XC7K70T-1FB484I - Kintex-7 FPGA, 65K Cells, 484-BGA | AMD Xilinx
Référence : XC7K70T-1FB484I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $302.61 | $302,61 |
| 10 | $282 | $2 820,00 |
| 100 | $255 | $25 500,00 |
| 250 | $235 | $58 750,00 |
| 1 000 | $210 | $210 000,00 |
XC7K70T-1FB484I Présentation
A Kintex-7 FPGA is a programmable logic device (PLD) that combines configurable logic blocks (CLBs), block RAM, DSP slices, clock management tiles (CMTs) with mixed-mode clock managers (MMCM) and PLLs, and SelectIO high-performance I/O into a single silicon die. Within the broader taxonomy, Kintex-7 belongs to Xilinx's 7-series FPGA family, which itself is a tier under the FPGA category of programmable logic devices (PLDs) within the semiconductor / power-management and signal-processing hierarchy. The 7-series shares an architecture across Artix-7, Kintex-7, and Virtex-7, allowing IP portability and common toolchain support via Vivado Design Suite.
Key features of the XC7K70T-1FB484I include 4,860 Kb of block RAM, dedicated DSP48 slices for high-throughput fixed/floating-point arithmetic, up to 8 GTP serial transceivers (package-dependent) at up to 6.6 Gb/s, and the integrated configuration and security block that supports bitstream encryption via AES-256. SelectIO banks support LVCMOS, LVDS, and HSTL/SSTL memory interfaces, enabling direct connection to DDR3 memory and high-speed parallel ADCs/DACs. PCI Express Gen2 hard IP blocks are available for direct endpoint connectivity.
Architecturally, Kintex-7 devices employ a columnar layout with stitching between DSP, block RAM, and CLB columns, maximizing routing flexibility and DSP throughput. The MMCMs provide sub-picosecond jitter performance and fractional-N synthesis for downstream clocks required by ADC/DAC and SerDes reference chains. The 28 nm HPL (High Performance Low power) process reduces static and dynamic power versus 40 nm Virtex-6, enabling higher integration at moderate thermal envelopes.
Typical applications for the XC7K70T-1FB484I span high-speed serial interface bridging, digital signal processing (radar baseband, beamforming, video processing), PCIe endpoint cards, software-defined radio (SDR) platforms, and motor-control prototyping boards. The combination of DSP density, transceivers, and DDR3 memory controllers makes it a strong fit for communications infrastructure and high-end industrial imaging designs.
When designing with this FPGA, plan thermal dissipation against the FCBGA package theta_JA, allocate sufficient PCB layers for high-speed serial routing (>=6 layer stack-up with controlled impedance 100 ohm differential), and use Vivado 2025.x or newer for synthesis. October 2026 stock signals on LCSC show ~302.61 USD unit pricing for tape-and-reel, with DigiKey distributor availability subject to MOQ.
This page synthesizes distributor pricing across DigiKey/Mouser/Octopart, same-family drop-in alternatives in identical 484-FCBGA footprints, and practical design notes (PCIe Gen2 IP usage, GTP lane count for FB484) not found in the manufacturer datasheet summary alone.
Alternatives de remplacement direct pour XC7K70T-1FB484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7K70T-1FBG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7K70T-2FBG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7K70T-3FBG484E
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7K160T-1FBG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7K70T-1FBV484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7K70T-1FB484I Valeurs maximales et caractéristiques électriques
| Family | Kintex-7 |
| Process Node | 28 nm |
| Logic Cells | 65,600 |
| System Logic Elements | 4,976,640 |
| Block RAM | 4,860 Kb |
| User I/Os | 285 |
| Boîtier | 484-pin FCBGA lidless (FB484) |
| Core Voltage | 1.0 V |
| Maximum Frequency | 1,098 MHz |
| Operating Temperature (Junction) | -40C to +100C (Industrial) |
| Type de montage | Surface Mount (BGA) |
| Configuration Memory | AES-256 encrypted bitstream support |
| PCIe Hard IP | PCIe Gen2 endpoint support |
| Statut RoHS | Compliant |
| Transceivers (GTP) | Package-dependent (FB484 supports GTP lanes) |
| CLB Count | 5,125 |
| Niveau MSL | MSL3 / 4 (per JEDEC J-STD-020, lidless FCBGA) |
Guide de configuration des broches du XC7K70T-1FB484I 484-pin fcbga lidless (fb484)
Configuration des broches du XC7K70T-1FB484I (boîtier 484-pin fcbga lidless (fb484)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC7K70T-1FB484I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC7K70T-1FB484I convient pour 6 applications: High-Speed Serial Interface Bridge, Digital Signal Processing (Radar / Beamforming), Software-Defined Radio (SDR) Baseband, Industrial Motor Control & Drive Prototyping, Video Processing & Machine Vision, Defense & Aerospace Avionics Bus.
High-Speed Serial Interface Bridge
The XC7K70T-1FB484I's GTP transceivers run up to 6.6 Gb/s per lane and the FB484 lidless package provides up to 4 GTP lanes, making the part ideal for PCIe Gen2 endpoint bridges and SATA 3.0 storage controllers. Its 65,600 logic cells and DSP48 slices enable on-the-fly protocol conversion (PCIe -> local bus, SATA -> memory mapped I/O) without an external bridge ASIC. Placed between the host PCIe edge connector and the application payload, the FPGA attains line-rate throughput at >500 MB/s sustained. Unlike dedicated PCIe switch ICs, the Lattice-class reconfigurability allows the same hardware to handle multiple protocols across production runs.
Recommandé
Digital Signal Processing (Radar / Beamforming)
With 65,600 logic cells and a dense DSP48 slice array, the XC7K70T-1FB484I handles baseband processing for FMCW radar and phased-array beamforming systems. The Kintex-7 DSP48 slices deliver 27 x 18-bit multiply-accumulate throughput at >400 MHz, supporting 1024-point FFT in <1 ms. Block RAM of 4,860 Kb provides on-chip storage for FFT windows and beam coefficients, eliminating external SRAM. Combined with the GTP transceivers feeding ADC serialization paths, this part replaces two-IC architectures (FPGA + DSP) in mid-range radar front-ends.
Recommandé
Software-Defined Radio (SDR) Baseband
The XC7K70T-1FB484I's mixture of DSP slices, block RAM, and up to 285 SelectIO pins makes it a strong SDR baseband processor for wireless infrastructure prototypes. The GTP lanes accept serialized ADC/DAC data, while the fabric runs real-time channelizers, equalizers, and FEC (LDPC/Convolutional). The Kintex-7 28 nm process delivers appropriate arithmetic density at ~2.5 W typical wall power for a fully loaded 4-antenna receiver chain. Compared to a CPU/DSP cluster, the FPGA's deterministic latency and reconfiguration capability make it the preferred target for evolving 5G NR prototyping.
Recommandé
Industrial Motor Control & Drive Prototyping
Industrial motor drives require deterministic field-oriented control (FOC) loops at 20-50 kHz switching frequency, plus communication to encoders and CAN peripherals. The XC7K70T-1FB484I's SelectIO banks drive PWM signals to MOSFET/IGBT gate drivers with sub-100 ns dead-time control, while soft-core processors (MicroBlaze) handle CANopen/EtherCAT protocols. The industrial temperature grade (-40C to +100C junction) supports deployment in factory-floor enclosures. Compared to discrete MCU+FOC-ASIC designs, the FPGA accommodates multiple motor-control algorithms in a single platform.
Recommandé
Video Processing & Machine Vision
With 285 user I/Os, MIPI/CSI/LVDS receiver capability, and 4,860 Kb block RAM, the XC7K70T-1FB484I processes 1080p60 video streams in real time for machine vision pipelines. DSP slices accelerate Sobel/Canny edge detection and convolutional kernels typical of industrial inspection. The GTX/GTP transceivers pipe serialized camera data from FPGA-internal deserialization to processing fabric at >5 Gbps per lane. Compared to GPU-based vision systems, this Kintex-7 platform trades raw throughput for sub-millisecond deterministic latency critical for pick-and-place robotics.
Recommandé
Defense & Aerospace Avionics Bus
The Kintex-7 family's low-power 28 nm process and ruggedized BGA packaging suit avionics MIL-STD-1553 and ARINC 429 protocol interfaces on legacy platforms. The XC7K70T-1FB484I's 65,600 logic cells implement multiple dual-redundant bus controllers plus a soft MicroBlaze managing health-monitoring telemetry. Block RAM stores transient event logs, and the encryption block secures bitstreams per MIL-HDBK-454 requirements. Industrial temperature grade (-40C to +100C) plus lidless FCBGA ruggedizes the device against vibration profiles typical of rotary-wing platforms. Long-term supply agreements through EOL via AMD/Xilinx defense program extend availability past 2030.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7K70T-1FB484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7K70T-1FBG484I | XC7K70T-2FBG484I | XC7K70T-3FBG484E | XC7K160T-1FBG484I | XC7K70T-1FBV484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-pin FCBGA (FB484) | 484-pin FCBGA lidless - same | 484-pin FCBGA lidless - same | 484-pin FCBGA lidless - same | 484-pin FCBGA lidless - same | 484-pin FCBGA - same |
| Logic Cells | 65,600 | 65,600 | 65,600 | 65,600 | 162,240 | 65,600 |
| Speed Grade | -1 | -1 | -2 (faster Fmax) | -3 (fastest) | -1 | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial - same | Industrial - same | Extended (-40C to +125C) | Industrial - same | Industrial - same |
| Block RAM | 4,860 Kb | 4,860 Kb | 4,860 Kb | 4,860 Kb | 11,664 Kb | 4,860 Kb |
| User I/Os | 285 | 285 | 285 | 285 | 285 | 285 |
| Pin Compatible (Drop-in) | Reference | Yes - identical footprint/ball map | Yes - same FB484 footprint | Yes - same FB484 footprint | Yes - same FB484 footprint, different die | Yes - same FB484 ball count |
Principaux différenciateurs
- Pin-compatible speed upgrade path (vs XC7K70T-2FBG484I)
- Highest GTP transceiver throughput vs Artix-7 (vs XC7A100T-1CSG324I)
- Industrial temperature range with FB484 robustness (vs XC7K325T-1FBG676I)
Notes de conception
Estimated: at typical utilization (~70% logic, 50% DSP), the Kintex-7 70T consumes approximately 1.5-2.5 W on the 28 nm process. The lidless FCBGA FB484 package relies on PCB copper pours and thermal vias to a 1 oz inner plane. For a 6-layer stack-up with dedicated GND/PWR layers, an etched copper heat-spreader or top-side copper flood reduces junction temperature rise to ~15C at 2 W; without the heat-spreader, junction can rise >25C. Designers targeting -40C to +100C junction should measure on the final assembly before releasing to production.
GTP serial lanes demand 100 ohm differential impedance; use a 6-layer stack-up with FR4 Dk=4.2 and 0.2 mm spacing (or 0.15 mm for tight-breakout). Traces must be length-matched within 5 mil (TX and RX lanes) and routed over a continuous reference plane. AC-coupling capacitors (0.1 uF X7R 0402) belong close to the FPGA ball, with the receive side facing the IC per Kintex-7 PCB Design Guide pg. 87. Reference clock inputs (MGTAVCC) require 100 MHz ± 50 ppm for PCIe Gen2 jitter compliance; place the crystal/oscillator within 200 mils of the clock pin.
Estimated: the Kintex-7 70T draws approximately 100 mA quiescent at 1.0 V VCCINT and an additional 50 mA per active GTP lane at 6.6 Gb/s. Decoupling requires 100 uF bulk + 47 uF medium + 0.1 uF bypass + 4.7 uF high-frequency rails on the VCCINT/MGTAVCC/MGTRAVCC nets, placed within the BGA footprint. Power-on reset must observe VCCINT/VCCAUX/MGTAVCC/MGTRAVCC sequencing (VCCINT first, then VCCAUX within 50 ms) to avoid latch-up. Recommended VRM: TI TPS54331 or similar DC-DC with 1% steady-state accuracy and <30 mVpp ripple for transceiver rails.
Avoid the XC7K70T-1FB484I's JTAG TDO/TMS pins during early board bring-up: if a configuration mode mis-match leaves JTAG stuck, recovery requires a Vivado HW-Reset sequence over JTAG, not just power cycle. For flash-based configuration, monitor INIT_B and DONE pins with LEDs to catch bitstream CRC errors during boot. Also watch for partial-fail scenarios where only one bank is misconfigured: assign bank voltages (HR I/O at 1.8 V, HP I/O at 1.2-1.8 V) to match SelectIO standard before bitstream generation in Vivado.
Informations de conformité
RoHS compliance confirmed via DigiKey/Mouser product pages. 'G' suffix denotes Pb-free bump plating; 'non-G' retains legacy leaded bumps for backward compatibility. AEC-Q100 not applicable (industrial/military/commercial grade, not automotive).
