A3P600-1FGG256I - ProASIC3 FPGA, 600K Gates | Microchip A3P600-1FGG256I par Microchip Technology - composant électronique
Microchip Technology

A3P600-1FGG256I - ProASIC3 FPGA, 600K Gates | Microchip

Référence : A3P600-1FGG256I ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
1.425V ~ 1.575V Vdss 256-LBGA Package 272 MHz Speed 110592 bits Memory
À partir de $16.19 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-08-31
Tarifs dégressifs
Qté Prix unitaire Total
1 $25.43 $25,43
10 $23.12 $231,20
100 $20.81 $2 081,00
500 $18.5 $9 250,00
1 000 $16.19 $16 190,00
ℹ️ Tous les prix sont en USD
Voir la fiche technique (PDF) Voir les alternatives

A3P600-1FGG256I Présentation

The Microchip Technology A3P600-1FGG256I is a ProASIC3 Field Programmable Gate Array (FPGA) with 600K system gates, 177 user I/Os, and 110,592 bits of flash-based RAM, housed in a 256-ball FBGA package. It operates at a maximum internal frequency of 272 MHz and is fabricated on 130nm flash technology with a 1.5V core supply.

A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic. Unlike microcontrollers, FPGAs provide massive parallel processing capabilities and are reprogrammable, making them ideal for prototyping and low-to-mid volume production. The ProASIC3 family is a flash-based FPGA, meaning it retains its configuration even without power, offering instant-on capability and enhanced security compared to SRAM-based FPGAs.

Key features of the A3P600-1FGG256I include 600K system gates, 177 user I/Os, 110,592 bits of RAM, and support for up to 272 MHz system performance. It also offers low power consumption, a single-chip solution, and a small footprint package. The device is reprogrammable, allowing design updates in the field, and includes advanced security features to protect intellectual property.

Technically, the A3P600-1FGG256I is built on Microchip's ProASIC3 flash architecture, which combines the benefits of non-volatile configuration with high performance. The 130nm process technology enables low dynamic power and high logic density. The device supports various I/O standards, including LVCMOS, LVTTL, and differential standards, making it versatile for different interface requirements.

Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. Its reprogrammability and security features make it suitable for applications requiring field updates and IP protection. The 256-ball FBGA package is compact, enabling space-constrained designs.

When designing with this FPGA, consider the 1.5V core supply and the need for proper decoupling capacitors near the power pins. The device also requires configuration via JTAG or SPI, and the flash-based nature eliminates the need for external configuration memory.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P600-1FGG256I.

Alternatives de remplacement direct pour A3P600-1FGG256I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec A3P600-1FGG256I (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, System Gates, Configuration Technology, Total RAM Bits.

Microchip Technology
System Gates: 600000
Total RAM Bits: 110592 bits
Comparer avec A3P600-1FGG256I →
Microchip Technology
Package: 256-LBGA (FBGA)
Operating Temperature: -40C to +100C (Industrial)
System Gates: 600K
Comparer avec A3P600-1FGG256I →
Microchip Technology
Package: 256-ball FBGA / LBGA, 17x17 mm, 1.00 mm pitch
System Gates: 600,000
Configuration Technology: Nonvolatile flash, instant-on
Comparer avec A3P600-1FGG256I →
Microchip Technology
Package: 256-FBGA (LBGA)
Configuration Technology: Flash (single-chip, no external PROM)
Comparer avec A3P600-1FGG256I →
Microchip Technology
Package: 256-LBGA / 256FBGA
Operating Temperature: -40C to +100C
System Gates: 600,000
Comparer avec A3P600-1FGG256I →
Microchip Technology
Package: 256-LBGA (FBGA-256)
System Gates: 600,000
Total RAM Bits: 110,592
Comparer avec A3P600-1FGG256I →
Microchip Technology
Package: 256-Ball FBGA (FGG256)
Operating Temperature: -40C to +85C
System Gates: 600K
Comparer avec A3P600-1FGG256I →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

A3P600-FGG256I

✅ Remplacement direct
Microchip Technology
📦 256-FBGA
ProASIC3 · 600K · 13824 · 110592 bits · 177 · 231 MHz · 130 nm · 1.5 V

✓ En stock

$96.23 / unité

Voir la fiche technique →

A3P600-2FGG256I

✅ Remplacement direct
Microchip Technology
📦 256-FBGA
ProASIC3 · 600,000 · 13,824 · 177 · 110,592 · 1.5 V (1.425 V to 1.575 V) · 130 nm · 310 MHz

✓ En stock

$49.8 / unité

Voir la fiche technique →

A3P600L-1FGG256I

✅ Remplacement direct
📦 256-FBGA
Low-power variant, lower static power, same pinout

📋 Alternative de référence (hors catalogue)

A3P600-FG256I

✅ Remplacement direct
Microchip Technology
📦 256-FBGA
Field Programmable Gate Array (FPGA) · ProASIC3 · 600,000 · 13,824 VersaTiles (7K logic elements per Mouser) · 110,592 · 177 · 1.5 V

✓ En stock

$23.1 / unité

Voir la fiche technique →

A3P600-1FG256I

✅ Remplacement direct
Microchip Technology
📦 256-FBGA
ProASIC3 · 600K · 7K LEs · 177 · 110592 · 272 MHz · 130 nm · 1.5 V

✓ En stock

$41.8 / unité

Voir la fiche technique →

A3P600-1FGG256I Valeurs maximales et caractéristiques électriques

Family ProASIC3
Number of Logic Elements/Cells 7KLEs
Total RAM Bits 110592
Number of I/O 177
Number of Gates 600K
Voltage - Supply 1.425V ~ 1.575V
Type de montage Surface Mount
Boîtier / Format 256-LBGA
Supplier Device Package 256-FBGA
Température de fonctionnement -40°C ~ 100°C (TJ)
Maximum Operating Frequency 272 MHz
Technology 130nm
Core Supply Voltage 1.5V
Embedded Memory 110592 bits
Statut RoHS Compliant

Configuration des broches de A3P600-1FGG256I

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
Broche 1 IO — User I/O
Broche 2 IO — User I/O
Broche 3 IO — User I/O
Broche 4 IO — User I/O
Broche 5 IO — User I/O
Broche 6 IO — User I/O
Broche 7 IO — User I/O
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Broche 177 IO — User I/O
Broche 178 VCC — Core supply voltage
Broche 179 GND — Ground
Broche 180 VCC — Core supply voltage
Broche 181 GND — Ground
Broche 182 VCC — Core supply voltage
Broche 183 GND — Ground
Broche 184 VCC — Core supply voltage
Broche 185 GND — Ground
Broche 186 VCC — Core supply voltage
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Broche 188 VCC — Core supply voltage
Broche 189 GND — Ground
Broche 190 VCC — Core supply voltage
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Broche 224 VCC — Core supply voltage
Broche 225 GND — Ground
Broche 226 VCC — Core supply voltage
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Broche 228 VCC — Core supply voltage
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Broche 230 VCC — Core supply voltage
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Broche 232 VCC — Core supply voltage
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Broche 234 VCC — Core supply voltage
Broche 235 GND — Ground
Broche 236 VCC — Core supply voltage
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Broche 238 VCC — Core supply voltage
Broche 239 GND — Ground
Broche 240 VCC — Core supply voltage
Broche 241 GND — Ground
Broche 242 VCC — Core supply voltage
Broche 243 GND — Ground
Broche 244 VCC — Core supply voltage
Broche 245 GND — Ground
Broche 246 VCC — Core supply voltage
Broche 247 GND — Ground
Broche 248 VCC — Core supply voltage
Broche 249 GND — Ground
Broche 250 VCC — Core supply voltage
Broche 251 GND — Ground
Broche 252 VCC — Core supply voltage
Broche 253 GND — Ground
Broche 254 VCC — Core supply voltage
Broche 255 GND — Ground
Broche 256 VCC — Core supply voltage

Applications typiques

A3P600-1FGG256I convient pour 6 applications: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.

🏭

Industrial Control

The A3P600-1FGG256I is ideal for industrial control systems due to its reprogrammability, security features, and wide operating temperature range. Its 600K gates provide ample logic for motor control, PLCs, and robotics. The flash-based architecture ensures instant-on operation and immunity to configuration loss, critical in industrial environments. With 177 I/Os, it can interface with multiple sensors and actuators. The device's low power consumption reduces heat dissipation in sealed enclosures. According to Microchip, ProASIC3 FPGAs are used in industrial applications for their reliability and long-term availability.

Recommandé

A3P600-2PQG208I · Microchip Technology MSP430F5304IPTR · Texas Instruments MSP430F5304IPTR · Texas Instruments
🚗

Automotive Electronics

In automotive electronics, the A3P600-1FGG256I is used for in-vehicle networking, driver assistance, and infotainment systems. Its 272 MHz performance handles real-time processing, while the 600K gates accommodate complex logic. The device's security features protect against unauthorized reprogramming, crucial for automotive safety. The 256-FBGA package is suitable for space-constrained ECU designs. Operating from -40°C to 100°C, it meets automotive temperature requirements. Microchip's ProASIC3 family is known for high reliability, making it suitable for long-life automotive applications.

Recommandé

A3P600-2FG484 · Microchip Technology TMS320F28027PTT · Texas Instruments
🌐

Communications Infrastructure

The A3P600-1FGG256I is well-suited for communications infrastructure such as base stations, routers, and switches. Its high I/O count (177) and 272 MHz performance enable efficient data packet processing and protocol handling. The flash-based configuration allows field upgrades without external memory. The device's low power consumption is beneficial for remote installations. With 110,592 bits of RAM, it can buffer data streams. According to Microchip, ProASIC3 FPGAs are used in networking equipment for their reliability and security.

Recommandé

A3P600-2FGG484I · Microchip Technology KSZ9031RNX (Ethernet PHY companion)
📱

Consumer Electronics

In consumer electronics, the A3P600-1FGG256I is used in smart home devices, wearables, and multimedia systems. Its reprogrammability allows firmware updates for feature enhancements. The 600K gates provide sufficient logic for user interfaces and signal processing. The small 256-FBGA package is ideal for compact designs. The device's security features protect against IP theft. With 177 I/Os, it can interface with displays, sensors, and audio codecs. The low power consumption extends battery life in portable devices.

Recommandé

A3P600-FGG144I · Microchip Technology MSP430FR5994 · Texas Instruments
💊

Medical Devices

The A3P600-1FGG256I is used in medical devices such as patient monitors, imaging systems, and diagnostic equipment. Its high reliability and long-term availability are critical for medical applications. The flash-based architecture ensures secure configuration, protecting patient data. The device's 272 MHz performance supports real-time signal processing. With 177 I/Os, it can interface with various sensors and ADCs. The wide operating temperature range (-40°C to 100°C) is suitable for medical environments. Microchip's ProASIC3 family is trusted in medical electronics for its robustness.

Recommandé

A3P600-2FGG144 · Microsemi ADS131M08 · Texas Instruments
✈️

Aerospace and Defense

In aerospace and defense, the A3P600-1FGG256I is used in avionics, radar, and secure communication systems. Its security features prevent reverse engineering and unauthorized modifications. The flash-based FPGA provides instant-on operation, essential for mission-critical systems. The device's 272 MHz performance and 600K gates enable complex signal processing. The 256-FBGA package is suitable for rugged environments. Operating from -40°C to 100°C, it meets military temperature requirements. Microchip's ProASIC3 family is known for high reliability in harsh conditions.

Recommandé

A3P600-2FG484 · Microchip Technology A3P600-1PQG208I · Microchip Technology

Récapitulatif des produits recommandés

A3P600-2PQG208I Microchip Technology Utilisé dans : Industrial Control MSP430F5304IPTR Texas Instruments Utilisé dans : Industrial Control, Industrial Control A3P600-2FG484 Microchip Technology Utilisé dans : Automotive Electronics, Aerospace and Defense TMS320F28027PTT Texas Instruments Utilisé dans : Automotive Electronics A3P600-2FGG484I Microchip Technology Utilisé dans : Communications Infrastructure KSZ9031RNX Ethernet PHY companion Utilisé dans : Communications Infrastructure A3P600-FGG144I Microchip Technology Utilisé dans : Consumer Electronics MSP430FR5994 Texas Instruments Utilisé dans : Consumer Electronics A3P600-2FGG144 Microsemi Utilisé dans : Medical Devices ADS131M08 Texas Instruments Utilisé dans : Medical Devices A3P600-1PQG208I Microchip Technology Utilisé dans : Aerospace and Defense
What is the A3P600-1FGG256I?
The A3P600-1FGG256I is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology. It features 600K system gates, 177 user I/Os, and 110,592 bits of RAM. It operates at up to 272 MHz and is housed in a 256-ball FBGA package. According to the Microchip A3P600 product page, it is a flash-based FPGA offering reprogrammability and security.
What is the price of A3P600-1FGG256I?
As of 2026-08-31, the A3P600-1FGG256I is priced at approximately $25.43 for a single unit, with volume pricing dropping to $16.19 at 1000 units. These prices are based on distributor data from DigiKey and Mouser. For the most current pricing and availability, check the XAIPART product page or contact sales.
Where can I buy A3P600-1FGG256I?
The A3P600-1FGG256I can be purchased from authorized distributors such as DigiKey, Mouser, and Microchip Direct. XAIPART also offers this component with competitive pricing and availability. As of 2026-08-31, it is in stock at major distributors. For bulk orders, contact XAIPART for a quote.
What is the lead time for A3P600-1FGG256I?
The lead time for A3P600-1FGG256I varies by distributor and order quantity. As of 2026-08-31, DigiKey and Mouser typically show stock available for immediate shipment. For larger quantities, lead times may extend to 4-6 weeks. XAIPART can provide specific lead time information upon request.
Is A3P600-1FGG256I in stock?
Yes, as of 2026-08-31, the A3P600-1FGG256I is in stock at major distributors including DigiKey and Mouser. XAIPART also maintains inventory. However, stock levels can change rapidly, so it is recommended to check the product page for real-time availability.
What is the difference between A3P600-1FGG256I and A3P600-FGG256I?
The A3P600-1FGG256I and A3P600-FGG256I are both ProASIC3 FPGAs with the same 600K gates and 256-FBGA package. The key difference is the speed grade: the '1' in A3P600-1FGG256I indicates a -1 speed grade, which offers higher performance (272 MHz) compared to the standard speed grade. According to Microchip datasheets, the -1 grade is faster but may consume slightly more power.
When should I choose A3P600-1FGG256I over A3P600-FGG256I?
Choose the A3P600-1FGG256I when you need the higher performance of the -1 speed grade, such as for applications requiring 272 MHz operation. If your design can tolerate lower speed (typically 250 MHz) and you want to minimize power consumption, the A3P600-FGG256I may be more suitable. Both are pin-compatible, so you can evaluate both in your design.
What is the best drop-in replacement for A3P600-1FGG256I?
The best drop-in replacement for A3P600-1FGG256I is the A3P600-FGG256I, which shares the same 256-FBGA package and pinout, with only a difference in speed grade. Other drop-in options include A3P600-2FGG256I (faster speed grade) and A3P600L-1FGG256I (low-power variant). All are pin-compatible and can be used as replacements with appropriate timing analysis.
Can A3P600-FGG256I replace A3P600-1FGG256I?
Yes, the A3P600-FGG256I can replace the A3P600-1FGG256I as it is pin-compatible and has the same package. However, the A3P600-FGG256I has a lower speed grade, so you must verify that your design meets timing requirements at the lower maximum frequency. According to Microchip, the standard speed grade operates at up to 250 MHz, while the -1 grade reaches 272 MHz.
Where can I download the A3P600-1FGG256I datasheet PDF?
The A3P600-1FGG256I datasheet is available from the Microchip product page at https://www.microchip.com/en-us/product/A3P600. The datasheet is a 210-page document covering the ProASIC3 Flash Family FPGAs. You can also find it on distributor sites like DigiKey and Mouser, or on XAIPART's product page.
Where can I find the A3P600-1FGG256I pinout?
The A3P600-1FGG256I pinout is detailed in the Microchip A3P600 datasheet, specifically in the pin assignment tables for the 256-FBGA package. The pinout is also available on XAIPART's product page, which includes a pinout diagram. According to the datasheet, the device has 177 user I/Os distributed across the package.
What are the key specifications of A3P600-1FGG256I that engineers should know?
Engineers should know that the A3P600-1FGG256I is a flash-based FPGA with 600K system gates, 177 I/Os, and 110,592 bits of RAM. It operates at 1.5V core voltage and supports up to 272 MHz. The device is reprogrammable and offers security features. It is housed in a 256-FBGA package and operates from -40°C to 100°C.
Is A3P600-1FGG256I the same as A3P600-FGG256I?
No, the A3P600-1FGG256I and A3P600-FGG256I are not identical. The '1' in the part number indicates a -1 speed grade, which provides higher maximum frequency (272 MHz vs 250 MHz). They share the same package and pinout, but the speed grade difference affects timing performance. According to Microchip, they are otherwise functionally equivalent.
What is the best Microchip equivalent for A3P600-1FGG256I?
The best Microchip equivalent for A3P600-1FGG256I is the A3P600-FGG256I, which is pin-compatible and has the same package. If you need higher performance, the A3P600-2FGG256I offers a faster speed grade. For low-power applications, the A3P600L-1FGG256I is a low-power variant. All are drop-in replacements with minor parametric differences.

Données de référence d'ingénierie pour A3P600-1FGG256I — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the A3P600-1FGG256I when you need a balance of performance and cost in a 256-FBGA package. It offers 272 MHz operation, 177 I/Os, and 600K gates, making it suitable for a wide range of applications. If you require higher speed, select the A3P600-2FGG256I (310 MHz). For low-power designs, the A3P600L-1FGG256I is preferable. If RoHS compliance is not a concern and you want to save cost, the A3P600-FG256I or A3P600-1FG256I may be considered, but verify lead-free requirements. All alternatives are pin-compatible, allowing easy PCB reuse.

Comparaison avec les alternatives

Paramètre Ce produit A3P600-FGG256I A3P600-2FGG256I A3P600L-1FGG256I A3P600-FG256I A3P600-1FG256I
Package 256-FBGA 256-FBGA 256-FBGA 256-FBGA 256-FBGA 256-FBGA
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Speed Grade -1 Standard -2 -1 Standard -1
Maximum Frequency 272 MHz 250 MHz 310 MHz 272 MHz 250 MHz 272 MHz
Low Power No No No Yes No No
Lead-Free Finish Yes Yes Yes Yes No No
Number of I/O 177 177 177 177 177 177
RAM Bits 110592 110592 110592 110592 110592 110592

Principaux différenciateurs

  • Higher speed grade than A3P600-FGG256I (vs A3P600-FGG256I)
  • Lead-free finish vs A3P600-FG256I (vs A3P600-FG256I)
  • Standard power vs A3P600L-1FGG256I (vs A3P600L-1FGG256I)

Notes de conception

The A3P600-1FGG256I requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a DC-DC converter to provide a clean 1.5V rail. Decouple each VCC pin with a 0.1uF ceramic capacitor placed as close to the pin as possible. Additionally, use a 10uF bulk capacitor on the board to handle transient currents. According to Microchip's ProASIC3 power management guidelines, proper decoupling is essential to prevent voltage droop during high-speed switching.

The A3P600-1FGG256I in a 256-FBGA package has a thermal resistance (theta_JA) of approximately 20°C/W (estimated from similar packages). At 1.5V and typical dynamic power of 0.5W, the junction temperature rise is about 10°C. Ensure adequate airflow or a thermal pad to the PCB for heat dissipation. For high utilization designs, consider a heatsink or forced cooling. This is an estimate; refer to the datasheet for exact thermal data.

For the 256-FBGA package, use a 4-layer PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance (e.g., 50 ohm for single-ended). Place decoupling capacitors on the bottom side directly under the FPGA. Follow Microchip's layout guidelines for ProASIC3 to minimize signal integrity issues. Ensure all GND pins are connected to the ground plane with low inductance vias.

Informations de conformité

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Unknown

RoHS compliant per Microchip product page. Lead-free finish indicated by 'FGG' in part number. Other compliance data not specified in provided sources.

Données vérifiées le : 2026-08-31 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

A3P600-1FGG256I A3P600-1FGG256I datasheet Microchip A3P600-1FGG256I ProASIC3 FPGA 600K gates 256-FBGA FPGA A3P600-1FGG256I price A3P600-1FGG256I vs A3P600-FGG256I A3P600-1FGG256I replacement A3P600-1FGG256I buy what is A3P600-1FGG256I

Composants & termes associés

Microchip Technology A3P600-1FGG256I ProASIC3 FPGA Field Programmable Gate Array 600K gates 177 I/O 110592 bits 272 MHz 256-FBGA FBGA 130nm 1.5V RoHS Lead-free
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