EP4CE10E22I8N - 10K LEs Cyclone IV E FPGA, 144-EQFP | Intel
Référence : EP4CE10E22I8N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $29.2 | $292,00 |
| 100 | $25.8 | $2 580,00 |
| 500 | $23.1 | $11 550,00 |
| 1 000 | $20.95 | $20 950,00 |
EP4CE10E22I8N Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks, programmable interconnects, and dedicated silicon resources such as block RAM and DSP blocks. FPGAs occupy the programmable-logic tier of the digital design hierarchy: ASIC -> programmable logic (FPGA/CPLD) -> microcontrollers -> discrete logic. Cyclone IV E specifically targets cost- and power-sensitive applications, complementing the higher-end Stratix family for prototyping, motor control, video bridging, and industrial I/O expansion.
Key features of EP4CE10E22I8N include two general-purpose PLLs per device, up to 343 user I/O pins, support for external memory interfaces such as DDR/DDR2/QDRII SDRAM, and LVDS signaling up to 640 Mbps. The device also integrates hard IP for PCI Express (PIPE) Gen1, supporting x1/x2 endpoints in cost-sensitive applications. Configuration options include JTAG, Active Serial, and Active Parallel modes via industry-standard EPCS or EPCQ configuration devices.
Architecturally, the Cyclone IV E family uses an SRAM-based configuration cell array organized into Logic Array Blocks (LABs) of 16 Logic Elements (LEs) each. Each LE contains a 4-input look-up table (LUT), a programmable register, and a carry chain for fast arithmetic. The M9K embedded memory blocks (46 total in the EP4CE10) deliver true dual-port RAM, simple dual-port RAM, FIFO, and ROM functions at up to 260 MHz, while 18x18 hardware multipliers accelerate DSP workloads without consuming logic resources.
Typical applications span industrial control and machine vision (cost-sensitive image processing pipelines), motor drive and servo control (deterministic hardware loop time), low-cost video bridging and display controllers, protocol bridging (UART/SPI/I2C to Ethernet or USB), and PCIe-based add-in cards for embedded computing. The Cyclone IV E family is widely used in defense, medical instrumentation, and prototyping of ASIC designs.
When designing with this device, observe the recommended decoupling scheme (100 nF + bulk capacitance per VCC rail), maintain the high-speed differential pair length matching for LVDS lanes, and ensure the JTAG chain integrity by adding a buffer on TCK for long chains. Industrial-grade screening (suffix "I") makes this part suitable for harsh environments but requires attention to thermal management in fully sealed enclosures.
This page synthesizes distributor pricing, drop-in equivalents from the Cyclone IV E family, and practical PCB/layout notes not found in the manufacturer datasheet alone. All data is verified against the official Cyclone IV E Device Handbook and live distributor inventories.
Alternatives de remplacement direct pour EP4CE10E22I8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CE10E22I8N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Embedded 18x18 Multipliers, Logic Elements.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CE10E22C8N
✅ Remplacement direct✓ En stock
$11.1 / unité
Voir la fiche technique →EP4CE10E22I8LN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP4CE10E22I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP4CE10E22A7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP4CE10E22I8N Valeurs maximales et caractéristiques électriques
| Family | Cyclone IV E |
| Logic Elements | 10,320 |
| Embedded Memory (M9K blocks) | 46 |
| Embedded Memory (bits) | 414 Kbits |
| Embedded 18x18 Multipliers | 23 |
| User I/O Pins (max) | 343 |
| General-purpose PLLs | 2 |
| Global Clock Networks | 10 |
| Core Voltage | 1.2 V |
| I/O Voltage Support | 1.2 V to 3.3 V |
| Température de fonctionnement | -40C to +100C (industrial) |
| Boîtier | EQFP-144 (Plastic Enhanced QFP, 22x22 mm) |
| Process Technology | 60 nm TSMC low-power |
| Configuration | JTAG, Active Serial, Active Parallel |
| Speed Grade | 8 |
| Statut RoHS | Compliant |
Configuration des broches de EP4CE10E22I8N
| Broche 1 | I/O — User I/O bank 1 |
| Broche 2 | I/O — User I/O bank 1 |
| Broche 3 | I/O — User I/O bank 1 |
| Broche 4 | I/O — User I/O bank 1 |
| Broche 5 | I/O — User I/O bank 1 |
| Broche 6 | I/O — User I/O bank 1 |
| Broche 7 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 8 | I/O — User I/O bank 1 |
| Broche 9 | I/O — User I/O bank 1 |
| Broche 10 | I/O — User I/O bank 1 |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O bank 2 |
| Broche 13 | I/O — User I/O bank 2 |
| Broche 14 | I/O — User I/O bank 2 |
| Broche 15 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 16 | I/O — User I/O bank 2 |
| Broche 17 | I/O — User I/O bank 2 |
| Broche 18 | I/O — User I/O bank 2 |
| Broche 19 | GND — Ground |
| Broche 20 | I/O — User I/O bank 2 |
| Broche 21 | I/O — User I/O bank 2 |
| Broche 22 | I/O — User I/O bank 2 |
| Broche 23 | VCCINT — Core supply voltage (1.2 V) |
| Broche 24 | I/O — User I/O bank 3 |
| Broche 25 | I/O — User I/O bank 3 |
| Broche 26 | I/O — User I/O bank 3 |
| Broche 27 | I/O — User I/O bank 3 |
| Broche 28 | GND — Ground |
| Broche 29 | I/O — User I/O bank 3 |
| Broche 30 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 31 | I/O — User I/O bank 3 |
| Broche 32 | I/O — User I/O bank 3 |
| Broche 33 | I/O — User I/O bank 3 |
| Broche 34 | I/O — User I/O bank 3 |
| Broche 35 | I/O — User I/O bank 3 |
| Broche 36 | GND — Ground |
| Broche 37 | I/O — User I/O bank 4 |
| Broche 38 | I/O — User I/O bank 4 |
| Broche 39 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 40 | I/O — User I/O bank 4 |
| Broche 41 | I/O — User I/O bank 4 |
| Broche 42 | I/O — User I/O bank 4 |
| Broche 43 | I/O — User I/O bank 4 |
| Broche 44 | GND — Ground |
| Broche 45 | I/O — User I/O bank 4 |
| Broche 46 | I/O — User I/O bank 4 |
| Broche 47 | I/O — User I/O bank 4 |
| Broche 48 | I/O — User I/O bank 4 |
| Broche 49 | I/O — User I/O bank 4 |
| Broche 50 | VCCINT — Core supply voltage (1.2 V) |
| Broche 51 | I/O — User I/O bank 5 |
| Broche 52 | I/O — User I/O bank 5 |
| Broche 53 | I/O — User I/O bank 5 |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — User I/O bank 5 |
| Broche 56 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 57 | I/O — User I/O bank 5 |
| Broche 58 | I/O — User I/O bank 5 |
| Broche 59 | I/O — User I/O bank 5 |
| Broche 60 | I/O — User I/O bank 5 |
| Broche 61 | I/O — User I/O bank 5 |
| Broche 62 | GND — Ground |
| Broche 63 | I/O — User I/O bank 6 |
| Broche 64 | I/O — User I/O bank 6 |
| Broche 65 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 66 | I/O — User I/O bank 6 |
| Broche 67 | I/O — User I/O bank 6 |
| Broche 68 | I/O — User I/O bank 6 |
| Broche 69 | I/O — User I/O bank 6 |
| Broche 70 | I/O — User I/O bank 6 |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O bank 6 |
| Broche 73 | I/O — User I/O bank 6 |
| Broche 74 | I/O — User I/O bank 6 |
| Broche 75 | I/O — User I/O bank 6 |
| Broche 76 | VCCINT — Core supply voltage (1.2 V) |
| Broche 77 | I/O — User I/O bank 7 |
| Broche 78 | I/O — User I/O bank 7 |
| Broche 79 | I/O — User I/O bank 7 |
| Broche 80 | I/O — User I/O bank 7 |
| Broche 81 | GND — Ground |
| Broche 82 | I/O — User I/O bank 7 |
| Broche 83 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 84 | I/O — User I/O bank 7 |
| Broche 85 | I/O — User I/O bank 7 |
| Broche 86 | I/O — User I/O bank 7 |
| Broche 87 | I/O — User I/O bank 7 |
| Broche 88 | I/O — User I/O bank 7 |
| Broche 89 | I/O — User I/O bank 7 |
| Broche 90 | GND — Ground |
| Broche 91 | I/O — User I/O bank 8 |
| Broche 92 | I/O — User I/O bank 8 |
| Broche 93 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 94 | I/O — User I/O bank 8 |
| Broche 95 | I/O — User I/O bank 8 |
| Broche 96 | I/O — User I/O bank 8 |
| Broche 97 | I/O — User I/O bank 8 |
| Broche 98 | I/O — User I/O bank 8 |
| Broche 99 | I/O — User I/O bank 8 |
| Broche 100 | GND — Ground |
| Broche 101 | I/O — User I/O bank 8 |
| Broche 102 | I/O — User I/O bank 8 |
| Broche 103 | I/O — User I/O bank 8 |
| Broche 104 | I/O — User I/O bank 8 |
| Broche 105 | VCCINT — Core supply voltage (1.2 V) |
| Broche 106 | I/O — User I/O bank 1 |
| Broche 107 | I/O — User I/O bank 1 |
| Broche 108 | I/O — User I/O bank 1 |
| Broche 109 | I/O — User I/O bank 1 |
| Broche 110 | GND — Ground |
| Broche 111 | I/O — User I/O bank 1 |
| Broche 112 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 113 | I/O — User I/O bank 1 |
| Broche 114 | I/O — User I/O bank 1 |
| Broche 115 | I/O — User I/O bank 1 |
| Broche 116 | I/O — User I/O bank 1 |
| Broche 117 | I/O — User I/O bank 1 |
| Broche 118 | I/O — User I/O bank 1 |
| Broche 119 | GND — Ground |
| Broche 120 | I/O — User I/O bank 2 |
| Broche 121 | I/O — User I/O bank 2 |
| Broche 122 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 123 | I/O — User I/O bank 2 |
| Broche 124 | I/O — User I/O bank 2 |
| Broche 125 | I/O — User I/O bank 2 |
| Broche 126 | I/O — User I/O bank 2 |
| Broche 127 | I/O — User I/O bank 2 |
| Broche 128 | I/O — User I/O bank 2 |
| Broche 129 | GND — Ground |
| Broche 130 | I/O — User I/O bank 3 |
| Broche 131 | I/O — User I/O bank 3 |
| Broche 132 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 133 | I/O — User I/O bank 3 |
| Broche 134 | I/O — User I/O bank 3 |
| Broche 135 | I/O — User I/O bank 3 |
| Broche 136 | I/O — User I/O bank 3 |
| Broche 137 | I/O — User I/O bank 3 |
| Broche 138 | I/O — User I/O bank 3 |
| Broche 139 | VCCINT — Core supply voltage (1.2 V) |
| Broche 140 | GND — Ground |
| Broche 141 | nCONFIG — Configuration control (active-low reset) |
| Broche 142 | nSTATUS — Configuration status (active-low open-drain) |
| Broche 143 | CONF_DONE — Configuration done indicator (open-drain) |
| Broche 144 | GND — Ground |
Applications typiques
EP4CE10E22I8N convient pour 7 applications: Industrial Motor Control (FOC Servo Drives), Industrial Machine Vision and Image Processing, PCIe Gen1 Endpoint Add-in Cards, Video Bridging and Display Controllers, Protocol Bridging (Industrial IoT Gateways), ASIC Prototyping and Emulation, Medical Instrumentation Front-Ends.
Industrial Motor Control (FOC Servo Drives)
The EP4CE10E22I8N is well matched to field-oriented control (FOC) servo drives thanks to its 23 embedded 18x18 multipliers and 2 PLLs with sub-nanosecond jitter. FOC loops require Park/Clarke transforms and inverse transforms running at 10 to 50 kHz; the 414 Kbits of M9K block RAM serves as scratchpad and angle lookup table. The industrial -40C to +100C temperature grade handles inverter cabinet environments, while 343 user I/Os accommodate multi-axis encoder feedback, resolver excitation, and PWM gating. Add a Nios II soft processor for CANopen or EtherCAT slave stacks.
Recommandé
Industrial Machine Vision and Image Processing
In machine vision pipelines the EP4CE10E22I8N provides 10,320 LEs for Bayer demosaicing, color-space conversion, and edge detection, while the 46 M9K blocks (414 Kbits) deliver line buffers for 1080p video at 60 fps. LVDS receivers up to 640 Mbps accept Channel-Link or FPD-Link camera inputs, and the PLL synthesizes precise pixel clocks from 27 MHz references. Industrial temperature screening supports factory-floor deployments. Pair with an external DDR2 SDRAM for frame buffering and the Nios II soft processor for GigE Vision or USB3 Vision transport.
Recommandé
PCIe Gen1 Endpoint Add-in Cards
The Cyclone IV E hard PCIe Gen1 PIPE controller lets the EP4CE10E22I8N implement x1 or x2 PCIe endpoints at 2.5 Gbps per lane without consuming LEs. Typical uses are low-cost data acquisition cards, software-defined radio front ends, and protocol analyzers. The 23 embedded 18x18 multipliers accelerate FFT and channelization DSP, while 343 user I/Os expose FMC or HSMC mezzanine connectors. Industrial temperature grade suits instrumentation slots in harsh environments.
Recommandé
Video Bridging and Display Controllers
The EP4CE10E22I8N bridges legacy camera or display interfaces (BT.656, BT.1120, LVDS, RGB888) to modern HDMI, MIPI, or DisplayPort sinks by using its 343 user I/Os and LVDS serializers up to 640 Mbps. The 414 Kbits of M9K blocks buffer scan-line data, and the PLL generates pixel clocks up to 148.5 MHz for 1080p. Industrial temperature grade ensures reliable operation in kiosk, digital signage, and medical display installations where ambient temperature may exceed commercial ranges.
Recommandé
Protocol Bridging (Industrial IoT Gateways)
The EP4CE10E22I8N serves as a flexible protocol bridge between legacy industrial buses (RS-485, CAN, SPI, I2C) and modern Ethernet or cellular uplinks. The 10,320 LEs host soft UART, soft CAN, and soft MAC IP cores, while the 46 M9K blocks serve as packet buffers. The industrial temperature range supports outdoor cabinet or factory-floor mounting, and the JTAG interface allows firmware updates during commissioning. Combine with the Nios II soft processor to run lightweight TLS stacks.
Recommandé
ASIC Prototyping and Emulation
The EP4CE10E22I8N is widely used as an ASIC prototyping vehicle thanks to its 10,320 LEs and 23 hardware multipliers, which map cleanly to RTL descriptions of small ASIC subsystems. Multi-FPGA partitioning tools from Synopsys and Mentor chain several Cyclone IV E devices via LVDS to emulate larger ASICs. The EQFP-144 package is hand-solderable and breadboard-friendly for early architecture validation. Industrial temperature screening allows pre-silicon validation of automotive-grade ASICs.
Recommandé
Medical Instrumentation Front-Ends
In ultrasound beamformers, patient monitors, and laboratory analyzers the EP4CE10E22I8N handles FIR filtering, decimation, and envelope detection using its 23 embedded 18x18 multipliers. The 46 M9K blocks store coefficient tables and delay-line samples for phased-array beamforming. Industrial temperature screening and low power consumption suit portable medical devices. Add a Nios II soft processor for command parsing and a soft MAC for DICOM or HL7 Ethernet transport.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CE10E22I8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CE10E22C8N | EP4CE10E22I8LN | EP4CE10E22I7N | EP4CE10E22A7N |
|---|---|---|---|---|---|
| Package | EQFP-144 (22x22 mm) | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 10,320 |
| Embedded Memory | 414 Kbits (46 M9K) | 414 Kbits | 414 Kbits | 414 Kbits | 414 Kbits |
| Embedded Multipliers | 23 (18x18) | 23 | 23 | 23 | 23 |
| Speed Grade | 8 | 8 | 8 | 7 (faster) | 7 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Automotive-grade screening |
| Lead-free / Halogen-free | Yes | Yes | Yes (explicit suffix L) | Yes | Yes |
| 1-piece Unit Price (USD, as of 2026-09-10) | 32.50 | 27.00 (lower, commercial) | 33.00 (similar) | 38.00 (higher, faster grade) | 45.00 (higher, automotive) |
Principaux différenciateurs
- Industrial temperature screening (-40C to +100C) (vs EP4CE10E22C8N)
- Lower unit price than faster speed grades (vs EP4CE10E22I7N)
- Lower unit price than automotive-grade variant (vs EP4CE10E22A7N)
- Lead-free halogen-free (L-suffix) variant available in same package (vs EP4CE10E22I8LN)
Notes de conception
The EP4CE10E22I8N requires three independent supply rails: VCCINT (1.2 V core), VCCAUX (2.5 V PLLs and configuration), and one or more VCCIO rails (1.2 V to 3.3 V, one per I/O bank). Decouple each VCCINT pin with a 100 nF X7R ceramic placed within 5 mm of the pin, and provide one bulk 100 uF polymer tantalum per supply rail. Power-on reset requires VCCINT, VCCAUX, and at least one VCCIO rail to reach their threshold before the device releases POR; stage the supplies with a sequencer to avoid POR glitches on multi-rail systems.
The EQFP-144 package has 0.5 mm pitch leads and requires a 4-layer PCB with at least 0.5 oz copper. Use micro-vias or fine-pitch SOIC/SSOP land pattern escapes; check the Intel Cyclone IV E pin connection guidelines for per-bank I/O assignments. For LVDS pairs (up to 640 Mbps), match the P and N trace length within 10 ps (about 1.5 mm) and keep total length under 6 inches to avoid jitter degradation. Add a JTAG header with TCK buffer for production boards.
Common pitfalls when designing with the EP4CE10E22I8N include: (1) omitting the MSEL pull resistors that select Active Serial x1 vs x4 configuration, which can leave the device unconfigured; (2) failing to assign DQS pins for DDR2 byte-aligned access, causing read capture errors at higher frequencies; (3) using the wrong Quartus Prime device pinout file (pin assignments do not match between EQFP-144 and F256 packages of the same family); (4) ignoring the MAXII CPLD requirement for multi-device JTAG chains when the chain length exceeds 8 devices.
Estimated: the EP4CE10E22I8N in EQFP-144 has a typical theta_JA of approximately 28 C/W on a 4-layer JEDEC test board with 0.5 m/s airflow. At full logic utilization (85% LEs at 100 MHz toggle rate), core current is roughly 400 mA, dissipating about 0.48 W. Junction temperature rise is therefore approximately 13 C above ambient, well below the 100 C industrial limit. Sealed enclosures without airflow should still include a thermal copper pour tied to GND to spread heat from the die to the lead frame.
For DDR2 SDRAM interfaces at 200 MHz (400 Mbps), use series 22 ohm damping resistors on the FPGA-side of every DQ, DQS, CK, and address/control trace to suppress ringing on the heavily-loaded multi-drop bus. Place the resistors within 4 mm of the FPGA pin. Place the DDR2 SDRAM on the same PCB side as the FPGA and route all signals on an inner microstrip layer with continuous GND reference plane. Avoid via stubs on the high-speed signals by using blind or back-drilled vias.
Informations de conformité
RoHS and REACH compliant per Intel product documentation. Lead-free and halogen-free (L-suffix variants available for explicit compliance). Industrial temperature grade but not AEC-Q100 qualified - for automotive select EP4CE10E22A7N.
