10AX115U3F45I2SG vs 10AX115U3F45E2SG Comparaison
Comparaison détaillée côte à côte de 10AX115U3F45I2SG par Intel et 10AX115U3F45E2SG par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | 10AX115U3F45I2SG | 10AX115U3F45E2SG |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $7 450,00 | $5 800,00 |
| Series | Arria 10 GX | — |
| Logic Elements | 1,150,000 | — |
| Embedded Memory (M20K) | 68,857,856 bits (67.5 Mbit) | — |
| Embedded Memory Blocks | 1,518 | — |
| DSP Blocks (18x19 Multipliers) | 1,518 | — |
| User I/O Pins | 480 | — |
| Transceivers | 24 channels | — |
| Max Transceiver Data Rate | 14.4 Gbps | — |
| Hard Memory Controller | Yes (DDR4 / DDR3 / QDRII+) | — |
| Process Technology | TSMC 20 nm | — |
| Boîtier | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45, 45×45 mm, 1.0 mm pitch) |
| Operating Temperature Grade | Industrial (-40C to +100C junction) | — |
| Speed Grade | I2 | -2 (E2 commercial/extended) |
| Configuration Scheme | AES-256 encrypted, partial reconfiguration | — |
| Type de montage | Surface Mount | — |
| Statut RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Niveau MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |
| Family | — | Arria 10 GX |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Embedded Memory Bits | — | 68,857,856 (≈ 52.99 Mbit) |
| Number of Transceivers | — | [DATA_NEEDED: per-die transceiver count, F45 package variant] |
| Maximum Transceiver Data Rate | — | 17.4 Gbps |
| DSP Blocks | — | Variable-precision, hardened floating-point |
| Hard Memory Controllers | — | 2 (DDR4/DDR3/QDRII+/RLDRAM3) |
| Hard PCIe Gen3 IP Blocks | — | 2 × PCIe Gen3 (x8/x4/x2/x1) |
| Process Node | — | 20 nm Tri-Gate (Intel) |
| Température de fonctionnement | — | Industrial (junction -40 °C to +100 °C) – device grade U |
| Supply Voltage Core | — | [DATA_NEEDED: VCC/VCCP core voltage] |
| Configuration Method | — | FPGA configuration via serial/parallel flash, JTAG |
| RoHS Compliance | — | Compliant |