Modules RF
Produits (305)
BM71BLES1FC2-0B02AA - BLE 5.0 Module 9x11.5mm | Microchip
The Microchip Technology BM71BLES1FC2-0B02AA is a fully certified Bluetooth 5.0 Low Energy (BLE) transceiver module operating in the 2.4 GHz ISM band, housed in a shielded 9 x 11.5 x 2.1 mm surface-mount package with an integrated chip antenna and -90 dBm receiver sensitivity. A Bluetooth Low Energy module is a complete wireless subsystem that integrates a BLE radio, baseband, protocol stack, and antenna into a single certified unit. In the system hierarchy it sits above discrete RF ICs (which require external stack development and RF design) and below complete host systems, functioning as a serial-to-BLE bridge that frees the host MCU from managing the Bluetooth software stack, timing-critical RF firmware, and regulatory certification. Key features of the BM71BLES1FC2-0B02AA include Bluetooth Core 5.0 compliance with up to 2.5x throughput improvement over earlier BM70-generation silicon, a completely integrated Bluetooth software stack with configuration via simple ASCII commands over UART, a shielded enclosure for EMI reduction, and an integrated chip antenna on a regulatory-certified variant. Supply voltage spans 1.9 V to 3.6 V, suiting single-cell lithium and 3.3 V logic designs, and the module is rated for industrial temperature environments. Architecturally, the BM71 embeds Microchip's BLE silicon with flash memory for stack and application script storage. The certified, shielded, antenna-integrated construction means the RF matching network, crystal, and antenna have been tuned by Microchip, removing the most error-prone portion of a wireless design. Developers interact with the module as a wireline replacement: UART data in, BLE data out. Typical applications include smart-home sensors and actuators, battery-powered IoT beacons, industrial wireless configuration and diagnostic links, and connected health accessories. The industrial temperature rating and shielded package also suit networked lighting controls and commercial building automation. A key design consideration is layout: although the antenna is integrated, keep at least the datasheet-recommended keep-out area free of copper and plastics above the antenna region to preserve the certified radiation pattern and sensitivity. This page synthesizes distributor pricing (as of 2026-10-19), drop-in family alternatives, design notes, and long-tail selection guidance not found in the manufacturer datasheet.
BM83SM1-00AB Bluetooth 5.0 Stereo Audio Module | Microchip
The Microchip Technology BM83SM1-00AB is a Bluetooth 5.0 stereo-audio transceiver module operating from 2.402 GHz to 2.48 GHz in a PCB-trace, surface-mount package. It supports Bluetooth Classic BR/EDR and Bluetooth Low Energy, together with HFP 1.7, HSP 1.2, A2DP 1.3, SPP 1.2, AVRCP 1.6, PBAP 1.2, GATT, and GAP. The module can receive audio through Auxiliary Input or I2S and stream it to as many as two paired Bluetooth sink devices using Audio Transceiver firmware. A Bluetooth audio module combines a short-range radio, baseband protocol stack, audio interface, and embedded control functions in one surface-mount assembly. The BM83 belongs to the RF transceiver-module hierarchy rather than a discrete Bluetooth IC: designers connect the module to a host product through power, control, communication, and audio interfaces instead of implementing an RF antenna network and Bluetooth firmware from scratch. Its Class 1 designation identifies it as a Bluetooth audio module intended for conventional short-range wireless audio links. The BM83SM1-00Tx configuration provides A2DP source capability, allowing legacy audio equipment to become a Bluetooth transmitter. A2DP Source and Sink support supports product designs that transmit or receive stereo audio. HSP 1.2 supports legacy headset roles, while HFP 1.7, PBAP 1.2, AVRCP 1.6, and SPP 1.2 address hands-free calling, phone-book access, media control, and serial data services. AAC and SBC decoding further broadens compatibility with common Bluetooth audio sources. The module integrates the radio and protocol functions required for embedded Bluetooth connectivity, reducing RF-layout exposure at the product level. Nevertheless, an embedded module does not eliminate antenna-design requirements: the PCB, copper, enclosure, ground distribution, and matching network still determine practical RF performance. Firmware selection and host-interface integration are equally important because protocol support alone does not establish the final user experience. Typical uses include Bluetooth audio dongles, wireless speakers, headphones, soundbars, automotive-accessory adapters, home-audio upgrades, and dual-sink speaker systems. Auxiliary Input suits products with an existing analog source, while I2S supports digital audio integration. The stated ability to stream to two paired sink devices is particularly useful when one product must share audio with two headphones or speakers. For implementation, follow the manufacturer datasheet for the exact 50-lead land pattern, exposed-pad or thermal requirements, supply sequencing, UART or control behavior, firmware configuration, and antenna clearance. Preserve the documented keep-out regions around the module and connect its RF reference and ground features exactly as specified. Do not assume that another BM83 suffix is interchangeable without checking revision, antenna, firmware, and regulatory differences.
BM83SM1-00TA Bluetooth 5.0 Stereo Audio Module | Microchip
The Microchip Technology BM83SM1-00TA is a Bluetooth 5.0 stereo audio module operating across 2.402 GHz to 2.48 GHz in a 50-lead surface-mount package. It combines Bluetooth Classic BR/EDR and Bluetooth Low Energy connectivity with integrated audio-transceiver firmware. According to the verified Microchip product material, the module supports HFP 1.7, HSP 1.2, A2DP 1.3, SPP 1.2, AVRCP 1.6, and PBAP 1.2, including A2DP source and sink operation. A Bluetooth audio module is a wireless connectivity and embedded-control subsystem that adds Bluetooth communication to an audio product without requiring a discrete radio design. In the broader product hierarchy, this module is a Bluetooth transceiver module, an RF and wireless module, and an embedded audio bridge. It can receive audio through auxiliary input or I2S and stream that audio to up to two paired Bluetooth sink devices, making it useful for dongle-style designs and products without native Bluetooth. The BM83SM1-00TA is qualified for Bluetooth 5.0 and supports Classic BR/EDR as well as BLE. Its profile set covers hands-free, headset, advanced audio distribution, serial port, audio/video remote control, and phone-book access functions. A2DP source and sink capability supports both sending audio to headphones or speakers and receiving audio from a paired source. The module also supports AAC and SBC decoding, broad protocol support, and GATT/GAP services. The BM83 family is intended for stereo-audio connectivity in compact embedded products. Its integrated module approach reduces the need to design and qualify a separate RF radio, antenna structure, audio interface, and Bluetooth protocol stack on the host PCB. Firmware configuration remains important: the BM83SM1-00Tx variant implements A2DP source capability using Audio Transceiver firmware, so host firmware and command sequences must match the intended audio role. Typical uses include Bluetooth audio dongles, wireless speakers, headphones, source accessories, home-audio adapters, and embedded audio gateways. The verified data confirms the frequency range, Bluetooth version, protocol profiles, audio inputs, and dual-sink streaming behavior. Electrical limits, pin names, supply voltage, antenna requirements, and package dimensions should be taken from the manufacturer datasheet before PCB release. PCB implementation must preserve the module’s required antenna clearance, ground connectivity, audio routing, and power decoupling. Keep RF-sensitive and audio-sensitive traces away from noisy switching paths where practical, provide the manufacturer-specified bypass capacitors close to the supply pins, and follow the reference layout for antenna and exposed grounding. Validate RF performance with the intended enclosure because plastic, cables, grounding, and nearby structures can change the installed antenna behavior. This product-data page combines the verified Microchip feature description, distributor identification, and cross-reference search results. It distinguishes confirmed facts from missing electrical details and avoids inventing a pinout or package drawing that was not present in the supplied sources. For production use, compare the selected BM83SM1 variant, firmware image, regulatory requirements, and supplier availability before committing the design.
BMD-341-A-R - BLE 5.0/Thread/Zigbee Module | u-blox
The u-blox BMD-341-A-R is a stand-alone Bluetooth 5.0 Low Energy, Thread, and Zigbee (IEEE 802.15.4) multiprotocol transceiver module operating in the 2.4 GHz band, based on the Nordic Semiconductor nRF52840 SoC with an ARM Cortex-M4F CPU, supplied in a 10.2 x 15.2 mm surface-mount package with a U.FL connector for an external antenna (antenna not included). A Bluetooth Low Energy (BLE) module is a short-range radio subsystem that integrates the radio, modem, processor, crystal, and RF matching network into a certified, pre-tested unit. Modules sit above raw SoCs in the wireless hierarchy, reducing RF design effort, certification cost, and time to market for connected products. Key features include full Bluetooth 5.0 long-range support, 802.15.4 Thread and Zigbee protocols, and an open CPU architecture that lets developers run their own firmware on the embedded nRF52840 with 1 MB flash and 256 KB RAM. The U.FL connector enables optimized external antennas for maximum range. The module is certified for use in Canada under ISED RSS-247 Issue 2 and RSS-Gen per the u-blox datasheet, and its footprint is identical to the BMD-340, with pins 1 through 47 directly mapping to BMD-300/301/330/360 for design reuse. Typical applications include low-power IoT sensor nodes, smart-home Thread/Zigbee devices, beacons, and connected industrial equipment. Design consideration: when one PCB design may use BMD-340, BMD-341, or BMD-345, follow the BMD-340 copper keep-out area for the trace antenna variant. This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and design notes not found in the manufacturer datasheet.
BP35A1 - 920MHz Wi-SUN Module with 32-bit MCU | ROHM
The ROHM BP35A1 is a 920MHz specified low-power radio module certified for the Wi-SUN (Wireless Smart Utility Network) standard, integrating a 32-bit microcontroller, Wi-SUN B-route firmware, and a built-in antenna in a connector-joint-type package. Receiver sensitivity is -103dBm typical at 100kbps with BER below 0.1%, providing high communication quality for smart-meter and home-energy-management links. A Wi-SUN module is a radio-frequency transceiver module that implements the Wi-SUN mesh networking protocol stack, a wireless standard used widely in utility infrastructure such as smart electricity, gas, and water meters. Within the system hierarchy, the BP35A1 sits at the module level: it combines a sub-GHz RF transceiver, baseband, protocol firmware, and host microcontroller into a single certified unit, so designers do not need to develop RF circuitry or obtain radio certifications themselves. Key features include operation in the 920MHz band, integrated Wi-SUN B-route profile firmware, a built-in antenna that removes external antenna matching from the design, and a connector joint type interface that allows the module to be plugged into a host PCB rather than soldered, simplifying assembly and field replacement. The -103dBm sensitivity at 100kbps (BER < 0.1%) supports long-range, low-data-rate mesh links typical of HAN (Home Area Network) single-hop topologies. The module is Wi-SUN Alliance certified as product WSA0064 (HEMS Controller, HAN single-hop). Technically, the BP35A1 integrates the RF transceiver, a 32-bit microcontroller running the Wi-SUN stack, and regulatory-certified radio parameters in one module, per the ROHM featured-products documentation. This integration reduces RF design risk, eliminates RF layout iteration, and shortens time to certification for ECHONET-Lite-based smart meter systems. Typical applications include smart electric meter HAN communication (B-route), home energy management system (HEMS) controllers, building energy monitoring, and sub-GHz mesh sensor networks in the 920MHz band. A key design consideration: because the module uses a connector joint type interface, plan the host-side mating connector and keep-out zone early; ROHM offers the dedicated BP35A7A 2.54mm-pitch conversion adapter board for evaluation and prototyping. This page synthesizes distributor availability, drop-in alternative analysis, and practical design guidance not found in the manufacturer datasheet.
BP35C5 - Wi-SUN FAN Sub-GHz Transceiver Module | ROHM
The ROHM BP35C5 is a Wi-SUN FAN compatible Sub-GHz wireless communication module operating in the 902 MHz to 928 MHz band, with 13.8 dBm output power, -105 dBm receiver sensitivity, and a supply voltage range of 2.6 V to 3.6 V, housed in a surface-mount module package with convex long-side terminals (1206-metric footprint classification, BP35C5-1 package). A Wi-SUN (Wireless Smart Utility Network) module is a radio transceiver with an integrated 32-bit MCU that implements the Wi-SUN FAN (Field Area Network) mesh networking protocol, an international standard optimized for smart community and utility infrastructure. Wi-SUN FAN devices form self-healing mesh networks supporting frequency-hopping spread spectrum, making them a power-management-layer building block for large-scale IoT deployments such as smart meters and street lighting. Key features of the BP35C5 include a maximum data rate of 300 kbps, receiver sensitivity of -105 dBm for extended link budget, and UART and GPIO host interfaces that simplify integration into existing systems. The module is certified under both Wi-SUN and FCC (US) regulations, significantly reducing end-product certification effort and enabling immediate evaluation. Technically, the BP35C5 integrates a Sub-GHz RF transceiver and 32-bit microcontroller running the Wi-SUN FAN stack, exposing a command-based UART interface so host processors do not need to implement the mesh protocol themselves. This offloads protocol complexity, flash footprint, and RF layout challenges from the host design. Typical applications include smart electricity, gas, and water metering networks, street lighting control, and smart city infrastructure across North America (902-928 MHz ISM band). Design consideration: an antenna is not included; ensure a 50-ohm matched antenna connection and verify FCC modular-approval conditions for the final enclosure. This page synthesizes distributor pricing, availability, lifecycle status, and practical design notes not found in the manufacturer datasheet alone.
BR-100AH-US - 802.11ah Wi-Fi HaLow Ethernet Bridge | Silex
The Silex Technology BR-100AH-US is a 10/100 Ethernet-to-802.11ah (Wi-Fi HaLow) wireless bridge operating in the sub-1 GHz band at 926.5 MHz (US SKU), delivering over 1 Mbps throughput in a standalone boxed enclosure with one RJ-45 Fast Ethernet port. An Ethernet-to-wireless bridge is a networking device that connects any Ethernet-equipped equipment to a wireless network by transparently converting wired frames to radio frames. In the network hierarchy it sits at the edge of the wireless LAN as a wireless client (station) with an embedded wired switch port, allowing legacy devices without native Wi-Fi to join a WLAN without driver or application changes. Key features include support for IEEE 802.11ah, the long-range, low-power Wi-Fi HaLow standard that operates below 1 GHz for dramatically better wall penetration and range than 2.4 GHz or 5 GHz Wi-Fi; software-transparent operation requiring no changes to drivers, management tools, or applications; multi-client mode operation; and a simple 10/100 Ethernet interface that makes integration plug-and-play. The 802.11ah radio in the 920-928 MHz unlicensed band trades raw bandwidth for range and link robustness, making it well suited for machine-type traffic at megabit-class data rates. Because the BR-100AH-US presents itself as a standard network device, industrial controllers, printers, cameras, and medical instruments can be relocated anywhere in a facility with wireless coverage. Typical applications include factory automation and industrial IoT sensor networks, smart building and metering infrastructure, and medical device connectivity where long range and wall penetration matter more than gigabit speeds. Design consideration: place the bridge within verified HaLow access point coverage and confirm regional regulatory fit - the US SKU (926.5 MHz) must not be deployed in regions using different 802.11ah channel plans such as China or Europe. This page synthesizes distributor availability, regulatory SKU information, and practical deployment notes not consolidated in the manufacturer datasheet.
C9400-SUP-1XL-Y - Catalyst 9400 Supervisor 1XL w/ 25G | Cisco
The Cisco C9400-SUP-1XL-Y is a next-generation supervisor engine for the Catalyst 9400 Series modular chassis, designed for enterprise-class core and aggregation deployments and delivering up to 240 Gbps per slot with native 25G uplink connectivity. The -1XL-Y variant adds a 25 Gigabit Ethernet uplink option to the proven Supervisor-1XL platform, providing investment protection as enterprises migrate from 10G aggregation to 25G core links. It is built around the Cisco UADP 2.0 ASIC with a programmable pipeline, microengine capabilities, and template-based allocation of Layer 2/3, forwarding, QoS, and ACL resources, ready for next-generation enterprise and SD-Access services including MPLS, VRF-aware Locator/ID Separation Protocol, and host-tracking database features. The supervisor occupies the dedicated supervisor slot in the Catalyst 9404R, 9407R, and 9410R chassis (one active plus one redundant SSO supervisor), and ships with 240 GB of SSD storage by default for IOS XE image, packages, and telemetry buffers. Two SFP28 uplink ports provide the 25G migration path while QSFP ports (numbered 9 and 10 on this -1XL-Y SKU) support 40G operations via QSFP transceivers with LC, copper, or MPO-12 connectors. A supervisor engine in a modular access/aggregation chassis is the centralized control plane and switching fabric manager: it runs the routing protocol stack, manages the line-card forwarding ASICs, terminates management access, and houses the bootflash, DRAM, and SSD that host Cisco IOS XE. Within Cisco's modular hierarchy, the C9400-SUP-1XL-Y sits between the entry-level C9400-SUP-1 (80 Gbps/slot, 1/10/40G uplinks) and the flagship C9400X-SUP-2/2XL (480 Gbps/slot, 100G uplinks, UADP 3.0sec), offering a balanced 240 Gbps/slot middle ground for buyers who need 25G uplinks today but do not yet require 100G or UADP 3.0sec scale. Key features include 240 Gbps per-slot switching capacity, dual SFP28 25G uplinks, dual QSFP 40G uplink ports (ports 9-10), SSD-backed storage, Stateful Switchover (SSO) for hitless failover, advanced routing (MPLS, BGP, OSPF, EIGRP, IS-IS), SD-Access border node capability, and full IOS XE programmability via Guest Shell, Python, and NETCONF/YANG APIs. The C9400-SUP-1XL-Y uses the UADP 2.0 ASIC combined with a multi-core x86 CPU complex and hardware-accelerated cryptography. Compared with the original C9400-SUP-1, the -1XL variant triples per-slot bandwidth from 80 Gbps to 240 Gbps, enabling full 10G line-card oversubscription-free operation and paving the way for mGig/25G access tiers. Typical applications include enterprise core switching for campus and branch aggregation, MPLS-aware SD-Access border or collapsed-core nodes, 25G server-farm aggregation in mid-sized data centers, and high-availability dual-supervisor deployments in the Catalyst 9404R, 9407R, and 9410R modular chassis. When designing around the C9400-SUP-1XL-Y, plan for two supervisor slots per chassis, populate redundant SSO supervisor pairs for hitless failover, and pair the supervisor with line cards that do not require the higher-bandwidth C9400X-SUP-2/2XL (some newer C9400 line cards are restricted to the X-series supervisors only, so verify compatibility per the line card matrix). This page aggregates verified distributor specifications, drop-in supervisor alternatives in the same Catalyst 9400 family, and practical design notes not consolidated in the Cisco datasheet.
CC1312PSIPMOTR - Sub-1GHz SiP RF Module | Texas Instruments
The Texas Instruments CC1312PSIPMOTR is a Sub-1 GHz system-in-package (SiP) wireless microcontroller module with an integrated power amplifier, operating across the 861 MHz to 930 MHz ISM bands (863 MHz to 930 MHz per ordering information; the radio supports 861 MHz to 1030 MHz), rated from -40C to +105C and housed in a 48-pin QFM (MOT) land-grid package supplied in tape and reel. A system-in-package wireless MCU combines a radio transceiver, a microcontroller, crystal oscillators, RF matching components and decoupling capacitors inside a single pre-tested package. In the power-management hierarchy of an IoT node, a SiP sits above a bare transceiver IC: it removes the hardest part of RF design, the antenna matching network and layout sensitivity, and replaces it with a surface-mount component that can be reflowed onto a standard PCB. The CC1312PSIP integrates a CC1312R device die plus an integrated power amplifier for increased link budget. Key features include support for IEEE 802.15.4-based stacks (Wi-SUN, Thread-compatible PHYs) and proprietary Sub-1 GHz protocols, operation on the SimpleLink MCU platform, and a Common SimpleLink Low Power F2 SDK shared across the family. The integrated PA extends output power and therefore range compared with non-PA SiP versions, which matters for metering and streetlight meshes. Technically, the device belongs to the SimpleLink F2 family and is supported by the SysConfig system configuration tool. TI explicitly states that the CC1312PSIP portfolio includes pin-compatible 2.4 GHz SiPs, so a product can migrate between communication standards (Sub-1 GHz and 2.4 GHz) on the same PCB footprint, protecting firmware and hardware investment. Typical applications include Wi-SUN mesh networks for smart utilities, wireless sensor networks in the 868/915 MHz bands, and long-range IoT nodes where the PA-enhanced link budget enables multi-kilometer range in rural deployments. Design consideration: as a SiP module, the CC1312PSIP still requires a clean 48-pin land pattern, ground vias under the package, and an antenna feed designed for the target band; follow the TI reference design impedance exactly. This page synthesizes verified distributor data, drop-in alternatives and practical design notes not found on the manufacturer datasheet alone.
CC660D-LS - 3GPP NTN Satellite IoT Module LCC+LGA | Quectel
The Quectel CC660D-LS is a 3GPP NTN (Non-Terrestrial Network) satellite communication module that supports 3GPP Release-17 IoT-NTN connectivity in L-band (B255) and S-band (B256/B23), housed in a compact LCC + LGA surface-mount package measuring 17.7 mm × 15.8 mm × 2.0 mm. It delivers two-way data communication plus SMS SOS functionality, enabling direct device-to-satellite links for IoT deployments that previously required terrestrial cellular coverage. A satellite IoT module is a self-contained wireless subsystem that integrates a baseband transceiver, RF front-end, power management and host interface into a single certified PCB. Within the broader electronics taxonomy it sits as: IoT module -> wireless module -> RF module -> electronic component. Direct-to-satellite modules like the CC660D-LS remove the dependency on terrestrial base stations, extending connectivity to maritime, agricultural, asset-tracking and emergency-response use cases where cellular coverage is absent. Key features include IoT-NTN Rel-17 protocol support over L-band (B255) and S-band (B256/B23), GNSS location reporting, integrated IP/UDP/TCP stacks, and an ultra-compact 17.7 × 15.8 × 2.0 mm LCC + LGA footprint suitable for SMT mass production. The module is designed for durable, rugged designs and is positioned for size-sensitive end products. Technically, the CC660D-LS pairs a 3GPP Rel-17 IoT-NTN baseband with multi-band RF front-end and integrated GNSS for location reporting. Because it operates exclusively through non-terrestrial network satellites, link budget, antenna gain and sky-view geometry become dominant design considerations; the module is intended to be paired with an active or passive NTN-tuned antenna. Typical applications include global asset tracking, maritime and fishery monitoring, agricultural sensor telemetry, SCADA fallback for remote industrial sites, and emergency SOS wearables. It is generally used together with a GNSS module, since CC660D-LS relies on GNSS to update location before transmitting via satellite. When designing with this module, ensure the host platform supplies a stable 3.3 V–4.3 V supply, that the antenna is tuned for the chosen NTN band, and that the SIM interface matches the operator's satellite SIM provisioning (which differs from terrestrial SIMs). This page synthesizes distributor availability, parametric positioning versus competing IoT-NTN modules, and practical integration notes not found in the manufacturer datasheet alone.
CMWX1ZZABZ-091 - LoRaWAN Module 868/915MHz | Murata
The Murata CMWX1ZZABZ-091 is a shielded ultra-small LoRaWAN sub-GHz transceiver module operating in the 868 MHz and 915 MHz ISM bands, integrating an STM32L072 Arm Cortex-M0+ microcontroller with 192 KB flash and an SX1276 LoRa transceiver in a 13.5 x 13.8 mm surface-mount land-grid package. A LoRaWAN module is a complete long-range, low-power wide-area network (LPWAN) radio subsystem that combines an RF transceiver, a host microcontroller, antenna matching, crystal references, and a shielded package into a single certified component. In the system hierarchy it sits above a bare transceiver IC: instead of designing RF matching networks and obtaining regional radio certifications yourself, a module such as the Type ABZ drops into a design with only power, ground, UART/SPI/I2C wiring, and an antenna connection required. Key features include support for LoRaWAN Class A and Class C operation, radio-law certification already obtained for major regions (including CE and FCC for 868/915 MHz deployments), and open MCU design support that exposes all STM32L072 peripherals such as ADC, 16-bit timers, LP-UART, I2C, SPI, and USB 2.0 FS. The module can additionally support Sigfox by modifying the firmware, with Sigfox RC1, RC2, and RC4 certification available through the X-CUBE-SFOX package. The Type ABZ architecture benefits from ST's I-CUBE-LRWAN stack and the B-L072Z-LRWAN1 Discovery kit, which embeds the same module, allowing code developed on the Discovery kit to transfer directly to production hardware. Standby-to-active wake-up occurs in approximately 60 microseconds via NRST, WKUP pins, RTC alarm, or RTC wakeup events, supporting strict battery-life budgets in asset-tracking and metering products. Typical applications include smart utility metering, asset trackers, smart-city sensor nodes, agricultural monitoring, and industrial IoT endpoints that require multi-kilometer range and years of battery life. A key design consideration is supply voltage: the module operates at 1.8 V to 3.6 V, so a primary lithium cell or low-dropout regulator should be chosen with adequate headroom for peak transmit current. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
CYBLE-012011-00 - BLE v4.1 Module, PSoC 4, 128KB Flash | Infineon
The Infineon CYBLE-012011-00 is a fully certified, turnkey Bluetooth Low Energy (BLE) v4.1 transceiver module based on the Cypress PSoC 4 BLE silicon, integrating a 128 KB flash PSoC, 16 KB SRAM, 23 GPIOs, and a 2.4 GHz trace antenna in a compact surface-mount module. Operating across the 2.4 GHz to 2.48 GHz ISM band, it ships pre-certified to FCC, IC, CE, and Bluetooth SIG specifications, which removes months of RF design and compliance work for cost-sensitive product teams. The module is built around an ARM Cortex-M0 core with a royalty-free BLE stack compatible with Bluetooth 5.1 features (when used with current firmware), and it exposes 23 GPIOs that can be configured for ADC, PWM, UART, SPI, I2C, and CapSense touch interfaces. A Bluetooth Low Energy (BLE) module is a pre-engineered radio subsystem that bundles the transceiver IC, antenna, matching network, crystal oscillators, and required passive components into a single certified PCB module. By offloading the RF section, BLE modules let product teams focus on firmware, sensors, and application logic rather than impedance matching, shielding, and regulatory pre-compliance testing. Within the broader taxonomy, a BLE module sits above a bare BLE transceiver IC and below a fully integrated SoC-based product; it is part of the wireless module family within RF & Wireless and is closely related to other AIROC and EZ-BLE module families from Infineon/Cypress. Key features of the CYBLE-012011-00 include a low deep-sleep current of 60 nA (with GPIO or XRES wakeup), programmable output power up to +9 dBm, and receive sensitivity of approximately -92 dBm in standard BLE mode. The onboard PSoC 4 BLE supports Cypress/PSoC Creator and ModusToolbox IDEs with a complete BLE Component and profile library. Integrated shield and regulatory certifications (FCC, IC, CE, MIC) eliminate the need for end-product RF testing for most regions. The CYBLE-012011-00 shares its module pin footprint and PSoC 4 BLE silicon datasheet with the uncertified CYBLE-012012-10 variant; the 012012-10 omits the RF shield and Bluetooth SIG listing, exposing the same GPIOs and pinout, making it a drop-in footprint alternative for prototypes that will go through self-certification. The host interface uses standard UART, SPI, or I2C, and the module runs from a single 1.8 V to 5.5 V supply rail. Typical applications include wireless sensor nodes for industrial IoT, BLE beacons for retail and asset tracking, fitness and medical wearables, smart-home hubs, remote controls, and HID peripherals such as mice, keyboards, and stylus devices. The 23 GPIOs and analog peripherals also support direct sensor readout without an external MCU. When replacing bare-chip designs with a module, expect to save 6-9 months of PCB iteration and regulatory certification effort, and budget approximately 200 mm² of host-board keep-out area for the antenna pattern.
CYBLE-022001-00 - Bluetooth LE 4.1 PSoC 4 Module 128 KB | Infineon
The Infineon CYBLE-022001-00 is a fully certified, turnkey Bluetooth Low Energy (BLE) module integrating a Cypress PSoC 4 BLE programmable MCU with 128 KB of flash memory, 16 KB of SRAM, and an onboard 2.4 GHz ceramic chip antenna, all housed in a compact 10 x 10 x 1.80 mm surface-mount package. An RF transceiver module (also called an RF module or BLE module) is a pre-certified subsystem that bundles a radio IC, matching network, crystal, antenna, and optional microcontroller into a single tested hardware unit, eliminating the need for designers to qualify the RF chain themselves. The CYBLE-022001-00 sits in the RF & Wireless > RF Modules subcategory of the broader Power/Connectivity semiconductor ecosystem and supports Bluetooth v4.1 LE with a 1 Mbps air data rate over the 2.4 GHz ISM band. Key features include 16 configurable GPIOs (with exposed ADC, PWM, UART, SPI, and I2C peripherals), an integrated ARM Cortex-M0 core, -92 dBm RX sensitivity for extended range, and up to +3 dBm programmable TX output power. Module-level FCC/IC/CE/MIC regulatory certifications substantially reduce end-product qualification time. Architecture depth: The module is built around the Infineon PSoC 4 BLE silicon (CYBL1XX7X family), which combines a 32-bit ARM Cortex-M0 CPU, configurable analog and digital blocks (the famous PSoC UDB/PLD fabric), CapSense touch support, and a 2.4 GHz radio. An onboard 32 kHz watch crystal and a 24 MHz main crystal are included, plus all RF matching components and the chip antenna. Flash is 128 KB, SRAM is 16 KB. Typical applications include BLE beaconing wearables, wireless HID peripherals (keyboards/mice/remote controls), industrial sensor telemetry nodes, smart-home lighting controllers, medical device accessory links, and proximity/marketing beacons where a small, certified, low-power radio drop is required. Design consideration: Because the module is pre-certified, no antenna-matching network is required - the user PCB only needs to expose the 10 x 10 mm land pattern and reserve adequate clearance around the antenna keep-out zone to maintain radiated performance. This page synthesizes distributor pricing, drop-in compatible module variants (CYBLE-222005-00, CYBLE-222014-01), and practical design notes not found in the manufacturer datasheet alone.
CYBLE-222014-01 - Bluetooth 4.2 LE Module, 256KB Flash | Infineon
The Infineon CYBLE-222014-01 is a fully certified, programmable Bluetooth Low Energy (BLE) v4.2 transceiver module based on the Cypress PSoC 4 BLE / PRoC BLE platform, housed in a compact 10 x 10 x 1.80 mm surface-mount module with an integrated chip antenna. It is built around an Arm Cortex-M0 core, integrates 256 KB of flash memory and 32 KB of SRAM, operates from 1.9 V to 5.5 V supply, and provides up to 16 GPIOs alongside ADC, timers, PWM, and serial interfaces (I2C, UART, SPI). An EZ-BLE module is a fully integrated, regulatory-certified Bluetooth Low Energy (BLE) turnkey solution that combines a Bluetooth radio, microcontroller, crystal oscillators, passive components, and a chip antenna into a single reflow-solderable package, eliminating the need for RF design expertise and significantly accelerating wireless product development. Key features include a royalty-free BLE stack compatible with Bluetooth 4.2 (and stack-upgradable to Bluetooth 5.x on compatible parts), an integrated 2.4 GHz transceiver with on-module chip antenna, up to 16 GPIOs, four serial communication blocks, four TCPWMs, an ADC, and onboard 32 kHz and main crystals. The module includes built-in security features and supports in-system programming via SWD. Architecturally, the CYBLE-222014-01 leverages Cypress's PSoC 4 programmable system-on-chip with CapSense touch-sensing capability, enabling flexible peripheral routing and capacitive touch buttons or sliders without external components. The integrated chip antenna is impedance-matched on the module, so designers can avoid the most common cause of BLE range failures: a poorly matched PCB trace antenna. Typical applications include IoT sensor nodes, BLE beacons, fitness and wearable devices, smart-home actuators, industrial wireless sensors, and any compact battery-powered product that needs certified wireless connectivity without an RF layout cycle. When designing with this module, follow Infineon's reference antenna keep-out region on the host PCB around the chip antenna, supply the module with a clean 1.9 V to 5.5 V rail with a decoupling cap within 5 mm of the VBAT pin, and verify regulatory output power limits in your target market. This page synthesizes distributor pricing, drop-in compatible module alternatives, and practical RF layout notes specific to the CYBLE-222014-01 that the Infineon datasheet alone does not surface, helping engineers compare candidates quickly.
CYBT-273063-02 - BT 5.0 Module U.FL, Cortex-M4 | Infineon
The Infineon Technologies CYBT-273063-02 is a certified AIROC Bluetooth v5.0 transceiver module for the 2.4 GHz ISM band, built around an Arm Cortex-M4 host processor with 256 KB flash and 176 KB RAM, housed in a 12.5 x 19 mm surface-mount LGA-style package with a U.FL connector for an external antenna. A Bluetooth module is an RF transceiver subsystem that integrates a radio, baseband, antenna interface, and a programmable host MCU into a single pre-certified unit. Modules occupy the upper tier of the wireless-connectivity hierarchy (semiconductor -> RF transceiver IC -> Bluetooth SoC -> Bluetooth module -> end device), letting OEMs add Bluetooth LE and BR/EDR connectivity without performing their own RF design or regulatory testing. Key features include Bluetooth 5.0 certification, an onboard Arm Cortex-M4 core executing user application code, 256 KB of flash for firmware and data storage, and 176 KB of RAM. The U.FL antenna connector supports a standard 2.0 dBi dipole antenna; per the Infineon EZ-BT module datasheet, any antenna of equivalent or less gain can be used without additional FCC application and testing. The EZ-BT module family shares a common footprint across antenna options: the CYBT-273063-02 uses a U.FL connector, the CYBT-263064-02 offers an RF solder-pad output, and the CYBT-263065-02 integrates a trace antenna. All three are pre-certified, reducing time-to-market for regulatory approval in North America and other regions. Typical applications include smart-home and IoT sensor nodes, industrial wireless gateways, point-of-sale and beacon hardware, and connected medical peripherals that require reliable 2.4 GHz connectivity with local processing headroom from the Cortex-M4 core. Design consideration: because the antenna is external, place the U.FL receptacle near the board edge, keep the 50-ohm transmission line short, and verify antenna placement away from ground planes and metal enclosures for optimal radiated performance. This page synthesizes distributor pricing, drop-in family alternatives, design notes, and AI-optimized technical FAQs not consolidated in the manufacturer datasheet.
DWM1000 - IEEE 802.15.4 UWB Transceiver Module | Qorvo
The Qorvo DWM1000 is a fully integrated IEEE 802.15.4-2011 ultra-wideband (IR-UWB) transceiver module operating from 3.5 GHz to 6.5 GHz, delivering data rates up to 6.8 Mbps and two-way-ranging accuracy of 10 cm, housed in a compact surface-mount castellated module with integrated chip antenna. An ultra-wideband transceiver module is a self-contained RF subsystem that combines the radio IC, antenna, RF matching, power management, and clock circuitry into one package, eliminating the RF design work normally required for a discrete UWB chip. In the product hierarchy, the DWM1000 sits between the DW1000 transceiver IC (the silicon) and complete positioning systems such as two-way ranging (TWR) or TDOA location networks. Key features include a 500 MHz-wide UWB channel implementation compliant with IEEE 802.15.4-2011, data rates of 110 kbps, 850 kbps, and 6.8 Mbps, and an integrated chip antenna. Supply voltage is 2.8 V to 3.6 V with typical receive current of 64 mA. Because the antenna and all RF components are on-module, no RF layout expertise is needed - the DWM1000 connects to a host MCU over a standard SPI interface. Technically, the module is built around the DW1000 single-chip CMOS UWB transceiver, which supports timestamps with sufficient resolution for centimeter-level ranging. The onboard DW1000 temperature sensor can dynamically trim the crystal during runtime to hold the +/- 2 ppm frequency specification across the full -40C to +85C operating range, according to Qorvo documentation. Typical applications include indoor asset tracking with 10 cm precision, TDOA and TWR positioning anchors and tags, factory automation, warehouse logistics, smart-building occupancy sensing, and RTLS research using platforms such as Arduino or ESP32 hosts. A key design consideration is power: receive current of 64 mA dominates duty-cycled tag designs, so sleeping the DW1000 between frames and using the lowest data rate with preamble optimization for range, or the highest rate for battery life, is an important trade-off to model early. This page synthesizes distributor pricing (as of 2026-10-20), drop-in alternatives, application guidance, and design notes not found in the manufacturer datasheet alone.
DWM1000SR - IEEE 802.15.4 UWB Transceiver Module | Qorvo
The Qorvo DWM1000SR is an IEEE 802.15.4-2011 ultra-wideband (UWB) transceiver module based on the Decawave DW1000 IC, operating across the 3.5 GHz to 6.5 GHz UWB spectrum with data rates up to 6.8 Mbps and 10 cm positioning accuracy, housed in a compact surface-mount module with an integrated ceramic antenna. An ultra-wideband transceiver module is a complete radio subsystem that packages an RF transceiver IC, antenna, crystal oscillator, power management, and clock circuitry into a single certified unit. Within the wireless connectivity hierarchy, UWB modules occupy the precision-ranging segment of short-range communications, complementing Bluetooth, Wi-Fi, and 802.15.4 Zigbee radios by delivering centimeter-level time-of-flight measurement that narrowband technologies cannot achieve. Key features include full IEEE 802.15.4a UWB compliance, integrated all-RF circuitry eliminating external matching components, on-chip voltage and temperature monitoring readable via SPI, and support for two-way ranging (TWR) and TDOA location topologies. The module supports six data-rate options up to 6.8 Mbps and programmable transmit power across its six supported UWB channels. The underlying DW1000 die implements a coherent receiver with accurate timestamping, enabling time-of-flight resolution far beyond conventional RSSI-based approaches. The integrated architecture minimizes BOM count and RF design risk, allowing OEMs to achieve regulatory-certified UWB performance without in-house RF layout expertise. Typical applications include indoor real-time location systems (RTLS) for asset tracking, autonomous navigation for robots and drones, geofencing and secure keyless entry, and precision positioning in warehouses and factories where 10 cm accuracy is required. Design considerations: the module requires a clean 2.8 V to 3.6 V supply and SPI host interface; follow the manufacturer recommended footprint and keep-out zone around the integrated antenna to preserve radiation pattern and ranging accuracy. This page synthesizes distributor availability, drop-in alternative analysis, and practical design guidance not consolidated in the manufacturer datasheet.
DWM3000-ESSR - UWB Transceiver Module DW3110 | Qorvo
The Qorvo DWM3000-ESSR is an engineering-sample variant of the DWM3000, a fully integrated Ultra-Wideband (UWB) transceiver module based on the Qorvo DW3110 IC, delivering 10 cm ranging precision and data rates up to 6.8 Mbps in a surface-mount module that integrates the antenna, all RF circuitry, power management, and clock circuitry. A UWB (Ultra-Wideband) transceiver module is a type of short-range RF module that transmits nanosecond-scale pulses across several gigahertz of spectrum, enabling time-of-flight measurement far more precisely than conventional narrowband radios. Within the wireless-IC hierarchy, it sits above the transceiver IC (here the DW3110) and below complete RTLS systems, complementing Bluetooth, Wi-Fi, and GNSS in the position-and-awareness layer of a wireless stack. Key features include IEEE 802.15.4-2015 compliance, FiRa PHY and MAC specification compliance for interoperability with other FiRa devices, and demonstrated interoperability with the Apple U1 and U2 chips. Channel 5 operation is compatible with the older DWM1000, and the module is pin and size compatible with the DWM1000 footprint, allowing straightforward platform migration. The module integrates a ceramic UWB antenna, the DW3110 transceiver IC, a crystal, power management, and clock circuitry in a single shielded package, dramatically simplifying RF design. On-chip voltage and temperature monitors let the host read VDD1 pin voltage and internal die temperature from the DW3110, supporting system health checks. The DW3110 supports both 2-way ranging (TWR) and TDoA location architectures, and its data rate of up to 6.8 Mbps also accommodates payload exchange alongside ranging frames. Typical applications include real-time location systems (RTLS) for asset tracking to 10 cm precision, secure keyless entry for automotive and smartphone access, and indoor navigation in warehouses and factories where GNSS is unavailable. Design consideration: because the -ESSR suffix denotes an ENGINEERING SAMPLE, use it for prototype and evaluation only and plan production builds around the standard (non-ES) DWM3000 ordering code. This page adds distributor pricing context, drop-in alternatives, and engineering design notes not found in the manufacturer datasheet.
DWM3001CTR13 - 6.5/8GHz UWB Module with BLE SoC | Qorvo
The Qorvo DWM3001CTR13 is a fully integrated 6.5 GHz and 8.0 GHz ultra-wideband (UWB) transceiver module in a 48-pad LCC surface-mount package with an integrated planar UWB antenna. It combines the Qorvo DW3110 UWB transceiver IC, a Nordic nRF52833 BLE SoC with ARM Cortex-M4F MCU, an accelerometer, power management circuitry, and a crystal in a single validated module. Ultra-wideband is a short-range radio technology that transmits nanosecond-scale pulses across several gigahertz of spectrum, enabling centimeter-level ranging accuracy that Bluetooth and Wi-Fi cannot achieve. Within the positioning ecosystem, a UWB module sits at the device level of the hierarchy: UWB radio -> RF transceiver module -> real-time location system (RTLS) -> IEEE 802.15.4-based personal area network. Key features include a 6.25 GHz to 8.25 GHz integrated RF front end, support for 6.5 and 8.0 GHz UWB channels, a 6.8 Mbps RF data rate, AES-128/256 hardware encryption on the UWB link, and full integration of the DW3110 IC, nRF52833 BLE SoC, planar UWB antenna, accelerometer, power management, and crystal. Because the RF design is fully validated, tested, and calibrated at the factory, no RF expertise is required to deploy the module. Architecturally, the DW3110 handles UWB physical-layer ranging per IEEE 802.15.4z while the nRF52833 manages BLE 5.4 connectivity, application firmware, and the accelerometer-based motion sensing. Low power consumption allows powering from a coin-cell or Li-ion battery for long periods, making the module cost-effective for battery-operated UWB nodes. Typical applications include smartphone-to-IoT precision ranging (UWB access keys and device pairing), asset tracking tags and anchors, secure keyless entry systems, and indoor real-time location systems (RTLS) in industrial and healthcare facilities. When designing with this module, keep RF trace requirements minimal thanks to the integrated antenna, and budget for the UWB pulse repetition duty cycle to optimize battery life. A in the data indicates pricing from $41.7621 at LCSC as of 2026-10-20. This page synthesizes distributor pricing, same-family module alternatives, and practical deployment guidance not found in the manufacturer datasheet.
E18-MS1-IPX - 2.4GHz CC2530 ZigBee SMD Module | EBYTE
The Chengdu Ebyte E18-MS1-IPX is a compact 2.4 GHz SMD ZigBee wireless module based on the Texas Instruments CC2530 SoC, integrating an 8051 microcontroller core with an IEEE 802.15.4 radio transceiver. The module ships in a 20.8 x 14.1 mm surface-mount package, is supplied with an integrated IPEX/U.FL antenna connector for flexible external antenna placement, and is rated for 4 dBm typical RF output and -97 dBm receive sensitivity. It targets low-power mesh networking designs operating from 2.0 V to 3.6 V over the 2.405 GHz to 2.480 GHz ISM band. A ZigBee module is a pre-certified radio sub-assembly that bundles the RF transceiver, matching network, and crystal into a single shielded PCB so that the host product only needs a UART/SPI command interface and an antenna. Within the broader hierarchy, the E18-MS1-IPX belongs to the IEEE 802.15.4 / ZigBee family of low-power wireless personal area networks (WPANs), which sit beneath Bluetooth and Wi-Fi in the 2.4 GHz connectivity stack and are optimized for low data-rate, battery-powered mesh nodes such as smart-home sensors, lighting controllers, and industrial telemetry. The E18-MS1-IPX supports the ZigBee 3.0 and IEEE 802.15.4 protocols, exposes a 2.4 GHz operating frequency band, and provides four typical RF power steps up to 4 dBm. The pin pitch is 1.27 mm across the SMD land pattern, allowing reflow soldering on standard SMT lines. Built-in shielding plus the IPEX antenna port let designers iterate on antenna choice without re-tuning the module, which is a useful differentiator versus the E18-MS1-PCB variant that ships with a trace antenna. Typical applications include smart-home bridges and lighting nodes, ZigBee-based wireless sensor networks, industrial telemetry and HVAC controllers, and consumer IoT hubs that need a compact, certified radio front end. The combination of the CC2530 firmware ecosystem (Z-Stack, Z-Stack Home) and a stable, off-the-shelf 2.4 GHz radio shortens time-to-market for products that must interoperate with existing ZigBee coordinators. When designing with this module, place it on a keep-out zone free of ground copper directly under the IPEX antenna footprint, observe the 1.27 mm pin pitch with a reflow profile compatible with lead-free SAC305 paste, and provide a clean 3.3 V regulated rail with adequate decoupling. Compared with designing an in-house CC2530 layout, the E18-MS1-IPX removes PCB antenna tuning and regulatory RF pre-compliance work. This page synthesizes distributor pricing, verified pin/package data, drop-in Ebyte sibling modules, and design notes that go beyond the manufacturer datasheet, helping engineers evaluate the E18-MS1-IPX against alternative 2.4 GHz modules in a single view.
E180-2G4Z20SX-TB - EFR32MG21 ZigBee 3.0 Test Kit | EBYTE
The Chengdu Ebyte E180-2G4Z20SX-TB is a development test board based on the E180-2G4Z20SX wireless module, integrating the Silicon Labs EFR32MG21 ZigBee 3.0 SoC with an integrated power amplifier in a compact 28.5 x 24.6 mm USB-stick form factor pre-soldered to the carrier PCB. A ZigBee module is a pre-certified, surface-mount radio module that integrates an RF transceiver, microcontroller, antenna interface, and matching networks into a single shielded package. ZigBee modules belong to the broader hierarchy of wireless connectivity modules -> short-range IoT radios -> 2.4 GHz ISM-band transceivers -> IEEE 802.15.4-based mesh networking devices, designed to reduce RF design complexity for OEMs building mesh-enabled smart products. Key features of the E180-2G4Z20SX-TB test kit include: the host module operates in the 2.4 GHz ISM band with maximum transmit power of 20 dBm, supports ZigBee 3.0 self-organizing mesh networking, and provides USB power and serial port access via a 2.0 mm pitch pin header. The carrier PCB is pre-soldered to the E180-2G4Z20SX module so developers can plug the kit directly into a breadboard or USB host. Product weight is 3.5 g +/- 0.1 g. The E180-2G4Z20SX-TB is purpose-built for engineers evaluating the E180-2G4Z20SX module: it exposes the module's UART, GPIO, and power pins through standard 2.54 mm headers, removes RF layout risk during firmware bring-up, and ships with reference firmware for rapid ZigBee 3.0 stack validation. The internal PA delivers the 20 dBm TX power needed for long-range mesh nodes. Typical applications include ZigBee 3.0 smart-home device prototyping, industrial sensor mesh networking, smart metering pilots, building automation gateways, and wireless HVAC/lighting control development. The test kit is also used as a reference design for designers integrating the bare E180-2G4Z20SX module into their own carrier PCB. When designing with this test kit, note that the kit is a development-only assembly - it is not intended for deployment in the final product. For production designs, use the host E180-2G4Z20SX module directly on a custom carrier PCB and obtain modular transmitter / certification requirements before shipping. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for E180-2G4Z20SX-TB selection, sourcing, and integration guidance.
E180-Z6907A - 2.4GHz ZigBee 3.0 SoC Module, 7dBm, TLSR8269
Chengdu Ebyte E180-Z6907A is a surface-mount 2.4 GHz ZigBee 3.0 wireless SoC module built around the Telink TLSR8269 chip, delivering 7 dBm transmit power with -40C to +85C industrial operating range in an 11.5 x 22 mm SMD package with on-board PCB antenna. A ZigBee module is a pre-certified, RF-tested sub-system that integrates the radio transceiver, microcontroller, antenna, and matching network into a single drop-in component, allowing designers to add mesh networking capability without performing RF layout, impedance matching, or radio regulatory compliance from scratch. Within the broader taxonomy, the E180-Z6907A sits inside RF & Wireless > RF Modules, and the underlying TLSR8269 belongs to the IEEE 802.15.4 / ZigBee family of low-power, low-data-rate mesh protocols used for short-range IoT connectivity. This background matters because antenna integration, regional RF certification (FCC, CE, SRRC), and firmware stack licensing are typically the largest engineering risks in any wireless product, and integrating a certified module eliminates most of them. Key specifications include 7 dBm typical transmit power, a stated link range of approximately 130 m line-of-sight at low data rate, and a supply voltage of 3.3 V with peak TX current near 65 mA and RX/TX-idle current near 40 mA. The module exposes GPIO for host interfacing, supports on-chip battery telemetry for battery-powered devices, and includes an RF diagnostic function for production testing and link debugging. The integrated PCB antenna eliminates the need for an external antenna trace. Architecturally, the TLSR8269 combines a 32-bit MCU core with an IEEE 802.15.4 / Bluetooth Low Energy / RF 6E capable 2.4 GHz radio, allowing the same module to participate in ZigBee 3.0 mesh networks or proprietary point-to-point links depending on firmware. Ebyte ships the module with a ZigBee 3.0 stack pre-loaded; engineers who need BLE or proprietary protocols can reflash using Telink's TLSR8269 SDK and the Ebyte hardware programming pins. Typical applications include smart-home lighting, door/window sensors, occupancy and environmental sensors, smart plugs, and ZigBee coordinators or routers for mesh networks. The small SMD footprint suits space-constrained designs such as in-wall switches and battery-powered sensor nodes. Design consideration: this module is SMD reflow-only (220C peak per JEDEC J-STD-020), and the antenna keep-out zone on the host board must remain clear of copper, traces, and grounded metal within roughly 5 mm of the PCB antenna edge to preserve radiated performance. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
E180-ZG120A - 2.4GHz ZigBee 3.0 Module, 20dBm, EFR32MG1B | EBYTE
The EBYTE E180-ZG120A is a compact, surface-mount 2.4 GHz ZigBee 3.0 wireless module built on the EFR32MG1B "Mighty Gecko" SoC from Silicon Labs, housed in a 17.5 x 28.7 mm SMD package and certified to CE/FCC/RoHS standards. It delivers +20 dBm (100 mW) transmit output power with an integrated high-efficiency PA and LNA chain, enabling a line-of-sight range of approximately 1 km and high sensitivity reception in noisy RF environments. A ZigBee module is a pre-certified, application-ready radio subsystem that integrates the RF transceiver, microcontroller, antenna matching network, and regulatory shielding into a single reflow-compatible component. It belongs to the product taxonomy: ZigBee module -> 802.15.4 wireless module -> short-range IoT radio module -> RF & Wireless module -> electronic component. By embedding an ARM Cortex-M4 core with up to 256 kB flash and 32 kB RAM, the E180-ZG120A removes the design complexity of impedance-controlled RF layout from the integrator's responsibility, dramatically shortening time-to-market for IEEE 802.15.4 products. Key features include full ZigBee 3.0 protocol stack support, GPIO exposure through castellated edge pads, an integrated PCB antenna with optional external antenna variants, low standby current for battery-powered nodes, and an operating temperature range suited to industrial IoT deployments. Compared with bare-chip CC2530 designs, the PA+LNA chain on the EFR32MG1B platform delivers substantially better link margin in industrial environments. Technically, the module exposes the Silicon Labs EFR32MG1B232F256GM48 die with hardware-accelerated AES-128/256, true random number generation, and rich peripheral set including ADC, timers, USART, and I2C. Developers can program the module directly via Silicon Labs' Simplicity Studio toolchain and EmberZNet (ZigBee 3.0) or OpenThread/Zigbee R22 SDK, with reference designs for coordinator, router, and end-device roles available from the manufacturer. Typical applications include ZigBee 3.0 smart home hubs, wireless lighting control, building automation sensor meshes, industrial telemetry, and battery-powered end devices such as window/door sensors and HVAC thermostats. The integrated antenna footprint and pre-loaded EmberZNet image make it ideal for low-volume OEM products that need a fast regulatory path. When designing with this module, follow the manufacturer's PCB keep-out region around the integrated antenna, observe reflow profile of 245 C peak, and verify that the host product's enclosure material does not deshalve more than 3 dB of radiated power. Stack-up and supply decoupling should follow Silicon Labs' AN1018 reference for best RF performance. This page consolidates distributor pricing, pin-compatible module swaps, and reference-design workflows beyond the manufacturer datasheet to support fast BOM decisions for ZigBee 3.0 product teams.
E180-ZG120B - 2.4GHz ZigBee 3.0 SMD Module | EBYTE
The EBYTE E180-ZG120B is a small, low-power, high-reliability 2.4 GHz ZigBee SMD wireless module based on the Silicon Labs EFR32MG1B SoC, integrating a high-performance 32-bit ARM Cortex-M4 core with an integrated power amplifier delivering up to 19 dBm (20 dBm typical chip-side) transmit output. The module measures 18 x 11.5 mm in surface-mount form factor, runs on a 3.3 V supply, and includes an IPEX/U.FL antenna connector for flexible RF chain design. A ZigBee module is a pre-certified surface-mount radio block that combines an RF transceiver, microcontroller, crystal oscillator, and matching network into a single shield-ready component. Within the broader wireless taxonomy, ZigBee (IEEE 802.15.4) sits alongside BLE, Thread, and proprietary sub-GHz protocols as a low-power mesh networking standard for IoT. The E180-ZG120B specifically supports ZigBee 3.0, enabling interoperability with the ZigBee Home Automation, Light Link, and Green Power profiles for unified mesh device ecosystems. Key features include 19 dBm (135 mA peak) maximum RF output, 10 mA average receive current, SMD package with castellated edge contacts, UART host interface, and an operating temperature range of -40 C to +85 C. The module exposes GPIO pins and supports AT command-mode as well as transparent serial-port operation, simplifying integration into legacy and new MCU designs. The EFR32MG1B SoC core delivers Cortex-M4 processing with built-in hardware crypto, hardware AES, and integrated balun, eliminating the need for external RF components. The internal PA bypass network and SAW filter on the module PCB provide 1.3 km line-of-sight range per the manufacturer's benchmark, while sleep current in low-power modes enables multi-year battery operation. Pre-loaded ZigBee 3.0 stack reduces firmware development time. Typical applications include smart home lighting and switch control, ZigBee 3.0 coordinator and router nodes, industrial sensor telemetry, wireless meter reading, and remote control scenarios where mesh networking and AES-128 security are required. The module's compact SMD footprint suits dense PCB designs and reflow-compatible assembly. For best performance, place the module at the PCB edge away from metal enclosures, route the IPEX antenna path clear of ground pours, and provide a stable 3.3 V LDO with at least 200 mA headroom to handle the 135 mA transmit peak. The UART baud rate, GPIO mapping, and AT command set are configured through the host MCU. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement the official E180-ZG120A/B user manual v1.0 from Chengdu Ebyte Electronic Technology.