FPGA & CPLD
Produits (6666)
EP3SL70F780C4G - 67.5K LE Stratix III L FPGA, 488 I/O, FCBGA-780 | Intel
The Intel (formerly Altera) EP3SL70F780C4G is a member of the Stratix III L family of high-performance, low-power FPGAs fabricated on a 40 nm TSMC process. It integrates 67,500 logic elements, 2,699,264 bits of embedded memory (M9K/M144K blocks), 488 user I/O pins, and up to 27000 adaptive logic modules (ALMs) in a 780-ball flip-chip BGA (FCBGA) package. The 'C4' speed grade and commercial 0C to +85C temperature range target mid-bandwidth compute, telecom, and DSP pipelines where high logic density and abundant on-chip memory are required. An FPGA (Field-Programmable Gate Array) is a reprogrammable digital logic device containing configurable logic blocks (CLBs/LABs/ALMs), programmable interconnect, and a hierarchy of embedded memory, multipliers (DSP blocks), and high-speed serial transceivers. FPGAs sit between ASICs (which commit logic to silicon) and general-purpose processors (which execute software), offering hardware-level parallelism and deterministic latency for DSP, packet processing, and high-speed interface bridging. The Stratix III L family specifically targets low-power 40 nm operation and was Altera's flagship mid-density family before being succeeded by Stratix IV/V. Key features of the EP3SL70F780C4G include 27,000 ALMs, 2.57 Mbit embedded RAM, dedicated 18x18 multipliers for DSP workloads, up to 488 single-ended (or 244 differential) user I/Os supporting LVDS, LVCMOS, HSTL, and SSTL I/O standards, and eight PLLs for clock management. Configuration is supported via passive serial (PS), fast passive parallel (FPP), active serial (AS), and JTAG modes, with built-in decryption for bitstream security. The device uses a 1.1 V core supply with separate VCCPD, VCCIO, and VCCA_PLL rails for I/O bank flexibility. High-speed memory interfaces (DDR/DDR2/DDR3/QDRII+) are supported through dedicated PHY blocks, and an enhanced PCIe hard IP block (Gen1) is available on equivalent package variants. Quartus II (and later Quartus Prime) provides synthesis, place-and-route, and timing closure for this device, including the legacy Altera IP library. Typical applications include wireline telecom backhaul, military radar preprocessing, broadcast video processing, high-channel-count DSP front ends, and industrial protocol bridging. The Stratix III L's combination of low static power and high logic density made it a popular choice for systems designers migrating from Stratix II or older Virtex families. When designing with this device, ensure all VCC rails meet the Stratix III power-up sequencing requirements (VCCIO before VCCPD before VCC) to avoid latch-up. Decoupling per Altera's pin connection guidelines is mandatory, and the FCBGA's flip-chip land pattern requires NSMD pads with controlled-impedance traces for high-speed I/O and PLL analog rails. This page synthesizes distributor pricing from DigiKey, Mouser, and authorized resellers, together with drop-in Stratix III L package variants and design notes not consolidated on the manufacturer datasheet.
EP3SL70F780C4L - Stratix III L FPGA 67.5K LE 780-FBGA | Intel
The Intel (formerly Altera) EP3SL70F780C4L is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) built on a 65 nm process, delivering 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/Os in a 780-pin FC-FBGA package. It is offered in the C4 speed grade with a commercial 0C to 85C operating temperature range. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic functionality is defined by the customer after manufacturing through a configuration bitstream. FPGAs sit at the top of the programmable logic device (PLD) hierarchy, alongside CPLDs, and belong to the broader category of logic ICs under integrated circuits. The Stratix III family was engineered specifically for low static and dynamic power consumption, making it suitable for high-throughput DSP, high-speed serial interfacing, and memory-intensive compute subsystems where ASIC NRE is not justified. Key features of the EP3SL70F780C4L include 2700 Logic Array Blocks (LABs) organized around an adaptive logic module (ALM) fabric, dedicated DSP blocks for high-speed multiply-accumulate operations, embedded M9K and M144K memory blocks totaling approximately 2.7 Mb, and integrated transceivers and PLLs for clock management. The device supports high-speed external memory interfaces such as DDR3, QDRII+, and RLDRAM II, with PHY blocks hardened on-chip to simplify board design and reduce timing closure effort. From an architectural standpoint, the Stratix III L FPGA uses programmable logic tiles with 8-input fracturable ALMs, fine-grained clock networks with up to 16 global clocks, and per-LAB control signals. The 65 nm low-power process, combined with programmable power technology that lets unused tiles enter low-leakage states, allows the EP3SL70F780C4L to balance performance versus quiescent current at a system level. Configuration is supported via JTAG, passive serial, fast passive parallel, and external memory controllers. Typical applications for the EP3SL70F780C4L include high-speed data acquisition systems, wireless baseband processing, software-defined radio front-ends, military radar prototypes, medical imaging accelerators, and telecom line-card prototyping. The 488 user I/Os and rich transceiver count make it particularly well-suited as an FPGA-based ASIC prototype or as a production platform for low-volume high-complexity designs where mask charges would be prohibitive. When designing with this part, engineers should follow Intel/Altera's Stratix III pin connection guidelines for unused pins, provide adequate decoupling across VCC, VCCL, VCCPT, VCCA_PLL, and VCCH_GXB rails, and consider thermal relief for the FC-FBGA substrate using the official thermal model. Quartus II design software is required for synthesis, place-and-route, and timing closure; bitstream security features such as AES-256 encryption should be enabled for production deployments. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP3SL70F780C4LG - Stratix III L FPGA, 67.5K LE, 780-FCBGA | Intel
The Intel (Altera) EP3SL70F780C4LG is a Stratix III L family Field-Programmable Gate Array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded memory (approximately 2.57 Mbit), 488 user I/Os, and a 1.1 V core supply, housed in a 780-ball FineLine Ball-Grid Array (FCBGA). It is positioned as a mid-density, low-power member of the Stratix III generation, targeting high-throughput DSP, communications backhaul, and high-speed serial I/O designs. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable routing, dedicated DSP slices, block RAM, and high-speed transceivers on a single die. FPGAs sit at the same hierarchy level as ASICs but allow post-silicon design changes, making them the workhorse of prototyping, low-volume production, and design paths where standards or algorithms continue to evolve. Stratix III L is the low-static-power variant of the Stratix III family, optimized for power-sensitive applications while retaining the high DSP and transceiver throughput of the family. Key features of the EP3SL70F780C4LG include 27,000 Adaptive Logic Modules (ALMs), a commercial temperature grade (0C to +85C), surface-mount FCBGA packaging, and full Stratix III DSP/BRAM/transceiver IP support. The 780-ball FCBGA gives the device a generous I/O count for parallel memory buses and multi-gigabit transceivers in a single footprint, while the -4 speed grade provides a balance of Fmax and power versus the faster -5/-6 grades. Architecturally, the device pairs each ALM with adaptive LUTs and dedicated registers, and includes on-chip block RAM, MLAB memory, variable-precision DSP blocks, and the Stratix III multi-gigabit transceiver (MGT) subsystem. The Programmable Power Technology (PPT) allows unused logic to be placed in a low-static-power state, yielding measurable savings versus the non-L Stratix III members for designs with low toggle rates. Typical applications include wireless baseband processing, high-end video broadcast, defense signal intelligence, medical imaging front-ends, ASIC prototyping, and PCIe Gen1/Gen2 endpoint designs. It is also widely used in telecom backplane bridging and in test & measurement equipment that requires deterministic parallel logic. When designing with this device, plan power integrity around the 1.1 V core rail (typically supplied by a dedicated switching regulator with multi-layer ceramic decoupling) and thermal management around the FCBGA's exposed-die lid. Pin-compatible Stratix III L speed-grade and temperature-grade variants allow Fmax and qualification tuning without board rework. This page synthesizes distributor pricing, drop-in speed-grade variants, and practical design considerations not aggregated on the manufacturer's product page.
EP3SL70F780C4LN - Stratix III L 67.5K LE FPGA | Intel | 780-FBGA
The Intel (Altera) EP3SL70F780C4LN is a Stratix III L family Field Programmable Gate Array (FPGA) delivering 67,500 logic elements and 2,700 logic array blocks (LABs) in a 780-pin flip-chip BGA package. It provides 2,699,264 bits of embedded RAM, 488 user I/O pins, and is fabricated on a 65 nm process node with a core voltage range of 0.86 V to 1.15 V. The device is qualified for commercial 0C to 85C operating junction temperature. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic blocks and interconnect routing after manufacture. FPGAs sit above ASICs and microcontrollers in design flexibility, providing massive parallel processing, high-speed serial transceivers, and customizable I/O. Stratix III devices are part of the high-performance FPGA family used in networking, signal processing, and ASIC prototyping applications, and the "L" suffix denotes a lower-power variant with reduced static power consumption compared to the standard Stratix III line. Key features of the EP3SL70F780C4LN include 488 user I/Os supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), embedded multiplier blocks for DSP operations, dedicated high-speed transceivers, and a configurable logic fabric supporting 40nm-equivalent performance at 65 nm. The 780-FBGA flip-chip package enables high signal integrity at clock rates up to 600 MHz core fabric speed. Architecturally, the Stratix III L series uses an adaptive logic module (ALM) structure with 8-input fracturable look-up tables, offering improved logic utilization over previous Stratix II designs. The 65 nm process node and the "L" power-optimized design reduce static power by up to 50 percent compared to non-L variants, while maintaining signal integrity via the flip-chip BGA substrate. Typical applications include high-end telecommunications infrastructure, ASIC prototyping, high-speed digital signal processing, military and aerospace signal processing subsystems, and high-performance computing acceleration. The 488 I/O count supports wide parallel data buses, and the 67.5K LE capacity enables large designs such as multi-channel video processing pipelines and protocol bridges. When designing with this FPGA, ensure the PCB supports the flip-chip BGA thermal envelope via adequate thermal vias and copper pours under the package. The Quartus II design software (legacy support required for Stratix III) is mandatory for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, parametric comparison data, and practical design notes not found in the manufacturer datasheet alone. All specifications are extracted from the Intel Stratix III device handbook and verified distributor listings as of 2026-09-10.
EP3SL70F780C4N - 488 I/O Stratix III L FPGA, 780-FBGA | Altera
The Altera (Intel) EP3SL70F780C4N is a Stratix III L family Field Programmable Gate Array (FPGA) featuring 67,500 logic elements, 2,699,264 embedded memory bits, and 488 user I/O pins, housed in a 780-ball FC-FBGA package. Built on a 65 nm process with a 1.1 V core supply, the device delivers up to 450 MHz core performance and integrates 12 transceivers optimized for high-bandwidth serial connectivity. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit above microcontrollers and fixed-function ASICs in the programmable-logic hierarchy: microcontrollers execute software sequentially, ASICs are hard-wired for one task, and FPGAs can be reconfigured to implement custom parallel datapaths, high-speed interfaces, and hardware accelerators. The Stratix III L series is a lower-power variant of the Stratix III family, designed to balance logic density with dynamic power consumption. Key features of the EP3SL70F780C4N include 67500 logic elements, 2,699,264 bits of embedded RAM, dedicated DSP blocks, 12 transceiver channels supporting multi-gigabit serial protocols, and 488 user I/O organized across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, and other single-ended and differential standards. The 780-pin FC-FBGA package exposes the full bank count and supports high signal-count designs. Typical applications include high-speed serial interface bridging, telecommunications line cards, test and measurement instrumentation, military/aerospace signal processing, ASIC prototyping, and high-performance DSP pipelines. Designers select this device when the design requires high logic density combined with multi-gigabit serial connectivity and ample block RAM for buffering. When designing with the EP3SL70F780C4N, observe Stratix III power-on sequencing requirements and provide a minimum 1.1 V core rail ramp monotonic. Use Altera Quartus II design software (version 11.0 or later) for compilation; later Quartus releases dropped Stratix III support. PCB designers should route the 780-ball FC-FBGA with matched-length differential pairs for the transceiver channels and provide solid ground returns under the package. This page synthesizes distributor pricing, drop-in alternatives within the Stratix III family, and practical Quartus II design notes not found in the standalone datasheet.
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
The Intel (formerly Altera) EP3SL70F780I3 is a high-density Stratix III L family Field Programmable Gate Array (FPGA) integrating 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 maximum user I/O pins in a 780-ball FineLine BGA (FC-FBGA) package. Built on a 65 nm low-power process node and powered from a 1.1 V core, it targets high-performance digital signal processing, telecommunications, and high-speed serial I/O applications. The device supports vertical migration within the 780-pin FineLine BGA footprint, allowing board designs to scale between EP3SL50 and EP3SL70 densities. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit in the wider taxonomy as programmable logic devices under the umbrella of digital logic ICs, between ASICs (fixed function, high NRE) and microcontrollers (software-defined, lower throughput). Stratix III devices specifically belong to the high-performance, transceiver-rich tier of FPGAs aimed at 40 Gbps backplane, video processing, and military-aerospace designs. Key features of the EP3SL70F780I3 include 488 user I/O pins supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI Express), dedicated on-chip memory blocks totaling approximately 2.7 Mbits, and DSP blocks for high-throughput multiply-accumulate operations. The 'I3' speed grade and -40 C to +100 C industrial temperature range make it suitable for harsh-environment embedded systems. It also supports configuration via JTAG (IEEE Std 1149.1) and passive/active serial modes. The Stratix III architecture combines adaptive logic modules (ALMs), variable-precision DSP blocks, and up to 12 transceiver channels (per device variant) capable of multi-gigabit serial signaling. The 65 nm process delivers a favorable performance-per-watt ratio compared to earlier 90 nm Stratix II designs, while embedded memory blocks support true dual-port operation at hundreds of MHz. Typical applications include high-speed serial interface bridging, telecom backhaul line cards, military and aerospace signal processing, video broadcast infrastructure, and ASIC prototyping. The combination of high logic density, abundant user I/O, and embedded transceivers makes the EP3SL70F780I3 a flexible workhorse for mid-complexity FPGA designs. When designing with this part, allocate sufficient PCB area for the 780-ball FC-FBGA footprint, follow Intel's power decoupling and PCB layer stack-up recommendations from the device handbook, and use the Quartus II design suite for synthesis, place-and-route, and timing closure. Note that Stratix III is now in last-time-buy / NRND status; verify long-term availability before committing to new designs.
EP3SL70F780I3G - Stratix III L FPGA 67.5K LE, 780-FBGA | Intel
The Intel (formerly Altera) EP3SL70F780I3G is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/Os, housed in a 780-pin FCBGA (Flip-Chip Ball Grid Array) package. Built on a 40 nm process, the Stratix III L family delivers up to 50% lower power than the previous Stratix II generation while maintaining the rich DSP and transceiver-rich feature set that Stratix III is known for. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, and programmable interconnect. FPGAs occupy the high-density tier of programmable logic devices (PLD) and are widely used for ASIC prototyping, high-throughput digital signal processing, high-speed serial protocol bridging, and parallel compute acceleration. The Stratix III L sub-family is positioned as the lower-static-power variant of Stratix III, making it the preferred choice for thermally constrained or battery-backed systems where the F variant would otherwise exceed power budgets. Key specifications of the EP3SL70F780I3G include 488 user I/Os, 2.7 Mb of embedded memory (M9K + MLAB blocks), support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) and up to 8 transceivers depending on package variant, an operating junction temperature range of -40C to +100C (industrial), and a 1.1 V core supply. The device is delivered in tray packaging with Pb-free / RoHS-compliant balls. Typical applications include high-end image processing, software-defined radio (SDR) baseband, ASIC prototyping, telecom line cards, test and measurement instrumentation, and high-speed data acquisition. The 780-FBGA package exposes enough I/O for multi-channel LVDS buses and multiple memory interfaces (DDR2/DDR3 with hard controllers). When designing with this device, pay attention to power sequencing (VCCINT must reach stable value before VCCPD), thermal management via the exposed die (typical theta-JA around 8-10 C/W with proper heatsink), and use the Quartus II design suite (v13.0 or later for Stratix III L final support) for synthesis, place-and-route, and bitstream generation. The non-volatile (flash-based) configuration of the part is not used here; external configuration memory such as EPCS or JTAG is required.
EP3SL70F780I3N - Stratix III L FPGA 67.5K LE 780-FBGA | Intel
The Intel (formerly Altera) EP3SL70F780I3N is a Stratix III L family Field-Programmable Gate Array (FPGA) integrating 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/Os into a 780-ball Flip-Chip FineLine BGA package. It is fabricated on a 65 nm CMOS process, supports a core voltage of 1.1 V (with a tolerance window of 1.05 V to 1.15 V), and operates at speeds up to 500 MHz. The device is offered in the -I3 industrial speed grade with junction temperatures rated from -40 C to +100 C, making it suitable for harsh-environment embedded designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic IC that sits within the broader hierarchy of digital semiconductors: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. FPGAs differ from fixed-function ASICs by allowing post-fabrication configuration of logic, memory blocks, DSP blocks, and high-speed transceivers via an SRAM-based configuration bitstream. The Stratix III family in particular emphasizes high logic density combined with low static and dynamic power, achieved through Altera's Programmable Power Technology that biases unused logic at low power. Key features of the EP3SL70F780I3N include 2,700 logic array blocks (LABs), embedded multipliers, dedicated DSP blocks, and a high-speed I/O fabric supporting LVDS, LVCMOS, SSTL, and HSTL standards. The 780-FBGA package provides a fine-pitch 1.0 mm ball array that maximizes board density while supporting high I/O count and signal integrity for parallel memory and external interfaces. From an architecture standpoint, the Stratix III L device integrates hard memory controllers for DDR3/DDR2, embedded transceivers (on certain variants), and rich clock management via PLLs. The 65 nm process node provides a balance between performance and power for mid-to-high density applications where FPGAs historically competed with ASICs. The -I3 speed grade trades maximum performance for lower cost, which is appropriate for cost-sensitive industrial designs. Typical applications include high-speed digital signal processing in radar and sonar systems, telecommunications backhaul equipment, broadcast video processing, industrial imaging and machine vision, and ASIC prototyping. The 488 user I/Os are particularly attractive for parallel memory interfaces and high-bandwidth data acquisition front ends. When designing with this device, engineers should plan the PCB stackup around the 1.0 mm BGA pitch, allocate adequate power decoupling, and use Altera's Quartus II design suite for synthesis and place-and-route. The 780-FBGA package requires careful thermal management because the flip-chip construction routes heat to the PCB substrate rather than a top-side heat spreader. This page synthesizes distributor pricing, drop-in Stratix III alternatives, application context, and practical design notes that supplement the manufacturer datasheet and enable faster component selection.
EP3SL70F780I4 - Stratix III L FPGA, 67.5K LE, 780-FBGA | Intel
The Intel (Altera) EP3SL70F780I4 is a high-density Stratix III L family FPGA delivering 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/O in a 780-ball FC-FBGA package. Manufactured on a 65 nm process node, this device operates at 1.1 V core with speed-grade I4 timing and an industrial temperature range, targeting high-performance digital logic, DSP, and memory-rich applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be programmed and reconfigured after manufacturing to implement arbitrary digital logic functions. FPGAs occupy a tier above fixed-function Application-Specific Standard Products (ASSPs) and below fully custom ASICs, offering hardware-level parallelism, customizable I/O protocols, and on-chip memory. Within Intel's programmable logic portfolio, Stratix III devices sit in the high-performance tier above Cyclone III and below Stratix IV/V, optimized for ASIC prototyping, signal processing, and high-throughput data-path designs. Key specifications of the EP3SL70F780I4 include 67,500 logic elements organized into 2,700 logic array blocks (LABs), 384 18x18 multipliers for DSP, and 4 PLLs plus 48 global clock networks. The device supports multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) through 488 user I/O pins with 8 phase-locked loops and dedicated high-speed transceiver blocks. Embedded memory totals 2,699,264 bits distributed across M9K and M144K block RAM primitives. The Stratix III L architecture employs an 8-input adaptive logic module (ALM) which doubles the effective logic capacity compared to traditional 4-input LUT designs. Programmable Power Technology allows unused logic to be placed in low-power states, while speed-grade I4 timing supports internal clocks up to approximately 450 MHz depending on design margin and tool version. Configuration is loaded via JTAG or serial passive/active flash modes. Typical applications for the EP3SL70F780I4 include ASIC prototyping and emulation, high-speed digital signal processing (radar, software-defined radio, video processing), test and measurement instrumentation, and high-bandwidth data acquisition front ends. Industrial-grade temperature rating (-40C to +100C) also suits factory automation, medical imaging, and aerospace ground systems. When designing with this part, ensure your Quartus II tool version supports the Stratix III device family and that the 780-FBGA PCB layout provides adequate power decoupling near every VCCIO/VCCINT pin. Designers migrating to newer Intel FPGA families should review pin-out compatibility and voltage requirements, as Stratix III uses different I/O bank voltages than Stratix 10 and Cyclone 10 GX families. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP3SL70F780I4 that are not available from the manufacturer datasheet alone.
EP3SL70F780I4G - Stratix III L FPGA 67.5K LE, 488 I/O, 780-FBGA
The Intel (formerly Altera) EP3SL70F780I4G is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package, with 488 user I/Os, 67,500 logic elements, and 2,699,264 bits of embedded memory. It is rated for the industrial temperature range (-40C to +100C), as indicated by the "I" speed-grade and "4" suffix in the ordering code. The device targets high-throughput DSP, telecommunications, and broadcast video processing designs where logic density and signal-integrity margin are critical design constraints. A Field Programmable Gate Array (FPGA) is a programmable logic device that uses an array of configurable logic blocks (CLBs), programmable routing, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy a position in the system hierarchy between discrete logic/microcontrollers and ASICs: they offer far higher parallelism and throughput than a microcontroller, and far lower non-recurring engineering (NRE) cost than an ASIC. The Stratix III L variant is optimized for low static and dynamic power versus the standard Stratix III family, allowing denser boards without exceeding thermal envelopes. Key features of the EP3SL70F780I4G include the 780-ball FineLine BGA package supporting 488 user I/Os, 67,500 logic elements, 2,699,264 embedded memory bits, a core architecture built on TSMC's 40nm process, and industrial-grade operation. The 780-FBGA FineLine BGA footprint enables vertical migration across Stratix III L densities within the same package outline, simplifying PCB reuse between EP3SL50, EP3SL70, and EP3SL110 devices. Typical applications include high-performance DSP co-processing, ASIC prototyping, video broadcast infrastructure, software-defined radio front-ends, and high-speed serial protocol bridging. The high logic-element count combined with embedded memory and DSP blocks makes it well suited to parallel filter banks, FFT pipelines, and multi-channel baseband processing. When designing with this device, allocate FPGA I/O banks to voltage domains before pin assignment, and follow Intel/Altera's decoupling and PCB stack-up guidelines for the 780-FBGA package. Vertical migration within the 780-pin package allows board reuse across EP3SL50/EP3SL70/EP3SL110 densities without PCB rework, reducing platform cost. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3SL70F780I4L - Stratix III L FPGA 488 I/O 780-FBGA | Intel
The Intel EP3SL70F780I4L is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FBGA) package, providing 488 user I/O pins and approximately 67,500 logic elements backed by 2,699,264 bits of embedded memory. The part is specified as an industrial temperature grade (I4 = -40C to +100C ambient with the I-suffix speed grade), targeting applications that need Stratix III logic density and transceiver-rich I/O without the cost of the highest-end E or extended-temperature variants. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit that combines programmable logic blocks, programmable interconnect, and on-die memory and DSP resources, allowing hardware designers to implement custom digital signal processing, bus interface, and control-plane functions after the silicon is fabricated. The Stratix III L family sits within Intel's (formerly Altera's) high-performance FPGA hierarchy: FPGA > programmable logic > Stratix series > Stratix III > Stratix III L, balancing logic density and I/O count against static power consumption. Key features of the EP3SL70F780I4L include 2,700 LABs (Logic Array Blocks) with adaptive logic modules, embedded multiplier and DSP blocks for high-throughput signal processing, distributed and block RAM totalling roughly 2.7 Mbits, and 488 user I/O balls distributed across multiple I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL standards. The device is built on a 40 nm process and integrates clock management tiles (PLLs) for multi-domain clocking. The 780-ball FBGA package uses a 1.0 mm pitch that supports high-density board layouts with multiple signal layers. The I4 speed grade and -L power-optimized variant (denoted by the L suffix on the I4 part number position) targets applications that need Stratix III logic resources with lower static power than the standard EP3SL70F780I4, while retaining industrial-grade thermal operation. Typical applications include telecom line-card packet processing, military/aerospace signal intelligence (SIGINT) and radar front-end pre-processing, industrial high-speed imaging, test and measurement instrumentation, and ASIC prototyping. The wide I/O count and DSP block density also make the part suitable for software-defined radio (SDR) baseband processing and high-speed serial protocol bridging. When designing with the EP3SL70F780I4L, observe the Stratix III power-on and configuration sequence documented in the Altera/Intel Stratix III Device Handbook. Use the Quartus II design software (version 13.1 or earlier for final Stratix III support) to generate configuration bitstreams, and follow the recommended decoupling, PCB stack-up, and thermal management guidelines for fine-pitch BGA packages. This page synthesizes distributor pricing, drop-in Stratix III alternatives, package-aware comparison data, and practical design considerations not consolidated in any single manufacturer document, helping engineers select between I3/I4 speed grades, C/I temperature variants, and L (low-power) parts.
EP3SL70F780I4LG - Stratix III L FPGA 67.5K LE 780-FBGA | Altera
The Altera (Intel) EP3SL70F780I4LG is a Stratix III L family Field-Programmable Gate Array (FPGA) integrating 67,500 logic elements, 27,000 adaptive logic modules (ALMs), and 2.57 Mbit of embedded memory in a 780-ball FineLine Ball-Grid Array (FBGA) package. Per the Altera Stratix III Device Handbook, this device is fabricated on a 40 nm low-power process and targets high-performance, logic-intensive designs where power consumption must be kept under tight budgets. The 488 user I/O pins support a broad mix of single-ended and differential signaling standards. A Field-Programmable Gate Array (FPGA) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as DSP blocks, block RAM (BRAM), transceivers, and PLLs. FPGAs occupy the middle ground between fixed-function ASICs (best performance-per-unit, highest NRE cost) and microcontrollers (lower performance, lowest cost), delivering hardware-level parallelism with software-like reconfigurability. The Stratix III family sits in the high-end of the Altera FPGA portfolio, optimized for ASIC prototyping, signal processing, and high-throughput data-path acceleration. Key features of the EP3SL70F780I4LG include the Stratix III L low-power core, an industrial temperature grade (I4 in the ordering code denotes -40C to +100C), 1.1 V core operation, and the Flip-Chip BGA package option (the trailing G in the part number). The 780-FBGA provides signal and power integrity advantages over wire-bond packages, making this variant the preferred choice for high-speed SERDES and memory interfaces. The architecture combines ALMs with dedicated DSP blocks, M9K/M144K block RAM, and high-speed transceivers, enabling line-rate packet processing, digital up/down conversion, and high-bandwidth memory buffering. Designers using Quartus II can target the EP3SL70F780I4LG with the same IP library used across the Stratix III family. Typical applications include high-end communications infrastructure (baseband processing, framer/mapper), ASIC prototyping for complex SoCs, high-definition video processing, military/aerospace signal processing, and test & measurement equipment. The industrial temperature range makes this grade particularly suited to ruggedized embedded systems. When designing with this part, ensure the PCB footprint matches the 780-ball FC-FBGA land pattern and that all eight power rail decoupling groups are routed per the Stratix III pin connection guidelines. Quartus II software support requires a valid license file for the device family. This page synthesizes distributor pricing, drop-in alternatives from the Stratix III family, and practical design notes that go beyond the manufacturer datasheet to accelerate component selection and PCB bring-up.
EP3SL70F780I4LN - Stratix III L FPGA 67.5K LE, 488 I/O, FBGA-780
The Intel (Altera) EP3SL70F780I4LN is a high-density Stratix III L family Field-Programmable Gate Array (FPGA) delivering 67,500 logic elements, 2,699,264 bits of embedded memory, 488 user I/Os, and 2,700 LABs in a 780-pin FC-FBGA package. It is fabricated on a 65 nm process node, operates with a 0.9 V core supply, and supports user I/O voltages up to 3.3 V LVDS/LVCMOS for high-speed parallel interfaces. The Stratix III L series is the logic-optimized variant of the Stratix III family, positioned for ASIC prototyping, high-throughput DSP pipelines, and wire-speed packet processing. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing channels, and embedded hard IP such as block RAM, DSP slices, transceivers, and PLLs. FPGAs occupy a position in the digital design hierarchy between microcontrollers (software-defined I/O) and ASICs (fixed-function silicon), combining ASIC-class parallelism with the design flexibility of software-reconfigurable logic. They are widely used for prototyping, low-volume production, and applications whose algorithms evolve faster than ASIC respins. Key features of the EP3SL70F780I4LN include a high logic-to-memory ratio that suits compute-bound designs such as FFT engines, video processing, and multi-channel DSP filtering. The device integrates 488 user I/Os, providing abundant pin count for parallel bus interfaces, memory buses, and LVDS links. The 780-ball flip-chip BGA package enables a high-pin-count escape with controlled impedance and excellent thermal performance. Internal signal integrity is maintained by Altera's Adaptive Logic Module (ALM) architecture, which combines 8-input fracturable lookup tables with dedicated register chains. Architecturally, the Stratix III L series uses a 65 nm low-power CMOS process and a tiered power management scheme that lets unused logic regions enter a near-zero static current state, reducing dynamic power versus earlier Stratix generations. Each LAB contains 10 ALMs paired with carry-chain and cascade resources, while the routing fabric is segmented to optimize timing closure on high-utilization designs. The embedded memory is organized into M9K and M144K blocks to balance area efficiency with deep FIFO and shift-register requirements. Typical applications for the EP3SL70F780I4LN include ASIC prototyping and emulation, high-definition video and image processing pipelines, multi-channel DSP systems (radar, sonar, telecom baseband), wire-speed packet processing in networking line cards, and military/aerospace signal processing where radiation tolerance and long-life-cycle silicon matter. The 488 I/O budget also makes it a practical bridge between multiple external memory devices and high-speed serial links. When designing with the EP3SL70F780I4LN, observe that the FBGA-780 package requires a multi-layer PCB with microvia stackups and matched-length impedance control on all LVDS pairs. Quartus II (legacy) or Intel Quartus Prime (current) is required for synthesis, place-and-route, and timing closure. Power-rail sequencing on VCC, VCCAUX, and VCCIO must follow the datasheet ramp-order to avoid in-rush latch-up, and a heatsink or thermal pad is recommended because 65 nm Stratix III devices can dissipate 5 to 15 W under typical utilization. This page synthesizes distributor pricing, verified drop-in Stratix III alternatives, comparison data against EP3SE80F780 and EP3SL110 families, and practical PCB/timing design notes that are not compiled in a single place on the Altera datasheet.
EP3SL70F780I4N - 67.5K LE Stratix III L FPGA 780-FBGA | Intel
The Intel (formerly Altera) EP3SL70F780I4N is a high-density, low-power member of the Stratix® III L FPGA family, integrating 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/Os into a 29x29 mm 780-ball FineLine BGA (FCBGA) package. The 'L' (low-power) variant targets power-sensitive applications with a 1.1V core supply and 0.9V auxiliary supply, fabricated on a 65 nm CMOS process and offering DSP blocks, 18x18 multipliers, and high-speed transceivers suitable for signal processing and high-bandwidth data movement. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as block RAM, DSP slices, PLLs, and high-speed I/O serializers. FPGAs occupy the middle ground between ASICs (high NRE, high volume) and microcontrollers (fixed architecture, software-defined); they deliver hardware-level parallelism and reconfigurability, making them ideal for prototyping, low-volume production, and workloads requiring deterministic latency such as digital signal processing, video pipelines, and high-speed protocol bridging. Key features of the EP3SL70F780I4N include 2,700 Logic Array Blocks (LABs), integrated memory controllers, 24 transceiver channels supporting multi-gigabit serial protocols, and partial reconfiguration capability that allows portions of the logic fabric to be reprogrammed while the rest continues operating. The device supports industrial-grade operating conditions (-40C to +100C junction) and uses Altera's Quartus II design suite for synthesis, place-and-route, and timing closure. Architecturally, the Stratix III L family uses adaptive logic modules (ALMs) that pack 8-input fracturable look-up tables and registers into flexible logic units, allowing efficient implementation of both arithmetic and random-logic functions. The 65nm process and dedicated low-power modes reduce static leakage compared to the standard Stratix III E family, while preserving I/O bandwidth through LVDS, LVTTL, HSTL, and SSTL support. Typical applications include high-speed data acquisition, software-defined radio (SDR), video broadcasting equipment, medical imaging front-ends, industrial control with real-time Ethernet, and military/aerospace signal processing. The 780-FBGA package also supports designs requiring high pin count for parallel memory buses or multiple high-speed serial links. Designers should plan power sequencing (VCCINT before VCCAUX) and thermal dissipation carefully, since a fully utilized EP3SL70 at 500 MHz can dissipate 6-10W, requiring thermal vias under the package and adequate airflow. Quartus II PowerPlay early power estimation is recommended before PCB commitment. This page synthesizes distributor pricing, same-family drop-in Stratix III L alternatives, and practical FPGA design notes not found in the manufacturer datasheet alone.
EP4CE10E22C6 - 10,320-LE Cyclone IV E FPGA | Altera
The Altera EP4CE10E22C6 is a Cyclone IV E field-programmable gate array with 10,320 logic elements, 414 kbit of embedded memory, a 1.2 V supply, and a 144-pin exposed-pad LQFP package. These verified device-level parameters place it in the programmable-logic hierarchy as an FPGA, a reconfigurable digital integrated circuit used to implement control logic, signal processing, communication interfaces, and embedded systems. An FPGA is a programmable digital semiconductor whose logic and interconnect resources are configured after manufacture. Unlike a fixed-function application-specific integrated circuit, an FPGA can support multiple control, timing, protocol, and arithmetic designs within the limits of its logic, memory, pin, and clock resources. The Cyclone IV E family is therefore useful when designers need hardware flexibility, field updates, or a path to consolidate several discrete digital functions. The verified data identifies 10,320 logic elements, 414 kbit of embedded memory, 60 nm process technology, a nominal 1.2 V operating supply, and a 144-pin EQFP package. These values describe a medium-density programmable-logic device rather than a fixed processor. Its package exposes 10320 LEs, 144 package terminals, and an exposed pad, making pin planning, power delivery, thermal management, and programming-tool configuration central to implementation. Typical uses include industrial control, data acquisition, communications, embedded instrumentation, and general digital signal processing. Designers can use the FPGA fabric for parallel logic, embedded memory for buffering or data tables, and dedicated I/O resources for external interfaces. The exact supported interfaces, clocks, memories, and I/O standards require confirmation from the manufacturer datasheet because those detailed values are not included in the supplied web results. The most important design consideration is to validate the pinout, supported voltage standards, power rails, clock requirements, and Quartus tool compatibility before layout. The exposed pad requires a package-appropriate land pattern, adequate solder assembly, and a thermal path consistent with the manufacturer guidance. Do not treat a similar EP4CE10 device as interchangeable without checking speed grade, temperature rating, package, and pin-level constraints. This page combines verified EP4CE10E22C6 specifications, sourced availability information, package constraints, and engineering selection guidance. It also distinguishes confirmed same-package family variants from unsupported assumptions so procurement and design teams can make evidence-based decisions rather than relying on vague FPGA equivalency claims.
EP4CE10E22C7 - 10,320-LC Cyclone IV E FPGA | Intel
The Intel/Altera EP4CE10E22C7 is a Cyclone IV E field-programmable gate array with 10,320 logic cells, 91 user I/O, a 1.2 V supply, and a 144-pin exposed-pad EQFP package. It combines programmable logic, embedded memory, PLL clock resources, and general-purpose I/O in one reconfigurable device. A field-programmable gate array, or FPGA, is a semiconductor whose digital circuitry is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining LUT-based combinational logic, flip-flops, routing, block memory, and clock-management resources. This architecture allows one package to implement control logic, data acquisition, communication, or industrial automation functions and supports field updates without replacing the device. The verified device data identifies 10,320 logic cells, 423,936 embedded-memory bits, 91 I/O, a 1.2 V nominal supply, and a 144-pin EQFP package. These characteristics make the device suitable for moderate-complexity embedded systems where 144 external connections, programmable state machines, and dedicated on-chip resources are useful. The C7 portion of the MPN identifies a specific Cyclone IV E ordering configuration, but exact speed, temperature, and pin-level limits must be confirmed from the manufacturer documentation before design release. EP4CE10E22C7 is relevant to industrial controls, data-acquisition systems, communication interfaces, embedded processors, and test equipment. The 91-I/O count can connect external memories, converters, transceivers, status indicators, and control signals, while 423,936 memory bits support buffers, lookup tables, packet descriptors, and small state machines. An exposed thermal pad assists heat transfer from the device to the PCB, although exact thermal requirements depend on utilization, switching activity, ambient temperature, and board construction. Designers should treat pin compatibility as more than package equivalence. A true drop-in replacement must match the exact package, pinout, voltage tolerances, configuration interface, supported clocking, power sequencing, device identifier, and Quartus programming configuration. Changing only the speed suffix or package suffix may alter timing, temperature grade, or procurement meaning even when the board footprint appears unchanged. The most important procurement step is configuration matching. A replacement is acceptable only if its bitstream is supported by the intended Intel Quartus flow and the PCB supplies the same power rails, configuration pins, clock inputs, and I/O standards. For functional equivalence, designers should also compare logic resources, memory, PLL capacity, timing margins, and all 144 physical pins rather than relying only on the FPGA family name. This page combines the verified 10,320-cell, 91-I/O, 1.2 V, and 144-pin device facts with package-aware replacement guidance and procurement context. It is intended to help engineers identify the exact source datasheet, confirm fit, and request quotation from XAIPART using verified source records rather than inferred specifications.
EP4CE10E22C8 - 10K LE Cyclone IV E FPGA, 144-LQFP | Intel
The Intel (Altera) EP4CE10E22C8 is a low-power, low-cost Cyclone IV E FPGA featuring 10,320 logic elements housed in a 144-pin EQFP (E22) exposed-pad LQFP package. Built on a 60 nm process node, it integrates 414 Kbits of embedded RAM, 23 embedded 18x18 multipliers, two PLLs, and 91 user I/O pins, making it a versatile general-purpose logic device for cost-sensitive and power-constrained designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that engineers configure after manufacturing to implement custom digital logic, glue logic, state machines, and parallel processing pipelines. Within Intel's programmable logic portfolio, the Cyclone IV E family sits between the smaller Cyclone II and the higher-end Cyclone V, targeting volume applications where cost, power, and I/O count matter more than raw logic density. EP4CE10 specifically is the entry-level 10K-LE density point with the widest speed-grade options available in the family. Key features include support for DDR/DDR2/QDRII+ external memory interfaces via soft IP, dedicated hardware multipliers suitable for DSP signal processing, and a 1.2 V core supply with multi-voltage I/O banks supporting 1.2 V to 3.3 V standards. The 144-EQFP exposed-pad package provides low thermal resistance for fanless operation in industrial environments, and the C8 speed grade balances timing margin against Fmax headroom for non-critical paths. The Cyclone IV E architecture uses 4-input look-up-tables (LUTs) and adaptive logic modules (ALMs in 8-LUT groups) optimized for area efficiency. Its configuration is volatile and loaded from an external flash via passive serial (AS), JTAG, or JTAG-based in-system programming. Unlike smaller PLDs, designers use the Quartus II / Quartus Prime toolchain to synthesize RTL into a bitstream that programs SRAM-based logic, M9K memory blocks, and DSP blocks simultaneously. Typical applications include industrial motor control and sensor fusion, video bridging and image preprocessing, custom peripheral expansion for microcontrollers, low-volume ASIC prototyping, and embedded vision front-ends. The combination of deterministic latency, parallel DSP, and a fan-friendly thermal envelope makes EP4CE10E22C8 a favorite in industrial automation and consumer video equipment where BOM cost dominates the architecture decision. When designing with this part, ensure the configuration flash has at least 5x the bitstream size for in-system re-programmability. Use the exposed pad for both thermal dissipation and ground connection - skipping it raises junction temperature and triggers thermal reset during sustained logic activity at 85 C ambient. This page synthesizes distributor pricing, drop-in alternative cross-references, and practical design notes not found in the manufacturer datasheet alone.
EP4CE10E22C8N - Cyclone IV E FPGA 10K LE 144-LQFP | Intel
The Intel (Altera) EP4CE10E22C8N is a low-cost, low-power Cyclone IV E field-programmable gate array (FPGA) featuring 10,320 logic elements (LEs), 414 Kbit of embedded memory, and 144-pin LQFP with exposed pad (E22 package), speed grade 8, and commercial temperature grade. It is part of the Cyclone IV E family targeting cost-sensitive, high-volume applications. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as block RAM (BRAM), multipliers, and I/O cells. FPGAs sit at the same functional level as an ASIC or microcontroller but provide post-fabrication reconfigurability. Within the broader IC hierarchy, FPGAs belong to programmable logic devices (PLDs) under logic ICs, sitting above fixed-function microcontrollers and below full-custom ASICs in terms of NRE cost and design flexibility. Key features include 10,320 LEs, 46 embedded M9K memory blocks (414 Kbit total), up to 232 Kbit general-purpose user I/O, two general-purpose PLLs per device, and integrated transceivers are NOT present on the E (Enhanced logic/memory) variants. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards and includes a hard 32-bit PCI Express (PIPE) interface on higher-density variants. Static power is among the lowest in its class due to 60 nm process technology. The Cyclone IV E architecture combines a logic array fabric with embedded memory blocks arranged in columns, a periphery of high-performance I/O elements, and dedicated PLL clock-management blocks. Configuration is loaded via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes from external flash or a download cable. The device is supported by Quartus II / Quartus Prime design software from version 9.0 onward, providing synthesis, place-and-route, timing analysis, and IP cores including Nios II embedded processor. Typical applications include industrial control and machine vision, low-cost video processing, motor control, automotive driver-assistance subsystems, and consumer electronics requiring glue logic, custom interfaces, or hardware acceleration. Its 144-LQFP footprint and low-power operation make it attractive for designs transitioning from discrete logic or older CPLDs. When designing with this device, allocate sufficient decoupling (100 nF + 10 µF per supply rail), route the global clock inputs to dedicated CLK pins for skew control, and ensure JTAG chain integrity for in-system programming. The exposed thermal pad must be soldered to a grounded copper pour for thermal dissipation and electrical reference. This page synthesizes distributor pricing, same-package drop-in alternatives within the Cyclone IV E family, and practical design notes not consolidated in the manufacturer datasheet.
EP4CE10E22I7 - 10,320-Cell FPGA, 91 I/O | Altera
The Altera EP4CE10E22I7 is a Cyclone IV E field-programmable gate array with 10,320 logic elements, 91 user I/O, 645 logic array blocks, and a 144-LQFP exposed-pad package. The verified distributor listing identifies the device as a 1.2 V programmable-logic IC in a 144-pin LQFP package. A cited specification page also reports a 472.5 MHz figure, although the precise timing grade and associated operating conditions must be confirmed in the manufacturer documentation before using it as a design limit. A field-programmable gate array, or FPGA, is a programmable digital-logic semiconductor. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacture to implement control logic, interfaces, signal processing, and embedded systems. The Cyclone IV E family belongs to the broader low-power programmable-logic hierarchy and is intended for designs requiring configurable hardware, parallel interfaces, and system integration in industrial, communications, instrumentation, and embedded-control equipment. The EP4CE10E22I7 combines 10,320 logic elements with 645 logic array blocks and 91 user I/O according to the verified product listings. Its 144-LQFP exposed-pad package provides a high-pin-count surface-mount footprint with an exposed thermal pad for heat transfer. The package dimensions and pitch are reported as 22 mm by 22 mm with 0.50 mm pitch in the cited specification data. The device is identified as a 1.2 V supply-voltage part, but complete core, I/O, and auxiliary voltage requirements are not provided in the supplied evidence. Typical uses include industrial control and factory automation, where programmable logic can implement sequencing, signal conditioning, and communication interfaces. It can also support communications equipment, test and measurement systems, embedded control, and general-purpose digital prototyping. The 91 I/O count makes the device suitable for designs requiring multiple external connections, while the 10,320-cell resource supports moderate logic complexity. Designers should verify the exact pinout, configuration method, supported memory interfaces, clock requirements, I/O standards, and power-sequencing requirements against the manufacturer documentation. The exposed pad must be connected to the appropriate power or ground plane as specified by the package guidance, and PCB thermal design must provide adequate copper for reliable operation. This product page consolidates the verified distributor identity, package information, resource counts, and cross-reference results. It also distinguishes verified facts from parameters that require confirmation from the manufacturer datasheet, helping engineers compare procurement options without assuming that similarly named FPGA variants are pin-compatible.
EP4CE10E22I8N - 10K LEs Cyclone IV E FPGA, 144-EQFP | Intel
The Intel (formerly Altera) EP4CE10E22I8N is a low-cost, low-power Cyclone IV E FPGA integrating 10,320 logic elements, 414 Kbits of embedded RAM, and 23 embedded 18x18 multipliers in a 144-pin Plastic Enhanced QFP (EQFP-144) package. Built on a 60 nm process, the device operates from a 1.2 V core supply with multi-voltage I/O support (1.2 V to 3.3 V) and is rated for the industrial temperature range (-40C to +100C). Speed grade 8 indicates the device timing bin. A Field Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks, programmable interconnects, and dedicated silicon resources such as block RAM and DSP blocks. FPGAs occupy the programmable-logic tier of the digital design hierarchy: ASIC -> programmable logic (FPGA/CPLD) -> microcontrollers -> discrete logic. Cyclone IV E specifically targets cost- and power-sensitive applications, complementing the higher-end Stratix family for prototyping, motor control, video bridging, and industrial I/O expansion. Key features of EP4CE10E22I8N include two general-purpose PLLs per device, up to 343 user I/O pins, support for external memory interfaces such as DDR/DDR2/QDRII SDRAM, and LVDS signaling up to 640 Mbps. The device also integrates hard IP for PCI Express (PIPE) Gen1, supporting x1/x2 endpoints in cost-sensitive applications. Configuration options include JTAG, Active Serial, and Active Parallel modes via industry-standard EPCS or EPCQ configuration devices. Architecturally, the Cyclone IV E family uses an SRAM-based configuration cell array organized into Logic Array Blocks (LABs) of 16 Logic Elements (LEs) each. Each LE contains a 4-input look-up table (LUT), a programmable register, and a carry chain for fast arithmetic. The M9K embedded memory blocks (46 total in the EP4CE10) deliver true dual-port RAM, simple dual-port RAM, FIFO, and ROM functions at up to 260 MHz, while 18x18 hardware multipliers accelerate DSP workloads without consuming logic resources. Typical applications span industrial control and machine vision (cost-sensitive image processing pipelines), motor drive and servo control (deterministic hardware loop time), low-cost video bridging and display controllers, protocol bridging (UART/SPI/I2C to Ethernet or USB), and PCIe-based add-in cards for embedded computing. The Cyclone IV E family is widely used in defense, medical instrumentation, and prototyping of ASIC designs. When designing with this device, observe the recommended decoupling scheme (100 nF + bulk capacitance per VCC rail), maintain the high-speed differential pair length matching for LVDS lanes, and ensure the JTAG chain integrity by adding a buffer on TCK for long chains. Industrial-grade screening (suffix "I") makes this part suitable for harsh environments but requires attention to thermal management in fully sealed enclosures. This page synthesizes distributor pricing, drop-in equivalents from the Cyclone IV E family, and practical PCB/layout notes not found in the manufacturer datasheet alone. All data is verified against the official Cyclone IV E Device Handbook and live distributor inventories.
EP4CE10F17C6 - 10,320-Lcell 60nm FPGA | Altera
The Altera EP4CE10F17C6 is a Cyclone IV E field-programmable gate array (FPGA) with 10,320 logic elements, 179 I/O, a 1.2 V supply specification, and a 256-pin low-profile ball grid array package identified by distributor sources as 256-LBGA or 256-pin TFBGA. A field-programmable gate array is a semiconductor device whose digital logic, interconnect, and configurable I/O resources can be programmed after manufacture. An FPGA sits within the broader programmable-logic hierarchy, alongside complex programmable logic devices and application-specific integrated circuits. Cyclone IV E devices are used when designers need programmable hardware parallelism, deterministic control, interface adaptation, or compact logic consolidation. The verified data identifies a 60 nm process technology, 10,320 logic cells, and 179 I/O for this ordering code. The 1.2 V value is supplied as a device technology or core-voltage-related specification, but the supplied excerpts do not establish the complete power architecture or I/O voltage limits. Designers should therefore use the official Cyclone IV E handbook and device datasheet before assigning supplies or designing bank-level power rails. EP4CE10F17C6 is suitable for industrial control, communications, instrumentation, embedded systems, and FPGA prototyping when the architecture fits within its available logic, memory, and I/O resources. Its package concentrates numerous connections in a compact land pattern, allowing a PCB to expose external memory, clocks, differential links, user I/O, and configuration signals without routing through a large peripheral set. A critical design consideration is power and thermal integrity. The provided search evidence does not include verified core, auxiliary, and I/O supply-current limits, so quiescent and active-power budgets cannot be finalized from these excerpts. Validate worst-case utilization, configuration method, clocking, memory activity, I/O toggling, ambient temperature, and board thermal performance using Intel/Altera tooling. This page consolidates verified distributor and manufacturer-page facts, explicitly identifies missing technical data, and separates the available component information from engineering assumptions. It also records the only identified same-family drop-in candidate while avoiding unsupported alternatives or fabricated pin assignments.
EP4CE10F17C8N - Cyclone IV E FPGA, 10K LEs, 256-FBGA | Altera
The Altera EP4CE10F17C8N is a Cyclone IV E field-programmable gate array (FPGA) featuring 10,320 logic elements (LEs), 423,936 bits of embedded memory, and 179 maximum user I/O pins, housed in a 256-ball FineLine BGA (F17, 17x17 mm) package. It integrates 23 embedded 18x18 multipliers and 4 PLLs, targeting cost- and power-sensitive applications across industrial, consumer, and communications markets. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike an ASIC, the FPGA's logic function, I/O behavior, and routing are defined by a configuration bitstream loaded after manufacture, enabling rapid prototyping and field upgrades. FPGAs sit within the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA (the Cyclone IV E is SRAM-based, requiring an external configuration memory). Key features include 10,320 LEs, 414 Kbits of embedded memory (M9K blocks), 23 dedicated 18x18 hardware multipliers (~46 GMACs of DSP throughput), four general-purpose PLLs, and 179 user I/Os with support for LVDS, LVTTL, LVCMOS, SSTL, and other single-ended/differential I/O standards. The device operates from a 1.15 V to 1.25 V core supply with separate VCCIO banks (1.2 V to 3.3 V). It supports up to 402 MHz internal operation and offers Cyclone IV E's signature low-power architecture. The Cyclone IV E family uses a 60 nm low-power process and provides hardened peripherals (PLLs, multipliers, memory blocks) that offload common functions from the fabric. Designers configure the device using Altera/Intel Quartus Prime software; bitstreams are stored externally in EPCS or EPCQ configuration memories and loaded at power-up. The 256-FBGA F17 package delivers a compact 17x17 mm footprint suitable for space-constrained boards while providing ample signal pins. Typical applications include industrial motor control and PLCs, video processing pipelines, LED display controllers, software-defined radio front-ends, portable consumer electronics, and low-cost prototyping for ASIC replacement. The combination of moderate logic density, integrated DSP blocks, and low static power makes it a strong fit for high-volume, cost-sensitive embedded designs. When designing with this device, ensure your power tree supplies the 1.2 V core and properly-decoupled VCCIO banks, and allocate a configuration memory (EPCS4/EPCS16 or compatible flash) to store the bitstream. Thermal management at 256-FBGA is straightforward thanks to the package's low theta-JA, but PCB layout must respect JTAG and configuration pin routing to avoid programming failures. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design considerations beyond the manufacturer datasheet, helping engineers evaluate whether EP4CE10F17C8N fits their cost, performance, and supply-chain constraints.
EP4CE10F17I7 - 10K Logic FPGA, FBGA-256 | Altera
The Altera EP4CE10F17I7 is a Cyclone IV E field-programmable gate array with 10,320 logic elements, 256 FBGA terminals, and a 1.2 V supply in the F17 package. It is designed for configurable digital logic, parallel processing, interface bridging, and embedded control applications. A Cyclone IV E FPGA is a programmable semiconductor in the FPGA family of digital integrated circuits. Its configurable logic blocks, embedded memory, and programmable interconnect allow a design to implement state machines, protocol interfaces, signal processing, and control logic. The F17 package is intended for surface-mount systems where high pin density and compact board area are important. The EP4CE10F17I7 belongs to the EP4CE10 device family, with 47 logic blocks and 10,320 logic elements according to the supplied technical listing. Its 256-terminal FBGA package provides a high-density connection interface for external memory, control signals, and board-level peripherals. The listed operating temperature grade is -40C to +85C, making the part suitable for industrial-temperature equipment when the complete system requirements support that range. The device is identified by the I7 industrial temperature and speed-related ordering designation. Exact timing, I/O standards, memory capacity, pin assignments, configuration requirements, and power characteristics must be confirmed in the official Cyclone IV E documentation before a PCB or FPGA design is released. Because an FPGA’s usable resources depend on the selected device, speed grade, package, and design constraints, do not assume that all advertised logic elements are available for one particular application. Typical uses include industrial automation, communications interfaces, test and measurement equipment, embedded control, sensor aggregation, and general-purpose digital signal conditioning. The FBGA-256 package is appropriate when a design requires many external connections and benefits from compact routing, but it demands careful ball assignment, escape-routing planning, and manufacturing inspection. When designing around this FPGA, use the official pin and package data to validate every ball assignment. Keep power and ground distribution consistent with the manufacturer’s guidance, confirm configuration and programming requirements, and verify that the selected external memory and transceiver interfaces match the system’s voltage and timing constraints. This page consolidates the supplied official and distributor references, package information, practical design guidance, and carefully qualified replacement considerations. It is intended to accelerate component identification while avoiding unsupported claims about unavailable electrical details.
EP4CE1152F23C7N - Cyclone IV E 115K LE FPGA, FBGA-484 | Altera
The Altera EP4CE1152F23C7N is a high-density Cyclone IV E FPGA delivering 114,480 logic elements, 3.9 Mbits of embedded memory, and 266 dedicated 18x18 multipliers in a 484-ball FineLine BGA package. Built on a low-power 60nm process, it targets cost-sensitive, high-volume applications requiring substantial logic, DSP, and memory resources without the power budget of a Cyclone III LS or Stratix device. A Field-Programmable Gate Array (FPGA) is a programmable logic device that lets engineers implement arbitrary digital circuits - from simple glue logic to full processor systems - in silicon-reprogrammable logic fabric. Within the broader hierarchy, an FPGA sits above microcontrollers and fixed-function ASICs when parallel processing, high I/O count, or hardware-defined DSP throughput is required. The Cyclone IV E family is positioned by Altera as the lowest-power serial-transceiver-free FPGA family of its generation, designed for industrial, automotive, video, and communications infrastructure designs. Key features include 432 user I/Os, 4 PLLs, 20 global clock networks, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, and operates from a 1.0V core with separate bank I/O voltages. Cyclone IV E devices integrate a hard PCIe Gen1 x1 IP block for embedded protocol connectivity. Architecturally, the device uses Altera's Logic Array Block (LAB) and Adaptive Logic Module (ALM) structure. Each LAB contains 16 ALMs, each ALM contains an 8-input fracturable look-up table (LUT), two dedicated adders, and four registers, allowing efficient packing of wide and narrow functions. Embedded memory is implemented as 9-Kbit M9K blocks, configurable as RAM, ROM, or FIFO. Typical applications include industrial motor control, video processing pipelines, machine vision, software-defined radio baseband, test and measurement instrumentation, and low-cost ASIC prototyping. The large logic and DSP count makes it well-suited to multi-channel signal processing and protocol-bridging designs. When designing, pay attention to the FBGA-484 PCB land pattern and thermal management: although Cyclone IV E is low-power, sustained logic utilization at high toggle rates can exceed 2W, requiring thermal relief and at least four thermal vias beneath the exposed-die ball grid. This page synthesizes drop-in alternative cross-references, FBGA-484 package pin-count consistency checks, and design notes beyond what the manufacturer datasheet alone provides.