XDPE12284C0000XUMA1 - 8-Phase Digital Multi-phase Controller | Infineon
N.º de pieza: XDPE12284C0000XUMA1 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.03 | $5,03 |
| 10 | $4.78 | $47,80 |
| 100 | $4.42 | $442,00 |
| 500 | $4.05 | $2.025,00 |
| 1.000 | $3.72 | $3.720,00 |
XDPE12284C0000XUMA1 Descripción general
A multi-phase buck controller is a power-management IC that drives several parallel switching phases to deliver high output current with low ripple and excellent thermal distribution. By interleaving the phases, the effective switching frequency seen at the load is multiplied, shrinking the output inductor and capacitor count. The XDPE12284C falls within the broader hierarchy: multi-phase controller → buck controller → DC-DC controller → power management IC → semiconductor device.
Key features include SVID rev 1.9.1 protocol compliance for digital communication with the CPU, a PMBus rev 1.3 compliant serial interface for telemetry and programming, dual-loop control for independent rail optimization, and integrated protection such as OVP, OCP, UVP, and OTP. The device supports adaptive voltage positioning and dynamic phase shedding to maximize efficiency across load conditions.
The XDPE12284C uses a digital state-machine architecture with an embedded microcontroller for non-volatile configuration and in-circuit telemetry. The 8-phase capability and per-phase current balancing allow it to scale from 60 A server rails up to 600 A HPC accelerator boards. Telemetry through PMBus provides real-time current, voltage, temperature, and fault data for system-level power-capping.
Typical applications include VR13/IMVP9 server core rails, AI accelerator POL converters, GPU core power, DDR5 memory VPP rails (with appropriate configuration), and high-end workstation motherboards. Industrial variants extend deployment to telecom equipment and ruggedized computing platforms.
When designing with this controller, follow Infineon's reference-design PCB layout guidelines for the 40-QFN exposed pad. The exposed pad must be soldered to a sufficiently large copper pour for thermal and electrical ground. PMBus address selection resistors and SVID bus pull-ups must be placed close to the controller. Use Infineon-validated DrMOS devices (e.g., TDA38826) for best transient performance.
This page synthesizes distributor pricing, datasheet specifications, drop-in alternative analysis, and practical design notes not collected on a single manufacturer page.
Alternativas directas para XDPE12284C0000XUMA1 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con XDPE12284C0000XUMA1 (mismo factor de forma y huella) — difiere en Package, Topology, Number of Phases, Operating Temperature, Output Voltage Range.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
XDPE12284D0000XUMA1
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XDPP1148100BXUMA1
✅ Sustitución directa✓ En stock
$5.25 / unidad
Ver hoja de datos →XDPP1140100BXUMA1
✅ Sustitución directa✓ En stock
$4.2 / unidad
Ver hoja de datos →XDPE132G
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
TDA38826XUMA1
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2.4 / unidad
Ver hoja de datos →XDPE12284C0000XUMA1 Valores máximos y características eléctricas
| Topología | Digital Multi-phase Buck Controller |
| Number of Phases | 8 (dual-loop) |
| Rango de tensión de salida | 0.2 V to 3.04 V |
| Número de salidas | 2 (dual output) |
| Protocol Compliance | Intel VR13, VR13HC rev 1.3, IMVP8 rev 1.2, IMVP9 rev 1.3 |
| SVID Interface | SVID rev 1.9.1 compliant |
| PMBus Interface | PMBus rev 1.3 compliant |
| Encapsulado | 40-QFN (5x5 mm) |
| Tipo de montaje | Surface Mount |
| Product Family | XDP™ digital multiphase controllers |
| Estado RoHS | Compliant |
| Temperatura de funcionamiento | -40 C to +125 C (industrial) |
| Application Segment | Industrial / Server / HPC |
| Protection Features | OVP, OCP, UVP, OTP |
| Configuration Memory | Non-volatile on-chip |
Guía de configuración de pines de XDPE12284C0000XUMA1 40-qfn (5x5 mm)
Configuración de pines para XDPE12284C0000XUMA1 (encapsulado 40-qfn (5x5 mm)). Este dispositivo de potencia presenta terminales de puerta, drenador y fuente. Para encapsulados no polarizados, consulte la hoja de datos del fabricante para conocer la orientación exacta del pin 1 y los detalles del footprint. Las aplicaciones habituales incluyen el diseño de fuentes de alimentación, el accionamiento de motores y la conmutación de cargas.
No hay datos detallados de patillaje disponibles para XDPE12284C0000XUMA1.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XDPE12284C0000XUMA1 es adecuado para 6 aplicacións: Intel VR13 Server Core Rail, AI Accelerator / GPU POL Converter, Workstation Motherboard Vcore Supply, DDR5 Memory VPP Rail, Telecom and Industrial Computing, HPC and Hyperscale Server Boards.
Intel VR13 Server Core Rail
The XDPE12284C is purpose-built for Intel VR13 and VR13HC rev 1.3 server platforms, driving CPU Vcore rails up to several hundred amps. Its 8-phase dual-loop architecture with SVID rev 1.9.1 compliance enables direct communication with Intel Xeon-class processors without external translation logic. With 0.2 V to 3.04 V output range and integrated OVP/OCP/UVP/OTP, it delivers robust power for multi-socket server boards where reliability and telemetry via PMBus rev 1.3 are essential for power-capping and platform management.
Recomendado
AI Accelerator / GPU POL Converter
The XDPE12284C's 8-phase capability and per-phase current balancing suit AI accelerator and high-end GPU point-of-load conversion where peak currents exceed 400 A. Its 0.2 V minimum output supports modern FinFET core domains, while PMBus telemetry delivers real-time voltage, current, and temperature data for accelerator power-capping algorithms. The 40-QFN 5x5 mm package allows dense placement adjacent to large GPU packages on HPC accelerator boards, where every square millimeter of PCB matters.
Recomendado
Workstation Motherboard Vcore Supply
For high-end desktop and workstation motherboards, the XDPE12284C provides a single-IC dual-rail solution: 6+2 phase allocation delivers CPU Vcore plus an integrated GPU or auxiliary rail. Its SVID rev 1.9.1 compliance ensures handshake with consumer-grade Intel CPUs that expect VR13 signaling, while PMBus rev 1.3 enables motherboard management firmware to monitor load. Compared to using two single-loop controllers, the XDPE12284C reduces BOM count, PCB area, and firmware complexity.
Recomendado
DDR5 Memory VPP Rail
With its dual-loop configuration and 0.2 V to 3.04 V output range, the XDPE12284C can be configured to deliver the DDR5 VPP rail (typically 1.8 V) alongside a CPU Vcore loop. The 40-QFN package fits into the memory VR area of server motherboards without forcing layout compromises. PMBus telemetry on VPP current enables per-DIMM power-budget tracking, which is increasingly required for hyperscale memory power optimization.
Recomendado
Telecom and Industrial Computing
The XDPE12284C's industrial-grade -40 C to +125 C junction rating and 8-phase dual-loop architecture suit telecom base-station compute blades and ruggedized edge servers. Its PMBus rev 1.3 interface integrates with BTS supervisory processors for remote monitoring in unmanned sites. According to Infineon's industrial-grade certification, the part meets the extended temperature and reliability requirements for outdoor telecom enclosures and industrial-control cabinets.
Recomendado
HPC and Hyperscale Server Boards
For hyperscale data centers, the XDPE12284C's 8-phase dual-loop design supports the high-current demands of multi-socket CPU boards where total platform current exceeds 800 A. Its PMBus rev 1.3 telemetry feeds platform-level power-management controllers that enforce data-center PUE targets. The 40-QFN package and exposed-pad thermal design enable sustained operation at high ambient temperatures in densely populated 1U/2U rack-mount chassis.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XDPE12284C0000XUMA1 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XDPE12284D0000XUMA1 | XDPP1148100BXUMA1 | XDPP1140100BXUMA1 |
|---|---|---|---|---|
| Package | 40-QFN (5x5 mm) | 40-QFN (5x5 mm) - same | 40-QFN (5x5 mm) - same | 40-QFN (5x5 mm) - same |
| Brand | Infineon | Infineon | Infineon | Infineon |
| Phase Count | 8 (dual-loop) | 8 (dual-loop) - same | 8+ - same family | 6 - fewer phases |
| Output Voltage Range | 0.2 V to 3.04 V | 0.2 V to 3.04 V - same | 0.25 V to 3.04 V - similar | 0.25 V to 3.04 V - similar |
| Protocol | VR13/IMVP9, SVID rev 1.9.1 | VR13/IMVP9 - same | VR14/IMVP9.1 - newer | VR14/IMVP9.1 - newer |
| PMBus Compliance | PMBus rev 1.3 | PMBus rev 1.3 - same | PMBus rev 1.3 - same | PMBus rev 1.3 - same |
| Application Segment | Industrial / Server | Industrial / Server - same | Server / HPC | Server / HPC |
| Drop-in Compatibility | Reference | 100% drop-in | Pin-compatible with firmware update | Pin-compatible with firmware update |
Diferenciadores clave
- Dual-loop architecture in single IC (frente a XDPE12284D0000XUMA1)
- Highest phase count in XDP family for VR13 (frente a XDPE132G)
- Newer XDPP1100 series with VR14 forward compatibility (frente a XDPP1148100BXUMA1)
Notas de diseño
The 40-QFN exposed pad must be soldered to a continuous ground pour of at least 25 mm² to meet thermal and electrical grounding requirements. Place input capacitors for each DrMOS within 5 mm of the power-stage VIN/SVIN pins to minimize switching-loop inductance. Keep the controller's PWM traces short and matched in length (within 1 mm) to all eight phases to prevent pulse-width distortion. Use 4-layer PCB minimum with a dedicated ground plane under the controller for clean reference and noise immunity.
Estimated: at full 8-phase operation driving 500 A into a 1.0 V rail from 12 V input, controller-side power dissipation is roughly 0.5 W (excluding DrMOS stages). With 40-QFN theta_JA around 35 C/W on a 4-layer board, junction rise is approximately 17 C above ambient. Ensure the surrounding airflow maintains ambient below 85 C to keep Tj under the 125 C limit. The exposed-pad copper area is the dominant thermal path; do not rely on package leads alone for heat removal.
Do not assume XDPE12284C is pin-compatible with non-Infineon controllers in the same QFN-40 footprint; SVID and PMBus pin assignments are vendor-specific. Always verify boot-mode strapping resistors (SVD, ADDR, CONFIG) against the datasheet table; incorrect strapping prevents SVID handshake with the CPU. When migrating from XDPE132 to XDPE12284C, update your firmware image because the PMBus command set differs. Finally, ensure PMBus pull-ups are sized for the full bus capacitance; large backplanes may require stronger pull-ups than the 10 kohm default.
The SVID clock and data lines run at high speed and require 50 ohm controlled-impedance routing with ground reference. Place the SVID pull-up resistors near the controller, not at the CPU end, to ensure clean rising edges. For PMBus, isolate the bus with a buffer if the XDPE12284C is more than 50 mm from the system management controller. Series-termination resistors (22-33 ohm) on PWM outputs reduce ringing into the DrMOS inputs at full 8-phase switching.
Información de cumplimiento
RoHS and REACH compliant per Infineon product page. Industrial-grade -40 C to +125 C; not AEC-Q100 qualified. Lead-free and halogen-free per Infineon material declaration.
