10M25DCF256I7G vs 10M08DCF256I7G Comparação
Comparação detalhada lado a lado de 10M25DCF256I7G por Intel e 10M08DCF256I7G por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | 10M25DCF256I7G | 10M08DCF256I7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $27,60 | $12,20 |
| Series | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | 8,000 |
| Number of LABs/CLBs | 1,563 | — |
| Total RAM Bits | 691,200 (675 Kbit) | — |
| Number of I/O Pins | 178 | — |
| Encapsulamento / Caixa | 256-LBGA (F256, 17x17 mm, 1.0 mm pitch) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | I7 (fastest industrial speed grade) | — |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | On-chip dual-configuration flash (non-volatile) |
| User Flash Memory | [DATA_NEEDED: user flash size in Mbit] | — |
| Embedded ADC | 12-bit, multi-channel (per MAX 10 family) | — |
| PLLs | [DATA_NEEDED: PLL count per F256 variant] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Programming Method | JTAG / Passive Serial (via Quartus Prime) | — |
| Nível MSL | 3 (per BGA handling) | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes | — |
| Packaging | Tray | — |
| Family | — | MAX 10 FPGA |
| Embedded Memory (bits) | — | 387,072 |
| User I/O Count | — | 178 |
| DSP Blocks (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Encapsulamento | — | 256-FBGA (FineLine BGA) |
| Supply Voltage - Core | — | [DATA_NEEDED: core voltage range] |
| Supply Voltage - I/O Banks | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| On-die ADC | — | 12-bit, up to 1 MSa/s |
| External Memory Interface | — | LPDDR2 / DDR3 / DDR3L |
| Lead-Free | — | Yes |
| Process Technology | — | 55 nm NOR-flash-backed CMOS |