10M25DCF256I7G vs 10M08DCF256I7G Vergleich
Detaillierter Direktvergleich von 10M25DCF256I7G von Intel und 10M08DCF256I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M25DCF256I7G | 10M08DCF256I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $27,60 | $12,20 |
| Series | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | 8,000 |
| Number of LABs/CLBs | 1,563 | — |
| Total RAM Bits | 691,200 (675 Kbit) | — |
| Number of I/O Pins | 178 | — |
| Gehäuse / Bauform | 256-LBGA (F256, 17x17 mm, 1.0 mm pitch) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | I7 (fastest industrial speed grade) | — |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | On-chip dual-configuration flash (non-volatile) |
| User Flash Memory | [DATA_NEEDED: user flash size in Mbit] | — |
| Embedded ADC | 12-bit, multi-channel (per MAX 10 family) | — |
| PLLs | [DATA_NEEDED: PLL count per F256 variant] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Programming Method | JTAG / Passive Serial (via Quartus Prime) | — |
| MSL-Level | 3 (per BGA handling) | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes | — |
| Packaging | Tray | — |
| Family | — | MAX 10 FPGA |
| Embedded Memory (bits) | — | 387,072 |
| User I/O Count | — | 178 |
| DSP Blocks (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Gehäuse | — | 256-FBGA (FineLine BGA) |
| Supply Voltage - Core | — | [DATA_NEEDED: core voltage range] |
| Supply Voltage - I/O Banks | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| On-die ADC | — | 12-bit, up to 1 MSa/s |
| External Memory Interface | — | LPDDR2 / DDR3 / DDR3L |
| Lead-Free | — | Yes |
| Process Technology | — | 55 nm NOR-flash-backed CMOS |