10M40SAE144C8G - 40K LE MAX 10 FPGA, 144-EQFP, 8 Transceivers | Intel
MPN: 10M40SAE144C8G ✓ فعال10M40SAE144C8G نمای کلی
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from configurable logic blocks (CLBs), programmable interconnects, and embedded memory/DSP slices that the designer can reconfigure after manufacture. FPGAs sit in the digital IC hierarchy as programmable logic -> programmable IC -> digital logic IC -> integrated circuit. The MAX 10 family specifically adds a non-volatile flash configuration cell and an integrated ADC, blurring the line between FPGA and microcontroller+glue-logic designs.
Key features include instant-on non-volatile configuration, an integrated 12-bit SAR ADC up to 1 MSa/s, 101 user I/O, dual-purpose configuration pins, 3.3 V LVCMOS/LVTTL support, and a hardened Nios II-ready embedded block. The 10M40 variant targets cost-sensitive, high-volume applications that still require substantial logic, DSP, and memory resources without an external configuration memory device.
Architecturally, the 10M40SAE144C8G uses Altera/Intel's low-power 55 nm embedded-flash process. Logic elements are organized into Logic Array Blocks (LABs) of 16, and 18x18 multipliers feed dedicated DSP blocks. The non-volatile configuration memory eliminates boot-time delay and provides field-upgradeable bitstream storage inside the part.
Typical applications include industrial machine vision and motor control, factory automation PLCs, video bridging and image processing, low-cost software-defined radio front ends, and automotive infotainment subsystems. The integrated ADC and DSP blocks are particularly attractive for sensor fusion and closed-loop control designs.
When designing with this device, pay close attention to LVDS/PCB-layout constraints (impedance-controlled differential pairs) and ensure the exposed pad is soldered to a sufficiently large ground copper pour to meet the device's thermal envelope. Quartus Prime Prime Lite is the free toolchain that supports this part family.
This page synthesizes distributor pricing, drop-in same-package alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet alone.
جایگزین‌های drop-in برای 10M40SAE144C8G — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای 10M40SAE144C8G (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Configuration Memory, Operating Temperature, Package, Speed Grade, Logic Elements.
10M40SAE144I7G
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشدهبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10M40DAE144C8G
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشده📋 جایگزین مرجع (خارج از کاتالوگ)
10M25SAE144C8G
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشدهبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10M25DAE144C8G
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشده📋 جایگزین مرجع (خارج از کاتالوگ)
10M16SAE144C8G
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشدهبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10M40SAE144C8G حداکثر مقادیر مجاز و مشخصات الکتریکی
| Series | MAX 10 |
| Logic Elements (LE) | 40,000 |
| Embedded Memory (bits) | 1,290,240 |
| M9K Memory Blocks | 51 |
| 18x18 Multipliers | 156 |
| User I/O Count | 101 |
| بسته‌بندی | 144-EQFP (LQFP with exposed pad), 22x22 mm, 0.50 mm pitch |
| نوع نصب | Surface Mount |
| دمای کاری | 0C to +85C (commercial) |
| Speed Grade | C8 |
| Logic Level | 3.3 V LVCMOS/LVTTL |
| Configuration Memory | Internal non-volatile flash (single-chip instant-on) |
| وضعیت RoHS | Compliant |
| سطح MSL | 3 |
| Transceivers (GXB) | 8 |
| Integrated ADC | 12-bit SAR, up to 1 MSa/s |
راهنمای پیکربندی پین 10M40SAE144C8G 144-eqfp (lqfp with exposed pad), 22x22 mm, 0.50 mm pitch
پیکربندی پین برای 10M40SAE144C8G (پکیج 144-eqfp (lqfp with exposed pad), 22x22 mm, 0.50 mm pitch). این IC دیجیتال شامل GPIO، رابط‌های ارتباطی (UART، SPI، I2C) و پین‌های تغذیه است. برای عملکردهای جایگزین پین و گزینه‌های پیکربندی به دیتاشیت سازنده مراجعه کنید. ضروری برای طراحی سیستم‌های نهفته و چیدمان PCB.
داده پین‌آوت تفصیلی موجود نیست برای 10M40SAE144C8G.
به دیتاشیت برای پیکربندی کامل پین‌ها.
کاربردهای معمول
10M40SAE144C8G مناسب است برای 6 کاربردs: Industrial Motor Control & Drive, Machine Vision & Image Processing, Factory Automation PLCs, Software-Defined Radio Front End, Video Bridging & Display Processing, Automotive Infotainment Subsystems.
Industrial Motor Control & Drive
The 10M40SAE144C8G is ideal for industrial motor-control and servo-drive designs. Its 156 18x18 hardware multipliers run field-oriented control (FOC) loops with sub-microsecond cycle times, and the integrated 12-bit 1 MSa/s SAR ADC samples current/voltage feedback directly without an external ADC. The 8 GXB transceivers handle industrial Ethernet such as EtherCAT or Profinet over LVDS, while 101 user I/Os drive gate-driver PWM signals. Non-volatile instant-on configuration lets the drive boot in <10 ms after power-up, critical for safety-rated systems where predictable startup matters.
پیشنهادی
Machine Vision & Image Processing
In machine-vision pipelines, the 10M40SAE144C8G combines 1.29 Mbit of embedded SRAM (51 M9K blocks) with 156 18x18 multipliers to deliver real-time image preprocessing - convolution, thresholding, and edge detection - directly in fabric. The 8 GXB channels receive MIPI-CSI-2 or sub-LVDS image-sensor data at up to 6.144 Gbps, while 101 user I/Os interface with the host SoC over parallel CMOS or LVDS. Designers save a discrete FPGA + companion image processor and shrink their BOM by integrating the ADC and configuration memory on-chip.
پیشنهادی
Factory Automation PLCs
The 10M40SAE144C8G is a strong fit for high-end factory automation PLCs where deterministic, non-volatile configuration and integrated analog are required. The 40K-LE fabric hosts IEC 61131-3 logic plus custom motion-control and protocol stacks, while the 12-bit ADC samples thermocouple/4-20 mA inputs. 8 GXB transceivers support industrial Ethernet uplinks, and 101 user I/Os drive 24V optically-isolated outputs. Single-chip non-volatile boot removes the PLC's need for an external configuration PROM, reducing both board area and field-update complexity.
پیشنهادی
Software-Defined Radio Front End
For software-defined radio (SDR) front-end processing - I/Q decimation, channelization, and digital downconversion - the 10M40SAE144C8G delivers 156 multipliers and 1.29 Mbit SRAM, enough for a 4-channel DDC at 100 MHz input. The 8 GXB transceivers accept ADC samples over LVDS at multi-gigabit rates, while 101 user I/Os interface with the host DSP or CPU. Designers can prototype 4G/5G small-cell baseband or test-and-measurement receivers on the MAX 10 fabric before porting to a higher-cost Cyclone V/10 SoC.
پیشنهادی
Video Bridging & Display Processing
The 10M40SAE144C8G fits video-bridging applications such as HDMI-to-LVDS conversion, frame-rate conversion, and overlay mixing. Its 1.29 Mbit embedded SRAM buffers multiple lines of 1080p video, and 156 multipliers scale and rotate images in real time. The 8 GXB channels receive HDMI-derived FRL or high-speed LVDS streams, while 101 user I/Os drive parallel RGB or MIPI-DSI to the panel. Designers use the integrated ADC for backlight and ambient-light sensing, all in a single non-volatile chip.
پیشنهادی
Automotive Infotainment Subsystems
Although the C8 commercial speed-grade is not automotive-qualified, the 10M40SAE144C8G and its I7 industrial sibling are commonly designed into pre-production automotive infotainment prototypes. The 40K-LE fabric handles audio DSP, CAN/LIN bridging, and rear-seat entertainment handoff, while 8 GXB transceivers route LVDS to the central head-unit display. Designers use the integrated 12-bit ADC to monitor temperature and supply rails. For production automotive builds, migrate to the AEC-Q100-grade Cyclone IV or Cyclone V families.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای 10M40SAE144C8G — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | 10M40SAE144I7G | 10M40DAE144C8G | 10M25SAE144C8G | 10M25DAE144C8G | 10M16SAE144C8G |
|---|---|---|---|---|---|---|
| Package | 144-EQFP (E144) 22x22 mm | 144-EQFP (E144) - same | 144-EQFP (E144) - same | 144-EQFP (E144) - same | 144-EQFP (E144) - same | 144-EQFP (E144) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 40,000 | 40,000 | 40,000 | 25,000 | 25,000 | 16,000 |
| 18x18 Multipliers | 156 | 156 | 156 | 66 | 66 | 56 |
| GXB Transceivers | 8 | 8 | 0 | 8 | 0 | 8 |
| User I/O | 101 | 101 | 101 | 101 | 101 | 101 |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Integrated ADC | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s |
| Configuration Memory | Internal non-volatile flash | Internal non-volatile flash | Internal non-volatile flash | Internal non-volatile flash | Internal non-volatile flash | Internal non-volatile flash |
تفاوت‌های کلیدی
- Highest logic density available in MAX 10 family (در مقابل10M25SAE144C8G)
- 8 GXB transceiver channels in the 144-EQFP package (در مقابل10M40DAE144C8G)
- Industrial -40C to +100C temperature grade option (در مقابل10M40SAE144I7G)
یادداشت‌های طراحی
The 144-EQFP package has 0.50 mm pitch leads and an exposed thermal pad that must be soldered to a ground copper pour no smaller than 100 mm^2 to meet the device's thermal envelope. Use 4-layer PCB stack-up with continuous VCC and GND planes. For each GXB transceiver channel, route 100-ohm differential pairs with intra-pair skew <5 mil and length-matching tolerance within 10 mil across all 8 pairs; reference the Intel MAX 10 High-Speed Design Guidelines for layer stack-up constraints.
Estimated: the 10M40SAE144C8G draws approximately 200-400 mA core current at full utilization with 8 GXB channels active, depending on toggle rate. Use a low-noise LDO such as the TPS7A4701 (4.17 uVrms noise, 1 A output) for the VCCINT rail, and a ferrite bead + bulk decoupling network for the VCCIO rails. Place 100 nF X7R 0402 capacitors within 2 mm of every supply pin, plus 10 uF X5R bulk capacitors at each supply island. Inrush current at power-up is limited by the internal flash configuration ramp (~10 ms).
Common pitfalls: (1) Forgetting to instantiate and connect the dual-purpose configuration pins (e.g., JTAG-aware dual-function pins) - leaving them as inputs without pull-resistors causes boot failures. (2) Treating 10M40S (with transceivers) and 10M40D (no transceivers) as interchangeable in PCB layout - the 8 GXB differential pairs must be routed only when using the S variant. (3) Exceeding the 3.3 V I/O absolute maximum on VCCIO banks. (4) Not connecting the exposed pad - the part will overheat and trigger thermal shutdown under heavy utilization. (5) Confusing the 144-EQFP (this part) with the 169-UBGA or 256-FBGA MAX 10 variants - they are NOT pin-compatible.
For GXB channels running at multi-gigabit LVDS, use a 4-layer PCB with FR-4 dielectric (Dk=4.2-4.6 at 1 GHz) and microstrip or stripline routing. Maintain 100-ohm differential impedance with 8-12 mil trace width and 6-8 mil intra-pair spacing on a 6-8 mil prepreg layer. Place 100 nF AC-coupling capacitors symmetrically within 200 mil of each transceiver pin, and follow Intel's MAX 10 Hardware Design Guidelines for via-stub length limits (stubs must be <100 mil).
اطلاعات انطباق
RoHS and lead-free per Altera/Intel product page. Not AEC-Q100 qualified (commercial 0C-85C) - migrate to industrial-grade I7 variant or AEC-Q100 Cyclone family for automotive.
