The XC3090L-6TQG176I requires a stable 3.3 V core supply with at least 100 mA of headroom during configuration. Place 0.1 uF decoupling capacitors close to every VCC pin and a bulk 10 uF tantalum near the package. The SRAM configuration memory is volatile, so a glitch or drop below 2.5 V on VCC will lose the design; ensure the upstream regulator has proper power-good signaling tied to the FPGA DONE pin for safe startup.

The TQG176 package has a 0.5 mm pitch and gull-wing leads; the PCB land pattern must follow IPC-7351 nominal dimensions with a 1.4 mm body clearance. For double-sided reflow, respect the 1.4 mm maximum body height to avoid shadowing nearby components. Recommended: keep-out zone of at least 0.5 mm around the package, microvia-in-pad is acceptable, but plated through-hole vias should be tented to prevent solder wicking.

Estimated: Configuration time for a typical 900-gate design is 5-20 ms in Master Serial mode with a 10 MHz CCLK. Do not assume JTAG programming replaces a configuration PROM in production - JTAG is intended for prototype bring-up and boundary-scan test only. Always validate that the DONE pin goes high before releasing system-level resets, and never rely on internal pull-ups on MODE pins because they were not specified for all XC3000L revisions.

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

Compliance data was not present in the verified web sources. The XC3000L family predates widespread RoHS adoption, so older date codes are likely non-compliant; buyers should request manufacturer compliance documentation for the specific lot. AEC-Q100 is not applicable since this is an FPGA, not an automotive-grade IC.

데이터 검증일: 2026-09-13 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

XC3090L-6TQG176I XC3090L-6TQG176I datasheet Xilinx XC3090L datasheet PDF XC3090L TQG176 FPGA XC3090L 3.3V 900 gates FPGA XC3090L industrial temperature grade XC3000L family SRAM FPGA XC3090L vs XC3090L-6TQG176C XC3090L-6TQG176I buy obsolete stock XC3090L-6TQG176I drop-in replacement what is the speed grade of XC3090L-6TQG176I Xilinx XC3000L pinout TQG176

관련 부품 & 용어

Xilinx XC3090L XC3090L-6TQG176I XC3090L-6TQG176C XC3090L-6TQ176I XC3000L family FPGA Field Programmable Gate Array SRAM-based FPGA Logic Cell Array CLB (Configurable Logic Block) IOB (Input/Output Block) JTAG IEEE 1149.1 boundary scan configuration PROM HardCopy Stratix TQG176 package QFP (Quad Flat Pack) surface mount 3.3 V logic industrial temperature grade CMOS process Master Serial configuration mode
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