10M25DCF256I7G vs 10M08DCF256I7G Comparaison
Comparaison détaillée côte à côte de 10M25DCF256I7G par Intel et 10M08DCF256I7G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | 10M25DCF256I7G | 10M08DCF256I7G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $27,60 | $12,20 |
| Series | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | 8,000 |
| Number of LABs/CLBs | 1,563 | — |
| Total RAM Bits | 691,200 (675 Kbit) | — |
| Number of I/O Pins | 178 | — |
| Boîtier / Format | 256-LBGA (F256, 17x17 mm, 1.0 mm pitch) | — |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | I7 (fastest industrial speed grade) | — |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | On-chip dual-configuration flash (non-volatile) |
| User Flash Memory | [DATA_NEEDED: user flash size in Mbit] | — |
| Embedded ADC | 12-bit, multi-channel (per MAX 10 family) | — |
| PLLs | [DATA_NEEDED: PLL count per F256 variant] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Programming Method | JTAG / Passive Serial (via Quartus Prime) | — |
| Niveau MSL | 3 (per BGA handling) | — |
| Statut RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes | — |
| Packaging | Tray | — |
| Family | — | MAX 10 FPGA |
| Embedded Memory (bits) | — | 387,072 |
| User I/O Count | — | 178 |
| DSP Blocks (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Boîtier | — | 256-FBGA (FineLine BGA) |
| Supply Voltage - Core | — | [DATA_NEEDED: core voltage range] |
| Supply Voltage - I/O Banks | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| On-die ADC | — | 12-bit, up to 1 MSa/s |
| External Memory Interface | — | LPDDR2 / DDR3 / DDR3L |
| Lead-Free | — | Yes |
| Process Technology | — | 55 nm NOR-flash-backed CMOS |