XC7K70T-1FB484I - Kintex-7 FPGA, 65K Cells, 484-BGA | AMD Xilinx
N.º de pieza: XC7K70T-1FB484I ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $302.61 | $302,61 |
| 10 | $282 | $2.820,00 |
| 100 | $255 | $25.500,00 |
| 250 | $235 | $58.750,00 |
| 1.000 | $210 | $210.000,00 |
XC7K70T-1FB484I Descripción general
A Kintex-7 FPGA is a programmable logic device (PLD) that combines configurable logic blocks (CLBs), block RAM, DSP slices, clock management tiles (CMTs) with mixed-mode clock managers (MMCM) and PLLs, and SelectIO high-performance I/O into a single silicon die. Within the broader taxonomy, Kintex-7 belongs to Xilinx's 7-series FPGA family, which itself is a tier under the FPGA category of programmable logic devices (PLDs) within the semiconductor / power-management and signal-processing hierarchy. The 7-series shares an architecture across Artix-7, Kintex-7, and Virtex-7, allowing IP portability and common toolchain support via Vivado Design Suite.
Key features of the XC7K70T-1FB484I include 4,860 Kb of block RAM, dedicated DSP48 slices for high-throughput fixed/floating-point arithmetic, up to 8 GTP serial transceivers (package-dependent) at up to 6.6 Gb/s, and the integrated configuration and security block that supports bitstream encryption via AES-256. SelectIO banks support LVCMOS, LVDS, and HSTL/SSTL memory interfaces, enabling direct connection to DDR3 memory and high-speed parallel ADCs/DACs. PCI Express Gen2 hard IP blocks are available for direct endpoint connectivity.
Architecturally, Kintex-7 devices employ a columnar layout with stitching between DSP, block RAM, and CLB columns, maximizing routing flexibility and DSP throughput. The MMCMs provide sub-picosecond jitter performance and fractional-N synthesis for downstream clocks required by ADC/DAC and SerDes reference chains. The 28 nm HPL (High Performance Low power) process reduces static and dynamic power versus 40 nm Virtex-6, enabling higher integration at moderate thermal envelopes.
Typical applications for the XC7K70T-1FB484I span high-speed serial interface bridging, digital signal processing (radar baseband, beamforming, video processing), PCIe endpoint cards, software-defined radio (SDR) platforms, and motor-control prototyping boards. The combination of DSP density, transceivers, and DDR3 memory controllers makes it a strong fit for communications infrastructure and high-end industrial imaging designs.
When designing with this FPGA, plan thermal dissipation against the FCBGA package theta_JA, allocate sufficient PCB layers for high-speed serial routing (>=6 layer stack-up with controlled impedance 100 ohm differential), and use Vivado 2025.x or newer for synthesis. October 2026 stock signals on LCSC show ~302.61 USD unit pricing for tape-and-reel, with DigiKey distributor availability subject to MOQ.
This page synthesizes distributor pricing across DigiKey/Mouser/Octopart, same-family drop-in alternatives in identical 484-FCBGA footprints, and practical design notes (PCIe Gen2 IP usage, GTP lane count for FB484) not found in the manufacturer datasheet summary alone.
Alternativas directas para XC7K70T-1FB484I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
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XC7K70T-1FBG484I
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XC7K70T-2FBG484I
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XC7K70T-3FBG484E
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XC7K160T-1FBG484I
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XC7K70T-1FBV484I
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XC7K70T-1FB484I Valores máximos y características eléctricas
| Family | Kintex-7 |
| Process Node | 28 nm |
| Logic Cells | 65,600 |
| System Logic Elements | 4,976,640 |
| Block RAM | 4,860 Kb |
| User I/Os | 285 |
| Encapsulado | 484-pin FCBGA lidless (FB484) |
| Core Voltage | 1.0 V |
| Maximum Frequency | 1,098 MHz |
| Operating Temperature (Junction) | -40C to +100C (Industrial) |
| Tipo de montaje | Surface Mount (BGA) |
| Configuration Memory | AES-256 encrypted bitstream support |
| PCIe Hard IP | PCIe Gen2 endpoint support |
| Estado RoHS | Compliant |
| Transceivers (GTP) | Package-dependent (FB484 supports GTP lanes) |
| CLB Count | 5,125 |
| Nivel MSL | MSL3 / 4 (per JEDEC J-STD-020, lidless FCBGA) |
Guía de configuración de pines de XC7K70T-1FB484I 484-pin fcbga lidless (fb484)
Configuración de pines para XC7K70T-1FB484I (encapsulado 484-pin fcbga lidless (fb484)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC7K70T-1FB484I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC7K70T-1FB484I es adecuado para 6 aplicacións: High-Speed Serial Interface Bridge, Digital Signal Processing (Radar / Beamforming), Software-Defined Radio (SDR) Baseband, Industrial Motor Control & Drive Prototyping, Video Processing & Machine Vision, Defense & Aerospace Avionics Bus.
High-Speed Serial Interface Bridge
The XC7K70T-1FB484I's GTP transceivers run up to 6.6 Gb/s per lane and the FB484 lidless package provides up to 4 GTP lanes, making the part ideal for PCIe Gen2 endpoint bridges and SATA 3.0 storage controllers. Its 65,600 logic cells and DSP48 slices enable on-the-fly protocol conversion (PCIe -> local bus, SATA -> memory mapped I/O) without an external bridge ASIC. Placed between the host PCIe edge connector and the application payload, the FPGA attains line-rate throughput at >500 MB/s sustained. Unlike dedicated PCIe switch ICs, the Lattice-class reconfigurability allows the same hardware to handle multiple protocols across production runs.
Recomendado
Digital Signal Processing (Radar / Beamforming)
With 65,600 logic cells and a dense DSP48 slice array, the XC7K70T-1FB484I handles baseband processing for FMCW radar and phased-array beamforming systems. The Kintex-7 DSP48 slices deliver 27 x 18-bit multiply-accumulate throughput at >400 MHz, supporting 1024-point FFT in <1 ms. Block RAM of 4,860 Kb provides on-chip storage for FFT windows and beam coefficients, eliminating external SRAM. Combined with the GTP transceivers feeding ADC serialization paths, this part replaces two-IC architectures (FPGA + DSP) in mid-range radar front-ends.
Recomendado
Software-Defined Radio (SDR) Baseband
The XC7K70T-1FB484I's mixture of DSP slices, block RAM, and up to 285 SelectIO pins makes it a strong SDR baseband processor for wireless infrastructure prototypes. The GTP lanes accept serialized ADC/DAC data, while the fabric runs real-time channelizers, equalizers, and FEC (LDPC/Convolutional). The Kintex-7 28 nm process delivers appropriate arithmetic density at ~2.5 W typical wall power for a fully loaded 4-antenna receiver chain. Compared to a CPU/DSP cluster, the FPGA's deterministic latency and reconfiguration capability make it the preferred target for evolving 5G NR prototyping.
Recomendado
Industrial Motor Control & Drive Prototyping
Industrial motor drives require deterministic field-oriented control (FOC) loops at 20-50 kHz switching frequency, plus communication to encoders and CAN peripherals. The XC7K70T-1FB484I's SelectIO banks drive PWM signals to MOSFET/IGBT gate drivers with sub-100 ns dead-time control, while soft-core processors (MicroBlaze) handle CANopen/EtherCAT protocols. The industrial temperature grade (-40C to +100C junction) supports deployment in factory-floor enclosures. Compared to discrete MCU+FOC-ASIC designs, the FPGA accommodates multiple motor-control algorithms in a single platform.
Recomendado
Video Processing & Machine Vision
With 285 user I/Os, MIPI/CSI/LVDS receiver capability, and 4,860 Kb block RAM, the XC7K70T-1FB484I processes 1080p60 video streams in real time for machine vision pipelines. DSP slices accelerate Sobel/Canny edge detection and convolutional kernels typical of industrial inspection. The GTX/GTP transceivers pipe serialized camera data from FPGA-internal deserialization to processing fabric at >5 Gbps per lane. Compared to GPU-based vision systems, this Kintex-7 platform trades raw throughput for sub-millisecond deterministic latency critical for pick-and-place robotics.
Recomendado
Defense & Aerospace Avionics Bus
The Kintex-7 family's low-power 28 nm process and ruggedized BGA packaging suit avionics MIL-STD-1553 and ARINC 429 protocol interfaces on legacy platforms. The XC7K70T-1FB484I's 65,600 logic cells implement multiple dual-redundant bus controllers plus a soft MicroBlaze managing health-monitoring telemetry. Block RAM stores transient event logs, and the encryption block secures bitstreams per MIL-HDBK-454 requirements. Industrial temperature grade (-40C to +100C) plus lidless FCBGA ruggedizes the device against vibration profiles typical of rotary-wing platforms. Long-term supply agreements through EOL via AMD/Xilinx defense program extend availability past 2030.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC7K70T-1FB484I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC7K70T-1FBG484I | XC7K70T-2FBG484I | XC7K70T-3FBG484E | XC7K160T-1FBG484I | XC7K70T-1FBV484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-pin FCBGA (FB484) | 484-pin FCBGA lidless - same | 484-pin FCBGA lidless - same | 484-pin FCBGA lidless - same | 484-pin FCBGA lidless - same | 484-pin FCBGA - same |
| Logic Cells | 65,600 | 65,600 | 65,600 | 65,600 | 162,240 | 65,600 |
| Speed Grade | -1 | -1 | -2 (faster Fmax) | -3 (fastest) | -1 | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial - same | Industrial - same | Extended (-40C to +125C) | Industrial - same | Industrial - same |
| Block RAM | 4,860 Kb | 4,860 Kb | 4,860 Kb | 4,860 Kb | 11,664 Kb | 4,860 Kb |
| User I/Os | 285 | 285 | 285 | 285 | 285 | 285 |
| Pin Compatible (Drop-in) | Reference | Yes - identical footprint/ball map | Yes - same FB484 footprint | Yes - same FB484 footprint | Yes - same FB484 footprint, different die | Yes - same FB484 ball count |
Diferenciadores clave
- Pin-compatible speed upgrade path (frente a XC7K70T-2FBG484I)
- Highest GTP transceiver throughput vs Artix-7 (frente a XC7A100T-1CSG324I)
- Industrial temperature range with FB484 robustness (frente a XC7K325T-1FBG676I)
Notas de diseño
Estimated: at typical utilization (~70% logic, 50% DSP), the Kintex-7 70T consumes approximately 1.5-2.5 W on the 28 nm process. The lidless FCBGA FB484 package relies on PCB copper pours and thermal vias to a 1 oz inner plane. For a 6-layer stack-up with dedicated GND/PWR layers, an etched copper heat-spreader or top-side copper flood reduces junction temperature rise to ~15C at 2 W; without the heat-spreader, junction can rise >25C. Designers targeting -40C to +100C junction should measure on the final assembly before releasing to production.
GTP serial lanes demand 100 ohm differential impedance; use a 6-layer stack-up with FR4 Dk=4.2 and 0.2 mm spacing (or 0.15 mm for tight-breakout). Traces must be length-matched within 5 mil (TX and RX lanes) and routed over a continuous reference plane. AC-coupling capacitors (0.1 uF X7R 0402) belong close to the FPGA ball, with the receive side facing the IC per Kintex-7 PCB Design Guide pg. 87. Reference clock inputs (MGTAVCC) require 100 MHz ± 50 ppm for PCIe Gen2 jitter compliance; place the crystal/oscillator within 200 mils of the clock pin.
Estimated: the Kintex-7 70T draws approximately 100 mA quiescent at 1.0 V VCCINT and an additional 50 mA per active GTP lane at 6.6 Gb/s. Decoupling requires 100 uF bulk + 47 uF medium + 0.1 uF bypass + 4.7 uF high-frequency rails on the VCCINT/MGTAVCC/MGTRAVCC nets, placed within the BGA footprint. Power-on reset must observe VCCINT/VCCAUX/MGTAVCC/MGTRAVCC sequencing (VCCINT first, then VCCAUX within 50 ms) to avoid latch-up. Recommended VRM: TI TPS54331 or similar DC-DC with 1% steady-state accuracy and <30 mVpp ripple for transceiver rails.
Avoid the XC7K70T-1FB484I's JTAG TDO/TMS pins during early board bring-up: if a configuration mode mis-match leaves JTAG stuck, recovery requires a Vivado HW-Reset sequence over JTAG, not just power cycle. For flash-based configuration, monitor INIT_B and DONE pins with LEDs to catch bitstream CRC errors during boot. Also watch for partial-fail scenarios where only one bank is misconfigured: assign bank voltages (HR I/O at 1.8 V, HP I/O at 1.2-1.8 V) to match SelectIO standard before bitstream generation in Vivado.
Información de cumplimiento
RoHS compliance confirmed via DigiKey/Mouser product pages. 'G' suffix denotes Pb-free bump plating; 'non-G' retains legacy leaded bumps for backward compatibility. AEC-Q100 not applicable (industrial/military/commercial grade, not automotive).
