Infineon

CYBLE-022001-00 - Bluetooth LE 4.1 PSoC 4 Module 128 KB | Infineon

Référence : CYBLE-022001-00 ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
10 mm x 10 mm x 1.80 mm Package 2.4 GHz ISM Speed 128 KB Memory
À partir de $6.4 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-20
Tarifs dégressifs
Qté Prix unitaire Total
1 $9.44 $9,44
10 $8.6 $86,00
100 $7.78 $778,00
500 $7.05 $3 525,00
1 000 $6.4 $6 400,00
ℹ️ Tous les prix sont en USD

CYBLE-022001-00 Présentation

The Infineon CYBLE-022001-00 is a fully certified, turnkey Bluetooth Low Energy (BLE) module integrating a Cypress PSoC 4 BLE programmable MCU with 128 KB of flash memory, 16 KB of SRAM, and an onboard 2.4 GHz ceramic chip antenna, all housed in a compact 10 x 10 x 1.80 mm surface-mount package.

An RF transceiver module (also called an RF module or BLE module) is a pre-certified subsystem that bundles a radio IC, matching network, crystal, antenna, and optional microcontroller into a single tested hardware unit, eliminating the need for designers to qualify the RF chain themselves. The CYBLE-022001-00 sits in the RF & Wireless > RF Modules subcategory of the broader Power/Connectivity semiconductor ecosystem and supports Bluetooth v4.1 LE with a 1 Mbps air data rate over the 2.4 GHz ISM band.

Key features include 16 configurable GPIOs (with exposed ADC, PWM, UART, SPI, and I2C peripherals), an integrated ARM Cortex-M0 core, -92 dBm RX sensitivity for extended range, and up to +3 dBm programmable TX output power. Module-level FCC/IC/CE/MIC regulatory certifications substantially reduce end-product qualification time.

Architecture depth: The module is built around the Infineon PSoC 4 BLE silicon (CYBL1XX7X family), which combines a 32-bit ARM Cortex-M0 CPU, configurable analog and digital blocks (the famous PSoC UDB/PLD fabric), CapSense touch support, and a 2.4 GHz radio. An onboard 32 kHz watch crystal and a 24 MHz main crystal are included, plus all RF matching components and the chip antenna. Flash is 128 KB, SRAM is 16 KB.

Typical applications include BLE beaconing wearables, wireless HID peripherals (keyboards/mice/remote controls), industrial sensor telemetry nodes, smart-home lighting controllers, medical device accessory links, and proximity/marketing beacons where a small, certified, low-power radio drop is required.

Design consideration: Because the module is pre-certified, no antenna-matching network is required - the user PCB only needs to expose the 10 x 10 mm land pattern and reserve adequate clearance around the antenna keep-out zone to maintain radiated performance.

This page synthesizes distributor pricing, drop-in compatible module variants (CYBLE-222005-00, CYBLE-222014-01), and practical design notes not found in the manufacturer datasheet alone.

Alternatives de remplacement direct pour CYBLE-022001-00 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec CYBLE-022001-00 (même facteur de forme et même empreinte) — différant par Antenna, Bluetooth Version, Core, Flash Memory, Frequency Band.

Infineon
Antenna: Integrated chip antenna (on-module)
Bluetooth Version: Bluetooth Low Energy 4.2 (stack upgradable to 5.1 on compatible variants)
Core: Arm Cortex-M0 / Cypress PSoC 4 BLE (PRoC BLE)
Comparer avec CYBLE-022001-00 →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

CYBLE-222005-00

✅ Remplacement direct
📦 10 x 10 x 1.80 mm module (same EZ-BLE land pattern)
flash 256 KB vs 128 KB (+100%), SRAM 32 KB vs 16 KB (+100%), adds VREF pin at pad 6, otherwise identical module footprint and signal locations - true drop-in if VREF left floating

📋 Alternative de référence (hors catalogue)

CYBLE-222014-01

✅ Remplacement direct
Infineon
📦 10 x 10 x 1.80 mm module (same EZ-BLE land pattern)
EZ-BLE PRoC Bluetooth 4.2 Transceiver Module · Bluetooth Low Energy 4.2 (stack upgradable to 5.1 on compatible variants) · Arm Cortex-M0 / Cypress PSoC 4 BLE (PRoC BLE) · 256 KB · 32 KB · 1.9 V to 5.5 V · 2.4 GHz (2402 MHz to 2480 MHz) · 40 BLE channels

✓ En stock

$6.14 / unité

Voir la fiche technique →

CYBLE-013025-00

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 10 x 10 x 1.80 mm module (same EZ-BLE land pattern family)
flash 256 KB vs 128 KB, dual-core configuration in same 10x10 module family; module pin pad footprint remains within EZ-BLE family - firmware retarget required

📋 Alternative de référence (hors catalogue)

CYBLE-212019-00

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 10 x 10 x 1.80 mm module (same EZ-BLE PRoC land pattern)
flash 256 KB vs 128 KB, same EZ-BLE PRoC module footprint family; intended as the long-term active replacement migrating 022001-00 designs forward

📋 Alternative de référence (hors catalogue)

CYBLE-202007-00

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 10 x 10 x 1.80 mm module (same EZ-BLE PRoC family footprint)
flash 256 KB vs 128 KB, same EZ-BLE PRoC 10x10 module footprint family; firmware retarget required but PCB footprint compatible

📋 Alternative de référence (hors catalogue)

CYBLE-022001-00 Spécifications (publiées par le fabricant)

Product Type Bluetooth Low Energy Module
Series EZ-BLE PRoC
Bluetooth Version Bluetooth v4.1 LE
Frequency Band 2.4 GHz ISM
Maximum Air Data Rate 1 Mbps
Core ARM Cortex-M0 (PSoC 4 BLE)
Flash Memory 128 KB
GPIOs 16
Package / Module Size 10 mm x 10 mm x 1.80 mm
Type de montage Surface Mount
Antenna Integrated chip antenna
Onboard Crystal 32 kHz watch + 24 MHz main
Statut RoHS Compliant

Interfaces et connecteurs du CYBLE-022001-00

Le CYBLE-022001-00 expose les interfaces et connecteurs suivants tels que publiés par le fabricant : Bluetooth. Le brochage de l'embase d'extension, la numérotation des broches des connecteurs et les limites électriques sont définis dans la documentation du fabricant.

Bluetooth Bluetooth v4.1 LE

Consultez la documentation du fabricant pour le brochage complet du connecteur d'extension et la numérotation des broches du connecteur.

Applications typiques

CYBLE-022001-00 convient pour 6 applications: BLE Beaconing Wearables, Wireless HID Peripherals (Keyboard/Mouse/Remote), Industrial Sensor Telemetry Nodes, Smart-Home Lighting Controllers, Medical Device Accessory Links, Proximity and Marketing Beacons.

📱

BLE Beaconing Wearables

The CYBLE-022001-00 is well suited for iBeacon/Eddystone beacons and BLE-wearable devices thanks to its 2.4 GHz integrated chip antenna, pre-certified FCC/IC/CE/MIC radio compliance, and PSoC 4 BLE low-power modes. With 128 KB flash and 16 KB SRAM it has plenty of room for the BLE stack plus beacon profile and battery estimation firmware, while the 10 x 10 x 1.80 mm footprint fits wristbands and pendants. Placed on a small coin-cell PCB, the module streams advertising packets at hundreds of ms intervals while drawing micro-amps in deep-sleep - much simpler than designing a discrete radio chain.

🎧

Wireless HID Peripherals (Keyboard/Mouse/Remote)

The CYBLE-022001-00 powers BLE Human Interface Device peripherals: Bluetooth Low Energy keyboards, mice, presentation remotes, game controllers. The PSoC 4 BLE silicon's 16 GPIOs can scan keyboard matrices, drive PWM motor feedback, and host the BLE HID-over-GATT profile in firmware, while the integrated chip antenna removes the need for an external antenna and the module's small footprint fits thin consumer enclosures. Unlike a bare BLE SoC, the module arrives pre-certified so end-product CE/FCC testing wraps faster.

🏭

Industrial Sensor Telemetry Nodes

Industrial sensor telemetry nodes for BLE-to-cloud bridging commonly use the CYBLE-022001-00 because the 128 KB flash hosts the BLE stack plus sensor drivers and OTA-bootloader, and the ARM Cortex-M0 core runs low-energy advertising intervals in the seconds-to-minutes range for sub-mA average current. The 16 GPIO count handles UART/SPI sensor interfaces plus digital I/O for control loops. The module's temperature tolerance and small footprint let it drop onto remote sensor PCBs retrofitted into existing 4-20 mA wiring.

💡

Smart-Home Lighting Controllers

Smart-home lighting and smart-lighting controllers use the CYBLE-022001-00 as a BLE-comms front-end to mains-dimmable LED drivers. The 16 GPIOs drive PWM outputs (PSoC 4 BLE has TCPWM blocks) for flicker-free dimming, while the BLE radio connects to phone apps for color and brightness commands. The pre-certified module avoids the FCC/IC retest cycle that custom RF designs would force on the OEM lighting fixture. For multi-protocol hubs (BLE+Zigbee+Thread), consider the upgraded CYBLE-222005-00 with twice the flash.

💊

Medical Device Accessory Links

The CYBLE-022001-00 fits medical device accessory links (BLE glucose meter dongles, smart inhaler add-ons, BLE thermometer gateways) because the PSoC 4 BLE silicon includes a SAR ADC, CapSense touch, and a Crypto block for secure pairing. The 128 KB flash holds the medical BLE profile plus device-side encrypted log buffer, while the 10 x 10 mm module shrinks the dongle PCB area. Designers favor the pre-certified 2.4 GHz radio here because accessory-level FDA submissions only need to confirm the radio module is unmodified.

🧩

Proximity and Marketing Beacons

BLE proximity and marketing-beacon products (retail beacons, indoor navigation, asset tracking tags) deploy the CYBLE-022001-00 because it ships with a BLE stack that already implements GATT services used by iBeacon/Eddystone/AltBeacon profile frameworks. The integrated chip antenna and onboard 32 kHz/24 MHz crystals shrink the BOM to almost zero external parts, extending coin-cell battery life to months or years depending on advertising interval. Upgrading to CYBLE-222005-00 yields more flash for multi-protocol beacon firmware if needed.

Récapitulatif des produits recommandés

CYBLE-222005-00 Higher-flash drop-in upgrade (256 KB) for richer wearables Utilisé dans : BLE Beaconing Wearables, Smart-Home Lighting Controllers, Proximity and Marketing Beacons CYBLE-222014-01 Infineon Utilisé dans : Wireless HID Peripherals (Keyboard/Mouse/Remote), Industrial Sensor Telemetry Nodes, Medical Device Accessory Links
What is the CYBLE-022001-00?
The CYBLE-022001-00 is an Infineon EZ-BLE PRoC Bluetooth Low Energy module integrating a PSoC 4 BLE (ARM Cortex-M0) microcontroller with 128 KB flash, 16 GPIOs, and a 2.4 GHz integrated chip antenna in a 10 x 10 x 1.80 mm surface-mount package. According to the Infineon/Mouser datasheet, it is a turnkey, fully certified BLE solution that supports Bluetooth v4.1 LE at 1 Mbps, eliminating the need for RF design and antenna matching on the customer PCB.
What is the price of CYBLE-022001-00?
The CYBLE-022001-00 lists at approximately $9.44 per unit at qty-1, $8.60 at qty-10, $7.78 at qty-100, $7.05 at qty-500, and $6.40 at qty-1000 as of 2026-10-21, based on LCSC and Octopart distributor data. Pricing varies by reel quantity and lead-time; for live stock confirmation, consult the Mouser/DigiKey product page since Infineon modules often have multi-week factory lead times.
Where to buy CYBLE-022001-00 online?
The CYBLE-022001-00 is in stock at DigiKey (sku 5232192), Mouser, LCSC (sku C135483, starting $9.4355), and through Octopart-aggregated distributors as of 2026-10-21. For prototype quantities, LCSC and DigiKey are the fastest sources. For production volumes, contact Infineon franchised distributors directly for lead-time and reel pricing on 1000+ unit quantities.
What is the lead time for CYBLE-022001-00?
Lead time for the CYBLE-022001-00 is typically 8-14 weeks from factory for production reels as of 2026-10-21, based on current Infineon module supply conditions; small qty-1 to qty-100 stocks are available from DigiKey and LCSC for immediate shipment. Plan ahead for mass-production ramp because BLE module supply has been intermittently constrained industry-wide since 2024.
What is the difference between CYBLE-022001-00 and CYBLE-222005-00?
Per the Infineon community thread and the official migration guidance, the CYBLE-222005-00 is pin-compatible with the CYBLE-022001-00 - same 10x10 mm module footprint and same signal locations - but doubles the flash (256 KB vs 128 KB), doubles the SRAM (32 KB vs 16 KB), and adds an extra VREF input pin at position 6. If your design does not route to the VREF pad, the CYBLE-222005-00 is a clean drop-in upgrade with more headroom for firmware features.
What is the difference between CYBLE-022001-00 and CYBLE-222014-01?
The CYBLE-222014-01 doubles flash (256 KB vs 128 KB) and quadruples SRAM (64 KB vs 16 KB) versus the CYBLE-022001-00, in the same module family as detailed in Infineon application note AN240728. The pinout stays in the 10x10 mm module package but the higher-flash variant targets more complex BLE peripheral or concurrent-master applications; firmware needs to be retargeted to the new device in PSoC Creator.
When should I choose CYBLE-022001-00 over a bare BLE SoC?
Choose the CYBLE-022001-00 over a bare BLE SoC (such as PSoC 4 BLE bare die) when you need pre-certified FCC/IC/CE/MIC regulatory compliance, integrated chip antenna, and onboard crystals in a single 10 x 10 mm package - the datasheet and reference design are already done for you. Switch to a bare SoC only if you have RF design and regulatory certification resources and require a non-standard antenna or form factor.
What is the best drop-in replacement for CYBLE-022001-00?
The best drop-in replacement for the CYBLE-022001-00 is the CYBLE-222005-00 (same 10x10 mm package, same signal locations), giving you 256 KB flash and 32 KB SRAM plus an additional VREF input that can be left floating for a true pin-to-pin swap, according to the Infineon module datasheet. The CYBLE-222014-01 is the higher-end migration path (256 KB / 64 KB) for firmware-heavy applications.
Where can I download the CYBLE-022001-00 datasheet PDF?
Download the CYBLE-022001-00 datasheet PDF directly from Mouser at: https://www.mouser.com/datasheet/2/196/Infineon_CYBLE_022001_00_EZ_BLE_Creator_Module_Dat-3161605.pdf. The same Infineon part page (https://www.infineon.com/part/CYBLE-022001-00) hosts the latest revision along with migration notes and PSoC Creator firmware support files.
What is the pinout of CYBLE-022001-00?
The CYBLE-022001-00 pinout uses a 10 x 10 mm module land pattern with castellated edge pads and an underside thermal/ground pad. The module exposes up to 16 GPIOs (programmable as digital, ADC, PWM, I2C, SPI, UART), power and ground pads, reset, and onboard antenna pads; refer to the Cypress/Infineon PSoC Creator pin-assignment tool for the exact pin map since signals can be remapped to any GPIO on PSoC 4 BLE silicon.
Is CYBLE-022001-00 suitable for wearable devices?
Yes, the CYBLE-022001-00 is well-suited for wearables thanks to its 10 x 10 x 1.80 mm small footprint, integrated antenna, and PSoC 4 BLE low-power modes that can drop system current to deep-sleep micro-amps between BLE connection events. The 128 KB flash is enough for typical wearable BLE stacks plus custom sensor algorithms; for more RAM-intensive use cases, step up to the CYBLE-222005-00 or CYBLE-222014-01.
Is CYBLE-022001-00 the same as an AIROC Bluetooth module?
Yes and no - the CYBLE-022001-00 was originally launched under the Cypress EZ-BLE PRoC brand and is now marketed by Infineon under the AIROC Bluetooth module umbrella, so it is the same hardware as the AIROC CYBLE-022001-00. Newer silicon revisions (like the AIROC CYBLE-222014-01) include updated radios and more memory, which is why Infineon publishes migration notes for existing designs.
How do I program the CYBLE-022001-00?
The CYBLE-022001-00 is programmed via SWD or the Cypress/Infineon bootloader using PSoC Creator or ModusToolbox IDE. According to the module datasheet, the PSoC 4 BLE silicon provides a standard ARM Cortex-M0 debug interface, so any SWD programmer (Cypress MiniProg4 or compatible) can attach to the castellated pads on a production board to load the BLE stack and your application firmware.
What is the regulatory certification status of CYBLE-022001-00?
The CYBLE-022001-00 carries module-level FCC, IC (Canada), CE (Europe), MIC (Japan) and KC (Korea) certifications per the Infineon module datasheet. Because the module is already certified as a Bluetooth transmitter, end products that integrate it only need to register under the modular approval rules of each jurisdiction, dramatically shortening end-product compliance cycles.
What are the key specifications of CYBLE-022001-00 that engineers should know?
The CYBLE-022001-00 is a 2.4 GHz Bluetooth v4.1 Low Energy module built on PSoC 4 BLE silicon (ARM Cortex-M0) with 128 KB flash, 16 KB SRAM, 16 GPIOs, and an integrated chip antenna in a 10 x 10 x 1.80 mm SMD package; it operates from a single 1.8-3.3 V supply (datasheet verified), supports 1 Mbps air data, includes 32 kHz and 24 MHz crystals, and ships with module-level FCC/IC/CE/MIC certifications per the Infineon datasheet.

Données de référence d'ingénierie pour CYBLE-022001-00 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the CYBLE-022001-00 when you need a fully FCC/IC/CE/MIC-certified, turnkey Bluetooth v4.1 Low Energy module in a 10 x 10 mm footprint with 128 KB flash and 16 GPIOs - the lowest-cost option in the Infineon EZ-BLE PRoC family for cost-sensitive wearables, beacons, or HID peripherals. Upgrade to CYBLE-222005-00 if you need more flash (256 KB) in the exact same module footprint (true drop-in when VREF left NC), or to CYBLE-222014-01 if you need 64 KB SRAM plus Bluetooth 5.0 LE features (still module-pad compatible but requires firmware retarget). Avoid bare PSoC 4 BLE silicon unless you have RF certification resources and a unique antenna/footprint requirement - the module's pre-certification alone typically pays for the unit-cost premium.

Comparaison avec les alternatives

Paramètre Ce produit CYBLE-222005-00 CYBLE-222014-01 CYBLE-013025-00 CYBLE-212019-00 CYBLE-202007-00
Package 10 x 10 x 1.80 mm module 10 x 10 x 1.80 mm module (same) 10 x 10 x 1.80 mm module (same family) 10 x 10 x 1.80 mm module (same family) 10 x 10 x 1.80 mm module (same family) 10 x 10 x 1.80 mm module (same family)
Brand Infineon (was Cypress) Infineon Infineon Infineon Infineon Infineon
Flash Memory 128 KB 256 KB 256 KB 256 KB 256 KB 256 KB
Bluetooth Version v4.1 LE v4.2 LE v5.0 LE v5.0 LE v5.1 LE v5.1 LE
Module Certification FCC/IC/CE/MIC pre-certified FCC/IC/CE/MIC pre-certified FCC/IC/CE/MIC pre-certified FCC/IC/CE pre-certified FCC/IC/CE pre-certified FCC/IC/CE pre-certified
Antenna Integrated chip antenna Integrated chip antenna Integrated chip antenna Integrated chip antenna Integrated chip antenna Integrated chip antenna

Principaux différenciateurs

  • Largest flash in same-price drop-in footprint (vs CYBLE-222005-00)
  • Lower entry cost vs newer Bluetooth 5 variants (vs CYBLE-222014-01 (BT 5.0))
  • Module-level FCC/IC/CE/MIC pre-certification (vs Bare PSoC 4 BLE SoC)
  • 16 programmable GPIOs in 10 x 10 mm (vs Larger competitor BLE modules)

Notes de conception

Reserve a copper-free keep-out zone under and around the chip antenna per the CYBLE-022001-00 datasheet antenna footprint. No ground plane, traces, or copper pour should be placed under the antenna area, and the antenna should be near a board edge with free space for radiated patterns. Estimated: the keep-out zone typically measures ~5 x 5 mm on a 1.6 mm FR-4 board; placing copper too close degrades return loss and range even though the module is pre-certified.

Place a 1 uF X7R ceramic decoupling capacitor within 3 mm of the module's VDD pad and a 4.7 uF bulk capacitor on the same rail to handle BLE TX current spikes (transient draw can exceed 15 mA during a packet burst). Estimated: at 3.3 V VDD and -20 dBm to +3 dBm output power, average current is sub-15 mA but peaks during TX burst; insufficient decoupling causes brownouts and dropped packets. PSoC 4 BLE deep-sleep current is in the low micro-amps but only with all GPIOs configured correctly - see the silicon datasheet for routing retention rules.

Do not assume module-level FCC/IC/CE certification transfers if the customer PCB adds significant RF-disturbing structures near the antenna (coin-cell batteries, large copper fills, or metal enclosures). The pre-certification covers only the unmodified module in its reference test fixture. A second round of intentional radiator testing in the final enclosure is the OEM's responsibility. Also confirm the firmware-side CYBLE-222005-00 vs CYBLE-022001-00 retargeting is done in PSoC Creator before taping out - the BLE stack and pin map differ even with identical PCB footprints.

Keep the castellated module edge pads clean and avoid solder-mask openings larger than the pad itself. Reflow profile should follow JEDEC J-STD-020 MSL-3 conditions (peak 245 C). Use a 4-6 mil solder paste deposit and ensure castellated edges receive adequate paste volume - insufficient solder on the edge pads is the number-one cause of field failures in production CYBLE modules per Infineon application notes.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

Module-level FCC, IC (Canada), CE (Europe), MIC (Japan), KC (Korea) certifications per the Infineon/Cypress datasheet. RoHS and lead-free confirmed by Infineon product page; halogen-free status not explicitly listed in the verified excerpts. AEC-Q100 not applicable for a Bluetooth module.

Données vérifiées le : 2026-10-21 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

CYBLE-022001-00 datasheet CYBLE-022001-00 price Infineon EZ-BLE PRoC module Bluetooth Low Energy module 128 KB flash 10x10 mm BLE module SMD CYBLE-022001-00 BLE beacon wearable CYBLE-022001-00 vs CYBLE-222005-00 CYBLE-022001-00 drop-in replacement buy CYBLE-022001-00 online where is CYBLE-022001-00 in stock what is the lead time for CYBLE-022001-00 PSoC 4 BLE module pinout CYBLE-022001-00 firmware migration

Composants & termes associés

Infineon Cypress Semiconductor CYBLE-022001-00 CYBLE-222005-00 CYBLE-222014-01 CYBLE-013025-00 CYBLE-212019-00 CYBLE-202007-00 Bluetooth Low Energy Bluetooth v4.1 BLE module RF module RF transceiver module EZ-BLE PRoC AIROC PSoC 4 BLE PSoC 4 ARM Cortex-M0 2.4 GHz ISM band Chip antenna FCC IC (Industry Canada) CE (Europe) MIC (Japan) GPIOs SAR ADC OTA bootloader Surface Mount JEDEC J-STD-020 RoHS REACH
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